CN102299233A - Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle - Google Patents
Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle Download PDFInfo
- Publication number
- CN102299233A CN102299233A CN201110118536XA CN201110118536A CN102299233A CN 102299233 A CN102299233 A CN 102299233A CN 201110118536X A CN201110118536X A CN 201110118536XA CN 201110118536 A CN201110118536 A CN 201110118536A CN 102299233 A CN102299233 A CN 102299233A
- Authority
- CN
- China
- Prior art keywords
- led chip
- heat sink
- metal heat
- circular groove
- power led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 16
- 238000009833 condensation Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 claims abstract description 29
- 239000007787 solid Substances 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 18
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000013078 crystal Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 230000003287 optical effect Effects 0.000 abstract 2
- 230000005494 condensation Effects 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to good-condensation high-power LED (light emitting diode) lamp beads without yellow circle. The LED lamp beads installed in a secondary optical reflective cup comprise a metal heat sink, an LED chip fixed in the metal heat sink, pins on the two sides of the metal heat sink, a metallic bonding wire for connecting the LED chip and the pins, a fluorescent powder layer coated on the LED chip and outermost packaging material, wherein the center of the metal heat sink is provided with a circular groove or a solid-crystal circular region of a cylindrical convex platform for fixing the LED chip, solid crystal on the center of the LED chip in the circular groove or on the cylindrical convex platform has high coincidence degree with the parabola spherical surface focus of the secondary optical reflective cup, so that the condensation degree is better; the fluorescent powder is coated in the circular groove or on the cylindrical convex platform which is used to fix the LED chip on the metal heat sink, so that the irradiation can reach naturally circular effect and the irradiation effect is better; and meanwhile, the light-emitting region can be lessened so that the light-emitting path on the sides of the periphery of the chip can be shorter and the yellow circle is not easy to emerge.
Description
Technical field
The present invention relates to a kind of LED lamp pearl, particularly a kind of not with the good large-power LED light bead of yellow circle optically focused.
Background technology
Large-power LED light bead is used in flashlight or the mine lamp, and irradiation hot spot and degree of concentration are all had very high requirement, and its radiation response is good to present even circular light spot.At present, when applying fluorescent material on metal heat sink, existing technology is difficult to control (as shown in Figure 1) to the scope of fluorescent material coating area and the diffusion of coating back, makes fluorescent material apply well beyond chip area, can't form point-source of light preferably; The parabola focus registration of fluorescent material coating area and light fixture secondary optics reflector is not high, causes spotlight effect bad; Simultaneously,, make that the side opticpath is longer around the chip, form yellow circle easily because it is bigger to apply the zone of fluorescent material.
Summary of the invention
The purpose of this invention is to provide a kind of luminous large-power LED light bead that evenly, does not enclose and have good spotlight effect with Huang.
Technical scheme of the present invention is: a kind of with the good large-power LED light bead of yellow circle optically focused, be installed in the secondary optics reflector of parabola sphere the pin of the led chip that comprises metal heat sink, be fixed on the metal heat sink center, metal heat sink both sides, the metal bonding that connects led chip and pin goes between, is coated in phosphor powder layer and outermost encapsulating material above the led chip; The metal heat sink center is provided with the solid brilliant circle of fixed L ED chip, Gu the diameter of brilliant circle is added 0.2-0.4 mm for the led chip length of side.Described solid brilliant circle is circular groove or is the cylindrical protrusions platform, Gu the center of brilliant led chip on circular groove or cylindrical protrusions platform overlaps with the parabola sphere focus of described secondary optics reflector.
The degree of depth of described circular groove is 100-500 μ m, is preferably 200-300 μ m.The height of described cylindrical protrusions platform is 300-600 μ m, is preferably 400-500 μ m.
The invention has the beneficial effects as follows:
1, the solid brilliant circle that is positioned at metal heat sink center fixation led chip comprises circular groove or cylindrical protrusions platform, the fluorescent material that is coated on circular groove or the cylindrical protrusions platform can long range diffusion, has reduced light-emitting zone greatly;
2, the center of solid brilliant led chip on circular groove or cylindrical protrusions platform and the parabola sphere focus registration height of described secondary optics reflector, optically focused Du Gengjia;
3, fluorescent material is applied in the circular cell territory of led chip of circular groove or cylindrical protrusions platform, makes radiation response have the nature circle, and radiation response is better;
4, owing to apply the regional smaller of fluorescent material, it is shorter to make that side sends around the led chip light goes out light path from the fluorescent material cover layer around the chip, is not easy to form yellow the circle.
