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CN102326226B - Automatically the silk-screen printing technique adjusted - Google Patents

Automatically the silk-screen printing technique adjusted Download PDF

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Publication number
CN102326226B
CN102326226B CN200980157608.2A CN200980157608A CN102326226B CN 102326226 B CN102326226 B CN 102326226B CN 200980157608 A CN200980157608 A CN 200980157608A CN 102326226 B CN102326226 B CN 102326226B
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substrate
orientation
automatization
alignment mark
pattern
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CN102326226A (en
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A·巴希尼
M·佳利亚佐
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Applied Materials Inc
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Applied Materials Inc
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0804Machines for printing sheets
    • B41F15/0813Machines for printing sheets with flat screens
    • B41F15/0818Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/20Supports for workpieces with suction-operated elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/137Batch treatment of the devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • H10F77/211Electrodes for devices having potential barriers for photovoltaic cells
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/10Screen printing machines characterised by their constructional features
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/10Screen printing machines characterised by their constructional features
    • B41P2215/11Registering devices
    • B41P2215/114Registering devices with means for displacing the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2233/00Arrangements for the operation of printing presses
    • B41P2233/50Marks on printed material
    • B41P2233/52Marks on printed material for registering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photovoltaic Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Display Devices Of Pinball Game Machines (AREA)
  • Combination Of More Than One Step In Electrophotography (AREA)

Abstract

The embodiment of the present invention is commonly provided in the apparatus and method of screen printed pattern on substrate.In one embodiment, patterned layer is printed on the surface of substrate together with multiple alignment marks.Measure these alignment marks position relative to the feature structure of substrate, to judge the physical location of patterned layer.Physical location is made comparisons with desired location the site error of the arrangement judging patterned layer on substrate.Use this information to adjust patterned layer arrangement on follow-up multiple treated substrates.

Description

自动调整的丝网印刷工艺Self-adjusting screen printing process

技术领域 technical field

本发明实施例一般涉及在衬底的表面上丝网印刷多层图案的系统与工艺。Embodiments of the invention generally relate to systems and processes for screen printing multi-layer patterns on the surface of a substrate.

背景技术 Background technique

太阳能电池为可直接将太阳光转换成电功率的光电(PV)器件。太阳能电池通常具有一个或多个p-n结。半导体材料内的每个p-n结包括两个不同区域,其中一侧被标示为p-型区域且另一侧被标示为n-型区域。当太阳能电池的p-n结暴露在太阳光(由来自光子的能量组成)下时,太阳光经由光电(PV)效应直接转换成电力。太阳能电池产生特定量的电功率,并铺列成大小确定为传递期望量的系统功率的模块。太阳能模块使用特定框架及连接器来与平板接合。太阳能电池通常形成在硅衬底上,其中硅衬底可为单晶硅衬底或多晶硅衬底。典型的太阳能电池包括:通常厚度小于约0.3mm的硅晶片、硅衬底、或硅板,该硅晶片、硅衬底、或硅板具有在衬底上形成的p-型区域之上的n-型硅薄层。Solar cells are photovoltaic (PV) devices that directly convert sunlight into electrical power. Solar cells typically have one or more p-n junctions. Each p-n junction within semiconductor material includes two distinct regions, one side of which is designated as a p-type region and the other side as an n-type region. When the p-n junction of a solar cell is exposed to sunlight (consisting of energy from photons), the sunlight is directly converted into electricity via the photovoltaic (PV) effect. Solar cells generate a specific amount of electrical power and are laid out in modules sized to deliver the desired amount of system power. Solar modules use specific frames and connectors to attach to panels. Solar cells are typically formed on silicon substrates, which may be monocrystalline silicon substrates or polycrystalline silicon substrates. A typical solar cell includes a silicon wafer, silicon substrate, or silicon plate, usually less than about 0.3 mm in thickness, having an n -type silicon thin layer.

在过去十年间,光电(PV)市场已经历了超过30%的年度成长率。一些文章认为全世界的太阳能电池功率产量可能在未来超过10GWp。预估所有太阳能模块的超过95%将为以硅晶片为基底。高市场成长率以及显着减少太阳能电力成本的需要已对不昂贵地形成高品质太阳能电池造成若干严峻的挑战。因此,制造商用太阳能电池的一个主要部分在于藉由改良器件产率及增加衬底产量来减少形成太阳能电池所需的生产成本。Over the past decade, the photovoltaic (PV) market has experienced an annual growth rate of over 30%. Some articles believe that the world's solar cell power production may exceed 10GWp in the future. It is estimated that more than 95% of all solar modules will be based on silicon wafers. High market growth rates and the need to significantly reduce the cost of solar electricity have created several serious challenges to inexpensively forming high quality solar cells. Therefore, a major part of fabricating solar cells lies in reducing the production costs required to form solar cells by improving device yield and increasing substrate yield.

已长期使用丝网印刷来在物体(例如布料或陶瓷)上进行印刷设计,并在电子工业中使用丝网印刷来印刷电组件设计,诸如衬底表面上的电接触或互连。现有技术水平的太阳能电池制造工艺亦使用丝网印刷工艺。由于衬底在自动化传送装置上的定位误差、衬底边缘上的缺陷造成的衬底表面上的丝网印刷图案的未对准,可导致较差的器件性能及因此导致器件产率问题。系统内的衬底定位的手动校准是耗时的,且需要基于多批次衬底间的差异或衬底的校准位置的偏移而频繁地调整。Screen printing has long been used to print designs on objects such as cloth or ceramics, and in the electronics industry to print electrical component designs such as electrical contacts or interconnects on the surface of a substrate. State-of-the-art solar cell manufacturing processes also use screen printing processes. Misalignment of the screen printed pattern on the substrate surface due to positioning errors of the substrate on the automated conveyor, defects on the substrate edge, can lead to poor device performance and thus device yield issues. Manual calibration of substrate positioning within the system is time consuming and requires frequent adjustments based on differences between batches of substrates or shifts in the calibrated positions of the substrates.

因此,需要一种用于生产太阳能电池、电路、或其他有用器件的丝网印刷装置,该丝网印刷相较于其它已知装置具有控制系统内的器件定位、产量增加及较低拥有成本的改良方法。Therefore, there is a need for a screen printing apparatus for producing solar cells, circuits, or other useful devices that has the advantages of controlling device positioning within the system, increased yield, and lower cost of ownership compared to other known apparatus Improved method.

发明内容 Contents of the invention

本发明一般提供一种自动化沉积工艺,包括以下步骤:在衬底支撑件上定位第一衬底,其中第一衬底具有至少一个特征结构;以一图案将材料层沉积至第一衬底的表面上,其中该图案包括至少两个对准标记;使用系统控制器确定至少两个对准标记相对于第一衬底的至少一个特征结构的实际取向及位置;及使用由系统控制器在确定该至少两个对准标记的实际定向及实际位置期间内所接收到的信息在相对于第二衬底的至少一个特征结构的经调整的取向或经调整的位置,以一图案将材料层沉积至第二衬底的表面上,其中沉积在第二衬底上的材料的取向或位置比沉积在第一衬底上的材料的取向或位置更接近预期取向或预期位置。The present invention generally provides an automated deposition process comprising the steps of: positioning a first substrate on a substrate support, wherein the first substrate has at least one feature; depositing a layer of material in a pattern onto the first substrate on the surface, wherein the pattern includes at least two alignment marks; using a system controller to determine the actual orientation and position of the at least two alignment marks relative to at least one feature of the first substrate; The information received during the actual orientation and actual position of the at least two alignment marks deposits a layer of material in a pattern at an adjusted orientation or an adjusted position relative to at least one feature of the second substrate onto the surface of a second substrate, wherein the orientation or position of the material deposited on the second substrate is closer to the intended orientation or position than the orientation or position of the material deposited on the first substrate.

本发明的实施例可进一步提供一种自动化沉积工艺,包括以下步骤:在衬底支撑件上定位第一衬底,其中第一衬底具有至少一个特征结构;使用系统控制器分析衬底支撑件上的第一衬底的取向及位置;以一图案将材料层沉积至第一衬底的表面上,其中该图案包括至少两个对准标记并使用由系统控制器在分析衬底的取向及位置期间所接收到的数据来与第一衬底的至少一个特征结构对准;使用系统控制器确定第一衬底上的沉积层的实际取向及实际位置;计算沉积材料层的实际取向及实际位置与预期取向及预期位置之间的偏差;及使用计算出的偏差以一图案将材料层沉积至第二衬底上,以使得沉积在第二衬底上的材料的取向或位置比沉积在第一衬底上的材料的取向或位置更接近预期取向或预期位置。Embodiments of the present invention may further provide an automated deposition process comprising the steps of: positioning a first substrate on a substrate support, wherein the first substrate has at least one feature; analyzing the substrate support using a system controller orientation and position of the first substrate on the first substrate; depositing a layer of material onto the surface of the first substrate in a pattern, wherein the pattern includes at least two alignment marks and is used by the system controller in analyzing the orientation and position of the substrate data received during positioning to align with at least one feature of the first substrate; determine the actual orientation and actual position of the deposited layer on the first substrate using the system controller; calculate the actual orientation and actual position of the deposited material layer a deviation between the position and the expected orientation and expected position; and using the calculated deviation to deposit a layer of material onto the second substrate in a pattern such that the orientation or position of the material deposited on the second substrate is greater than that deposited on The orientation or position of the material on the first substrate is closer to the intended orientation or position.

