CN102313521A - Method for measuring thickness of organic protective film - Google Patents
Method for measuring thickness of organic protective film Download PDFInfo
- Publication number
- CN102313521A CN102313521A CN201110077624A CN201110077624A CN102313521A CN 102313521 A CN102313521 A CN 102313521A CN 201110077624 A CN201110077624 A CN 201110077624A CN 201110077624 A CN201110077624 A CN 201110077624A CN 102313521 A CN102313521 A CN 102313521A
- Authority
- CN
- China
- Prior art keywords
- protective film
- organic protective
- thickness
- measuring
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 230000003321 amplification Effects 0.000 claims description 2
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
Landscapes
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention relates to a method for measuring thickness of an organic protective film. The method comprises the following steps of: (1) uniformly coating a layer of electroconductive substances on the surface of the organic protective film; (2) performing ion peeling and cutting on local parts of the organic protective film treated in the step (1); and (3) locally amplifying the organic protective film treated in the step (2) and measuring the thickness of the cross section of the organic protective film. According to the method for measuring the thickness of the organic protective film in the invention, by uniformly coating a layer of electroconductive substances on the surface of the organic protective film and performing ion peeling and cutting on the local parts of the organic protective film, the precision in measuring the thickness of the organic protective film is increased; and by locally amplifying the organic protective film and measuring the thickness of the cross section of the organic protective film, the thickness uniformity of the organic protective film can be observed microcosmically.
Description
Technical field
The present invention relates to a kind of measuring method, belong to the detection technique field.Be particularly related to a kind of organic protective film method for measuring thickness.
Background technology
The method of measuring various organic membrane thickness at present adopts the measurement of Mechanical Contact formula mostly, because organic membrane has certain flexibility, has bigger error during measurement, will be accurate to 0.1um during measurement and must use other method.And the thickness of organic protective film generally has only tens microns, adopts traditional Mechanical Contact formula measuring method to be difficult to satisfy the measuring accuracy requirement.
Summary of the invention
The technical matters that the present invention will solve is: a kind of organic protective film method for measuring thickness is provided, changes the precision that measuring method can improve the organic protective film thickness measure.
In order to solve the problems of the technologies described above, the present invention provides a kind of organic protective film method for measuring thickness, and it may further comprise the steps:
1), plates the material of one deck conduction equably on the organic protective film surface;
2), ion is carried out in the part of the organic protective film handled through step 1) and peel off cutting;
3), to through step 2) organic protective film of handling carries out the thickness in local amplification and measurement organic protective film cross section.
According to organic protective film method for measuring thickness of the present invention, the material of the conduction in the said step 1) is gold or platinum.
According to organic protective film method for measuring thickness of the present invention, said step 2) in ion peel off cutting and adopt the FIB cutting mode.
Organic protective film method for measuring thickness of the present invention plates the material of one deck conduction equably and ion is carried out in its part peel off cutting through being employed in the organic protective film surface, improves the precision of organic protective film thickness measure.And, can also observe the homogeneity of organic protective film thickness from microcosmic through organic protective film being carried out the local thickness that amplifies and measure the organic protective film cross section.
Embodiment
Below combine accompanying drawing that the present invention is made more detailed description with embodiment.Present embodiment only is the description to best mode for carrying out the invention, scope of the present invention is not had any restriction.
Embodiment:
The material of one deck conduction is plated on the organic protective film surface equably, be preferably platinum or gold.Then the appearance organic protective film is peeled off cutting with FIB, again the part is carried out in the cross section of the organic protective film of well cutting and spin measurement by magnification.
Organic protective film method for measuring thickness of the present invention plates the material of one deck conduction equably and ion is carried out in its part peel off cutting through being employed in the organic protective film surface, improves the precision of organic protective film thickness measure.And, can also observe the homogeneity of organic protective film thickness from microcosmic through organic protective film being carried out the local thickness that amplifies and measure the organic protective film cross section.
Claims (3)
1. organic protective film method for measuring thickness is characterized in that: may further comprise the steps:
1), plates the material of one deck conduction equably on the organic protective film surface;
2), ion is carried out in the part of the organic protective film handled through step 1) and peel off cutting;
3), to through step 2) organic protective film of handling carries out the thickness in local amplification and measurement organic protective film cross section.
2. organic protective film method for measuring thickness according to claim 1 is characterized in that: the material of the conduction in the said step 1) is gold or platinum.
3. organic protective film method for measuring thickness according to claim 1 and 2 is characterized in that: the ion said step 2) is peeled off cutting and is adopted the FIB cutting mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110077624A CN102313521A (en) | 2011-03-29 | 2011-03-29 | Method for measuring thickness of organic protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110077624A CN102313521A (en) | 2011-03-29 | 2011-03-29 | Method for measuring thickness of organic protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102313521A true CN102313521A (en) | 2012-01-11 |
Family
ID=45426905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110077624A Pending CN102313521A (en) | 2011-03-29 | 2011-03-29 | Method for measuring thickness of organic protective film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102313521A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106767628A (en) * | 2015-12-18 | 2017-05-31 | 深圳市汇顶科技股份有限公司 | The thickness detecting method and system of a kind of fingerprint sensor protective layer |
| CN111220103A (en) * | 2020-01-21 | 2020-06-02 | 珠海斗门超毅实业有限公司 | Method for measuring surface treatment thickness of circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3973122A (en) * | 1974-06-17 | 1976-08-03 | Ixcon Inc. | Measuring apparatus |
| CN101875111A (en) * | 2009-04-30 | 2010-11-03 | 比亚迪股份有限公司 | Spray powder, sprayed product, spraying method and anodic oxidation metal piece |
| CN101969035A (en) * | 2009-07-27 | 2011-02-09 | 中芯国际集成电路制造(上海)有限公司 | Method for detecting Damascus structure of semiconductor device |
| CN102052906A (en) * | 2009-11-10 | 2011-05-11 | 中芯国际集成电路制造(上海)有限公司 | Preparation method of observation sample of device insulated isolation region for transmission electron microscope |
-
2011
- 2011-03-29 CN CN201110077624A patent/CN102313521A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3973122A (en) * | 1974-06-17 | 1976-08-03 | Ixcon Inc. | Measuring apparatus |
| CN101875111A (en) * | 2009-04-30 | 2010-11-03 | 比亚迪股份有限公司 | Spray powder, sprayed product, spraying method and anodic oxidation metal piece |
| CN101969035A (en) * | 2009-07-27 | 2011-02-09 | 中芯国际集成电路制造(上海)有限公司 | Method for detecting Damascus structure of semiconductor device |
| CN102052906A (en) * | 2009-11-10 | 2011-05-11 | 中芯国际集成电路制造(上海)有限公司 | Preparation method of observation sample of device insulated isolation region for transmission electron microscope |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106767628A (en) * | 2015-12-18 | 2017-05-31 | 深圳市汇顶科技股份有限公司 | The thickness detecting method and system of a kind of fingerprint sensor protective layer |
| CN106767628B (en) * | 2015-12-18 | 2019-04-19 | 深圳市汇顶科技股份有限公司 | A kind of thickness detecting method and system of fingerprint sensor protective layer |
| CN111220103A (en) * | 2020-01-21 | 2020-06-02 | 珠海斗门超毅实业有限公司 | Method for measuring surface treatment thickness of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120111 |