CN102298431A - Computer heat radiation control system and method - Google Patents
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Abstract
一种计算机散热控制系统及方法,该系统安装并运行于计算机中,该计算机包括CPU、风扇及温度传感器。该系统包括:参数设置模块,设置CPU的温度标准差、第一逻辑温度及第二逻辑温度;温度侦测模块,用于通过温度传感器侦测出CPU的工作温度,以及根据温度标准差、第一逻辑温度与第二逻辑温度判断CPU的工作温度是否需要调整;及调节模块,用于当CPU的工作温度需要调整时,通过调节风扇在运转模式下的风扇转速以及CPU的工作频率来调整CPU的工作温度。实施本发明,能够调整出四种不同风扇运转模式下计算机的系统温度,以及抑制风扇在加速运转和减速运转时产生的系统噪音。
A computer cooling control system and method, the system is installed and run in a computer, the computer includes a CPU, a fan and a temperature sensor. The system includes: a parameter setting module, which sets the temperature standard deviation, the first logic temperature and the second logic temperature of the CPU; A logic temperature and a second logic temperature determine whether the operating temperature of the CPU needs to be adjusted; and an adjustment module is used to adjust the CPU by adjusting the fan speed of the fan in the operating mode and the operating frequency of the CPU when the operating temperature of the CPU needs to be adjusted. working temperature. By implementing the invention, the system temperature of the computer under four different fan operation modes can be adjusted, and the system noise generated when the fan is accelerated and decelerated can be suppressed.
Description
技术领域 technical field
本发明涉及一种控制电子装置的散热系统及方法,特别是关于一种计算机散热控制系统及方法。The invention relates to a heat dissipation system and method for controlling electronic devices, in particular to a computer heat dissipation control system and method.
背景技术 Background technique
计算机系统和服务器产业迅速发展,对于系统风扇的控制要求愈来愈严格。尤其是在讲求节能减排的时代里,对于节能及声音质量规范也愈趋严格,因此产品必须经过工程设计来改善系统耗能及声音质量以符合产品规范及客户要求。计算机系统中除必要元件之外,例如主机板、处理器、硬盘等,还必须具备散热元件。而目前计算机系统所使用的散热元件,主要以风扇为主,风扇对于计算机系统中所扮演的角色及重要性可归纳出三点:(1)计算机系统能保持稳定的运转及良好的散热;(2)计算机系统的耗能占有一定重要的指标;(3)对计算机系统的声音质量控制有关键性的影响。其中,风扇行为控制逻辑,是影响风扇在耗能及噪音方面的控制最主要的因素,如风扇行为控制逻辑不当,将造成计算机系统的散热耗能而增加系统的声音质量不良,有时会因为计算机系统过热而当机。With the rapid development of the computer system and server industry, the control requirements for system fans are becoming more and more stringent. Especially in the era of energy saving and emission reduction, the standards for energy saving and sound quality are becoming more and more stringent. Therefore, products must be engineered to improve system energy consumption and sound quality to meet product specifications and customer requirements. In addition to the necessary components in a computer system, such as a motherboard, a processor, a hard disk, etc., a cooling component must also be provided. At present, the heat dissipation components used in computer systems are mainly fans. The role and importance of fans in computer systems can be summarized in three points: (1) the computer system can maintain stable operation and good heat dissipation; 2) The energy consumption of the computer system occupies a certain important index; (3) It has a key influence on the sound quality control of the computer system. Among them, the fan behavior control logic is the most important factor affecting the control of the fan's energy consumption and noise. If the fan behavior control logic is improper, it will cause the heat dissipation and energy consumption of the computer system and increase the sound quality of the system. The system overheated and crashed.
发明信息invention information
鉴于以上内容,有必要提供一种计算机散热控制系统及方法,通过控制逻辑温度调整出四种不同风扇运转模式下计算机的系统温度,以及抑制风扇在加速运转和减速运转时产生的系统噪音。In view of the above, it is necessary to provide a computer heat dissipation control system and method, which can adjust the system temperature of the computer in four different fan operation modes by controlling the logic temperature, and suppress the system noise generated by the fan when it is accelerating and decelerating.
