CN102332409A - Integrated manufacturing equipment for semiconductor element and manufacturing method thereof - Google Patents

Abstract

An integrated manufacturing apparatus of semiconductor device and its manufacturing method, including a track device, a clamping mechanism, a wafer carrying platform, a package carrier accommodating device, a package carrier pick-and-place device, a glue dispensing device and a die pick-and-place device. The rail device comprises a first rail, a second rail, a rail conversion mechanism, a packaging carrier dispensing area and a crystal bonding area. The clamping mechanism can clamp the packaging carrier to move on the rail device in an indexing manner, the wafer carrying platform can carry a wafer containing a plurality of crystal grains, the packaging carrier containing device comprises a plurality of magazines, a plurality of packaging carriers can be placed in each magazine, the packaging carrier taking and placing device moves the packaging carriers between the clamping mechanism and the packaging carrier containing device, the glue dispensing device is arranged above a glue dispensing area of the packaging carriers of the rail device, and the crystal grain taking and placing device is arranged above a crystal bonding area of the rail device.

Description

Integrated manufacturing equipment for semiconductor element and manufacturing method thereof

technical field

The invention relates to an integrated manufacturing equipment and a manufacturing method of a semiconductor element, in particular to an integrated manufacturing equipment and a manufacturing method that can complete semiconductor crystal grain classification and crystal bonding processes on a single device.

Background technique

In the traditional known semiconductor process, after the wafer is etched, ground and cut by the mask, the wafer test procedure is carried out. The so-called wafer test is to test the function of each die on the wafer through the test machine. (For example, the brightness of the LED die needs to be tested, and the signal and electrical properties of the logic IC need to be tested) to determine the grade of each die, and then the die of different grades on the wafer are sorted and packaged by the sorter, and then Then enter the next stage of packaging processes such as die bond, wire bond, and encapsulation. However, since the sorter and the die bonder are two different machines, after the sorter sorts and packs the dies, it is necessary to carry out the procedures required for changing the machine, such as the inspection of the packaging quality, the calculation of the number of dies, etc. A large amount of manpower is often required in these procedures for converting machines, which not only consumes time, but also increases labor costs. In addition, the packaged die needs to be unpacked before the die-bonding process, and the unpacked packaging consumables cannot be recycled. In this way, not only the cost of packaging consumables is spent, but also a large amount of waste is generated. It poses a great threat to environmental protection and waste reduction.

In addition, in the above-mentioned manufacturing process, in order to make the production process smoother, the number of sorting machines and die bonding machines should be equal in configuration, so that the sorting and die bonding process will not be costly due to insufficient machines. Waiting time, but in this way, it will cost a lot of money to purchase sorting machines and die bonding machines. At the same time, it is necessary to have a large enough factory building and clean room to place these machines, resulting in more costs.

In addition, after general semiconductors are tested, they are usually divided into 2-4 categories according to their characteristics. However, for semiconductors of light-emitting diodes, more classifications are often required, and they can even be distinguished according to their brightness, wavelength, etc. There are more than 100 categories, so using traditional sorting machines and die bonding machines to classify and bond dies requires more manpower.

In view of the above-mentioned problems, the industry urgently needs to propose an integrated semiconductor machine to meet the rapid development of the industrial ecology of the semiconductor industry.

Contents of the invention

In order to solve the above-mentioned problems, the present invention proposes an integrated manufacturing equipment for semiconductor components, including a track device, a clamping mechanism, a wafer carrier, a package carrier receiving device, a package carrier pick-and-place device, a glue dispensing device and a die Pick and place device. The track device includes the first track, the second track and the track conversion mechanism. The track conversion mechanism is arranged at one end of the first track and the second track to connect the first track and the second track. At the same time, the track device is further provided with a package Carrier dispensing area and die sticking area. The clamping mechanism is arranged on the track device, and the clamping mechanism can clamp the package carrier, and can move on the track device in the package carrier dispensing area, the die bonding area, the track conversion mechanism and the second track in an index. The wafer carrier is arranged on one side of the track device and adjacent to the die bonding area. The wafer carrier carries a wafer including a plurality of dies, wherein each die belongs to at least two die levels. The packaging carrier storage device is arranged at one end of the track device. The packaging carrier storage device includes a plurality of magazines, and multiple packaging carriers can be placed in each magazine. The package carrier pick-and-place device is arranged between the rail device and the package carrier storage device, and the package carrier pick-and-place device is used to move the package carrier between the track device and the magazine of the package carrier storage device. At least one dispensing device is arranged in the packaging carrier dispensing area of the track device, and is used to provide glue on the packaging carrier of the clamping mechanism in the packaging carrier dispensing area. The die pick-and-place device is arranged above the die-bonding area of the wafer stage and the track device, and is used to move the die on the wafer stage to the package carrier of the clamping mechanism located in the die-bonding area.

