CN102248794B - Liquid discharging head - Google Patents
Liquid discharging head Download PDFInfo
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- CN102248794B CN102248794B CN201110130120.XA CN201110130120A CN102248794B CN 102248794 B CN102248794 B CN 102248794B CN 201110130120 A CN201110130120 A CN 201110130120A CN 102248794 B CN102248794 B CN 102248794B
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Abstract
The invention relates to a liquid discharging head, including a plurality of nozzle arrays. A recess part is formed on the back face of a head substrate and all of the supply ports are formed in the bottom of the recess part. The head substrate and a support member are combined at the bottom of the recess part to lead the supply port and an introducing port to be communicated. According to the arrangement, the grounded area is fully ensured and the liquid discharging head with the high reliability and heat radiation capacity is manufactured at a high production efficiency.
Description
Technical field
The present invention relates to liquid discharging head, and relate more specifically to ink jet print head.
Background technology
Japanese Patent Application Publication No.2005-125516 has discussed ink jet print head.In order to be connected and to keep substrate with outside ink supply system, by the ink-jet substrate that is formed with electrothermal conversioning element is above engaged to configure ink jet print head with support component.
In the situation that ink jet print head can utilize an ink-jet substrate to print with multiple color, become and must seal apart from each other various China inks in the office, junction surface between ink-jet substrate and support component, to prevent the mixing of different China inks.In addition, become and must maintain enough areas of bonding part to increase the reliability of sealing.
In addition in recent years, exist for the requirement of ink jet recording method of exporting at a relatively high speed higher resolution image.Therefore exist for increasing and discharge the quantity of black nozzle and increase the requirement of discharging frequency.
On the other hand, if writing speed increases, energy and this temperature rise that during recording, time per unit is inputted to the end increase.If this temperature rise, dissimilates for the black discharge rate of every one page, make to discharge and become unstable at high temperature China ink.In addition, may reduce recording occurring continuously performance.
Japanese Patent Application Publication No.2005-125516 has discussed ink jet print head, and in this ink jet print head, ink-jet substrate is fixed to support component, makes the heat producing in ink-jet substrate be diffused into support component.Therefore can reduce the temperature rise in ink jet print head by the area (hereinafter referred to as contact area) that increases the bonding part between ink-jet substrate and support component.
But if increase the contact area between ink-jet substrate and support component in order to reduce the temperature rise in ink jet print head, the size of ink-jet substrate becomes large, and productivity ratio is reduced.
In order to address this is that, can make the attenuation of whole ink-jet substrate.In other words, can be by making the attenuation of whole ink-jet substrate reduce the size of the opening of black supply opening.Therefore can in the case of not increasing the size of ink-jet substrate, guarantee the contact area between ink-jet substrate and support component.
But if select this method, the strength decreased of ink-jet substrate, makes to produce warpage (warpage) because stream forms the stress of parts in ink-jet substrate.In this case, greatly reduced productivity ratio.
Summary of the invention
The present invention relates to liquid discharging head, in this liquid discharging head, can guarantee the contact area between support component and a substrate, and can manufacture this liquid discharging head with high production rate.More particularly, the present invention relates to liquid discharging head, this liquid discharging head is because contact area is enough and highly reliable and have high heat-sinking capability, and can manufacture this liquid discharging head with high production rate.
According to an aspect of the present invention, a kind of liquid discharging head comprises: stream forms parts, described stream forms parts and is configured for the liquid flow path of discharging the outlet of liquid and being communicated with described outlet, and comprises the nozzle array that multiple described outlets by being communicated with spatially each other and described liquid flow path form; Substrate, described substrate comprises the exhaust energy producing component that produces the energy for discharging liquid, and for each nozzle array, is formed for to the supply opening of described liquid flow path supply liquid in described substrate; And support component, described support component comprises for the intake to described supply opening supply liquid, wherein said substrate comprises sunk part in a side relative with the surface that is furnished with described stream formation parts above, wherein all supply openings are connected described substrate and are formed in the bottom of described sunk part, and wherein said substrate and described support component be engaged at the place, bottom of described sunk part, described supply opening and described intake are communicated with each other.
According to the detailed description of the exemplary embodiment below with reference to accompanying drawing, the more feature of the present invention and aspect will become clear.
Accompanying drawing explanation
The accompanying drawing being added into and form a description part shows exemplary embodiment of the present invention, feature and aspect, and is used for together with the description explaining principle of the present invention.
Fig. 1 illustrates the schematic sectional view of ink jet print head according to an exemplary embodiment of the present invention.