本发明的实施例进一步提供一种自动化沉积工艺,包括以下步骤:将设置在衬底支撑件上的第一衬底定位在第一位置,其中第一衬底具有至少一个特征结构;使用光学检测系统及系统控制器分析定位在第一位置的衬底支撑件上的第一衬底的取向及位置;以一图案将材料层沉积至设置于第二位置处的衬底支撑件上的第一衬底的表面上,该图案包括至少两个对准标记并使用由系统控制器在分析第一衬底的取向及位置期间所接收到的数据来于第一衬底的至少一个特征结构对准;将第一衬底及衬底支撑件定位在第一位置;使用光学检测系统及系统控制器确定被定位在第一位置的第一衬底上的沉积层的实际取向及实际位置;计算沉积材料层的实际取向及实际位置与预期取向及预期位置之间的偏差;及使用计算出的偏差以一图案将材料层沉积至第二衬底上,第二衬底在衬底支撑件上被设置在第二位置中,以使得沉积在第二衬底上的材料的取向或位置比沉积在第一衬底上的材料的取向或位置更接近预期取向或预期位置。Embodiments of the present invention further provide an automated deposition process comprising the steps of: positioning a first substrate disposed on a substrate support at a first position, wherein the first substrate has at least one feature; using optical detection The system and system controller analyze the orientation and position of a first substrate positioned on a substrate support at a first location; deposit a layer of material in a pattern onto the first substrate on a substrate support positioned at a second location; On the surface of the substrate, the pattern includes at least two alignment marks and is aligned to at least one feature of the first substrate using data received by the system controller during analysis of the orientation and position of the first substrate ; positioning the first substrate and the substrate support at a first position; determining the actual orientation and actual position of the deposited layer on the first substrate positioned at the first position using the optical detection system and the system controller; calculating the deposition Deviations between the actual orientation and actual position of the material layer and the expected orientation and expected position; and using the calculated deviations to deposit the material layer in a pattern onto a second substrate held on the substrate support Arranged in the second position such that the orientation or position of the material deposited on the second substrate is closer to the desired orientation or position than the orientation or position of the material deposited on the first substrate.

本发明实施例进一步提供一种自动化沉积工艺系统,包括:旋转致动器,具有设置于旋转致动器上的衬底支撑件,且该旋转致动器可在第一位置及第二位置之间移动;输入输送带,输入输送带被定位成在第一位置将第一衬底装载至衬底支撑件上;丝网印刷腔室,具有设置于丝网印刷腔室中的可调整的丝网印刷装置,丝网印刷腔室被定位成当衬底支撑件位于第二位置时,将图案印刷至第一衬底上;光学检测组件,具有相机及灯,光学检测组件被定位成当衬底支撑件位于第一位置时捕获第一图案层的多个光学图像;以及包括软体的系统控制器,软件被配置成确定在第一图案层的光学图像中所捕获的对准标记的实际位置相对于这些对准标记的预期位置的偏差,并在第二衬底上印刷第二图案层之前调整丝网印刷装置来解决所确定的偏差。An embodiment of the present invention further provides an automated deposition process system, including: a rotary actuator with a substrate support disposed on the rotary actuator, and the rotary actuator can be positioned between the first position and the second position the input conveyor belt, the input conveyor belt is positioned to load the first substrate onto the substrate support in the first position; the screen printing chamber has an adjustable silk screen disposed in the screen printing chamber A screen printing device, the screen printing chamber is positioned to print a pattern onto the first substrate when the substrate support is in the second position; the optical detection assembly has a camera and a lamp, and the optical detection assembly is positioned to act as the substrate support capturing a plurality of optical images of the first patterned layer when the bottom support is in the first position; and a system controller comprising software configured to determine an actual position of the alignment marks captured in the optical images of the first patterned layer Deviations from the expected positions of these alignment marks and adjusting the screen printing apparatus to account for the determined deviations prior to printing the second pattern layer on the second substrate.

附图简单说明Brief description of the drawings

因此,能更详细地理解本发明上述特征的方式,即对以上概述的本发明的更具体描述可参照各个实施例进行,在附图中示出了一些实施例。须注意的是,附图仅仅揭示了本发明的特定实施例,而并非用以限制本发明的精神与范围,因为本发明可允许其它等效实施例。So that the manner in which the above recited features of the invention can be understood in greater detail, a more particular description of the invention, summarized above, may be had by reference to various embodiments, some of which are shown in the accompanying drawings. It should be noted that the accompanying drawings only disclose specific embodiments of the invention and are not intended to limit the spirit and scope of the invention, since the invention may admit to other equivalent embodiments.

图1A为可结合本发明的实施例使用以形成多层期望图案的系统的示意等角视图。Figure 1A is a schematic isometric view of a system that may be used in conjunction with embodiments of the present invention to form multiple layers of desired patterns.

图1B为图1A中系统的示意性平面视图。Figure IB is a schematic plan view of the system in Figure IA.

图2为太阳能电池衬底的正表面、即光接收表面的平面视图。Fig. 2 is a plan view of the front surface, ie, the light-receiving surface, of a solar cell substrate.

图3A例示根据本发明一个实施例的印刷在衬底上的多个对准标记的多示例性个示例。FIG. 3A illustrates multiple exemplary examples of a plurality of alignment marks printed on a substrate according to one embodiment of the present invention.

图3B-3D例示根据本发明实施例的在衬底的正表面上的多个对准标记的多种配置。3B-3D illustrate various configurations of multiple alignment marks on the front surface of a substrate according to embodiments of the present invention.

图4A为旋转致动器组件的一实施例的示意性等角视图,例示检测组件被定位以检测衬底的正表面的一配置。4A is a schematic isometric view of an embodiment of a rotary actuator assembly illustrating a configuration in which the detection assembly is positioned to detect the front surface of a substrate.

图4B例示旋转致动器的一实施例,该旋转致动器用于控制衬底的正表面的照明。Figure 4B illustrates an embodiment of a rotary actuator for controlling the illumination of the front surface of a substrate.

图5为旋转致动器组件的一实施例的示意性等角视图,在该旋转致动器组件中检测组件包括多个光学检测装置。5 is a schematic isometric view of one embodiment of a rotary actuator assembly in which the detection assembly includes a plurality of optical detection devices.

图6为根据本发明一实施例的操作序列的示意性示图,该操作序列用于在衬底150的正表面上精确地丝网印刷一双层图案。FIG. 6 is a schematic illustration of an operational sequence for accurately screen printing a two-layer pattern on the front surface of a substrate 150 according to an embodiment of the present invention.

图7为可结合本发明实施例使用来形成多层期望图案的系统的平面俯视图。7 is a top plan view of a system that may be used in conjunction with embodiments of the present invention to form multiple layers of desired patterns.

为便于理解,各图中相同的元件符号尽可能代表相似的元件。应理解某一实施例的元件和/或处理步骤可并入其他实施例,在此不另外详述。To facilitate understanding, the same reference numerals in the various drawings represent similar components as far as possible. It should be understood that elements and/or process steps of one embodiment may be incorporated into other embodiments without further detail herein.

须注意的是,附图仅仅揭示了本发明特定实施例,而并非用以限制本发明的精神与范围,因为本发明可允许其它等效实施例。It should be noted that the accompanying drawings only disclose specific embodiments of the invention and are not intended to limit the spirit and scope of the invention, since the invention may allow other equivalent embodiments.

具体实施方式 detailed description

本发明的各个实施例提供一种用于在丝网印刷系统中处理多个衬底的装置与方法,该装置及方法利用改良的衬底传送、对准、及丝网印刷工艺而可改良衬底处理生产线的器件产率性能及拥有成本(cost-of-ownership,CoO)。在一实施例中,丝网印刷系统(此后称为系统)适于在结晶硅太阳能电池生产线中实行丝网印刷工艺,在该生产线中衬底分两层或多层用期望材料图案化,且衬底随后在一个或多个后续工艺腔室中处理。该后续工艺腔室可适于执行一个或多个烘烤步骤及一个或多个清洁步骤。在一实施例中,该系统为定位在可购自Baccini S.p.A.的SoftlineTM工具中的模块,其中Baccini S.p.A.为美国加州圣塔克拉拉的应用材料公司所拥有。虽然以下所述主要探讨在太阳能电池器件的表面上丝网印刷一图案(例如,互连或接触结构)的工艺,但此配置并不意欲将本发明的范畴限制于本文所描述的内容。Embodiments of the present invention provide an apparatus and method for processing multiple substrates in a screen printing system that utilizes improved substrate handling, alignment, and screen printing processes to improve substrate The device yield performance and cost-of-ownership (CoO) of the bottom processing line. In one embodiment, a screen printing system (hereinafter referred to as the system) is adapted to perform a screen printing process in a crystalline silicon solar cell production line in which a substrate is patterned with a desired material in two or more layers, and The substrate is then processed in one or more subsequent process chambers. The subsequent processing chamber may be adapted to perform one or more baking steps and one or more cleaning steps. In one embodiment, the system is a module located in a Softline™ tool available from Baccini S.p.A., owned by Applied Materials, Inc. of Santa Clara, California, USA. Although the following description primarily discusses the process of screen printing a pattern (eg, interconnect or contact structure) on the surface of a solar cell device, this configuration is not intended to limit the scope of the invention to what is described herein.

图1A为示意性等角视图且图1B为示意性平面图,图1A与图1B例示丝网印刷系统的一个实施例即系统100,该系统100可结合本发明实施例使用来在太阳能电池衬底150的表面上形成期望图案。在一实施例中,系统100包括传入输送带111、旋转致动器组件130、丝网印刷腔室102,及输出输送带112。传入输送带111可被配置成接收来自输入装置(例如,输入输送带113)的衬底150,并将衬底150传送至印刷嵌套(pringting nest)131,该印刷嵌套131耦接至旋转致动器组件130。输出输送带112可被配置成从耦接至旋转致动器组件130的印刷嵌套131接收经处理的衬底150,并将衬底150传送至衬底移除装置(例如出口输送带114)。输入输送带113及出口输送带114可为大规模生产线的一部分的自动化衬底搬运设备。例如,输入输送带113及出口输送带114可为SoftlineTM工具的一部分,在该工具中系统100可为一模块。1A is a schematic isometric view and FIG. 1B is a schematic plan view. FIGS. 1A and 1B illustrate one embodiment of a screen printing system, system 100, that may be used in conjunction with embodiments of the present invention to print solar cell substrates. A desired pattern is formed on the surface of 150 . In one embodiment, the system 100 includes an incoming conveyor 111 , a rotary actuator assembly 130 , a screen printing chamber 102 , and an outgoing conveyor 112 . Incoming conveyor 111 may be configured to receive substrate 150 from an input device (e.g., input conveyor 113) and transfer substrate 150 to printing nest 131, which is coupled to The actuator assembly 130 is rotated. The output conveyor 112 may be configured to receive a processed substrate 150 from the printing nest 131 coupled to the rotary actuator assembly 130 and to transfer the substrate 150 to a substrate removal device (eg, the exit conveyor 114 ). . The input conveyor 113 and the exit conveyor 114 may be automated substrate handling equipment that is part of a large scale production line. For example, the input conveyor 113 and the exit conveyor 114 can be part of a Softline™ tool in which the system 100 can be a module.

