CN102264021A - MEMS (Micro-Electro-Mechanical Systems) microphone chip - Google Patents
MEMS (Micro-Electro-Mechanical Systems) microphone chip Download PDFInfo
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- CN102264021A CN102264021A CN2010105762978A CN201010576297A CN102264021A CN 102264021 A CN102264021 A CN 102264021A CN 2010105762978 A CN2010105762978 A CN 2010105762978A CN 201010576297 A CN201010576297 A CN 201010576297A CN 102264021 A CN102264021 A CN 102264021A
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- vibrating diaphragm
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Abstract
The invention discloses an MEMS (Micro-Electro-Mechanical Systems) microphone chip which comprises a substrate with a hole in the middle, a diaphragm and a fixed pole plate arranged in relative to the diaphragm, wherein the diaphragm is supported by a suspended cantilever beam structure, and a reinforcing structure is arranged on the cantilever beam structure. The MEMS microphone chip with the design has small diaphragm stress, high sensitivity and good product reliability, the supporting part of the diaphragm can not be damaged by external force.
Description
Technical field
The present invention relates to a kind of MEMS microphone chip.
Background technology
Along with electronic products such as mobile phone, notebook, hearing aids are more and more littler to the dimensional requirement of inner body, performance requirement is more and more higher, less, the quality of taking measurements greatly MEMS microphone preferably is employed.The key components and parts of MEMS microphone is its inner MEMS microphone chip, the structure of MEMS microphone chip generally comprises the middle part fixed polar plate that pertusate substrate, vibrating diaphragm is set and is oppositely arranged with vibrating diaphragm, and for example number of patent application is that the Chinese patent of CN200920109776.1 has embodied a kind of MEMS microphone chip structure.For the MEMS microphone chip, in order to reach sensitivity preferably, generally the part that supports vibrating diaphragm can be arranged to suspension beam structure, can be so that diaphragm be obtained compliance preferably in vibration, thereby obtain higher sensitivity, and the electrode on the vibrating diaphragm is derived by overarm.Yet, when this suspension beam structure supports diaphragm, be very easy to be subjected to the impact of external force and cause the overarm fracture, obviously this will cause the MEMS microphone chip to lose efficacy.
So the needs design is a kind of can to reach the higher good new construction MEMS microphone chip of sensitivity, product reliability.
Summary of the invention
Technical problem to be solved by this invention provides and a kind ofly can reach the higher good new construction MEMS microphone chip of sensitivity, product reliability.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of MEMS microphone chip, comprise the fixed polar plate that the middle part is provided with pertusate substrate, vibrating diaphragm and is oppositely arranged with described vibrating diaphragm, it is characterized in that, described vibrating diaphragm is supported by the suspension beam structure of unsettled setting, and described suspension beam structure is provided with reinforcement.
The improvement of the technical program is that described reinforcement is a plurality of strip reinforcements.
The improvement of the technical program is that described reinforcement is a plurality of strip metal layers.
The improvement of the technical program is, described reinforcement is the strip projected parts with described vibrating diaphragm material of the same race.
The improvement of the technical program is that described vibrating diaphragm is connected to the metal solder joint that described suspension beam structure one end is provided with by described reinforcement.
The improvement of the technical program is that described reinforcement and described metal solder joint are same material.
The improvement of the technical program is that described reinforcement is uniformly distributed on the described suspension beam structure.
The improvement of the technical program is, described reinforcement runs through and is distributed on described suspension beam structure and the described vibrating diaphragm main body.
Owing to adopted technique scheme, a kind of MEMS microphone chip, comprise the fixed polar plate that the middle part is provided with pertusate substrate, vibrating diaphragm and is oppositely arranged with described vibrating diaphragm, described vibrating diaphragm is supported by the suspension beam structure of unsettled setting, and described suspension beam structure is provided with reinforcement; The MEMS microphone chip of this design, its vibrating diaphragm stress is little, highly sensitive, and product reliability is good, can not damage because of the external force effect cause the support section of vibrating diaphragm.
Description of drawings
Fig. 1 is the vertical view of the embodiment of the invention one.
Fig. 2 is the upward view of the embodiment of the invention one.
Fig. 3 is that the A-A of Fig. 1 is to generalized section.
Fig. 4 is the embodiment of the invention two diaphragm structure schematic diagrames.
Fig. 5 is the embodiment of the invention three diaphragm structure schematic diagrames.