Description of drawings
The schematic diagram of the existing technology packaged LED lamp pearl of Fig. 1.
Fig. 2 is the structural representation (the A-A section of Fig. 3) of LED lamp pearl that is provided with the crystal bonding area of round groove.
Fig. 3 is the vertical view (the secondary optics reflector does not draw) of Fig. 2.
Fig. 4 is the structural representation (the B-B section of Fig. 5) of LED lamp pearl that is provided with the crystal bonding area of cylindrical protrusions platform.
Fig. 5 is the vertical view (the secondary optics reflector does not draw) of Fig. 4.
In the accompanying drawing: 1-metal heat sink, 2-circular groove crystal bonding area, 3-led chip, 4-phosphor powder layer, 5-pin, 6-round raised platforms crystal bonding area, 7-secondary optics reflector, 8-metal bonding lead-in wire, 9-outer encapsulating material.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
Embodiment 12-3 shows as accompanying drawing: a kind of with the good large-power LED light bead of yellow circle optically focused, be installed in the secondary optics reflector 7 of parabola sphere the led chip 3 that comprises metal heat sink 1, be fixed on the metal heat sink center, metal heat sink both sides pin 5, connect led chip 3 and pin 5 metal bonding lead-in wire 8, be coated in phosphor powder layer 4 and outermost encapsulating material 9 above the led chip.In degree of depth of metal heat sink 1 center punching press is the solid brilliant circle of groove 2 conducts of 200-300 μ m circle, and the diameter of circular groove 2 is that led chip 3 maximal sides add 0.2-0.4mm; Led chip 3 is solid brilliant on circular groove 2, Gu the center of brilliant led chip on circular groove 2 and the parabola sphere focus registration height of described secondary optics reflector 7, optically focused Du Gengjia.Fluorescent material is applied in the circular cell territory of circular groove 2, can long range diffusion, reduced light-emitting zone greatly, and to go out light path shorter for side around the chip, is not easy to form yellow circle, and makes radiation response have nature circle, better effects if.
Adopt other encapsulating materials 9 commonly used such as silica gel or epoxy resin to carry out outermost encapsulation subsequently.
Embodiment 24-5 shows as accompanying drawing: a kind of with the good large-power LED light bead of yellow circle optically focused, be installed in the secondary optics reflector 7 of parabola sphere the led chip 3 that comprises metal heat sink 1, be fixed on the metal heat sink center, metal heat sink both sides pin 5, connect led chip 3 and pin 5 metal bonding lead-in wire 8, be coated in phosphor powder layer 4 and outermost encapsulating material 9 above the led chip.At height of metal heat sink 1 center punching press is the solid brilliant circle of cylindrical protrusions platform 6 conducts of 400-500 μ m, and the diameter of cylindrical protrusions platform 6 is that led chip 3 maximal sides add 0.2-0.4mm; Led chip 3 is solid brilliant on cylindrical protrusions platform 6, Gu the center of brilliant led chip on cylindrical protrusions platform 6 and the parabola sphere focus registration height of described secondary optics reflector 7, optically focused Du Gengjia.Fluorescent material is applied in the circular cell territory on the cylindrical protrusions platform 6, can long range diffusion, reduced light-emitting zone greatly, and to go out light path shorter for side around the chip, is not easy to form yellow circle, and makes radiation response have nature circle, better effects if.Adopt other encapsulating materials 9 commonly used such as silica gel or epoxy resin to carry out outermost encapsulation subsequently.
Claims (6)
1. one kind is not enclosed the good large-power LED light bead of optically focused with Huang, be installed in the secondary optics reflector (7) of parabola sphere and comprise metal heat sink (1), be fixed on the led chip (3) at metal heat sink center, the pin of metal heat sink both sides (5), the metal bonding lead-in wire (8) that connects led chip (3) and pin (5), be coated in phosphor powder layer (4) and outermost encapsulating material (9) above the led chip, it is characterized in that: metal heat sink (1) center is provided with the solid brilliant circle of fixed L ED chip, Gu the diameter of brilliant circle is added 0.2-0.4 mm for the led chip length of side.
2. described a kind of not with the good large-power LED light bead of yellow circle optically focused according to claim 1, it is characterized in that: described solid brilliant circle is circular groove (2) or is cylindrical protrusions platform (6), Gu the center of brilliant led chip on circular groove (2) or cylindrical protrusions platform (6) overlaps with the parabola sphere focus of described secondary optics reflector (7).