在一配置中,如图5所示,各印刷嵌套131通常由输送器组件所构成,输送器组件具有馈送卷轴135、接取卷轴(未示出)、及一个或多个致动器(未示出),其中这些致动器耦接至馈送卷轴和/或接取卷轴,且适于馈送及维持被横跨平台138定位的支撑材料137。平台138通常具有衬底支撑表面,在丝网印刷腔室102内执行丝网印刷工艺期间衬底150及支撑材料137被定位在该衬底支撑表面上。在一实施例中,支撑材料137为一多孔材料,该支撑材料137允许被设置在支撑材料137的一侧上的衬底150可藉由常规真空产生装置(例如,真空泵、真空喷射器)施加至支撑材料137的相对侧的真空而被维持在平台138上。在一实施例中,对形成在平台138的衬底支撑表面138A中的多个真空口(未示出)施加真空,使得衬底可被“吸”到平台的衬底支撑表面138A上。在一实施例中,支撑材料137为可蒸发材料(transpirable material),该支撑材料137由(例如)用于香烟的类型的可蒸发纸张或其他类似材料(例如可执行相同功能的塑胶或纺织材料)所构成。示例性印刷嵌套设计的一示例在2008年10月23日提交的共同待审的美国专利申请No.12/257,159[律师案号13565]中有进一步描述。In one configuration, as shown in FIG. 5 , each printing nest 131 is generally comprised of a conveyor assembly having a feed spool 135, a take-up spool (not shown), and one or more actuators ( not shown), wherein the actuators are coupled to the feed reel and/or take-up reel and are adapted to feed and maintain the support material 137 positioned across the platform 138. Platform 138 generally has a substrate support surface on which substrate 150 and support material 137 are positioned during the performance of the screen printing process within screen printing chamber 102 . In one embodiment, the support material 137 is a porous material that allows the substrate 150 disposed on one side of the support material 137 to be vacuumed by conventional vacuum generating devices (e.g., vacuum pumps, vacuum ejectors). Vacuum is maintained on platform 138 by applying a vacuum to the opposite side of support material 137 . In one embodiment, a vacuum is applied to a plurality of vacuum ports (not shown) formed in the substrate support surface 138A of the platform 138 so that the substrate can be "suctioned" onto the substrate support surface 138A of the platform. In one embodiment, the support material 137 is a transpirable material made of, for example, transpirable paper of the type used in cigarettes or other similar material such as plastic or textile material that can perform the same function. ) constitutes. An example of an exemplary printed nesting design is further described in co-pending US Patent Application No. 12/257,159 [Attorney Docket No. 13565], filed October 23, 2008.

如图1A所示,旋转致动器组件130可藉由旋转致动器(未示出)及系统控制器101围绕”B”轴旋转并有角度定位,以使得印刷嵌套131可在系统100内选择性地有角度定位。旋转致动器组件130也可具有一个或多个支撑部件来便于对用来在系统100中执行衬底处理序列的印刷嵌套131或其他自动化设备的控制。As shown in FIG. 1A , the rotary actuator assembly 130 can be rotated and angularly positioned about the “B” axis by the rotary actuator (not shown) and the system controller 101 so that the printing nest 131 can be positioned in the system 100 Optionally angled inside. Rotary actuator assembly 130 may also have one or more support members to facilitate control of print nest 131 or other automated equipment used to execute substrate processing sequences in system 100 .

在一实施例中,旋转致动器组件130包括四个印刷嵌套131,或衬底支撑件,这些印刷嵌套各自适于在丝网印刷腔室102内执行丝网印刷工艺期间支撑衬底150。图1B示意性地图示旋转致动器组件130的位置,在该图中印刷嵌套131A在位置”1”从输入输送带131接收衬底150,另一印刷嵌套131B位于丝网印刷腔室102内的位置“2”以使得另一衬底150可在衬底150表面上接收丝网印刷图案,另一印刷嵌套131C位于位置”3”用于将经处理的衬底150传送至输出输送带112,而另一印刷嵌套131D位于位置”4”,位置”4”为位置”1”与位置”3”之间的中间阶段。In one embodiment, the rotary actuator assembly 130 includes four printing nests 131, or substrate supports, each adapted to support a substrate during a screen printing process performed within the screen printing chamber 102. 150. Figure 1B schematically illustrates the position of the rotary actuator assembly 130, in which a printing nest 131A is at position "1" receiving a substrate 150 from an input conveyor 131 and another printing nest 131B is located in the screen printing chamber 102 in position "2" so that another substrate 150 can receive a screen printed pattern on the surface of the substrate 150, another printing nest 131C is in position "3" for delivering the processed substrate 150 to the output conveyor belt 112, and another printing nest 131D is located at position "4", which is an intermediate stage between position "1" and position "3".

在一实施例中,系统100内的丝网印刷腔室102使用可购自Baccini S.p.A的多个常规丝网印刷头,这些丝网印刷头适于在丝网印刷工艺期间在衬底150的表面上以期望图案来沉积材料,其中衬底150定位在位置”2”的印刷嵌套131中。在一实施例中,丝网印刷腔室102含有多个致动器,例如可与系统控制器101通信且可经由从系统控制器101发出的指令来调整至衬底的丝网印刷掩模的位置和/或角度取向的致动器102A(例如,步进马达、伺服马达)。在一实施例中,丝网印刷腔室102适于将含有金属或含有介电质的材料沉积至太阳能电池衬底150上。在一实施例中,太阳能电池衬底150具有介于约125mm与约156mm之间的宽度及介于约70mm至约156mm的长度。In one embodiment, the screen printing chamber 102 within the system 100 uses a plurality of conventional screen printing heads available from Baccini S.p.A. which are adapted to print on the surface of the substrate 150 during the screen printing process. The material is deposited in the desired pattern on the substrate 150 positioned in the print nest 131 at position "2". In one embodiment, the screen printing chamber 102 contains a plurality of actuators, such as those of the screen printing mask that can communicate with the system controller 101 and can be adjusted to the substrate via commands from the system controller 101. Positional and/or angular orientation of the actuator 102A (eg, stepper motor, servo motor). In one embodiment, the screen printing chamber 102 is adapted to deposit metal-containing or dielectric-containing materials onto the solar cell substrate 150 . In one embodiment, the solar cell substrate 150 has a width between about 125 mm and about 156 mm and a length between about 70 mm and about 156 mm.

在一实施例中,系统100包括检测组件200,该检测组件200适于检测位于位置”1”的印刷嵌套131上的衬底150。该检测组件200可包括一个或多个相机121,相机121被定位以检测位于位置”1”的印刷嵌套131上的传入经处理衬底150。在一实施例中,检测组件120包括至少一个相机121(例如,CCD相机)以及其他可检测及将检测结果传达至系统控制器101的电子部件,系统控制器101用来分析印刷嵌套131上衬底150的取向及位置。在一实施例中,印刷嵌套131各自可含有灯123(图4B)、或其他相似的光学辐射装置,以照明定位在印刷嵌套131上的衬底150,以使得检测组件200可更容易地检测衬底150。In one embodiment, the system 100 includes an inspection assembly 200 adapted to inspect the substrate 150 on the print nest 131 at position "1". The detection assembly 200 may include one or more cameras 121 positioned to detect an incoming processed substrate 150 on the print nest 131 at position "1". In one embodiment, the detection assembly 120 includes at least one camera 121 (eg, a CCD camera) and other electronic components that can detect and communicate the detection results to the system controller 101, which is used to analyze the The orientation and position of the substrate 150. In one embodiment, each of the printing nests 131 may contain a lamp 123 ( FIG. 4B ), or other similar optical radiation device, to illuminate the substrate 150 positioned on the printing nest 131 so that the inspection assembly 200 may be more easily The substrate 150 is detected.

在一实施例中,系统100也可包括第二检测组件201,该第二检测组件201被定位成在材料在丝网印刷腔室102中沉积于衬底的表面上之后检测衬底,以分析衬底表面上的沉积层的位置。在一配置中,如上所述,第二检测组件201与检测组件200相似,且第二检测组件一般可检测并将检测结果传达至系统控制器101。在一示例中,第二检测组件201适于检测位于位置”3”的印刷嵌套131上的衬底150。检测组件201可包括一个或多个相机121(例如,CCD相机),相机被定位成检测位于位置”3”的印刷嵌套131上的经处理衬底150。In one embodiment, the system 100 may also include a second detection assembly 201 positioned to detect the substrate after material has been deposited on the surface of the substrate in the screen printing chamber 102 to analyze The location of the deposited layer on the substrate surface. In one configuration, as described above, the second detection component 201 is similar to the detection component 200 , and the second detection component can generally detect and communicate the detection result to the system controller 101 . In one example, the second inspection assembly 201 is adapted to inspect the substrate 150 on the printing nest 131 at position "3". Inspection assembly 201 may include one or more cameras 121 (eg, CCD cameras) positioned to inspect processed substrate 150 on print nest 131 at position "3".