所述的计算机散热控制系统,安装并运行于计算机中,该计算机包括CPU、风扇及温度传感器。该系统包括:参数设置模块,用于设置CPU的温度标准差、第一逻辑温度及第二逻辑温度;温度侦测模块,用于通过温度传感器侦测出CPU的工作温度,以及根据温度标准差、第一逻辑温度与第二逻辑温度判断CPU的工作温度是否需要调整;及调节模块,用于当CPU的工作温度需要调整时,通过调节风扇在运转模式下的风扇转速以及CPU的工作频率来调整CPU的工作温度。The computer heat dissipation control system is installed and operated in a computer, and the computer includes a CPU, a fan and a temperature sensor. The system includes: a parameter setting module, which is used to set the temperature standard deviation, the first logic temperature and the second logic temperature of the CPU; a temperature detection module, which is used to detect the operating temperature of the CPU through a temperature sensor, and , the first logical temperature and the second logical temperature determine whether the operating temperature of the CPU needs to be adjusted; and the adjustment module is used to adjust the fan speed in the operation mode of the fan and the operating frequency of the CPU when the operating temperature of the CPU needs to be adjusted. Adjust the operating temperature of the CPU.
所述的计算机散热控制方法包括步骤:设置CPU的温度标准差、第一逻辑温度及第二逻辑温度;通过温度传感器侦测CPU的工作温度;根据温度标准差、第一逻辑温度与第二逻辑温度判断CPU的工作温度是否需要调整;当CPU的工作温度需要调整时,通过调节风扇在运转模式下的风扇转速及CPU的工作频率来调整CPU的工作温度。The computer heat dissipation control method includes the steps of: setting the temperature standard deviation, the first logic temperature and the second logic temperature of the CPU; detecting the operating temperature of the CPU through a temperature sensor; according to the temperature standard deviation, the first logic temperature and the second logic temperature Temperature determines whether the working temperature of the CPU needs to be adjusted; when the working temperature of the CPU needs to be adjusted, adjust the working temperature of the CPU by adjusting the fan speed in the operation mode of the fan and the working frequency of the CPU.
相较于现有技术,本发明所述的计算机散热控制系统及方法,通过调整控制逻辑温度的值即可调整出四种不同风扇运转模式下CPU的工作温度,以及通过时间延迟能够抑制风扇在加速运转和减速运转时产生的系统噪音。Compared with the prior art, the computer heat dissipation control system and method of the present invention can adjust the operating temperature of the CPU in four different fan operation modes by adjusting the value of the control logic temperature, and the time delay can inhibit the fan from running. System noise during acceleration and deceleration.
附图说明 Description of drawings
图1是本发明计算机散热控制系统较佳实施例的实施架构图。FIG. 1 is an implementation structure diagram of a preferred embodiment of the computer heat dissipation control system of the present invention.
图2是风扇的运转模式的示意图。FIG. 2 is a schematic diagram of the operation mode of the fan.
图3是在不受环境温度影响下的计算机散热控制方法较佳实施例的流程图。Fig. 3 is a flowchart of a preferred embodiment of a method for controlling heat dissipation of a computer without being affected by ambient temperature.
图4是在受环境温度影响下的计算机散热控制方法较佳实施例的流程图。Fig. 4 is a flowchart of a preferred embodiment of a method for controlling heat dissipation of a computer under the influence of ambient temperature.