Embodiment
Case study on implementation one,
Represent the vertical view of present embodiment as Fig. 1, mainly showed the diaphragm structure of MEMS microphone chip; Represent the upward view of present embodiment as Fig. 2, mainly showed the substrate and the electrode plate structure of MEMS microphone chip; Fig. 3 be the A-A of Fig. 1 to generalized section, mainly showed each layer of MEMS microphone chip structure distribution.A kind of MEMS microphone chip comprises square substrate 1, and substrate 1 is made for single crystal silicon material, and its central part is provided with columniform through hole 1a; Substrate 1 top is provided with barrier layer 2, and barrier layer 2 makes for silica material, and the position of barrier layer 2 and through hole 1a correspondence also is provided with the shape through hole 2a consistent with through hole 1a; 2 tops, barrier layer are provided with the back pole plate 3 of squarish, back pole plate 3 is made for polycrystalline silicon material, shown in Fig. 1,3, there is a tie point 3b outside of back pole plate 3, back pole plate 3 is connected with tie point 3b by a narrow dowel 3a, tie point 3b is provided with the metal solder joint 3c that is used to connect external circuit, also is provided with a plurality of aperture 3d that are used to breathe freely on the back pole plate 3; Backplane flaggy 3 tops are provided with the separator 4 of insulation, and separator 4 is made for silica material, and in the present embodiment, separator 4 is the shape of several supporting struts; Separator 4 tops are provided with the vibrating diaphragm 5 of squarish, vibrating diaphragm 5 is made for polycrystalline silicon material, as shown in Figure 1, there are a plurality of tie point 5b the outside of vibrating diaphragm 5, tie point 5b is arranged on the upper end of separator 4, vibrating diaphragm 5 is connected with tie point 5b by a plurality of narrow, unsettled suspension beam structure 5a, tie point 5b is provided with the metal solder joint 5c that is used to connect external circuit, vibrating diaphragm 5 is supported on the separator 4 by a plurality of unsettled suspension beam structure 5a, suspension beam structure 5a in the shape of a spiral shape be distributed in vibrating diaphragm 5 four limits on; On suspension beam structure 5a, also be provided with reinforcement 5d; In the implementation case, reinforcement 5d is the reinforcement of a plurality of strips, and reinforcement 5d is the metal level with the identical material of metal solder joint 5c, and reinforcement 5d and the metal solder joint 5c combination that is interconnected.
Rely on this structure, at the MEMS microphone chip when receiving that the external force effect is big, reinforcement 5d can guarantee effectively that the suspension beam structure 5a between tie point 5b and the vibrating diaphragm 5 is stable, can not cause fracture, and the sensitivity of the vibrating diaphragm of this structure in vibration is guaranteed simultaneously also.
In the present embodiment, reinforcement 5d and the metal solder joint 5c combination that is interconnected can guarantee that suspension beam structure 5a is more stable, and reinforcement 5d can also be played the effect of conductive communication.
In the present embodiment, reinforcement 5d adopts the material identical with metal solder joint 5c to make, thereby the two can adopt same process to make, and can not increase the production cost.
In the present embodiment, reinforcement 5d is arranged at surface of suspension beam structure 5a, can be arranged at two surfaces equally or embed suspension beam structure 5a inside, can play stiffening effect preferably.
Case study on implementation two,
Represent the diaphragm structure schematic diagram of present embodiment as Fig. 4, mainly showed the diaphragm structure of MEMS microphone chip.The vibrating diaphragm 5 of squarish is made for polycrystalline silicon material, four bights of vibrating diaphragm 5 are provided with tie point 5b, vibrating diaphragm 5 is connected with tie point 5b by a plurality of T shape structures, unsettled suspension beam structure 5a, and tie point 5b is provided with the metal solder joint 5c that is used to connect external circuit; On suspension beam structure 5a, also be provided with the reinforcement 5d of annular, in the implementation case, reinforcement 5d be the strip projected parts with the making of the polycrystalline silicon material of vibrating diaphragm 5 identical materials, and reinforcement 5d and the metal solder joint 5c combination that is interconnected.The reinforcement 5d of this annular makes with the polycrystalline silicon material of vibrating diaphragm 5 identical materials, can adopt with a kind of technology and make, and is simple in structure, low production cost.
Case study on implementation three,
Represent the diaphragm structure schematic diagram of present embodiment as Fig. 5, mainly showed the diaphragm structure of MEMS microphone chip.Different with case study on implementation two is, in the implementation case, reinforcement 5d runs through and is distributed on suspension beam structure 5a and vibrating diaphragm 5 main bodys, and this structure can obtain better effect.