系统控制器101便于整体系统100的控制及自动化,且可包括中央处理单元(CPU)(未示出)、存储器(未示出)、及支持电路(或I/O)(未示出)。CPU可为任何形式的计算机处理器之一,其中这些计算机处理器用于控制多种腔室工艺及硬件(例如,输送带、侦测器、马达、流体传送硬件等)的工业装置中,并监控该系统及腔室工艺(例如,衬底位置、工艺时间、检测器信号等)。存储器连接至CPU并可以是容易获得的存储器中的一种或多种,例如随机存取存储器(RAM)、只读存储器(ROM)、软盘、硬盘、或任何形式的数字储存器,无论是本地或远程皆可。软件指令及数据可编码并储存在存储器内以指示CPU。支持电路也可连接至CPU以常规方式来支持处理器。支持电路也可包括高速缓存、电源、时钟电路、输入/输出电路、子系统及其类似物。可藉由系统控制器101读取的程序(或计算机指令)确定哪些任务可在衬底上执行。较佳地,程序为可藉由系统控制器101读取的软件,程序包括用于产生并储存至少一个衬底位置信息、各种受控部件的移动序列、衬底检测系统信息、及用于产生并储存至少一个衬底位置信息、各种受控部件的移动序列、衬底检测系统信息的任何组合的编码。在本发明的一实施例中,系统控制器101包括图案识别软件,用以解析这些对准标记的位置,如后续参照图3A-3D的描述。也可使用图案识别软件来校正对准标记形状的失真或变化,从而能收集到关于丝网印刷图案的实际位置的更精确数据。在一实施例中,藉由使用系统控制器101从检测组件200接收到的图像,图案识别软件适于测量对准标记相对于对准标记预期现状的失真,且随后使用常规几何/数学技术来界定对准标记与丝网印刷图案的实际位置。System controller 101 facilitates control and automation of overall system 100 and may include a central processing unit (CPU) (not shown), memory (not shown), and support circuitry (or I/O) (not shown). The CPU can be one of any form of computer processor used in industrial installations that control various chamber processes and hardware (e.g., conveyor belts, detectors, motors, fluid transfer hardware, etc.), and monitor The system and chamber process (eg, substrate position, process time, detector signal, etc.). The memory is connected to the CPU and can be one or more of readily available memories such as random access memory (RAM), read only memory (ROM), floppy disks, hard disks, or any form of digital storage, whether local or remotely. Software instructions and data can be encoded and stored in the memory to instruct the CPU. Support circuitry may also be coupled to the CPU to support the processor in a conventional manner. Support circuits may also include cache memory, power supplies, clock circuits, input/output circuits, subsystems, and the like. Programs (or computer instructions) readable by the system controller 101 determine which tasks can be performed on the substrate. Preferably, the program is software that can be read by the system controller 101, and the program includes at least one piece of substrate position information for generating and storing, movement sequences of various controlled components, substrate detection system information, and for Generate and store at least one code of any combination of substrate position information, movement sequences of various controlled components, and substrate inspection system information. In an embodiment of the present invention, the system controller 101 includes pattern recognition software to resolve the positions of these alignment marks, as described later with reference to FIGS. 3A-3D . Pattern recognition software can also be used to correct for distortions or changes in the shape of the alignment marks, allowing more accurate data to be collected about the actual location of the screen printed pattern. In one embodiment, pattern recognition software is adapted to measure the distortion of the alignment marks relative to the expected state of the alignment marks by using the images received by the system controller 101 from the inspection assembly 200, and then use conventional geometric/mathematical techniques to Define the actual location of the alignment marks and the silkscreen pattern.

图2为太阳能电池衬底150的正表面155即光接收表面的平面视图。当照射太阳能电池时藉由在太阳能电池中形成的结而产生的电流会流过设置在太阳能电池衬底150的正表面155上的正面接触结构156与设置在太阳能电池150的背表面(未示出)的背面接触结构(未示出)。如图2中所示,正面接触结构156可配置为多个宽间隔的薄金属线或指状物(finger)152,这些薄金属线或指状物152可将电流供应至较大的汇流排(bus bar)151。一般而言,正表面155涂覆有介电材料薄层(例如,氮化硅(SixNy)),该介电材料薄层可作为抗反射涂层(ARC)以将光反射减到最小。因为太阳能电池衬底150的背表面不是光接收表面,所以背面接触结构(未示出)一般不会局限为薄金属线。FIG. 2 is a plan view of the front surface 155 of the solar cell substrate 150 , that is, the light receiving surface. When the solar cell is illuminated, the current generated by the junction formed in the solar cell flows through the front contact structure 156 provided on the front surface 155 of the solar cell substrate 150 and the back surface (not shown) of the solar cell 150. out) backside contact structure (not shown). As shown in FIG. 2, the front contact structure 156 can be configured as a plurality of widely spaced thin metal lines or fingers (fingers) 152, which can supply current to the larger busbar (bus bar) 151. Generally, the front surface 155 is coated with a thin layer of dielectric material (eg, silicon nitride (SixNy)) that acts as an anti-reflective coating (ARC) to minimize light reflection. Because the back surface of the solar cell substrate 150 is not a light receiving surface, back contact structures (not shown) are generally not limited to thin metal lines.

在一实施例中,汇流排151及指状物152在衬底150的正表面155上的安置取决于在丝网印刷腔室102(图1A)中使用的丝网印刷器件相对于印刷嵌套131上的衬底150的定位的对准。丝网印刷器件一般具有包含在丝网印刷腔室102中的丝网印刷掩模,该丝网印刷掩模具有多个孔、狭缝、或其他形成在内部的特征结构,以界定丝网印刷墨或糊浆在衬底150的正表面155上的图案与安置。一般而言,指状物152及汇流排151的丝网印刷图案153在衬底150的表面上的对准取决于丝网印刷器件至衬底150的特征结构(例如衬底150的边缘150A、150B)的对准及定位。举例来说,汇流排151及指状物152的单层丝网印刷图案的安置可具有相对于边缘150A的预期位置X与预期角度取向R,以及相对于衬底150的边缘150B的预期位置Y,如图2所示。在衬底150的前表面155上的指状物152及汇流排151的单层丝网印刷图案与衬底150的前表面155上的预期位置(X,Y)及预期角度取向R的位置误差可描述为位置偏差(ΔX,ΔY)与角度偏差(ΔR)。因此,位置偏差(ΔX,ΔY)为汇流排151与指状物152的图案相对于边缘150A与150B安置的误差,角度偏差(ΔR)为汇流排151与指状物152的印刷图案相对于衬底150的边缘150B的角度对准的误差。在衬底150的正表面155上的汇流排151及指状物152的单层丝网印刷图案的未对准可能影响所形成器件正确执行的能力且因此影响系统100的器件产率。In one embodiment, the placement of the bus bars 151 and fingers 152 on the front surface 155 of the substrate 150 depends on the relative print nesting of the screen-printed device used in the screen-print chamber 102 (FIG. 1A). Alignment of the positioning of the substrate 150 on 131 . A screen-printed device typically has a screen-printing mask contained within the screen-printing chamber 102, the screen-printing mask having a plurality of holes, slits, or other features formed inside to define the screen-printing pattern. Pattern and placement of ink or paste on front surface 155 of substrate 150 . In general, the alignment of the screen-printed pattern 153 of the fingers 152 and bus bars 151 on the surface of the substrate 150 depends on the features of the screen-printed device to the substrate 150 (eg, edge 150A, edge 150A, 150B) alignment and positioning. For example, the placement of a single layer screen printed pattern of bus bars 151 and fingers 152 may have a desired position X and desired angular orientation R relative to edge 150A, and a desired position Y relative to edge 150B of substrate 150 ,as shown in picture 2. The position error of the single layer screen printing pattern of fingers 152 and busbars 151 on the front surface 155 of the substrate 150 from the expected position (X, Y) and the expected angular orientation R on the front surface 155 of the substrate 150 It can be described as position deviation (ΔX, ΔY) and angle deviation (ΔR). Therefore, the positional deviation (ΔX, ΔY) is the error in the placement of the busbar 151 and finger 152 pattern relative to the edges 150A and 150B, and the angular deviation (ΔR) is the error in the printed pattern of the busbar 151 and finger 152 relative to the substrate. The error in the angular alignment of the edge 150B of the bottom 150. Misalignment of the single-layer screen-printed pattern of bus bars 151 and fingers 152 on front surface 155 of substrate 150 may affect the ability of formed devices to perform correctly and thus affect the device yield of system 100 .

为了改良丝网印刷图案与衬底的边缘或其他特征结构对齐的精确性,本发明实施例利用一个或多个光学检测装置、系统控制器101、及一个或多个对准标记,其中这些对准标记在印刷第一层丝网印刷图案期间形成于衬底150的正表面155上,以自动地调整丝网印刷图案相对于衬底的对准。一般而言,藉由使用系统控制器101从一个或多个光学检测装置接收到的信息及系统控制器101控制丝网印刷掩模相对于衬底表面的位置及取向的能力,可以自动化方式将丝网印刷图案153与衬底的表面对准。丝网印刷掩模一般耦接至一个或多个机械致动器102A(图1A),这些机械致动器102A适于以自动化方式在丝网印刷腔室102内将丝网印刷掩模定位及对准至期望位置。在一实施例中,光学检测装置包括检测装置200中所包含的一个或多个部件。在一实施例中,该一个或多个对准标记或基准标记可包括下文在图3A-3D图中所示的多个对准标记160。In order to improve the accuracy of the alignment of the screen printing pattern with the edge or other features of the substrate, embodiments of the present invention utilize one or more optical detection devices, the system controller 101, and one or more alignment marks, wherein these align Alignment marks are formed on the front surface 155 of the substrate 150 during printing of the first layer of the screen printing pattern to automatically adjust the alignment of the screen printing pattern relative to the substrate. In general, by using the information received by the system controller 101 from one or more optical detection devices and the ability of the system controller 101 to control the position and orientation of the screen printing mask relative to the substrate surface, the The screen printing pattern 153 is aligned with the surface of the substrate. The screen printing mask is generally coupled to one or more mechanical actuators 102A (FIG. 1A) adapted to position and position the screen printing mask within the screen printing chamber 102 in an automated fashion. Align to desired position. In an embodiment, the optical detection device includes one or more components included in the detection device 200 . In one embodiment, the one or more alignment marks or fiducial marks may include alignment marks 160 shown below in FIGS. 3A-3D .