主要元件符号说明Explanation of main component symbols
计算机 1computer 1
计算机散热控制系统 10Computer
参数设置模块 101Parameter setting module 101
温度侦测模块 102Temperature detection module 102
调节模块 103
风扇 20
温度传感器 30
中央处理器 40CPU 40
内存 50RAM 50
具体实施方式 Detailed ways
如图1所示,是本发明计算机散热控制系统10较佳实施例的实施架构图。在本实施例中,该计算机散热控制系统10安装并运行于计算机1中,该计算机1是一种桌上型计算机(PC)、笔记本计算机(Notebook)、服务器(Server)或工作站(Workstation)等。所述的计算机1还包括风扇20、温度传感器30、中央处理器(central processing unit,CPU)40、以及内存50。该风扇20是一种散热装置,用于在计算机1工作时为计算机1内部的电子元件,例如CPU 40以及内存50等,提供散热功能。该温度传感器30用于实时侦测在计算机1工作时的系统温度,其包括CPU40、内存50的温度、或者其它内部电子元件的工作温度。为了便于描述,本发明仅以CPU 40的工作温度作为计算机1的系统温度。As shown in FIG. 1 , it is an implementation structure diagram of a preferred embodiment of a computer heat
所述的计算机散热控制系统10能够控制计算机1不受环境温度影响(即Close loop状态)下的系统温度(参考图3所示),以及计算机1受环境温度影响(即Open loop状态下)下的系统温度(参考图4所示)。在本实施例中,该计算机散热控制系统10包括参数设置模块101、温度侦测模块102以及调节模块103。The computer heat
所述的参数设置模块101用于设置CPU 40的温度标准差、第一逻辑温度T1及第二逻辑温度T2,以及设置第一参考温度T3、第二参考温度T4及第三参考温度T5,其中T3<T4<T5。所述温度标准差值是生产厂商(例如Intel公司)为CPU所定义的温度标准差值,例如Intel CPU的温度标准差值为“-16”。该参数设置模块101还用于设置环境温度范围,例如最高环温值为60℃,以及最低环温值-20℃。The parameter setting module 101 is used to set the temperature standard deviation of the CPU 40, the first logical temperature T1 and the second logical temperature T2, and set the first reference temperature T3, the second reference temperature T4 and the third reference temperature T5, wherein T3<T4<T5. The temperature standard deviation value is the temperature standard deviation value defined by the manufacturer (such as Intel Corporation) for the CPU, for example, the temperature standard deviation value of the Intel CPU is "-16". The parameter setting module 101 is also used to set the ambient temperature range, for example, the highest ambient temperature value is 60°C, and the lowest ambient temperature value is -20°C.
所述的温度侦测模块102用于通过温度传感器30侦测出CPU 40的工作温度及计算机1所处的环境温度。该温度侦测模块102还用于在计算机1不受环境温度影响下根据CPU 40的温度标准差、第一逻辑温度T1与第二逻辑温度T2判断CPU的工作温度是否需要调整。该温度侦测模块102还用于在计算机1受环境温度影响下判断CPU 40的工作温度是否介于环境温度范围内。The temperature detection module 102 is used to detect the operating temperature of the CPU 40 and the ambient temperature of the computer 1 through the
所述的调节模块103用于当CPU 40的工作温度需要调整时,通过控制风扇20在不同风扇运转模式下的风扇转速来调整CPU 40的工作温度,以及通过调节CPU 40的工作频率来调整CPU 40的工作温度。所述的风扇20的运转模式包括预设模式(Default mode)、效率模式(Performancemode)、静音模式(Acoustic mode)以及节能模式(Power saving mode)。The
在本实施例中,调节模块103根据CPU 40的工作温度来增加或降低CPU 40的工作频率。例如,当工作温度T_PECI大于第一参考温度T3时,调节模块103使CPU 40的工作频率降低30%;当工作温度T_PECI大于第二参考温度T4时,调节模块103使CPU 40的工作频率降低70%;当工作温度T_PECI大于第三参考温度T5时,调节模块103使CPU 40的工作频率降低100%,从而使计算机1自动关机。调节模块103还用于当工作温度T_PECI大于第三参考温度T5时,发出CPU 40的工作温度过高的警示讯息,以提醒用户因温度过高需关闭计算机1。In this embodiment, the
在本实施例中,调节模块103还根据CPU 40的工作温度以及环境温度来增加或降低风扇20的转速。例如,当CPU 40的工作温度大于第二参考温度T4时,调节模块103增加风扇20的转速至V1=PWM×a%,其中PWM为风扇转速最高占比;当CPU 40的工作温度小于第一参考温度T3时,调节模块103降低风扇20的转速至V1=PWM×b%;当CPU 40的工作温度大于环境温度时,调节模块103增加风扇转速至V3=PWM×c%;当CPU 40的工作温度小于环境温度时,调节模块103降低风扇转速至V3=PWM×d%。In this embodiment, the
如图2所示,是风扇20的运转模式的示意图。一般地,每一个CPU均具有一个温度标准差(标示为“T_control”),该温度标准差值是生产厂商(例如Intel公司)为CPU所定义的温度标准差值,不同的CPU定义了不同的温度标准差值。本实施例以Intel CPU为例,该温度标准差值为“-16”,亦即温度标准差值T_control=-16。假设CPU 40的工作温度差值为ΔT=T1-T2,其中T1及T2为控制风扇20运转模式下CPU 40的逻辑温度。在本实施例中,当-30<ΔT<-20时,风扇20的运转模式处于效率模式(Performance mode);当-20<ΔT<-15时,风扇20的运转模式处于静音模式(Acoustic mode);当-17<ΔT<-10时,风扇20的运转模式处于节能模式(Power saving mode);当-25<ΔT<-16时,风扇20的运转模式处于预设模式(Default mode)。因此,经由调整CPU 40的逻辑温度T1及T2值,就可以调整出风扇20的四种不同运转模式,从而满足计算机1在各种不同状态下的需求。As shown in FIG. 2 , it is a schematic diagram of the operation mode of the
如图3-4所示,是本发明计算机散热控制方法较佳实施例的流程图。在本实施例中,该散热控制方法能够控制计算机1不受环境温度影响(即Close loop状态)下的工作温度(参考图3),以及计算机1受环境温度影响(即Open loop状态下)下的工作温度(参考图4)。As shown in Fig. 3-4, it is a flow chart of a preferred embodiment of the computer heat dissipation control method of the present invention. In this embodiment, the heat dissipation control method can control the operating temperature (refer to FIG. 3 ) of the computer 1 not affected by the ambient temperature (that is, the Close loop state), and the computer 1 is affected by the ambient temperature (that is, the Open loop state). operating temperature (refer to Figure 4).