Fig. 2 illustrates the schematic cross section perspective view of ink jet print head according to an exemplary embodiment of the present invention.
Fig. 3 A and Fig. 3 B illustrate the schematic diagram of the joint between ink jet head substrate and support component according to an exemplary embodiment of the present invention.
Fig. 4 A, Fig. 4 B, Fig. 4 C, Fig. 4 D, Fig. 4 E, Fig. 4 F, Fig. 4 G and Fig. 4 H illustrate to be used to form the schematic process flow diagram of the black supply opening of ink-jet substrate and the method for sunk part according to an exemplary embodiment of the present invention.
Fig. 5 is the schematic sectional view that the ios dhcp sample configuration IOS DHCP of traditional ink jet print head is shown.
Fig. 6 illustrates the schematic sectional view of ink jet print head according to an exemplary embodiment of the present invention.
Fig. 7 is the schematic plan view that the layout example of each element in ink jet print head is according to an exemplary embodiment of the present invention shown.
Fig. 8 illustrates according to an exemplary embodiment of the present invention the vertically perspective schematic view of the ink jet print head of cutting.
Fig. 9 is the amplification sectional view that the part of being surrounded by the dotted line frame X shown in Fig. 6 is according to an exemplary embodiment of the present invention shown.
Figure 10 is the schematic plan view that the layout example of each element in ink jet print head is according to an exemplary embodiment of the present invention shown.
Figure 11 A, Figure 11 B, Figure 11 C, Figure 11 D, Figure 11 E, Figure 11 F and Figure 11 G illustrate for the manufacture of the technological process sectional view of the method for ink jet print head according to an exemplary embodiment of the present invention.
Figure 12 illustrates the schematic diagram of the ios dhcp sample configuration IOS DHCP of ink jet recording device according to an exemplary embodiment of the present invention.
The specific embodiment
Describe below with reference to the accompanying drawings each exemplary embodiment of the present invention, feature and aspect in detail.
To the exemplary embodiment of liquid discharging head be described below.Ink jet print head can be described using as application example of the present invention.But the scope of application is not limited to this.
For example, except carrying out China ink record, the present invention can also be applied to making biochip or printed circuit.The present invention relates to discharge the liquid discharging head of liquid, and except ink jet print head, colour filter manufacture head is also the example of liquid discharging head.
Fig. 1 is the sectional view illustrating according to the ink jet print head of the first exemplary embodiment.Fig. 2 is the schematic cross section perspective view illustrating according to the ink jet print head of this exemplary embodiment.Fig. 3 A illustrates by ink-jet substrate and stream, to form the perspective schematic view of the discharge component substrate that parts form according to this exemplary embodiment.Fig. 3 B is the perspective schematic view that support component is shown.
With reference to figure 1, Fig. 2, Fig. 3 A and Fig. 3 B, by joining by adhesive 4 the ink-jet substrate 1 that is formed with stream formation parts 3 on upper surface to support component 2, form ink jet print head.Ink-jet substrate 1 comprises sunk part in a side relative with the surface that is furnished with stream formation parts 3 above.Ink-jet substrate 1 is engaged to support component 2 at the place, bottom of sunk part.
Ink-jet substrate 1 comprises the multiple exhaust energy producing components 7 for discharging China ink, such as electrothermal conversioning element.In addition, ink-jet substrate 1 can comprise the wiring (not shown) for driving exhaust energy producing component.In addition, ink-jet substrate 1 comprises for supplying black black supply opening 8 to black stream 5.In the bottom of sunk part, connect ink-jet substrate and form multiple black supply openings 8.
Support component 2 comprises for supplying black black intake 9 to black supply opening 8.Support component 2 is engaged to ink-jet substrate 1 at the place, bottom of sunk part, and black intake 9 and black supply opening 8 can be communicated with each other.Ink jet print head can comprise the black black supply part (not shown) that storage will be supplied to the black intake 9 in support component 2.
Multiple nozzle arrays that comprise the black outlet, black stream and the black supply opening that are communicated with spatially are each other formed in stream formation parts 3.In other words, arrange multiple black streams 5 and multiple outlet 6 to form multiple nozzle arrays (with reference to figure 3A).
In addition, for each nozzle array, form the black supply opening 8 that runs through ink-jet substrate.Shown in Fig. 3 A, preferably embark on journey and arrange nozzle array.A nozzle array can keep and discharge identical China ink.
In addition,, in this exemplary embodiment, for a nozzle array, form a black supply opening 8.In the bottom of sunk part, along nozzle array, with rectangular shape, arrange the opening of multiple black outlets 8.In addition, support component 2 comprises the bossing being contained in sunk part, and in support component 2, is formed on the multiple black intake 9 that has opening on the upper surface of bossing.