Therefore, the main purpose of the present invention is to propose an integrated manufacturing equipment for semiconductor elements. Since the packaging carrier dispensing area and the die bonding area are provided on the track device, the packaging carrier pick-and-place device can pick up specific grades from the wafer. The die is directly placed on the packaging carrier in the die bonding area, and the grading and die bonding process is completed at the same time, so that the process that originally required two machines can be completed on the same machine, which can simplify the process and reduce the cost of machine purchase cost.

Another object of the present invention is to propose an integrated manufacturing equipment for semiconductor components. Since the processes of grading and die bonding are integrated in a single machine, it can effectively reduce the waste of packaging consumables during the conversion from the grading process to the die bonding process, and reduce production costs. waste generation during the process.

Another object of the present invention is to provide an integrated manufacturing equipment for semiconductor devices, which can effectively reduce the manpower required in the semiconductor process because the grading and die-bonding processes are integrated in a single machine.

Another object of the present invention is to propose an integrated manufacturing equipment for semiconductor components. Since the classification and die bonding processes are integrated in a single machine, it can reduce the waste of time in the process of converting from the classification process to the die bonding process, and effectively increase production capacity. .

In addition, the present invention further proposes an integrated manufacturing method for semiconductor components, which includes providing a packaging carrier receiving device, the packaging carrier receiving device includes a plurality of magazines, and each magazine can place a plurality of packaging carriers. A package carrier pick-and-place device is provided, and the package carrier pick-and-place device is used for taking out the package carrier from the magazine. A track device is provided, including a first track, a second track, and a track switching mechanism. The track switching mechanism is used to connect the first track and the second track. The track mechanism is further provided with a packaging carrier dispensing area and a die bonding area. A clamping mechanism is provided, and each clamping mechanism can clamp the package carrier and move the packaging carrier indexing area on the track device, the package carrier dispensing area, the die bonding area, the track conversion mechanism and the second track. The package carrier pick-and-place device takes out the package carrier from the magazine and places it on the clamping mechanism, and the clamping mechanism clamps the package carrier and moves to the package carrier dispensing area. A dispensing device is provided, and the dispensing device can provide glue on the packaging carrier located in the dispensing area of the packaging carrier. The clamping mechanism clamps the packaging carrier and moves to the die bonding area. A wafer carrier is provided, the wafer carrier carries a wafer, the wafer contains a plurality of dies, and the dies belong to at least two die classes. A die pick-and-place device is provided. The die pick-and-place device picks up dies with a specific grade from the wafer and places them on the packaging carrier located in the die-bonding area. The clamping mechanism clamps the packaging carrier with the crystal grains stuck and moves to the package carrier pick-and-place device, and the package carrier pick-and-place device moves the package carrier with the crystal grains stuck into the magazine.

Therefore, the main purpose of the present invention is to propose an integrated manufacturing method for semiconductor elements. Since the package carrier dispensing area and the die-bonding area are provided on the track device, the package carrier pick-and-place device can pick up specific grades from the wafer. The die is directly placed on the packaging carrier in the die bonding area, and the grading and die bonding processes are completed at the same time, so that the process that originally required two machines can be completed on the same machine, reducing the cost of machine purchase.

Another object of the present invention is to propose an integrated manufacturing method for semiconductor components. Since the processes of grading and die bonding are integrated in a single machine, it can effectively reduce the waste of packaging consumables during the conversion from the grading process to the die bonding process, and reduce production. waste generation during the process.

Another object of the present invention is to provide an integrated manufacturing method for semiconductor devices, which can effectively reduce the manpower required in the semiconductor process because the grading and die-bonding processes are integrated in a single machine.