参考图3所示,是在Close loop状态下的计算机散热控制方法流程图。步骤S100,参数设置模块101设置温度参量(标示为“T_temp”),并将使温度参量T_temp等于温度标准差值T_control。此外,参数设置模块101设置第一逻辑温度T1、第二逻辑温度T2、第一参考温度T3、第二参考温度T4及第三参考温度T5,其中T3<T4<T5。例如,用户可以透过参数设置模块101设置T1=0、T2=8、T3=T_control+5、T3=T_control+8及T5=T_control+10等。Referring to FIG. 3 , it is a flowchart of a computer heat dissipation control method in the Close loop state. In step S100, the parameter setting module 101 sets a temperature parameter (marked as "T_temp"), and makes the temperature parameter T_temp equal to the temperature standard deviation T_control. In addition, the parameter setting module 101 sets the first logical temperature T1, the second logical temperature T2, the first reference temperature T3, the second reference temperature T4 and the third reference temperature T5, wherein T3<T4<T5. For example, the user can set T1=0, T2=8, T3=T_control+5, T3=T_control+8 and T5=T_control+10 through the parameter setting module 101 .
步骤S101,温度侦测模块102通过温度传感器30侦测出CPU 40的工作温度(标示为“T_PECI”),该工作温度是计算机1在工作状态下的实际温度。步骤S102,温度侦测模块102判断CPU 40的工作温度T_PECI是否大于控制温度T_control与第一逻辑温度T1的和,亦即T_PECI>T_control+T1。若工作温度T_PECI大于控制温度T_control与第一逻辑温度T1的和,执行步骤S103;否则,执行步骤S109。In step S101, the temperature detection module 102 detects the working temperature of the CPU 40 (marked as "T_PECI") through the
步骤S103,温度侦测模块102判断CPU 40的工作温度T_PECI是否大于第一参考温度T3,亦即T_PECI>T3,并且风扇转速是否为最高转速。若工作温度T_PECI大于第一参考温度T3且风扇转速是最高转速,执行步骤S104;否则,执行步骤S105。In step S103, the temperature detection module 102 determines whether the working temperature T_PECI of the CPU 40 is greater than the first reference temperature T3, that is, T_PECI>T3, and whether the fan speed is the maximum speed. If the working temperature T_PECI is greater than the first reference temperature T3 and the fan speed is the highest speed, go to step S104 ; otherwise, go to step S105 .
步骤S104,调节模块103降低CPU 40的工作频率。在本实施例中,当工作温度T_PECI大于第一参考温度T3时,调节模块103使CPU 40的工作频率降低30%,当工作温度T_PECI大于第二参考温度T4时,调节模块103使CPU 40的工作频率降低70%;当工作温度T_PECI大于第三参考温度T5时,调节模块103使CPU 40的工作频率降低100%,从而使计算机1自动关机。Step S104, the
步骤S105,温度侦测模块102判断工作温度T_PECI是否大于温度参量T_temp,亦即T_PECI>T_temp。若工作温度T_PECI大于温度参量T_temp,执行步骤S106;否则,执行步骤S101。In step S105, the temperature detection module 102 determines whether the working temperature T_PECI is greater than the temperature parameter T_temp, that is, T_PECI>T_temp. If the working temperature T_PECI is greater than the temperature parameter T_temp, go to step S106; otherwise, go to step S101.