Each black intake 9 is arranged to each black supply opening 8 and is communicated with.Go out as shown in Figure 3 B, embark on journey and form multiple black intakes 9.
According to the present invention, can be provided in the situation of the productivity ratio that does not reduce ink-jet substrate highly reliably and have the liquid discharging head of high heat-sinking capability.Therefore according to liquid discharging head of the present invention, can be suitable for flying print.
To describe effect of the present invention below in detail.If expand the contact area between ink gun and support component in order to improve reliability or heat radiation, the interval between nozzle array increases.As a result, Substrate Area increases, and productivity ratio may be reduced.
On the other hand, if can reduce the aperture area of black supply opening, can also reduce the interval between nozzle array, productivity ratio can be increased.Can form black supply opening to reduce the aperture area of black supply opening by anisotropic etching.But utilizing anisotropic etching is unpractical at the little through hole of the upper formation of general wafer (wafer) that will be used in ink-jet substrate from the viewpoint of time.
In addition,, if make the attenuation of whole ink-jet substrate and form black supply opening by anisotropic etching, can the opening of black supply opening be formed littlely.But, if make the attenuation of ink-jet substrate, the strength decreased of ink-jet substrate.Therefore, because stream forms the stress in parts, in ink-jet substrate, produce warpage, productivity ratio may greatly be reduced.
In order addressing this is that, according to the present invention, on ink-jet substrate, to form sunk part, and form ink-jet supply opening in the bottom of the sunk part of thin substrates.As a result, the opening of ink-jet supply opening can being formed to such an extent that maintain the intensity of ink-jet substrate in less, and can obtain the large contact area between support component and ink-jet substrate.Therefore can realize highly reliably and have with high production rate the ink jet print head of high heat-sinking capability.
In addition, according to a further aspect in the invention, can obtain the ink jet print head that there is durability and can be miniaturized.In other words, according to the present invention, due to the opening of ink-jet supply opening being formed to such an extent that maintained the intensity of ink-jet substrate in less, therefore ink jet print head can be miniaturized when maintaining durability.
In addition, can reduce nozzle array interval, and can form outlet with high density, make to improve discharging performance.
As exemplary embodiment of the present invention, ink jet print head has been described above.But, the invention is not restricted to this, and the present invention relates to discharge the liquid discharging head of the liquid such as China ink.
If describe ink jet print head in detail as liquid discharging head, its basic configuration is similar.Term for every stature can be described in detail as follows: China ink is corresponding to liquid, ink-jet substrate is corresponding to a substrate, China ink outlet is corresponding to outlet, China ink stream is corresponding to liquid flow path, China ink supply opening is corresponding to supply opening, China ink intake is corresponding to intake, and black supply part is corresponding to liquid supply part.
As mentioned above, in a substrate, in a side (that is, the back side) relative with the surface that is furnished with stream formation parts above, form sunk part.For the method that is used to form sunk part, do not limit.For example, can form sunk part by crystal anisotropy etching.
Can form a substrate with silicon substrate.In this case, preferably by the crystal anisotropy etching of silicon substrate, form sunk part, by the crystal anisotropy etching of this silicon substrate, can effectively on a substrate, form sunk part with high production rate.
In addition, the silicon substrate of the crystal orientation by having <100> face forms a substrate.In this case, the bottom of sunk part becomes the <100> face forming by the crystal anisotropy etching of silicon substrate, and this <100> face becomes the composition surface between a substrate and support component.
More particularly, by crystal anisotropy etching, remove a part for silicon substrate, and the <100> face as a result of exposing becomes the composition surface between a substrate and support component.The thickness of silicon substrate can be that 0.3mm is to 1.0mm.The degree of depth of sunk part can be 325～675 μ m.
According to the present invention, stream forms parts and comprises multiple nozzle arrays, and the each nozzle array in the plurality of nozzle array comprises the outlet and the liquid flow path that are communicated with spatially each other.For each nozzle array, form at least one supply opening, and all supply openings are formed in the bottom of sunk part.
With reference to figure 1, Fig. 2 and Fig. 3 A, along a nozzle array, form a supply opening with rectangular aperture.But, the invention is not restricted to this, and can form multiple supply openings for a nozzle array.
If form multiple supply openings for a nozzle array, support component can be for example for each the formation intake in the supply opening being communicated with same nozzle array.In addition, can form an intake for the multiple supply openings that are communicated with nozzle array.