3. described a kind of not with the good large-power LED light bead of yellow circle optically focused according to claim 2, it is characterized in that: the degree of depth of described circular groove (2) is 100-500 μ m.
4. described a kind of not with the good large-power LED light bead of yellow circle optically focused according to claim 3, it is characterized in that: the degree of depth of described circular groove (2) is preferably 200-300 μ m.
5. described a kind of not with the good large-power LED light bead of yellow circle optically focused according to claim 2, it is characterized in that: the height of described cylindrical protrusions platform (6) is 300-600 μ m.
6. described a kind of not with the good large-power LED light bead of yellow circle optically focused according to claim 5, it is characterized in that: the height of described cylindrical protrusions platform (6) is preferably 400-500 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110118536XA CN102299233A (en) | 2011-05-10 | 2011-05-10 | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110118536XA CN102299233A (en) | 2011-05-10 | 2011-05-10 | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102299233A true CN102299233A (en) | 2011-12-28 |
Family
ID=45359520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110118536XA Pending CN102299233A (en) | 2011-05-10 | 2011-05-10 | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102299233A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050224822A1 (en) * | 2003-07-04 | 2005-10-13 | Wen-Huang Liu | Light-emitting diode array having an adhesive layer |
| CN2840332Y (en) * | 2005-10-18 | 2006-11-22 | 陈建华 | The light-focusing type large-power light-emitting diodes |
| CN201536111U (en) * | 2009-07-03 | 2010-07-28 | 福建中科万邦光电股份有限公司 | Packaging structure of high-performance high-power LED |
| CN201739794U (en) * | 2010-01-18 | 2011-02-09 | 赵翼 | Integrated package high-power LED illuminating lamp |
| CN202221777U (en) * | 2011-05-10 | 2012-05-16 | 江西科技师范学院 | High-power led lamp bead |
-
2011
- 2011-05-10 CN CN201110118536XA patent/CN102299233A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050224822A1 (en) * | 2003-07-04 | 2005-10-13 | Wen-Huang Liu | Light-emitting diode array having an adhesive layer |
| CN2840332Y (en) * | 2005-10-18 | 2006-11-22 | 陈建华 | The light-focusing type large-power light-emitting diodes |
| CN201536111U (en) * | 2009-07-03 | 2010-07-28 | 福建中科万邦光电股份有限公司 | Packaging structure of high-performance high-power LED |
| CN201739794U (en) * | 2010-01-18 | 2011-02-09 | 赵翼 | Integrated package high-power LED illuminating lamp |
| CN202221777U (en) * | 2011-05-10 | 2012-05-16 | 江西科技师范学院 | High-power led lamp bead |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11035525B2 (en) | LED light bulb | |
| US20110148270A1 (en) | Spherical light output LED lens and heat sink stem system | |
| WO2017186150A1 (en) | Led light bulb | |
| CN100489386C (en) | Non-reflection high light extracting rate unit WLED power expanding type high power WLED light source | |
| JP2012231036A (en) | Light-emitting device and luminaire using the same | |
| CN201751679U (en) | High-power LED packaging single lamp with batwing light distribution function | |
| US9605814B2 (en) | Lighting module | |
| US9562653B2 (en) | Lighting device | |
| CN201527991U (en) | LED with toroidal lens | |
| CN201590435U (en) | LED encapsulation structure | |
| CN204905249U (en) | High color rendering index's COB light source | |
| CN102299233A (en) | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle | |
| CN102646784A (en) | Light emitting diode device | |
| CN102148321A (en) | LED (Light Emitting Diode) white light fluorescent cap and manufacturing method thereof | |
| CN107221531A (en) | The encapsulating structure and UVLED lamps of a kind of UVLED lamps | |
| TWI565102B (en) | Light-emitting diode module and lamp using the same | |
| CN202221777U (en) | High-power led lamp bead | |
| CN202957299U (en) | LED packaging structure | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN102148319A (en) | High-power white light emitting diode (LED) light source packaging structure | |
| CN201303008Y (en) | Led packaging structure | |
| CN104864340B (en) | The LED automobile wick and LED automobile light source of a kind of adjustable angle | |
| CN102176505A (en) | Integrated LED light source system | |
| CN203517365U (en) | Scattering LED bulb lamp | |
| CN203162616U (en) | Light source plate of light emitting diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111228 |