步骤S106,调节模块103增加风扇转速至V1=PWM×a%,其中,PWM为风扇转速最高占比。步骤S107,参数设置模块101设置温度参量T_temp=T_PECI。步骤S108,温度侦测模块102延迟第一段时间d1后,执行步骤S101继续侦测风扇20在转速V1下CPU 40的工作温度T_PECI。In step S106, the
步骤S109,温度侦测模块102判断工作温度T_PECI是否小于控制温度T_control与第二逻辑温度T2的差,亦即T_PECI<T_control-T2。若工作温度T_PECI小于控制温度T_control与第二逻辑温度T2的差,执行步骤S110;否则,执行步骤S101。In step S109 , the temperature detection module 102 determines whether the working temperature T_PECI is smaller than the difference between the control temperature T_control and the second logic temperature T2 , that is, T_PECI<T_control−T2 . If the working temperature T_PECI is smaller than the difference between the control temperature T_control and the second logical temperature T2, execute step S110; otherwise, execute step S101.
步骤S110,调节模块103降低风扇转速至V2=PWM×b%。步骤S111,温度侦测模块102延迟第二段时间d2后,执行步骤S101继续侦测风扇20在转速V2下CPU 40的工作温度T_PECI。In step S110, the
步骤S112,温度侦测模块102判断工作温度T_PECI是否大于第三参考温度T5,亦即T_PECI>T5。若工作温度T_PECI大于第三参考温度T5,执行步骤S115;否则,执行步骤S113。In step S112 , the temperature detection module 102 determines whether the working temperature T_PECI is greater than the third reference temperature T5 , that is, T_PECI>T5. If the working temperature T_PECI is greater than the third reference temperature T5, go to step S115; otherwise, go to step S113.
步骤S113,温度侦测模块102判断工作温度T_PECI是否小于等于第二参考温度T4,亦即T_PECI≤T4。若工作温度T_PECI小于等于第二参考温度T4,执行步骤S114。若工作温度T_PECI大于第二参考温度T4,步骤S104。In step S113 , the temperature detection module 102 determines whether the working temperature T_PECI is less than or equal to the second reference temperature T4 , that is, T_PECI≦T4. If the working temperature T_PECI is less than or equal to the second reference temperature T4, step S114 is executed. If the working temperature T_PECI is greater than the second reference temperature T4, step S104.
步骤S114,调节模块103增加CPU 40的工作频率。当工作温度T_PECI大于第三参考温度T5时,步骤S115,调节模块103发出CPU 40的工作温度过高的警示讯息,以提醒用户因温度过高需关闭计算机1。Step S114, the
参考图4所示,是在Open loop状态下的计算机散热控制方法流程图。步骤S200,参数设置模块101设置环境温度范围,亦即最高环温值(标示为“T_high”),最低环温值(标示为“T_low”)。步骤S201,温度侦测模块102通过温度传感器30侦测出计算机1所处的环境温度(标示为“Ta”),以及CPU 40的工作温度T_PECI。Referring to FIG. 4, it is a flow chart of a computer heat dissipation control method in an Open loop state. In step S200, the parameter setting module 101 sets the ambient temperature range, that is, the highest ambient temperature value (marked as “T_high”) and the lowest ambient temperature value (marked as “T_low”). In step S201, the temperature detection module 102 detects the ambient temperature (marked as “Ta”) of the computer 1 and the operating temperature T_PECI of the CPU 40 through the
步骤S202,温度侦测模块102判断CPU 40的工作温度T_PECI是否大于等于最高环温值T_high+1,亦即T_PECI≥T_high+1。若系统温度T大于等于最高环温值T_PECI_high+1,执行步骤S203;否则,执行步骤S207。In step S202, the temperature detection module 102 determines whether the operating temperature T_PECI of the CPU 40 is greater than or equal to the highest ambient temperature value T_high+1, that is, T_PECI≥T_high+1. If the system temperature T is greater than or equal to the highest ambient temperature value T_PECI_high+1, execute step S203; otherwise, execute step S207.
步骤S203,温度侦测模块102判断CPU 40的工作温度T_PECI是否大于环境温度Ta,亦即T_PECI>Ta。若CPU 40的工作温度T_PECI大于环境温度Ta,则执行步骤S204;否则流程结束。In step S203, the temperature detection module 102 determines whether the operating temperature T_PECI of the CPU 40 is greater than the ambient temperature Ta, that is, T_PECI>Ta. If the operating temperature T_PECI of the CPU 40 is greater than the ambient temperature Ta, then step S204 is executed; otherwise, the process ends.