图3A例示对准标记160的多个示例,例如对准标记160A-160D,这些对准标记可在汇流排151与指状物152的丝网印刷工艺期间形成于衬底150的正表面155上,并藉由检测组件200用来找出丝网印刷在衬底150的正表面155上的第一层汇流排151与指状物152的位置偏差(ΔX,ΔY)及角度偏差(ΔR)。在一实施例中,这些对准标记160被印刷至衬底150的正表面155的未使用区,以防止这些对准标记160影响所形成的太阳能电池器件的性能。在一实施例中,对准标记160可具有圆形形状(例如,对准标记160A)、矩形形状(例如,对准标记160B)、十字形状(例如,对准标记160C)、或字母数字形状(例如,对准标记160D)。一般期望将标记160的形状选择成使系统控制器101中的图案识别软件能精确地解析对准标记160的实际位置,且因此可根据检测组件200查看到的图像解析衬底150的正表面155上的汇流排151与指状物152的丝网印刷图案的实际位置。系统控制器101随后可根据预期位置(X,Y)解析位置偏差(ΔX,ΔY)并根据预期角度取向R解析角度偏差ΔR,并调整丝网印刷器件中的丝网印刷掩模的对准以将衬底表面上的汇流排151及指状物152的未对准最小化。因此,由于各个丝网印刷嵌套相对于旋转致动器组件131、传入输送带111、及丝网印刷腔室102的位置可改变,因此各个定位在旋转致动器组件130内的丝网印刷嵌套131以及丝网印刷腔室102的多个部件的对准将需要单独的调整。相信藉由使用离散的、期望形状的对准标记(例如,圆形)且这些对准标记定位在衬底的相对边缘上,可更精确地解析沉积层的取向及位置。3A illustrates several examples of alignment marks 160, such as alignment marks 160A-160D, that may be formed on front surface 155 of substrate 150 during the screen printing process of bus bars 151 and fingers 152. , and the detection component 200 is used to find out the positional deviation (ΔX, ΔY) and angular deviation (ΔR) of the first layer bus bar 151 and the finger 152 screen-printed on the front surface 155 of the substrate 150 . In one embodiment, the alignment marks 160 are printed onto unused areas of the front surface 155 of the substrate 150 to prevent the alignment marks 160 from affecting the performance of the formed solar cell device. In one embodiment, the alignment mark 160 may have a circular shape (eg, alignment mark 160A), a rectangular shape (eg, alignment mark 160B), a cross shape (eg, alignment mark 160C), or an alphanumeric shape. (eg, alignment mark 160D). It is generally desirable to choose the shape of the marks 160 such that the pattern recognition software in the system controller 101 can accurately resolve the actual location of the alignment marks 160, and thus the front surface 155 of the substrate 150 from the image viewed by the inspection assembly 200. The actual positions of the screen printing patterns of the busbars 151 and fingers 152 on the top. The system controller 101 can then resolve the positional deviation (ΔX, ΔY) from the expected position (X, Y) and the angular deviation ΔR from the expected angular orientation R, and adjust the alignment of the screen printing mask in the screen printing device to Misalignment of bus bars 151 and fingers 152 on the substrate surface is minimized. Accordingly, since the position of each screen printing nest relative to the rotary actuator assembly 131, the incoming conveyor 111, and the screen printing chamber 102 can be varied, each screen positioned within the rotary actuator assembly 130 Alignment of the printing nest 131 and the various components of the screen printing chamber 102 will require separate adjustments. It is believed that by using discrete, desired-shaped alignment marks (eg, circles) positioned on opposite edges of the substrate, the orientation and position of the deposited layer can be resolved more precisely.

图3B-3D例示在衬底150的正表面155上的对准标记160的多种配置,这些对准标记160可用来改良系统控制器101根据检测组件200所接收到的图像来计算偏差测量值的精确性。图3B例示两个对准标记160被放置在靠近衬底150的正表面155上的相对隅角的一配置。在此实施例中,藉由尽可能远地散布对准标记160,与衬底150上的特征结构(例如边缘150A或150B)的相对误差可更精确地被解析。图3C例示另一配置,在该配置中三个对准标记160被印刷在衬底150的正表面155上靠近多个隅角处以有助于解析汇流排151A与指状物152A的第一图案层的偏差。3B-3D illustrate various configurations of alignment marks 160 on the front surface 155 of the substrate 150 that can be used to improve the system controller 101's calculation of deviation measurements from images received by the inspection assembly 200. the accuracy. FIG. 3B illustrates a configuration in which two alignment marks 160 are placed near opposite corners on the front surface 155 of the substrate 150 . In this embodiment, by spreading the alignment marks 160 as far as possible, relative errors to features on the substrate 150 (eg, edge 150A or 150B) can be more accurately resolved. FIG. 3C illustrates another configuration in which three alignment marks 160 are printed on the front surface 155 of the substrate 150 near a plurality of corners to facilitate resolution of the first pattern of bus bars 151A and fingers 152A. layer deviation.

图3D例示另一配置,在该配置中三个对准标记160被印刷在跨过衬底150的正表面155的多个策略位置。在此实施例中,对准标记160中的两个被定位在平行于边缘150A的直线上,且第三对准标记160定位在垂直于边缘150A的一距离处。在此实施例中,系统控制器101中的图案识别软件产生垂直基准线L1及L2,以提供关于第一层汇流排151A与指状物152A相对于衬底150的位置及取向的附加信息。FIG. 3D illustrates another configuration in which three alignment marks 160 are printed at strategic locations across the front surface 155 of the substrate 150 . In this embodiment, two of the alignment marks 160 are positioned on a line parallel to the edge 150A, and the third alignment mark 160 is positioned at a distance perpendicular to the edge 150A. In this embodiment, pattern recognition software in system controller 101 generates vertical reference lines L1 and L2 to provide additional information about the position and orientation of first layer bus bar 151A and fingers 152A relative to substrate 150 .

在一些情况中,由于沉积丝网印刷图案的机械工艺所致,所沉积的丝网印刷图案与对准标记160倾向在一个或多个方向失真或改变形状。在一实施例中,期望在衬底150的表面上定位各个对准标记160,以使得这些对准标记160的形状变化最低限度地影响系统控制器101中的图案识别软件所收集的位置偏差数据。In some cases, the deposited screen-printed pattern and alignment marks 160 tend to distort or change shape in one or more directions due to the mechanical process by which the screen-printed pattern is deposited. In one embodiment, it is desirable to position the individual alignment marks 160 on the surface of the substrate 150 such that changes in the shape of these alignment marks 160 minimally affect the positional deviation data collected by the pattern recognition software in the system controller 101. .

图4A为旋转致动器组件130的一实施例的示意性等角视图,该图例示检测组件200被定位成检测设置在印刷嵌套131上的衬底150的正表面155的一配置。在一实施例中,相机121被定位在衬底150的正表面155上方,以使得相机121的观察区域122可检测衬底150上的正表面155的至少一个区域。在一实施例中,观察区域122被定位成可观察一个或多个对准标记160及衬底150的特征结构(例如,衬底边缘150A),以向系统控制器101提供关于汇流排151A与指状物152A的第一层丝网印刷图案的偏差的信息。在一实施例中,观察区域122被定位成观察衬底150上的多个特征结构(例如边缘150A与150B)及一个或多个对准标记160,以提供关于多个对准标记160与理想位置的位置偏差的坐标信息,并因而提供在衬底150的正表面155上的汇流排151与指状物152的位置偏差(ΔX,ΔY)与角度偏差ΔR。4A is a schematic isometric view of an embodiment of rotary actuator assembly 130 illustrating a configuration in which detection assembly 200 is positioned to detect front surface 155 of substrate 150 disposed on print nest 131 . In an embodiment, the camera 121 is positioned above the front surface 155 of the substrate 150 such that the viewing area 122 of the camera 121 can detect at least one area of the front surface 155 on the substrate 150 . In one embodiment, viewing region 122 is positioned to view one or more alignment marks 160 and features of substrate 150 (eg, substrate edge 150A) to provide system controller 101 with information about bus bars 151A and Information about the deviation of the first layer of the screen printing pattern of the fingers 152A. In one embodiment, observation region 122 is positioned to observe the plurality of features (eg, edges 150A and 150B) and one or more alignment marks 160 on substrate 150 to provide information about the alignment of plurality of alignment marks 160 with the ideal The coordinate information of the positional deviation of the position, and thus provide the positional deviation (ΔX, ΔY) and the angular deviation ΔR of the busbar 151 and the finger 152 on the front surface 155 of the substrate 150 .