Can utilize anisotropic etching (such as the dry etching and the crystal anisotropy etching that comprise reactive ion etching (RIE)) to form supply opening.Preferably use and utilize the rich construction skill (Bosch process) of RIE to form supply opening.The height of supply opening can be set to 50～400 μ m.
Material for support component has no particular limits.For example, preferably use the aluminium oxide (Al with high heat conductance
2o
3) and silicon (Si), aln precipitation (AlN), zirconia (ZrO
2), silicon nitride (Si
3n
4), silicon carbide (SiC), molybdenum (Mo) and tungsten (W).
In addition, preferably use and there is the aluminium oxide of high heat conductance and ink-resistant property, and particularly, preferably use aluminium oxide ceramics.In addition, can use resin material, and can form support component by the resin forming of Noryl resin (molding).In addition, as the Noryl (PPE) of the polymer alloy (polymer alloy) of PPE and polystyrene (PS), can be used as resin material.
If by the heat producing in the exhaust energy producing component such as electrothermal conversioning element from the beginning substrate be diffused into support component, expect to use the support component that formed by aluminium oxide.The material of support component 10 is not limited to aluminium oxide.Can by its linear expansion coefficient have with the linear expansion coefficient par of a substrate and have with the material of the thermal conductivity of the thermal conductivity par of a substrate and form support component 10.
As mentioned above, the region of a part of attenuation of a substrate (that is, the bottom of sunk part) locates support component to engage substrate to the end therein.For example, can come engagement head substrate and support component with adhesive.Owing to there being thick region in the marginal portion of a substrate, therefore can maintain intensity.
Support component can be shaped as and comprise for example bossing, makes support component can be engaged the bottom of the sunk part on substrate to the end.In addition, preferably, support component comprises the part of the convex shaped matching with the sunk part of a substrate.
The example that can be used to the material that forms stream formation parts is photonasty epoxy resin and photonasty acrylic resin.Preferably use the compound of photoreactive cationic polymerizable.Because type and the characteristic of the liquid by using have greatly been determined durability, therefore can select suitable compound as stream, to form the material of parts according to the liquid such as China ink.
Substrate can comprise the wiring layer for transmitting the signal of telecommunication.For example, can form Al wiring by film technique.
As mentioned above, liquid discharging head can comprise the liquid supply part of the intake for supplying liquid to support component.Liquid supply part is the case (tank) of the liquid such as China ink for the intake supply to support component, and can be formed by organic material or inorganic material.
Expect, even if liquid supply part is by also not expanding or dissolve or do not cause the material of the elution (elution) of organic material or inorganic material to form when liquid supply part contacting with the liquid such as China ink that will be stored in inside.
In addition,, from the actual cost of material and the easy aspect of processing, preferably use thermoplastic resin as the material that is used to form liquid supply part.For example, the resins for universal use of main use such as polypropylene and MODIFIED PP E is as black supply part.Can use silica and aluminium oxide as the reinforcing agent for increasing mechanical strength.
In addition, can form support component and liquid supply part by insert-molding (insert molding).
In addition, according to the ink jet print head of this exemplary embodiment, can be installed in such as printer, duplicator, comprise the facsimile machine of communication system and comprise in the equipment the word processor of printer unit.In addition according to the ink jet print head of this exemplary embodiment, can be installed in wherein multiple the industrial recording equipment in conjunction with various treatment facilities.Ink jet print head can be used at the enterprising line item of various recording mediums such as paper, line (thread), textile, silk, leather, metal, plastics, glass, timber and pottery.
To the liquid discharging head that can more effectively control temperature be described below.
Fig. 6 is the schematic sectional view illustrating according to the ink jet print head of the second exemplary embodiment.Fig. 7 is the schematic plan view that the position that is wherein furnished with each element is shown from watching according to the front of the ink jet print head of this exemplary embodiment (that is, stream forms component side).
Fig. 8 illustrates the perspective schematic view of wherein having cut a part of ink jet print head.Fig. 6 is the sectional view corresponding with the cross section of the dotted line A-A ' intercepting along shown in Fig. 7.
With reference to figure 6, ink jet print head comprises the discharge component substrate that is formed parts 3 and ink-jet substrate (substrate) 1 formation by stream.In addition, ink jet print head comprises support component 2, in the relative side of that side with being furnished with stream formation parts 3 of ink-jet substrate 1, uses adhesive 4 that this support component 2 is engaged with discharge component substrate.
Stream forms parts 3 and is formed on ink-jet substrate 1.In addition, stream forms parts 3 and comprises that China ink (, first liquid) therein flow black stream (, first liquid stream), black outlet (, outlet) 6 and temperature control liquid (, second liquid) mobile temperature control stream (that is, second liquid stream) 10 therein.