步骤S204,调节模块103增加风扇转速至V3=PWM×c%。步骤S205,参数设置模块101设置环境温度Ta等于CPU 40的工作温度T_PECI,亦即Ta=T_PECI。步骤S206,温度侦测模块102延迟第三段时间d3后,执行步骤S201继续侦测风扇20在转速V3下侦测出环境温度Ta以及工作温度T_PECI。In step S204, the
步骤S207,温度侦测模块102判断CPU 40的工作温度T_PECI是否小于等于最低环温值T_low-1,亦即T_PECI≤T_low-1。若工作温度T_PECI小于等于最低环温值T_low-1,执行步骤S208;否则流程结束。In step S207, the temperature detection module 102 determines whether the operating temperature T_PECI of the CPU 40 is less than or equal to the lowest ambient temperature value T_low-1, that is, T_PECI≤T_low-1. If the working temperature T_PECI is less than or equal to the lowest ambient temperature value T_low-1, execute step S208; otherwise, the process ends.
步骤S208,温度侦测模块102判断CPU 40的工作温度T_PECI是否小于环境温度Ta,亦即T_PECI<Ta。若CPU 40的工作温度T_PECI小于环境温度Ta,执行步骤S209;否则流程结束。In step S208, the temperature detection module 102 determines whether the operating temperature T_PECI of the CPU 40 is lower than the ambient temperature Ta, that is, T_PECI<Ta. If the operating temperature T_PECI of the CPU 40 is lower than the ambient temperature Ta, execute step S209; otherwise, the process ends.
步骤S209,调节模块103降低风扇转速至V4=PWM×d%。步骤S210,参数设置模块101设置环境温度Ta等于CPU 40的工作温度T_PECI,亦即Ta=T_PECI。步骤S211,温度侦测模块102延迟第四段时间d4后,执行步骤S201继续侦测风扇20在转速V4下侦测出环境温度Ta以及CPU40的工作温度T_PECI。In step S209, the
最后需要说明的是,计算机1的系统温度包括CPU 40、内存50的温度、或者其它内部电子元件的工作温度,而本发明仅以CPU 40的工作温度作为计算机1的系统温度。因此,计算机1内部的其它具备发热性能的电子元件,例如内存50、南北桥芯片等,均可利用本发明所述的计算机散热控制系统及方法来达到调节计算机系统温度的效果。Finally, it should be noted that the system temperature of the computer 1 includes the temperature of the CPU 40, the memory 50, or the operating temperature of other internal electronic components, and the present invention only uses the operating temperature of the CPU 40 as the system temperature of the computer 1. Therefore, other electronic components with heat-generating performance inside the computer 1, such as memory 50, north-south bridge chips, etc., can use the computer heat dissipation control system and method of the present invention to achieve the effect of adjusting the temperature of the computer system.
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103324260A (en) * | 2013-05-28 | 2013-09-25 | 赵剑毅 | Server radiating and silencing device |
| CN104102313A (en) * | 2014-08-04 | 2014-10-15 | 浪潮电子信息产业股份有限公司 | Energy-saving and noise-reduction server fan regulation and control method |
| CN104202180A (en) * | 2014-08-20 | 2014-12-10 | 浪潮(北京)电子信息产业有限公司 | Server cluster management method and server |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262599A (en) * | 1999-02-04 | 2000-08-09 | 富士通株式会社 | Method of controlling cooling device in portable electronic device and cooling device thereof |
| CN1622046A (en) * | 2003-11-24 | 2005-06-01 | 顺德市顺达电脑厂有限公司 | Method of heat radiation for CPU in computer system |
| CN1719041A (en) * | 2004-07-09 | 2006-01-11 | Lg电子株式会社 | Apparatus and method for controlling fan operation |
| CN1755586A (en) * | 2004-10-01 | 2006-04-05 | 株式会社东芝 | Information processing apparatus and cooling method |
| CN1890878A (en) * | 2003-10-10 | 2007-01-03 | 英特尔公司 | Computer system having controlled cooling |
| CN1889010A (en) * | 2005-07-05 | 2007-01-03 | 威盛电子股份有限公司 | Method and device for dynamic setting of temperature characteristics in integrated circuit |
| CN101145058A (en) * | 2007-04-23 | 2008-03-19 | 中兴通讯股份有限公司 | A temperature regulating device and temperature regulating method thereof |
| CN101667054A (en) * | 2008-09-02 | 2010-03-10 | 联想(北京)有限公司 | Temperature control method for computer and computer |