图4B例示光学检测组件200的一实施例,该光学检测组件200用于控制衬底150的正表面155的照明以改良相机121所接收到的位置信息的精确性。在一实施例中,灯123可被取向成使得从灯123投射的光”D”被对准标记160遮蔽所产生的阴影161最小化。一般而言,由于反射光E至少含有从对准标记160反射的第一分量E1及从阴影区域161反射的第二分量E2,因此阴影161可影响对准标记160的测量尺寸。具有宽度W2的阴影161可影响相机121分辨出对准标记160的真实宽度W1与对准标记160的表观宽度W1+W2之间的能力。因此,期望将灯123尽可能靠近垂直(亦即,90度)衬底150的正表面155来取向,以尽可能减小阴影161的尺寸。在一实施例中,灯123以介于约80度至约100度的角度F来取向。在另一实施例中,灯123以介于约85度至约95度的角度F来取向。FIG. 4B illustrates an embodiment of an optical inspection assembly 200 for controlling the illumination of the front surface 155 of the substrate 150 to improve the accuracy of the position information received by the camera 121 . In an embodiment, lights 123 may be oriented such that shadows 161 produced by light “D” projected from lights 123 being obscured by alignment marks 160 are minimized. Generally speaking, since the reflected light E includes at least the first component E1 reflected from the alignment mark 160 and the second component E2 reflected from the shadow area 161 , the shadow 161 can affect the measurement size of the alignment mark 160 . A shadow 161 having a width W2 may affect the ability of the camera 121 to distinguish between the real width W1 of the alignment mark 160 and the apparent width W1+W2 of the alignment mark 160 . Therefore, it is desirable to orient lamps 123 as close as possible to perpendicular (ie, 90 degrees) to front surface 155 of substrate 150 to minimize the size of shadow 161 . In one embodiment, the lights 123 are oriented at an angle F between about 80 degrees and about 100 degrees. In another embodiment, the lights 123 are oriented at an angle F of between about 85 degrees and about 95 degrees.

在一实施例中,亦期望控制从灯123传递的光的波长以有助于改良光学检测组件200精确地解析对准标记160在衬底150的正表面155上的位置的能力。在一实施例中,灯123使用红色LED来照明衬底150的前表面155。当汇流排151与指状物152被印刷在氮化硅(SiN)抗反射涂覆(ARC)层(该抗反射涂覆层通常形成在太阳能电池衬底150的正表面155上)时,红色LED光是特别有效的。在一实施例中,期望将相机121的观察区域122定位在对准标记160上,其中对准标记160被印刷在ARC形成于衬底150的正表面155上的区域中。In one embodiment, it is also desirable to control the wavelength of the light delivered from lamp 123 to help improve the ability of optical detection assembly 200 to accurately resolve the position of alignment mark 160 on front surface 155 of substrate 150 . In one embodiment, the lamp 123 uses a red LED to illuminate the front surface 155 of the substrate 150 . When the bus bars 151 and fingers 152 are printed on a silicon nitride (SiN) anti-reflective coating (ARC) layer (the anti-reflective coating layer is usually formed on the front surface 155 of the solar cell substrate 150), the red LED lights are particularly effective. In an embodiment, it is desirable to position the viewing area 122 of the camera 121 on the alignment mark 160 printed in the area where the ARC is formed on the front surface 155 of the substrate 150 .

图5为旋转致动器组件130的一实施例的示意性等角视图,在该图中检测组件200包括多个光学检测装置。在一实施例中,检测组件200包括三个相机121A、121B及121C,这些相机适于观察衬底150的正表面155的三个不同区域。在一实施例中,相机121A、121B及121C各自被定位成观察衬底150的正表面155的一区域,该区域中包含所印刷的对准标记160。在此实施例中,第一层汇流排151与指状物152的安置的测量精确性可归因于以下所述而得到改良:减少每一个个别观察区域122A、122B及122C的尺寸且因此增加解析度或每单位面积像素数目的能力,同时仍允许对准标记160的位置尽可能地跨衬底150的正表面155散布开,以允许系统控制器101更佳地解析任何对准误差。在一示例中,各个相机121A、121B及121C为三百万像素CCD相机,这些相机被定位成观察衬底的约352mm2的面积,其中衬底具有约24,650mm2的表面积。然而,若有人想要使用单个相机来达成所有对准标记的相同光学解析度,该单个相机必须能观察整个衬底表面而将需要210百万像素CCD相机,这样的相机将过分昂贵和/或不存在。5 is a schematic isometric view of one embodiment of a rotary actuator assembly 130, in which detection assembly 200 includes a plurality of optical detection devices. In one embodiment, the inspection assembly 200 includes three cameras 121A, 121B, and 121C adapted to observe three different regions of the front surface 155 of the substrate 150 . In one embodiment, cameras 121A, 121B, and 121C are each positioned to view an area of front surface 155 of substrate 150 that includes printed alignment marks 160 . In this embodiment, the measurement accuracy of the placement of the first layer of bus bars 151 and fingers 152 can be improved due to the reduction in the size of each of the individual viewing areas 122A, 122B, and 122C and thus the increase in The resolution, or number of pixels per unit area, while still allowing the positions of the alignment marks 160 to be spread out as much as possible across the front surface 155 of the substrate 150 to allow the system controller 101 to better resolve any alignment errors. In one example, each camera 121A, 121B, and 121C is a three megapixel CCD camera positioned to view an area of about 352 mm 2 of the substrate, where the substrate has a surface area of about 24,650 mm 2 . However, if one wanted to use a single camera to achieve the same optical resolution of all alignment marks, this single camera would have to be able to view the entire substrate surface and would require a 210 megapixel CCD camera which would be prohibitively expensive and/or does not exist.

图6为根据本发明一实施例的操作序列600的示意性示图,操作序列600用于在衬底150的正表面155上精确地丝网印刷图案。在操作序列600中所讨论的工艺可因此使用来校准及精确地对准各个衬底支撑装置,例如将用来在印刷腔室102中支撑及定位衬底的丝网印刷嵌套131。本文所讨论的方法可在系统100的初始设立期间、例行维修活动期间用作为沉积工艺的随机品质测试和/或校正工艺偏差的方法。FIG. 6 is a schematic illustration of a sequence of operations 600 for precisely screen printing a pattern on the front surface 155 of the substrate 150 in accordance with an embodiment of the present invention. The process discussed in sequence of operations 600 may thus be used to calibrate and precisely align various substrate support devices, such as screen printing nests 131 that will be used to support and position substrates in printing chamber 102 . The methods discussed herein may be used during initial setup of the system 100, during routine maintenance activities as a random quality test of the deposition process and/or as a method to correct for process deviations.

参照图1B及6,在衬底装载操作602中,第一衬底150沿着路径”A”装载至位于旋转致动器组件130的位置”1”的印刷嵌套131A上。在一示例中,如图1A、1B及5中所示,印刷嵌套131中的支撑材料137适于使用系统控制器101发送的指令,以配合地接收来自传入输送带111中所包含的带116的衬底150。Referring to FIGS. 1B and 6 , in substrate loading operation 602 , a first substrate 150 is loaded onto printing nest 131A at position “ 1 ” of rotary actuator assembly 130 along path “A”. In one example, as shown in FIGS. 1A , 1B, and 5 , the support material 137 in the printing nest 131 is adapted to receive instructions from the incoming conveyor 111 in coordination with instructions sent by the system controller 101 . Substrate 150 with 116 .

接着,在第一对准操作603中,使用被定位在邻近位置”1”处的光学检测组件200来捕获衬底150的空白正表面155和/或一个或多个特征结构(例如图4A或5中所示的边缘150A-150D)的图像,且系统控制器101基于图像使用所收集的数据来调整丝网印刷掩模的位置,以在后续操作中精确地在衬底150的正表面155上沉积期望图案。丝网印刷图案的位置随后基于光学检测组件200所接收到的平台138上的衬底150的所收集到的取向及位置信息。Next, in a first alignment operation 603, the blank front surface 155 of the substrate 150 and/or one or more features (e.g., FIG. 4A or 5), and the system controller 101 uses the collected data to adjust the position of the screen printing mask based on the images to accurately print on the front surface 155 of the substrate 150 in subsequent operations. deposit the desired pattern. The position of the screen printed pattern is then based on the collected orientation and position information of the substrate 150 on the platform 138 received by the optical inspection assembly 200 .

在操作604中,旋转致动器组件130被旋转以使得含有装载衬底150的印刷嵌套131A以顺时针方向沿着路径B1移动至印刷腔室102内的位置”2”。In operation 604 , rotary actuator assembly 130 is rotated such that print nest 131A containing loaded substrate 150 is moved in a clockwise direction along path B1 to position “2” within print chamber 102 .

在操作606中,第一层丝网印刷图案(例如汇流排151、指状物152及至少两个对准标记160)被印刷在衬底150的正表面155上。在一实施例中,三个或多个对准标记160被印刷在衬底150的正表面155上。在一实施例中,第二衬底150被装载至目前位于位置”1”的印刷嵌套131B上。在此实施例中,第二衬底150跟随与第一装载衬底150相同的路径通过整个操作序列。In operation 606 , a first layer of screen printing pattern (eg, bus bars 151 , fingers 152 and at least two alignment marks 160 ) is printed on the front surface 155 of the substrate 150 . In one embodiment, three or more alignment marks 160 are printed on the front surface 155 of the substrate 150 . In one embodiment, the second substrate 150 is loaded onto the print nest 131B that is currently at position "1". In this embodiment, the second substrate 150 follows the same path as the first loaded substrate 150 through the entire sequence of operations.

在操作607中,旋转致动器组件130被旋转成在位置”1”定位印刷嵌套131A,以使得衬底上的丝网印刷图案可藉由光学检测组件200来分析。在一实施例中,操作607包括用来在位置”1”重新定位印刷嵌套131A的一系列操作608-612。在此实施例中,操作607包括一系列附加操作608-610,这些附加操作用来将衬底装载至附连至旋转致动器组件130的各个印刷嵌套131C-131D,如下文所讨论。尽管在操作序列600中所讨论的工艺通常揭示具有四个印刷嵌套131的旋转致动器组件130,但是由于可藉由自动化组件定位的任何数量的衬底支撑装置皆可在不悖离本文所述的发明的基本范畴下使用,此配置不意欲限制印刷嵌套的数量。In operation 607 , the rotary actuator assembly 130 is rotated to position the printing nest 131A at position “1” so that the screen printing pattern on the substrate can be analyzed by the optical inspection assembly 200 . In one embodiment, operation 607 includes a series of operations 608-612 to reposition print nest 131A at position "1". In this embodiment, operation 607 includes a series of additional operations 608-610 for loading substrates into respective printing nests 131C-131D attached to rotary actuator assembly 130, as discussed below. Although the process discussed in sequence of operations 600 generally discloses a rotary actuator assembly 130 having four printing nests 131, any number of substrate supports may be positioned without departing from the context as any number of substrate supports may be positioned by an automated assembly. Used within the basic scope of the invention described, this configuration is not intended to limit the number of printing nests.