Another object of the present invention is to propose an integrated manufacturing method for semiconductor components. Since the classification and die-bonding processes are integrated in a single machine, it can reduce the waste of time in the process of converting from the classification process to the die-bonding process, and effectively increase production capacity. .

Description of drawings

Since the present invention mainly discloses an integrated semiconductor element manufacturing equipment and its manufacturing method, the manufacturing principle of the semiconductor element mentioned therein has been understood by those with ordinary knowledge in the relevant technical field, so the following description will not be repeated. for a full description. At the same time, the accompanying drawings that are compared below are structural representations related to the features of the present invention, and are not and need not be completely drawn according to actual dimensions, wherein:

FIG. 1 is a schematic diagram of an integrated manufacturing equipment for a semiconductor device of the present invention.

Fig. 2 is a schematic diagram of the packaging carrier receiving device and the packaging carrier pick-and-place device of the present invention.

FIG. 3 is a schematic diagram of the integrated manufacturing equipment of the semiconductor device of the present invention.

FIG. 4A is a flow chart of the integrated manufacturing method of the semiconductor device of the present invention.

FIG. 4B is a flowchart of the integrated manufacturing method of the semiconductor device of the present invention.

Detailed ways

Please refer to FIG. 1 , which is a schematic diagram of an integrated manufacturing equipment for a semiconductor device of the present invention. The integrated manufacturing equipment for semiconductor components includes a track device 11 , a clamping mechanism 12 , a wafer stage 13 , a package carrier receiving device 14 , a package carrier pick-and-place device 15 , multiple dispensing devices 16 and a die pick-and-place device 17 . The track device 11 comprises a first track 111, a second track 112 and a track switching mechanism 113, the first track 111 and the second track 112 are arranged in parallel, and the track switching mechanism 113 is arranged at one end of the first track 111 and the second track 112 , and can be moved between the first track 111 and the second track 112 to move the package carrier 10 from the first track 111 to the second track 112, in addition, the track device 11 is also provided with a package carrier dispensing area 116 and Die sticky region 117 . The clamping mechanism 12 is arranged on the track device 11, and can clamp the package carrier 10 indexingly and move on the package carrier dispensing area 116, the die bonding area 117, the track switching mechanism 113 and the second track 112 on the track device 11, At the same time, the package carrier 10 can be converted from the first track 111 to the second track 112 by the track conversion mechanism 113 , and then the package carrier 10 is transferred back to the package carrier pick-and-place device 15 through the clamping mechanism 12 on the second track 112 . The wafer carrier 13 is arranged on one side of the track device 11 and adjacent to the die bonding area 116 of the track device 11. The wafer carrier 13 carries a wafer 130 including a plurality of crystal grains 131, and each crystal grain 131 belongs to At least two grain grades. The dispensing device 16 is arranged in the package carrier dispensing area 116 of the track device 11. In this embodiment, there are two dispensing devices 16, which can be used to provide glue to the clamping mechanism located in the package carrier dispensing area 116. 12 on the package carrier 10 . The die pick-and-place device 17 is arranged above the die bonding area 117 of the wafer stage 13 and the track device 11, and is used to move the die 131 in the wafer 130 on the wafer stage 13 to the clamp located in the die bonding area 117. On the packaging carrier 10 of the holding mechanism 12, since the glue provided by the dispensing device 16 has been provided on the packaging carrier 10 at this time, when the die 131 is placed on the packaging carrier 10 by the die pick-and-place device 17, it is carried out simultaneously. Crystal sticking process. The present invention further includes a curing platform 18 , which is arranged on the track device 11 and adjacent to the die bonding area 117 , and can perform curing procedures such as heating or lighting on the package carrier 10 with the chips bonded thereto.

Please refer to FIG. 1 and FIG. 2 at the same time, the packaging carrier storage device 14 is arranged on one end of the rail device 11, the packaging carrier storage device 14 includes a plurality of magazines 141, and multiple packaging carriers 10 can be accommodated in each magazine 141. . The package carrier pick-and-place device 15 is arranged between the rail device 11 and the package carrier storage device 14, and includes a biaxial mobile platform 151 and a pick-and-place mechanism 152 connected thereto. The biaxial mobile platform 151 enables the pick-and-place mechanism 152 to move vertically Move on the plane, at the same time, the package carrier pick-and-place device 15 can take the package carrier 10 out of the magazine 141 in the package carrier storage device 14 by the pick-and-place mechanism 152, and move the package carrier 10 to the clamping position on the track device 11 Agency12.