Under above-mentioned instruction of the present invention; those skilled in the art can carry out various improvement and distortion on the basis of the foregoing description; and these improvement and distortion; all drop in protection scope of the present invention; those skilled in the art should be understood that; above-mentioned specific descriptions are just better explained purpose of the present invention, and protection scope of the present invention is limited by claim and equivalent thereof.
Claims (8)
1. a MEMS microphone chip comprises the fixed polar plate that the middle part is provided with pertusate substrate, vibrating diaphragm and is oppositely arranged with described vibrating diaphragm, it is characterized in that, described vibrating diaphragm is supported by the suspension beam structure of unsettled setting, and described suspension beam structure is provided with reinforcement.
2. MEMS microphone chip as claimed in claim 1 is characterized in that, described reinforcement is a plurality of strip reinforcements.
3. MEMS microphone chip as claimed in claim 2 is characterized in that, described reinforcement is a plurality of strip metal layers.
4. MEMS microphone chip as claimed in claim 2 is characterized in that, described reinforcement is the strip projected parts with described vibrating diaphragm material of the same race.
5. MEMS microphone chip as claimed in claim 2 is characterized in that, described vibrating diaphragm is connected to the metal solder joint that described suspension beam structure one end is provided with by described reinforcement.
6. MEMS microphone chip as claimed in claim 5 is characterized in that, described reinforcement and described metal solder joint are same material.
7. as the described MEMS microphone chip of the arbitrary claim of claim 1-6, it is characterized in that described reinforcement is uniformly distributed on the described suspension beam structure.
8. as the described MEMS microphone chip of the arbitrary claim of claim 1-6, it is characterized in that described reinforcement runs through and is distributed on described suspension beam structure and the described vibrating diaphragm main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105762978A CN102264021A (en) | 2010-12-07 | 2010-12-07 | MEMS (Micro-Electro-Mechanical Systems) microphone chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105762978A CN102264021A (en) | 2010-12-07 | 2010-12-07 | MEMS (Micro-Electro-Mechanical Systems) microphone chip |
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| CN102264021A true CN102264021A (en) | 2011-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105762978A Pending CN102264021A (en) | 2010-12-07 | 2010-12-07 | MEMS (Micro-Electro-Mechanical Systems) microphone chip |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016015530A1 (en) * | 2014-08-01 | 2016-02-04 | 无锡华润上华半导体有限公司 | Mems microphone |
| CN111372178A (en) * | 2019-12-15 | 2020-07-03 | 瑞声科技(新加坡)有限公司 | MEMS microphone, array structure and processing method |
| CN111818409A (en) * | 2020-07-20 | 2020-10-23 | 潍坊歌尔微电子有限公司 | Bone voiceprint sensor and electronic device |
| WO2024250333A1 (en) * | 2023-06-07 | 2024-12-12 | 瑞声声学科技(深圳)有限公司 | Diaphragm and mems microphone |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101272636A (en) * | 2007-03-21 | 2008-09-24 | 歌尔声学股份有限公司 | Condenser Microphone Chip |
| CN201541344U (en) * | 2009-07-01 | 2010-08-04 | 歌尔声学股份有限公司 | A MEMS microphone |
-
2010
- 2010-12-07 CN CN2010105762978A patent/CN102264021A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101272636A (en) * | 2007-03-21 | 2008-09-24 | 歌尔声学股份有限公司 | Condenser Microphone Chip |
| CN201541344U (en) * | 2009-07-01 | 2010-08-04 | 歌尔声学股份有限公司 | A MEMS microphone |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016015530A1 (en) * | 2014-08-01 | 2016-02-04 | 无锡华润上华半导体有限公司 | Mems microphone |
| US10003890B2 (en) | 2014-08-01 | 2018-06-19 | Csmc Technologies Fab1 Co., Ltd. | MEMS microphone |
| CN111372178A (en) * | 2019-12-15 | 2020-07-03 | 瑞声科技(新加坡)有限公司 | MEMS microphone, array structure and processing method |
| CN111372178B (en) * | 2019-12-15 | 2022-01-11 | 瑞声科技(新加坡)有限公司 | MEMS microphone, array structure and processing method |
| CN111818409A (en) * | 2020-07-20 | 2020-10-23 | 潍坊歌尔微电子有限公司 | Bone voiceprint sensor and electronic device |
| WO2024250333A1 (en) * | 2023-06-07 | 2024-12-12 | 瑞声声学科技(深圳)有限公司 | Diaphragm and mems microphone |
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Application publication date: 20111130 |