在操作608中,旋转致动器组件130被旋转成使得含有第一装载衬底150的印刷嵌套131A以顺时针方向沿着路径B2移动至位置”3”。在一实施例中,含有第二衬底150的印刷嵌套131B移动至位置”2”,用于在第二衬底150上印刷第一层丝网印刷图案。在一实施例中,第三衬底150装载至目前位于位置”1”的印刷嵌套131C上。在此实施例中,第三衬底150跟随与第二衬底150相同的路径通过整个操作序列。In operation 608, the rotary actuator assembly 130 is rotated such that the print nest 131A containing the first load substrate 150 is moved in a clockwise direction along path B2 to position "3". In one embodiment, the printing nest 131B containing the second substrate 150 is moved to position “2” for printing the first layer of screen printing pattern on the second substrate 150 . In one embodiment, the third substrate 150 is loaded onto the print nest 131C currently at position "1". In this embodiment, the third substrate 150 follows the same path as the second substrate 150 through the entire sequence of operations.

在操作610中,旋转致动器组件130被旋转成使得含有第一装载衬底150的印刷嵌套131A以顺时针方向沿着路径B3移动至位置”4”。在一实施例中,含有第二衬底150的印刷嵌套131B移动至位置”3”。在一实施例中,第三装载衬底150被移至位置”2”,用于在第三装载衬底150上印刷第一层丝网印刷图案。在一实施例中,第四衬底150装载至目前位于位置”1”的印刷嵌套131D上。在此实施例中,第四衬底150跟随与第三衬底150相同的路径通过整个操作序列。In operation 610, the rotary actuator assembly 130 is rotated such that the print nest 131A containing the first load substrate 150 is moved in a clockwise direction along path B3 to position "4". In one embodiment, print nest 131B containing second substrate 150 is moved to position "3". In one embodiment, the third loading substrate 150 is moved to position “2” for printing the first layer of screen printing pattern on the third loading substrate 150 . In one embodiment, the fourth substrate 150 is loaded onto the print nest 131D currently at position "1". In this embodiment, the fourth substrate 150 follows the same path as the third substrate 150 through the entire sequence of operations.

在步骤612中,旋转致动器组件130被旋转成使得含有第一装载衬底150的印刷嵌套131A以顺时针方向沿着路径B4移回位置”1”。In step 612, the rotary actuator assembly 130 is rotated such that the print nest 131A containing the first load substrate 150 is moved back to position "1" along path B4 in a clockwise direction.

在操作614中,藉由定位在邻近位置”1”的光学检测组件200来分析丝网印刷图案沉积层的对准。在一实施例中,光学检测装置200捕获印刷在衬底150的正表面155上的至少两个对准标记160的图像。这些图像可藉由系统控制器101中的图像识别软件分析。随后,系统控制器101根据丝网印刷图案的预期位置(X,Y)与预期角度取向R计算位置偏差(ΔX,ΔY)与角度偏差ΔR,丝网印刷图案的预期位置(X,Y)与预期角度取向R藉由相对于衬底150的特征结构(例如一个或多个边缘150A-150D,或形成这些特征结构的隅角)分析至少两个对准标记160,而储存在系统控制器101的存储器中。位置偏差(ΔX,ΔY)与角度偏差ΔR数据随后可被储存于系统控制器101的存储器中。随后,系统控制器101使用取自此分析的位置偏差(ΔX,ΔY)与角度偏差ΔR信息来调整丝网印刷腔室102内的丝网印刷掩模的位置,以使后续定位在印刷嵌套131A上的经处理的衬底将具有更精确放置的丝网印刷图案。In operation 614, the alignment of the screen-printed pattern deposition layer is analyzed by the optical detection assembly 200 positioned adjacent to position "1". In an embodiment, the optical inspection device 200 captures images of at least two alignment marks 160 printed on the front surface 155 of the substrate 150 . These images can be analyzed by image recognition software in the system controller 101 . Subsequently, the system controller 101 calculates the position deviation (ΔX, ΔY) and the angle deviation ΔR according to the expected position (X, Y) and the expected angular orientation R of the screen printing pattern, and the expected position (X, Y) and The expected angular orientation R is stored in the system controller 101 by analyzing at least two alignment marks 160 relative to features of the substrate 150, such as one or more edges 150A-150D, or the corners forming these features. in the memory. The positional deviation (ΔX, ΔY) and angular deviation ΔR data can then be stored in the memory of the system controller 101 . The system controller 101 then uses the positional deviation (ΔX, ΔY) and angular deviation ΔR information derived from this analysis to adjust the position of the screen printing mask within the screen printing chamber 102 so that subsequent positioning within the printing nest The processed substrate on 131A will have a more precisely placed screen printed pattern.

接着,当这些图案后续重新定位至位置”1”时(即,操作616),沉积在各个衬底上的丝网印刷图案的对准(其中这些衬底定位在各个印刷嵌套131B-131D上)分别藉由光学检测组件200来分析(即,操作617)。在操作616期间,旋转致动器组件130被旋转成使得期望印刷嵌套(例如,附图标记131B-131D)旋转回到位置”1”,以使得定位在期望丝网印刷嵌套上的衬底上的沉积层可藉由光学检测组件200来检测。在各个操作617期间,定位于印刷嵌套131B-131D上的各个衬底上所执行的工艺与上述的操作614相同或相似。针对各个印刷嵌套131A-131D收集的位置偏差(ΔX,ΔY)与角度偏差ΔR数据因而储存于系统控制器101的存储器中,以用于定位于各个相应印刷嵌套中的后续待处理衬底。Then, when these patterns are subsequently repositioned to position "1" (i.e., operation 616), the alignment of the screen-printed patterns deposited on the respective substrates positioned on the respective print nests 131B-131D ) are respectively analyzed by the optical detection component 200 (ie, operation 617). During operation 616, the rotary actuator assembly 130 is rotated such that the desired printing nest (e.g., reference numerals 131B-131D) is rotated back to position "1" such that the liner positioned on the desired screen printing nest The deposited layer on the bottom can be detected by the optical detection unit 200 . During each operation 617, the same or similar processes performed on each substrate positioned on the print nests 131B-131D are the same as or similar to operation 614 described above. The positional deviation (ΔX, ΔY) and angular deviation ΔR data collected for each printing nest 131A- 131D are thus stored in the memory of the system controller 101 for positioning subsequent substrates to be processed in each corresponding printing nest .

本领域技术人员应了解对准操作603是用来校正衬底150相对于印刷嵌套131中的平台138(图5)的位置变化,且操作614、617是用来校正使用印刷掩模形成的印刷图案相对于衬底的特征结构的位置误差。因此,尽管对准操作613通常用于印刷腔室102中的所有待处理衬底以校正平台138上的衬底150的位置的变化,可偶尔执行操作614和/或操作617以超时校正或调整丝网印刷图案相对于衬底的安置的变化。如上所述,因此,本文所描述的方法可在系统100的初始设立期间、例行维修活动期间用作为沉积工艺的随机品质测试和/或校正工艺偏差的方法。在一实施例中,系统控制器101是用来以某期望间隔自动分析一系列、或一序列待处理衬底内丝网印刷图案的取向及位置,其中这些衬底在系统100内的各个印刷嵌套131上处理。在一配置中,系统控制器适于使用从定位在相同丝网印刷嵌套上的衬底处收集到的最新的取向及位置数据,来改变沉积至定位在印刷嵌套上的各个后续待处理衬底上的丝网印刷图案的取向和/或位置。在一示例中,系统控制器适于分析与再调整每个衬底、每隔一个衬底、每三个衬底、每十个衬底的、每百个衬底、或其他期望间隔的定向丝网印刷图案。It will be appreciated by those skilled in the art that alignment operation 603 is used to correct for variations in the position of substrate 150 relative to stage 138 ( FIG. 5 ) in print nest 131 and that operations 614, 617 are used to correct The positional error of the printed pattern relative to the features of the substrate. Thus, while alignment operation 613 is typically used to print all substrates to be processed in chamber 102 to correct for variations in the position of substrate 150 on stage 138, operation 614 and/or operation 617 may occasionally be performed to correct or adjust over time. Variations in the placement of the screen-printed pattern relative to the substrate. As noted above, therefore, the methods described herein may be used during initial setup of the system 100 , during routine maintenance activities as a random quality test of the deposition process and/or as a method of correcting for process deviations. In one embodiment, the system controller 101 is configured to automatically analyze, at some desired interval, the orientation and position of the screen-printed pattern within a series, or sequence, of substrates to be processed, where the substrates are individually printed within the system 100. Nest 131 is processed on. In one arrangement, the system controller is adapted to use the latest orientation and position data collected from substrates positioned on the same screen printing nest to alter the substrate deposited on each subsequent to-be-processed substrate positioned on the same screen printing nest. Orientation and/or position of the screen printed pattern on the substrate. In one example, the system controller is adapted to analyze and readjust the orientation of every substrate, every other substrate, every third substrate, every tenth substrate, every hundred substrates, or other desired intervals Screen printing pattern.