When performing the grading and die-bonding process, the packaging carrier 10 is firstly taken out from the magazine 141 of the packaging carrier receiving device 14 as described above, and placed on the two-axis moving platform 151 by the pick-and-place mechanism 152 . The two-axis moving platform 151 carrying the package carrier 10 moves to a place close to the track device 11 , and moves the package carrier 10 to the clamping mechanism 12 on the track device 11 . After that, the clamping mechanism 12 carrying the package carrier 10 moves to the package carrier dispensing area 116 along the first track 111 of the track device 11 . At this time, glue is provided by the dispensing device 16 to the package carrier 10 staying in the package carrier dispensing area 116, and then, the clamping mechanism 12 moves the package carrier 10 to the die-bonding area 117 along the first track 111, and the die is removed. The placement device 17 picks up the die 131 with specific characteristics from the wafer 130 on the wafer stage 13, and then places the die 131 with specific characteristics on the package carrier 10 located in the die bonding area 117 for bonding. . Afterwards, the clamping mechanism 12 moves the packaging carrier 10 with the die 131 attached to the curing platform 18, and performs curing procedures such as heating and lighting on the curing platform 18, so that the die 131 can be firmly fixed on the packaging carrier 10, and then clamping The holding mechanism 12 moves the package carrier 10 to the track switching mechanism 113, and the track switching mechanism 113 moves the package carrier 10 to the second track 112, and then the package carrier 10 is clamped on the clamping mechanism 12 and moves along the second track 112 to Close to one end of the package carrier pick-and-place device 15 , the package carrier 10 glued with the die 131 is moved from the clamping mechanism 12 of the second track 112 to the magazine 141 by the package carrier pick-and-place device 15 .

Please refer to FIG. 3 , in the integrated semiconductor device manufacturing equipment of the present invention, a package carrier stacking device 21 and a package carrier grabbing device 22 may be further provided. The package carrier stacking device 21 is disposed on one side of the track device 11 and adjacent to the package carrier dispensing area 116 , and the package carrier stacking device 21 can stack a plurality of package carriers 10 . The packaging carrier grabbing device 22 is arranged between the packaging carrier dispensing area 116 and the packaging carrier stacking device 21, and can be used to grab the packaging carrier 10 to the clamping mechanism 12 on the track device 11, and then the clamping mechanism 12 along the The first track 111 moves to complete processes such as glue dispensing and die bonding. In addition, the present invention can further be provided with a control device 19, the control device 19 can control the package carrier pick-and-place device 15 to take out the package carrier 10 from a specific position packaged in the carrier accommodating device 14, and then control the package carrier pick-and-place device 15 to The package carrier 10 with the die 131 attached thereto is put into the originally removed position, or another specific position. Still further, the present invention is still provided with a wafer basket lifting mechanism 31 and a wafer transfer mechanism 32, wherein the wafer basket lifting mechanism 31 is arranged on one side of the wafer carrier 13, and the wafer basket lifting mechanism 31 A wafer holding device (not shown in the figure) can be used in the middle. The wafer holding device can be a wafer boat or a wafer basket, and multiple wafers 130 can be placed in the wafer holding device, and the wafer transfer mechanism 32 It is arranged between the wafer basket lifting mechanism 31 and the wafer stage 13, and is mainly used to transfer the wafer 130 in the wafer holding device to the wafer stage 13, so that the die pick-and-place device 17 can From the wafer 130 on the wafer stage 13, the wafer 131 of a specific grade is picked up to carry out the subsequent process. onto the stage 13 and transferred to the wafer holding device. In addition, an information label (not shown) can be mounted on the magazine 141 or the packaging carrier 10, so that the control device 19 can identify and record the storage location of the packaging carrier 10 and the situation of sticking the die. The foregoing information labels may be colored labels, one-dimensional barcodes, two-dimensional barcodes or RFID labels that can be read by mechanical scanning.

