CN102296488B - Production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper - Google Patents
Production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper Download PDFInfo
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- CN102296488B CN102296488B CN 201110189569 CN201110189569A CN102296488B CN 102296488 B CN102296488 B CN 102296488B CN 201110189569 CN201110189569 CN 201110189569 CN 201110189569 A CN201110189569 A CN 201110189569A CN 102296488 B CN102296488 B CN 102296488B
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Abstract
The invention discloses a production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper. The production method comprises the following steps: adopting 100 of hardwood pulp in percentage by weight at the pulping degree of 15-25 degrees Schopper Riegler (SR); adding 0.2-0.5 of wet strength agent in percentage by weight; squeezingby a path of double blankets after long-net dewatering is carried out; and under the condition that the small quantitative difference is less than 2g/m<2> and the lateral extensibility ratio is less than 1.6%, producing a paper base laminating circuit board body paper product, wherein the wet strength agent is any one of polyamide, epichlorohydrin resin or melamine resin. The paper base laminating circuit board body paper prepared with the production method has the following specific technical indexes: paper is quantitative to 125-135g/m<2>, tightness is 0.47-0.51g/m<3>, longitudinal tensile strength is more than or equal to 3.0N/mm, and water suction height is more than or equal to 70mm/10 min. Compared with the prior art, the paper base laminating circuit board body paper has the characteristics of simple production method, and the traditional operating requirements can be satisfied.
Description
Technical field
The invention discloses a kind of paper-based laminated wiring board base paper production method and paper-based laminated wiring board body paper, the paper-based laminated wiring board base paper production method that especially a kind of angularity is little and former paper product.
Background technology
Lamination wiring board body paper is the base material that is mainly used in the circuit printed panel.It is the novel lamination main body that is laminated with of high-grade circuit printed panel, need molded through elevated temperature heat during production, require in order not make laminated board be worn, stain when hot pressing is made a plate, in upper and lower each layer of laminated board, to immerse or coating insulating resin glue again through being laminated into composite board, and then be covered with Copper Foil and become printed substrate.Good printed substrate can even be used circuit printing material on the aerospace vehicle as colour television set or computer.
The sorting technique of lamination circuit paperboard has multiple.The reinforcing material difference of general pressing board can be divided into: paper substrate, glass fibre fabricbase, compound base (CEM series), lamination multi-layer sheet base and special material base (pottery, metal-cored base etc.) five big classes.Along with development of electronic technology and constantly progressive, the printed board baseplate material is constantly proposed new demand, thereby, the continuous development of promoting layer line ball road paperboard.
Paper-based laminated wiring board body paper should have following characteristics:
1. electrical characteristic such as electrical apparatus insulation high frequency characteristic;
2. heat resistance is stable;
3. the paper fiber alignment is neatly even;
4. do not contain ash content;
5. resin impregnated is good and stable;
6. good to thermal dimensional stability.
Electronic product requires more and more higher, very little to the requirement of wiring board body paper angularity to printed circuit technique at present, and the warpage of paper base material is bigger than other materials comparatively speaking, and present technique mainly solves the dimensionally stable problem of paper-based laminated wiring board body paper.
Summary of the invention
It is simple to the purpose of this invention is to provide a kind of production method, can satisfy low warpage paper-based laminated wiring board base paper production method and the paper-based laminated wiring board body paper of existing instructions for use.
For achieving the above object, technical scheme of the present invention is: described production method is: adopt the hardwood pulp of percentage by weight 100, beating degree is 15-25 ° of SR; The wet strength agent that adds percentage by weight 0.2～0.5; Adopt one pair of blanket squeezing by fourdrinier wire dehydration back, control little quantitatively poor＜2g/m
2, produce the former paper product of paper-based laminated wiring board under the situation of lateral extensometer shrinkage＜1.6%.
Described wet strength agent be in polyamine epichlorohydrin resin or the melmac any one.
