CN102300384A

CN102300384A - Multi-layer printed circuit board

Info

Publication number: CN102300384A
Application number: CN2010102078337A
Authority: CN
Inventors: 施瑞坤; 洪颖福; 陈鹤文
Original assignee: HUANXU ELECTRONICS CO Ltd; Universal Global Scientific Industrial Co Ltd
Current assignee: HUANXU ELECTRONICS CO Ltd; Universal Global Scientific Industrial Co Ltd
Priority date: 2010-06-23
Filing date: 2010-06-23
Publication date: 2011-12-28

Abstract

The invention discloses a multi-layer printed circuit board, which comprises a lower layer substrate, a plurality of intermediate substrates, an upper layer substrate and a plurality of conductive materials, wherein the intermediate substrates are stacked one above another and are stacked on the lower layer substrate; each of the intermediate substrates is provided with a first side face; the first side face of each of the intermediate substrates is provided with a plurality of first through grooves; the upper layer substrate is stacked on the intermediate substrates; and the plurality of conductive materials are arranged in the first through grooves respectively. In the invention, the conductive materials do not occupy any space on the top surface of the upper layer substrate, so that more electronic elements can be arranged on the top surface of the upper layer substrate.

Description

The multiple field printed circuit board (PCB)

Technical field

The present invention relates to a kind of printed circuit board (PCB), particularly a kind of multiple field printed circuit board (PCB).

Background technology

See also shown in the accompanying drawing 1, the end face of general printed circuit board (PCB) (printed circuit board, or multilayerPCB) 10A more is provided with a plurality of metallic contact 12A except being provided with a plurality of different types of electronic component 11A.Metallic contact 12A can be convenient to the overall performance of engineer's testing printed circuit board 10A, but has occupied the segment space of printed circuit board (PCB) 10A end face, but reduce in the space that makes printed circuit board (PCB) 10A end face electronic component 11A be provided with.

Therefore based on this, the inventor finds that above-mentioned disappearance can improve, and proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned defective.

Summary of the invention

The technical problem to be solved in the present invention is in order to overcome the few defective in space that but the printed circuit board top surface electronic component is provided with in the prior art, provide a kind of multiple field printed circuit board (PCB), but its end face to have the electronic component setting of more space.

The present invention solves above-mentioned technical problem by following technical proposals:

A kind of multiple field printed circuit board (PCB), its characteristics are, comprising: laminar substrate once; A plurality of Intermediate substrates that pile up mutually, it is stacked on this time laminar substrate, and those Intermediate substrates respectively have one first side, respectively are provided with most first grooves on first side of those Intermediate substrates; One top substrate layer, it is stacked on those Intermediate substrates; And a plurality of electric conducting materials, it is arranged at respectively in those first grooves.

Preferably, those electric conducting materials fill up those first grooves respectively, and those electric conducting materials are plated in respectively on the inner edge surface of those first grooves.

Preferably, this top substrate layer has one second side, and this second side is provided with a plurality of second grooves, the position of corresponding those first grooves in the position of those second grooves, and those electric conducting materials are arranged at respectively in those second grooves in addition.

Preferably, those electric conducting materials fill up those second grooves respectively.

Preferably, those electric conducting materials are plated in respectively on the inner edge surface of those second grooves.

Positive progressive effect of the present invention is: the test contacts of this multiple field printed circuit board (PCB) (electric conducting material in the groove) is arranged on the side of printed circuit board (PCB), therefore the end face of multiple field printed circuit board (PCB) (top substrate layer) does not have test contacts, or have only a little part of top edge that contact is arranged, so but the multiple field top surface of printed circuit board has the electronic component setting of more space.

For enabling further to understand feature of the present invention and technology contents, see also following relevant detailed description of the present invention and accompanying drawing, yet accompanying drawing is only for reference and explanation usefulness, as restriction content of the present invention.

Description of drawings

Fig. 1 is the top view of traditional printing circuit board.

Fig. 2 is the three-dimensional exploded view of the multiple field printed circuit board (PCB) of first preferred embodiment of the present invention.

Fig. 3 is the three-dimensional combination figure of the multiple field printed circuit board (PCB) of first preferred embodiment of the present invention.

Fig. 4 is the three-dimensional exploded view of the multiple field printed circuit board (PCB) of second preferred embodiment of the present invention.

Fig. 5 is the three-dimensional combination figure of the multiple field printed circuit board (PCB) of second preferred embodiment of the present invention.

[primary clustering symbol description]

Known:

The 10A printed circuit board (PCB)

The 11A electronic building brick

The 12A metallic contact

The present invention:

10 times laminar substrates

20 Intermediate substrates

21 first sides

22 first grooves

30 top substrate layer

31 second sides

32 second grooves

40 electric conducting materials

Embodiment

Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to describe technical scheme of the present invention in detail.

As shown in Figures 2 and 3, be first preferred embodiment of multiple field printed circuit board (PCB) of the present invention.This multiple field printed circuit board (PCB) can comprise: once laminar substrate 10, a plurality of Intermediate substrate 20, a top substrate layer 30 and a plurality of electric conducting material 40.

The architectural feature of the following multiple field of explanation earlier printed circuit board (PCB), and then the characteristics of explanation multiple field printed circuit board (PCB).

Laminar substrate 10, Intermediate substrate 20 and top substrate layer 30 can be a square template respectively under those, and its material can be bakelite, glass fibre or plastic or other material.Those Intermediate substrates 20 reciprocally are stacked, and then are stacked to down on the laminar substrate 10, and this top substrate layer 30 is stacked on those Intermediate substrates 20.