Referring to FIG. 4 , it is a flow chart of the integrated manufacturing method of the semiconductor device of the present invention. First, as in step 401 : providing a packaging carrier receiving device, the packaging carrier receiving device includes multiple magazines, and multiple packaging carriers can be placed in each magazine. For example, step 402: providing a package carrier pick-and-place device, which can take the package carrier out of the magazine. Step 403: providing a track device, including a first track, a second track, and a track switching mechanism, the track switching mechanism can connect the first track and the second track, in addition, the track mechanism is further provided with a package carrier dispensing area and die bonding district. In step 404: providing multiple clamping mechanisms, each clamping mechanism can move on the track device. Step 405: The packaging carrier pick-and-place device takes out the packaging carrier from the magazine and places it on the clamping mechanism, and the clamping mechanism clamps the packaging carrier and moves to the packaging carrier dispensing area. Step 406 : providing a glue dispensing device, the glue dispensing device provides glue on the package carrier located in the package carrier dispensing area. Step 407: The clamping mechanism clamps the package carrier and moves to the die bonding area. Step 408: Provide a wafer carrier, the wafer carrier carries a wafer, the wafer includes a plurality of dies, and the dies belong to at least two die classes. Step 409: Provide a die pick-and-place device. The die pick-and-place device picks up a die with a specific grade from the wafer and places it on the packaging carrier located in the die-bonding area. Step 410 : The clamping mechanism clamps the package carrier with the die attached and moves it to the package carrier pick-and-place device. Step 411 : The package carrier pick-and-place device moves the package carrier with the die stuck into the magazine.

The integrated semiconductor device manufacturing method of the present invention may further include a solidification process after step 409, and a solidification platform may be provided at the position adjacent to the die bonding area of the track device to stabilize the die on the package carrier. In addition, in the steps of the integrated manufacturing method of semiconductor elements of the present invention, the control device further includes controlling the package carrier pick-and-place device in step 405, taking out the package carrier from the magazine at a specific position, and taking out the package carrier in step 411. The placing device places the packaging carrier in a specific position of the magazine. Moreover, in the integrated manufacturing method of semiconductor devices described in the present invention, the wafer loading and unloading steps can be further included, mainly by the wafer basket lifting mechanism and the wafer transfer mechanism, the wafer is loaded or removed from the wafer. Wafer carrier, wafer carrier lifting mechanism can accommodate wafer storage device, wafer storage device can be wafer boat or wafer basket, in the wafer storage device can carry multiple wafers, wafer The transfer mechanism can transfer the wafer from the wafer accommodation device to the wafer carrier, and transfer the wafer from the wafer carrier to the wafer accommodation device.

The packaging carrier 10 used in the integrated manufacturing equipment and manufacturing method of the semiconductor device of the present invention can be a lead frame, a printed circuit board or a ceramic substrate, which is not limited here.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of rights of the present invention; at the same time, the above descriptions should be clear and implementable for those skilled in the relevant technical fields, so others that do not depart from the disclosure of the present invention Equivalent changes or modifications made under the spirit should be included in the scope of the claims.

Claims (10)

1. the integrated manufacturing equipment of a semiconductor element comprises:

One rail set; Comprise first track, second track and track switching mechanism; This track switching mechanism is arranged at an end of this first track and this second track; And be displaced between this first track and this second track, this rail set further is provided with a package carrier glue application region and a viscous crystal region;

Fixture, this fixture is arranged on this rail mechanism, but this fixture clamping one package carrier, and calibration moves as for this package carrier glue application region on this rail set, this viscous crystal region, this track switching mechanism and this second track;

One wafer carrier is arranged at a side of this rail set and is close to this viscous crystal region, and this wafer carrier is carried a wafer, and this wafer includes a plurality of crystal grain, and said crystal grain belongs at least two crystal grain grades;

One package carrier accommodation apparatus is arranged at an end of this rail set, and this package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine;

One package carrier fetching device is arranged between this rail set and this package carrier accommodation apparatus, and this package carrier fetching device is in order to move this package carrier between the magazine of this rail mechanism and this package carrier accommodation apparatus;

At least one point glue equipment is arranged at the package carrier glue application region of this rail set, in order to provide viscose glue on the package carrier of this fixture of this package carrier glue application region; And

One crystal grain fetching device is arranged at above the viscous crystal region of this wafer carrier and this rail set, in order to the crystal grain on this wafer carrier is moved on the package carrier of this fixture that is positioned at this viscous crystal region.