With the paper-based laminated wiring board body paper of aforementioned production method preparation, its concrete technical indicator is:
Substance 125～135g/m2(method of testing is pressed GB451.2-1989);
Tightness 0.47-0.51 g/m3(method of testing is pressed GB451.3-1989);
Tensile strength (vertically) 〉=3.0N/mm (method of testing is pressed GB/T453-1989);
Suction head 〉=70mm/10 minute (method of testing is pressed GB-T 461.1-2002).
The present invention compared with prior art, it is simple to have production method, can satisfy characteristics such as existing instructions for use.
The specific embodiment
The present invention will be described in detail below in conjunction with specific embodiment: production method of the present invention is: adopt the hardwood pulp of percentage by weight 100, beating degree is 15-25 ° of SR; The wet strength agent (also being hardwood pulp: wet strength agent=1:0.2～0.5) that adds percentage by weight 0.2～0.5; Adopt one pair of blanket squeezing by fourdrinier wire dehydration back, control little quantitatively poor＜2g/m
2, produce the former paper product of paper-based laminated wiring board under the situation of lateral extensometer shrinkage＜1.6%.
Described wet strength agent be in polyamine epichlorohydrin resin or the melmac any one.
With the paper-based laminated wiring board body paper of aforementioned production method preparation, its concrete technical indicator is:
Substance 125～135g/m2(method of testing is pressed GB451.2-1989);
Tightness 0.47-0.51 g/m3(method of testing is pressed GB451.3-1989);
Tensile strength (vertically) 〉=3.0N/mm (method of testing is pressed GB/T453-1989);
Suction head 〉=70mm/10 minute (method of testing is pressed GB-T 461.1-2002).
Embodiment 1: adopt 100% hardwood pulp, beating degree is 15 ° of SR; Add wet strength agent 0.2%(weight); Adopt one pair of blanket squeezing by fourdrinier wire dehydration back, control little quantitative poor be 1.8g/m
2, lateral extensometer shrinkage 1.5%.
It is as follows to produce the paper index:
Substance 125g/m2(method of testing is pressed GB451.2-1989);
Tightness 0.47 g/m3(method of testing is pressed GB451.3-1989);
Tensile strength (vertically) 3.4N/mm (method of testing is pressed GB/T453-1989);
Suction head 90mm/10 minute (method of testing is pressed GB-T 461.1-2002).
Embodiment 2: adopt 100% hardwood pulp, beating degree is 25 ° of SR; Add wet strength agent 0.5%(weight); Adopt one pair of blanket squeezing by fourdrinier wire dehydration back, control little quantitative poor 1.5g/m
2, lateral extensometer shrinkage 1.3%
Substance 130g/m2(method of testing is pressed GB451.2-1989);
Tightness 0.51 g/m3(method of testing is pressed GB451.3-1989);
Tensile strength (vertically) 4.5N/mm (method of testing is pressed GB/T453-1989)
Suction head 72mm/10 minute (method of testing is pressed GB-T 461.1-2002)
Embodiment 3: adopt 100% hardwood pulp, beating degree is 15 ° of SR; Add wet strength agent 0.5%(weight); Adopt one pair of blanket squeezing by fourdrinier wire dehydration back, control little quantitative poor 1.3g/m
2, lateral extensometer shrinkage 1.4%
Substance 135g/m2(method of testing is pressed GB451.2-1989);
Tightness 0.49g/m3(method of testing is pressed GB451.3-1989);
Tensile strength (vertically) 5.1N/mm (method of testing is pressed GB/T453-1989);
Suction head 85mm/10 minute (method of testing is pressed GB-T 461.1-2002).