在一实施例中,光学检测组件200适于执行对准操作603,第二光学检测组件201适于执行操作614及617。在一实施例中,在操作607期间,旋转致动器组件130被旋转成使得印刷嵌套重新定位在位置”3”,从而衬底上的丝网印刷图案可藉由光学检测组件201分析。在此配置中,系统控制器101从各个检测组件200、201接收到的取向及位置结果可能需要被校准或调整,以使得由两个不同位置及对准的检测组件所产生的不想要的测量误差不会影响自动对准工艺结果的精确性。在一示例中,期望将取向及位置的误差最小化,以使得衬底上的图案层的安置可小于约±60微米(m),且较佳小于约±15m。In one embodiment, the optical detection assembly 200 is adapted to perform alignment operation 603 , and the second optical detection assembly 201 is adapted to perform operations 614 and 617 . In one embodiment, during operation 607 , the rotary actuator assembly 130 is rotated such that the printing nest is repositioned at position “3” so that the screen printing pattern on the substrate can be analyzed by the optical inspection assembly 201 . In this configuration, the orientation and position results received by the system controller 101 from the various detection assemblies 200, 201 may need to be calibrated or adjusted such that unwanted measurements produced by two differently positioned and aligned detection assemblies Errors do not affect the accuracy of the auto-alignment process results. In one example, it is desirable to minimize errors in orientation and position so that the placement of the patterned layer on the substrate can be less than about ±60 microns (m), and preferably less than about ±15 m.

替代系统配置Alternate system configuration

尽管本发明实施例在图1A与图1B中绘示具有单一输入及单一输出的系统100,但本发明的实施例亦可相同地应用于具有双输入及双输出的系统700,如图7所绘示。Although the embodiment of the present invention shows a system 100 with a single input and a single output in FIG. 1A and FIG. draw.

图7为系统700的平面俯视图,系统700可结合本发明实施例使用以在衬底150的正表面155上形成期望图案(例如,汇流排151及指状物152)。如图所示,系统700不同于图1A及图1B所示的系统100,在系统700中包括两个传入输送带111及两个输出输送带112。系统700不同于系统100之处还在于系统700包括两个丝网印刷腔室102。然而,本发明实施例关于系统700的操作序列实质上与系统100中的操作序列相同。举例来说,关于第一衬底150的操作序列600与先前参照图6所述相同,在开始时装载至位置”1”。然而,操作序列600可同时运行,以将第二衬底150初始装载至位置”3”。7 is a top plan view of a system 700 that may be used in conjunction with embodiments of the present invention to form desired patterns (eg, bus bars 151 and fingers 152 ) on front surface 155 of substrate 150 . As shown, the system 700 is different from the system 100 shown in FIGS. 1A and 1B , in that the system 700 includes two incoming conveyor belts 111 and two outgoing conveyor belts 112 . System 700 also differs from system 100 in that system 700 includes two screen printing chambers 102 . However, the operation sequence of the system 700 in the embodiment of the present invention is substantially the same as the operation sequence in the system 100 . For example, the sequence of operations 600 for the first substrate 150 is the same as previously described with reference to FIG. 6, initially loaded to position "1". However, the sequence of operations 600 may run concurrently to initially load the second substrate 150 to position "3".

虽然前述内容是针对本发明实施例进行的,但可在不背离本发明的基本范围及由所附权利要求书所确定的范围的情况下,设计出其他及进一步的实施例。While the foregoing has been described with respect to an embodiment of the invention, other and further embodiments may be devised without departing from the basic scope of the invention and its scope as defined by the appended claims.

Claims (21)

1. automatization's depositing operation, comprises the following steps:
Positioning the first substrate on substrate support, wherein said first substrate has at least one edge;
With a pattern by the surface of material layer depositions to described first substrate, wherein said pattern includes at least Two alignment marks;
System controller is used to determine that described at least two alignment mark is relative to described in described first substrate The actual orientation at least one edge and position, and it is inclined to calculate the position between physical location and desired location Angular deviation between difference and actual orientation and expection angular orientation;And
Use described position deviation and the information of described angular deviation, relative at least one of the second substrate In the adjusted orientation at edge or adjusted position, with a pattern by material layer depositions to described second substrate On surface, the orientation or the position ratio that are wherein deposited on the material on described second substrate are deposited on described first lining The orientation of the material at the end or position are closer to described expection orientation or described desired location.
2. automatization as claimed in claim 1 depositing operation, it is characterised in that described material includes a plurality of Conductive material line.
3. automatization as claimed in claim 2 depositing operation, it is characterised in that described substrate is polygon And each in described at least two labelling is printed on different corner regions.
4. automatization as claimed in claim 1 depositing operation, it is characterised in that determine described at least two The actual orientation of alignment mark and the step of position comprise the following steps: capture the optical picture of described alignment mark As and identify the physical characteristic of alignment mark on described optical imagery.
5. automatization as claimed in claim 4 depositing operation, it is characterised in that before printing ground floor, Expection orientation or the desired location of described alignment mark is determined relative at least one edge of described substrate.
6. automatization as claimed in claim 4 depositing operation, it is characterised in that at least three alignment mark It is printed on the surface of described substrate.
7. automatization as claimed in claim 6 depositing operation, it is characterised in that determine described at least two The actual orientation of alignment mark and the step of position comprise the following steps: two in described alignment mark right Build the first datum line between fiducial mark note, and between the 3rd alignment mark and described first datum line, build the Two datum lines, wherein said second datum line is vertical with described first datum line.
8. automatization's depositing operation, comprises the following steps:
Positioning the first substrate on substrate support, wherein said first substrate has at least one edge;
System controller is used to analyze orientation and the position of described first substrate on substrate support;
With pattern by the surface of material layer depositions to described first substrate, wherein said pattern includes at least two Individual alignment mark using is connect during analyzing the orientation of described substrate and position by described system controller The data received are directed at at least one edge of described first substrate making described pattern;
Described system controller is used to determine actual orientation and the physical location of sedimentary on described first substrate;
Calculate deposition material layer actual orientation and physical location and expection orientation and desired location between inclined Difference;And
Use the deviation calculated with pattern by material layer depositions to the second substrate, so that being deposited on described The orientation of the orientation of the material on the second substrate or the position material on described first substrate than being deposited on or position Put closer to described expection orientation or described desired location.
9. automatization as claimed in claim 8 depositing operation, it is characterised in that described material includes a plurality of Conductive material line.
10. automatization as claimed in claim 9 depositing operation, it is characterised in that described substrate is many Each in limit shape and described at least two labelling is printed on different corner regions.
11. automatization as claimed in claim 8 depositing operations, it is characterised in that described in determining at least The actual orientation of two alignment marks and the step of position comprise the following steps: capture the light of described alignment mark Learn image and identify the physical characteristic of alignment mark on described optical imagery.
12. automatization as claimed in claim 8 depositing operations, it is characterised in that at printing ground floor Before, expection orientation or the desired location of described alignment mark is determined relative at least one edge of substrate.
13. automatization as claimed in claim 8 depositing operations, it is characterised in that at least three is directed at Labelling is printed on the surface of described substrate.
14. automatization as claimed in claim 8 depositing operations, it is characterised in that described in determining at least The actual orientation of two alignment marks and the step of position comprise the following steps: two in described alignment mark The first datum line, and structure between the 3rd alignment mark and described first datum line is built between individual alignment mark Building the second datum line, wherein said second datum line is vertical with described first datum line.
15. 1 kinds of automatization's depositing operations, comprise the following steps:
The first substrate being arranged on substrate support is positioned at primary importance, wherein said first substrate tool There is at least one edge;
Use Systems for optical inspection and system controller analyzing and positioning at the substrate support of described primary importance On the orientation of described first substrate and position;
With a pattern by material layer depositions to being arranged at described the of the second position on described substrate support On the surface of one substrate, wherein said pattern includes that at least two alignment mark using is controlled by described system Device data received by during the orientation analyzing described first substrate and position are come and described first substrate At least one edge alignment;
Described first substrate and described substrate support are positioned at described primary importance;
Use Systems for optical inspection and system controller to determine and be positioned in described the first of described primary importance The actual orientation of the sedimentary on substrate and physical location;
Calculate deposition material layer actual orientation and physical location and expection orientation and desired location between inclined Difference;And
Using the deviation calculated with a pattern by material layer depositions to the second substrate, wherein said second serves as a contrast The end, is set in the second position on described substrate support, so that being deposited on described second substrate The orientation of the orientation of material or the position material on described first substrate than being deposited on or position are closer to described Expection orientation or described desired location.
16. automatization as claimed in claim 15 depositing operations, it is characterised in that farther include Following steps:
With pattern by material layer depositions at least one or more substrate, each in described substrate is by phase Continue and be arranged on described substrate support;
After at least one or more substrate described deposits material layer, with pattern by material layer depositions to volume On outer-lining bottom;
Described additional substrate and described substrate support are positioned at described primary importance;
Described Systems for optical inspection and described system controller is used to determine the sedimentary on described additional substrate Actual orientation and physical location, wherein said additional substrate is positioned in described primary importance;
Calculate deposition material layer actual orientation and physical location and expection orientation and desired location between inclined Difference;And
Use the deviation calculated with other patterns by material layer depositions to the second additional substrate, wherein said Second additional substrate is arranged in the described second position on described substrate support, so that being deposited on institute State orientation or position the taking than the material being deposited on described additional substrate of material on the second additional substrate To or position closer to described expection orientation or described desired location.
17. automatization as claimed in claim 16 depositing operations, it is characterised in that described substrate is Each in polygon and described at least two labelling is printed on different corner regions.
18. automatization as claimed in claim 15 depositing operations, it is characterised in that described in determining extremely Few actual orientation of two alignment marks and the step of position comprise the following steps: capture described alignment mark Optical imagery also identifies the physical characteristic of described alignment mark on described optical imagery.
19. automatization as claimed in claim 15 depositing operations, it is characterised in that in printing first Before Ceng, determine expection orientation or the expection of described alignment mark relative at least one edge of described substrate Position.
20. automatization as claimed in claim 15 depositing operations, it is characterised in that at least three pair Fiducial mark note is printed on the surface of described substrate.
21. automatization as claimed in claim 15 depositing operations, it is characterised in that described in determining extremely Few actual orientation of two alignment marks and the step of position comprise the following steps: in described alignment mark The first datum line is built between two alignment marks, and between the 3rd alignment mark and described first datum line Building the second datum line, wherein said second datum line is vertical with described first datum line.
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