Those Intermediate substrates 20 respectively have one first side (for example leading flank) 21 of exposing, and refer to that just each Intermediate substrate 20 respectively has one first side 21.And on first side 21 of those Intermediate substrates 20, respectively be concaved with a plurality of first grooves (through groove) 22, and just refer to, respectively be provided with a plurality of first grooves 22 on first side 21 of each Intermediate substrate 20.The cross section of those first grooves 22 can be shapes such as semicircle or half elliptic.Those first grooves 22 can link to each other with the part metals circuit (figure does not show) that is coated on Intermediate substrate 20 end faces or the bottom surface in addition.

Those electric conducting materials 40 can be metal etc., and it is arranged at respectively in those first grooves 22, refer to that just each electric conducting material 40 respectively is arranged in one of them first groove 22.The mode that is provided with then can be plated on the inner edge surface of first groove 22 for electric conducting material 40, or can fill up first groove 22 as in more detail.And those electric conducting materials 40 can be followed the metallic circuit (figure does not show) on the Intermediate substrate 20 to contact and be reached electric connection.See that from the side neighbouring electric conducting material 40 forms the contact (pad) of a strip.

It more than is the architectural feature of the multiple field printed circuit board (PCB) of first preferred embodiment, and the characteristics that this multiple field printed circuit board (PCB) is had are: electric conducting material 40 is arranged in first groove 22 of multiple field printed circuit board (PCB) side, do not occupy any space of multiple field top surface of printed circuit board (end face of top substrate layer 30 just), but so the multiple field top surface of printed circuit board more space electronic component setting is arranged.And the electric conducting material 40 that is positioned at the side can be used as test contacts that debug uses, ground contact that electromagnetic protection is used or is used for other structural ornament design.

As shown in Figure 4 and Figure 5, second preferred embodiment for multiple field printed circuit board (PCB) of the present invention, the difference of itself and first preferred embodiment is: top substrate layer 30 is provided with most second grooves 32, and those electric conducting materials 40 are arranged at respectively in those second grooves 32 in addition, are described in detail as follows.

Top substrate layer 30 has one second side 31 of corresponding first side 21, and when therefore first side 21 was leading flank, second side 31 also was a leading flank.On this second side 31, be concaved with a plurality of second grooves 32, the position of corresponding those first grooves 22 in the position of those second grooves 32, therefore neighbouring first groove 22 and second groove 32 can be connected.Those electric conducting materials 40 also can be arranged at respectively in those second grooves 32, can be plated on the inner edge surface of those second grooves 32, or fill up those second grooves 32.And the electric conducting material 40 that is located among second groove 32 can link to each other with the electric conducting material 40 that is located among first groove 22 of below.

The multiple field printed circuit board (PCB) of second preferred embodiment has the characteristics of similar first preferred embodiment, just 40 of electric conducting materials occupy the space of the few part of end face of multiple field printed circuit board (PCB) (top substrate layer 30), because 40 of electric conducting materials are distributed in the edge sub-fraction of top substrate layer 30.Similarly, the electric conducting material 40 that is positioned at the side can be used as test contacts that debug uses, ground contact that electromagnetic protection is used or is used for other structural ornament design.

The multiple field printed circuit board (PCB) is except above two kinds of embodiment, still have other to change situation, for example Intermediate substrate 20 can be provided with first groove 22 and electric conducting material 40 except first side (for example leading flank) 11, and other side (for example trailing flank) also can be simultaneously for it.In like manner, top substrate layer 30 also can be provided with second groove 32 and electric conducting material 40 simultaneously in other sides.

In sum, multiple field printed circuit board (PCB) of the present invention is provided with electric conducting material on the side, but reduces or do not take the space of end face electronic component setting, makes end face that more more intensive electronic components can be set.

The above only is preferred embodiment of the present invention; do not limit to scope of patent protection of the present invention; therefore the equivalence of all utilizations specification of the present invention and graphic content generation changes, and all in like manner all is contained in the scope of the present invention, states explanation in the lump.

Claims

1. a multiple field printed circuit board (PCB) is characterized in that, comprising:

Laminar substrate once;

A plurality of Intermediate substrates that pile up mutually, it is stacked on this time laminar substrate, and those Intermediate substrates respectively have one first side, respectively are provided with a plurality of first grooves on first side of those Intermediate substrates;

One top substrate layer, it is stacked on those Intermediate substrates; And

A plurality of electric conducting materials, it is arranged at respectively in those first grooves.

2. multiple field printed circuit board (PCB) as claimed in claim 1 is characterized in that, those electric conducting materials fill up those first grooves respectively.

3. multiple field printed circuit board (PCB) as claimed in claim 1 is characterized in that those electric conducting materials are plated in respectively on the inner edge surface of those first grooves.

4. as claim 1,2 or 3 described multiple field printed circuit board (PCB)s, it is characterized in that, this top substrate layer has one second side, this second side is provided with a plurality of second grooves, the position of corresponding those first grooves in the position of those second grooves, those electric conducting materials are arranged at respectively in those second grooves in addition.

5. multiple field printed circuit board (PCB) as claimed in claim 4 is characterized in that, those electric conducting materials fill up those second grooves respectively.

6. multiple field printed circuit board (PCB) as claimed in claim 4 is characterized in that those electric conducting materials are plated in respectively on the inner edge surface of those second grooves.