-
2010
- 2010-06-28 CN CN2010102108370A patent/CN102298431A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262599A (en) * | 1999-02-04 | 2000-08-09 | 富士通株式会社 | Method of controlling cooling device in portable electronic device and cooling device thereof |
| CN1890878A (en) * | 2003-10-10 | 2007-01-03 | 英特尔公司 | Computer system having controlled cooling |
| CN1622046A (en) * | 2003-11-24 | 2005-06-01 | 顺德市顺达电脑厂有限公司 | Method of heat radiation for CPU in computer system |
| CN1719041A (en) * | 2004-07-09 | 2006-01-11 | Lg电子株式会社 | Apparatus and method for controlling fan operation |
| CN1755586A (en) * | 2004-10-01 | 2006-04-05 | 株式会社东芝 | Information processing apparatus and cooling method |
| CN1889010A (en) * | 2005-07-05 | 2007-01-03 | 威盛电子股份有限公司 | Method and device for dynamic setting of temperature characteristics in integrated circuit |
| CN101145058A (en) * | 2007-04-23 | 2008-03-19 | 中兴通讯股份有限公司 | A temperature regulating device and temperature regulating method thereof |
| CN101667054A (en) * | 2008-09-02 | 2010-03-10 | 联想(北京)有限公司 | Temperature control method for computer and computer |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103324260A (en) * | 2013-05-28 | 2013-09-25 | 赵剑毅 | Server radiating and silencing device |
| CN104750213B (en) * | 2013-12-30 | 2018-12-18 | 英特尔公司 | Fuzzy logic control of thermoelectric cooling in a processor |
| CN104750213A (en) * | 2013-12-30 | 2015-07-01 | 英特尔公司 | Fuzzy logic control of thermoelectric cooling in a processor |
| CN105094250A (en) * | 2014-05-18 | 2015-11-25 | 吴燕珊 | Automatic speed control fan |
| CN104102313A (en) * | 2014-08-04 | 2014-10-15 | 浪潮电子信息产业股份有限公司 | Energy-saving and noise-reduction server fan regulation and control method |
| CN104202180A (en) * | 2014-08-20 | 2014-12-10 | 浪潮(北京)电子信息产业有限公司 | Server cluster management method and server |
| CN105373461A (en) * | 2014-08-22 | 2016-03-02 | 国基电子(上海)有限公司 | Terminal device and heat dissipation detection method therefor |
| CN104268058A (en) * | 2014-09-25 | 2015-01-07 | 中国农业银行股份有限公司 | Background monitoring device and method |
| CN104268058B (en) * | 2014-09-25 | 2017-10-20 | 中国农业银行股份有限公司 | A kind of background monitoring device and method |
| CN104881104A (en) * | 2015-03-11 | 2015-09-02 | 小米科技有限责任公司 | Intelligent equipment, intelligent equipment performance improvement method and intelligent equipment performance improvement device |
| CN105867269A (en) * | 2016-04-11 | 2016-08-17 | 武汉攀升兄弟科技有限公司 | Computer work environment management system |
| CN109407801A (en) * | 2018-11-01 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of data center's temperature control method and system |
| CN113747739A (en) * | 2020-05-29 | 2021-12-03 | 技嘉科技股份有限公司 | Multi-heat-source temperature management method and multi-heat-source wireless communication device |
| CN113747739B (en) * | 2020-05-29 | 2023-09-22 | 技嘉科技股份有限公司 | Multi-heat source temperature management method and multi-heat source wireless communication device |
| US11812389B2 (en) | 2020-05-29 | 2023-11-07 | Giga-Byte Technology Co., Ltd. | Thermal management method for multiple heat sources and wireless communication apparatus having multiple heat sources |
| CN114706726A (en) * | 2022-03-22 | 2022-07-05 | 华能国际电力股份有限公司河北清洁能源分公司 | Computer data verification method |
| TWI827426B (en) * | 2022-12-30 | 2023-12-21 | 技嘉科技股份有限公司 | Control method of heat dissipation mode of fans of notebook computer |
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