Claims (3)
1. one kind low warpage paper-based laminated wiring board base paper production method, it is characterized in that: the concrete technical indicator of this low warpage paper-based laminated wiring board body paper is: Substance 125～135g/m
2, method of testing is pressed GB451.2-1989; Tightness 0.47-0.51 g/m
3, method of testing is pressed GB451.3-1989; Machine direction tensile strength 〉=3.0N/mm, method of testing is pressed GB/T453-1989; Suction head 〉=70mm/10 minute, method of testing was pressed GB-T 461.1-2002; Described production method is: adopt the hardwood pulp of percentage by weight 100%, beating degree is 15-25 ° of SR; The wet strength agent that adds percentage by weight 0.2～0.5; Adopt one pair of blanket squeezing by fourdrinier wire dehydration back, control little quantitatively poor＜2g/m
2, produce the former paper product of paper-based laminated wiring board under the situation of lateral extensometer shrinkage＜1.6%.
2. low warpage paper-based laminated wiring board base paper production method according to claim 1, it is characterized in that described wet strength agent be in polyamine epichlorohydrin resin or the melmac any one.
3. the low warpage paper-based laminated wiring board body paper of the described method preparation of a claim 1, its concrete technical indicator is: Substance 125～135g/m
2, method of testing is pressed GB451.2-1989; Tightness 0.47-0.51 g/m
3, method of testing is pressed GB451.3-1989; Machine direction tensile strength 〉=3.0N/mm, method of testing is pressed GB/T453-1989; Suction head 〉=70mm/10 minute, method of testing was pressed GB-T 461.1-2002.
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| CN 201110189569 CN102296488B (en) | 2011-07-07 | 2011-07-07 | Production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper |
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| CN 201110189569 CN102296488B (en) | 2011-07-07 | 2011-07-07 | Production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper |
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| CN102296488A CN102296488A (en) | 2011-12-28 |
| CN102296488B true CN102296488B (en) | 2013-09-11 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6622769B2 (en) * | 2017-09-21 | 2019-12-18 | 大王製紙株式会社 | Tissue paper product and tissue paper product package |
| CN113338077B (en) * | 2021-05-19 | 2022-04-19 | 安徽集友新材料股份有限公司 | Anti-thermoprinting deformation tipping base paper for cigarettes and preparation method and application thereof |
| CN113944062B (en) * | 2021-10-28 | 2022-07-26 | 汇胜集团股份有限公司 | Production method for eliminating lotus leaf edges of paper tube base paper |
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| CN1063132A (en) * | 1991-09-11 | 1992-07-29 | 大连经济技术开发区振兴造纸厂 | The manufacture method of bleached wood pulp base paper |
| CN101718053A (en) * | 2009-11-12 | 2010-06-02 | 忠信(太仓)绝缘材料有限公司 | Method for manufacturing base paper for electronic industry |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5314742A (en) * | 1993-03-31 | 1994-05-24 | E. I. Du Pont De Nemours And Company | Resin impregnated laminate for wiring board applications |
-
2011
- 2011-07-07 CN CN 201110189569 patent/CN102296488B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063132A (en) * | 1991-09-11 | 1992-07-29 | 大连经济技术开发区振兴造纸厂 | The manufacture method of bleached wood pulp base paper |
| CN101718053A (en) * | 2009-11-12 | 2010-06-02 | 忠信(太仓)绝缘材料有限公司 | Method for manufacturing base paper for electronic industry |
Non-Patent Citations (8)
| Title |
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| > * |
| < * |
| .2002,第20卷(第6期),第32-34页. * |
| 吴养育等.覆铜箔用高吸水性纸制造工艺的研究.< * |
| 吴养育等.覆铜箔用高吸水性纸制造工艺的研究.《西北轻工业学院学报》.2002,第20卷(第6期),第32-34页. |
| 吴养育等.覆铜箔用高吸水性纸制造工艺的研究.<<西北轻工业学院学报>>.2002,第20卷(第6期),第32-34页. |
| 西北轻工业学院学报> * |
| 覆铜箔用高吸水性纸制造工艺的研究;吴养育等;《西北轻工业学院学报》;20021231;第20卷(第6期);第32-34页 * |
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