2. according to the integrated manufacturing equipment of the described semiconductor element of claim 1, wherein this package carrier fetching device comprises a twin shaft mobile platform and a connected fetching device, and this fetching device is moved on a vertical plane.

3. according to the integrated manufacturing equipment of the described semiconductor element of claim 1, further comprise one and solidify platform, be arranged at this rail set and contiguous this viscous crystal region, so that package carrier and adhesion crystal grain are on it imposed a program curing.

4. according to the integrated manufacturing equipment of the described semiconductor element of claim 1; Further comprise a package carrier stack apparatus and a package carrier grabbing device; This package carrier stack apparatus is arranged at a side of this rail set; This package carrier stack apparatus storehouse has a plurality of package carriers, and this package carrier grabbing device is arranged between this package carrier glue application region and this package carrier stack apparatus, in order to package carrier is moved to the fixture on this rail set.

5. according to the integrated manufacturing equipment of the described semiconductor element of claim 1, further include a control device, the ad-hoc location of the self-styled loading body of this control device this package carrier fetching device of control accommodating device takes out and inserts this package carrier.

6. according to the integrated manufacturing equipment of the described semiconductor element of claim 1; Further include a wafer hand basket elevating mechanism and a wafer transfer mechanism; This wafer hand basket elevating mechanism is arranged at a side of this wafer carrier, and this wafer mounted mechanism is arranged between this wafer hand basket elevating mechanism and this wafer carrier.

7. the integrated manufacturing approach of a semiconductor element comprises:

One package carrier accommodation apparatus is provided, and this package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine; One package carrier fetching device is provided, and this package carrier fetching device is in order to take out package carrier in this magazine;

One rail set is provided, this rail set comprise first track, second track, with track switching mechanism, this track switching mechanism is in order to link first track and second track, this rail set further is provided with a package carrier glue application region and a viscous crystal region;

One fixture is provided, and this fixture is arranged on this rail mechanism, but this fixture clamping one package carrier, and calibration moves as for this package carrier glue application region on this rail set, this viscous crystal region, this track switching mechanism and this second track;

This package carrier fetching device takes out package carrier and is positioned on this fixture in this magazine, this this package carrier of fixture clamping moves to this package carrier glue application region;

At least one point glue equipment is provided, and this point glue equipment provides viscose glue on this package carrier that is positioned at this package carrier glue application region;

This fixture carries this package carrier and moves to this viscous crystal region;

One wafer carrier is provided, and this wafer carrier is carried a wafer, and this wafer includes a plurality of crystal grain, and this crystal grain belongs at least two crystal grain grades,

One crystal grain fetching device is provided, and this crystal grain fetching device picks up this crystal grain with particular level on this wafer, is positioned on the package carrier that is positioned at this viscous crystal region again;

This package carrier that this fixture clamping is stained with this crystal grain moves to this package carrier fetching device; And

This package carrier that this package carrier fetching device will be stained with this crystal grain moves in this magazine.

8. according to the integrated manufacturing approach of the described semiconductor element of claim 7, further comprise a program curing, contiguous this viscous crystal region of this rail set is provided with one and solidifies platform, so that this crystal grain is stable on this package carrier.

9. according to the integrated manufacturing approach of the described semiconductor element of claim 7, further comprise by a control device and control this package carrier fetching device, take out and insert this package carrier from this package carrier accommodating device ad-hoc location.

10. according to the integrated manufacturing approach of the described semiconductor element of claim 7; Further comprise a wafer and load and shift out step; Comprise a wafer hand basket elevating mechanism and a wafer transfer mechanism are provided that this wafer hand basket elevating mechanism carries the multi-disc wafer in order to a ccontaining wafer accommodating device in this wafer accommodating device; This wafer transfer mechanism transfers load to this wafer carrier with this wafer in this wafer accommodating device, and this wafer carrier transfers load to this wafer in this wafer accommodating device certainly.

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