In temperature control stream 10, mobile temperature control medium is not particularly limited, and can be water or oil.Temperature control medium is mainly used to cooling ink jet print head.First liquid stream and second liquid stream are independent of one another.In addition, second liquid is not used to discharge.Owing to forming similarly record head with the first exemplary embodiment, therefore can easily form second liquid stream.
Ink-jet substrate 1 comprises the multiple exhaust energy producing components 7 for discharging China ink, such as electrothermal conversioning element.Ink-jet substrate 1 can also comprise the wiring (not shown) for driving exhaust energy producing component 7.In addition, ink-jet substrate 1 comprises for supply black black supply opening (that is, supply opening) 8 to black stream 5.
In addition, ink-jet substrate 1 comprises the service duct (that is, first liquid passage) 11 as the openings for to temperature control stream 10 supply temperature control liquid.In addition, ink-jet substrate 1 comprises the passing away (that is, second liquid passage) 13 as the openings for from temperature control stream 10 discharge temperature control liquid.
Shown in Fig. 6 and Fig. 7, at stream, form and form the nozzle array that multiple black streams 5 by being communicated with spatially each other and black outlet 6 form in parts 3.In other words, arrange that multiple black outlets 6 and multiple black stream 5 are to form multiple nozzle arrays.
In addition, for each nozzle array, form the black supply opening 8 that runs through ink-jet substrate 1.A nozzle array can comprise and discharge identical China ink.
With reference to figure 7, the stream that temperature control stream 10 is arranged by the both sides along each nozzle array forms.Temperature control stream 10 comprises to the liquid inlet of its supply temperature control liquid and from the liquid outlet of its discharge temperature control liquid.Liquid inlet is connected with service duct 11, and liquid outlet is connected with passing away 13.
In addition, temperature control stream 10 starts to extend along nozzle array near the liquid inlet that is arranged in stream and forms the angular zone of parts 3.Then temperature control stream 10 between each nozzle array by and arrive and be arranged in stream and form near the liquid outlet angular zone of parts 3.Therefore temperature control liquid is fed to temperature from service duct 11 and is controlled stream 10, flows through temperature control stream 10, and discharges from passing away 13.
The temperature of ink jet print head or the temperature of more preferably discharging component substrate can be controlled by the temperature control liquid flowing in temperature control stream 10.For example, if cooling temperature control liquid is flowed in temperature control stream 10, the heat that temperature control liquid absorption is produced by exhaust energy producing component.Then the discharge component substrate of cooling ink jet print head effectively.
Not to use especially cooling temperature control liquid.Can discharge outside component substrate by making the temperature control liquid of room temperature flow the heat being produced by exhaust energy producing component to be discharged in temperature control stream 10.
In addition, ink jet print head is connected with the liquid-circulating mechanism such as pump, makes the temperature control liquid of discharging from passing away 13 be again supplied to service duct 11.Liquid-circulating mechanism can be included in the liquid discharge apparatus such as ink-jet printer.Temperature control liquid can be when being circulated by liquid-circulating mechanism emission and absorption heat.
In addition, liquid discharge apparatus can comprise the temperature control device of the temperature of adjusting liquid.More particularly, temperature control device is effectively adjusted the temperature of the temperature control liquid of discharging from passing away 13 and temperature control liquid is turned back to service duct 11.Especially, according to the present invention, preferably temperature control device comprises the refrigerating function of cooling liquid, so that the cooling heat producing in exhaust energy producing component effectively.
The pipe that can be flow through by liquid and generation form liquid-circulating mechanism for the pump of the energy of moving liquid.
As exemplary embodiment of the present invention, ink jet print head has been described above.But, the invention is not restricted to this, and the present invention relates to discharge the liquid discharging head of the liquid such as China ink.
If ink jet print head is liquid discharging head, basic configuration is similar.As pointed out in above-mentioned bracket, term can be understood as follows: China ink is corresponding to first liquid, temperature control liquid is corresponding to second liquid, ink-jet substrate is corresponding to a substrate, China ink outlet is corresponding to outlet, China ink supply opening is corresponding to supply opening, and service duct is corresponding to first liquid passage, and passing away is corresponding to second liquid passage.
Aforesaid liquid is discharged head and is at least comprised that stream forms parts and a substrate, and comprises liquid-circulating mechanism.Stream forms parts and forms first liquid such as China ink mobile the first stream and the second liquid stream flowing therein for carrying out temperature controlled second liquid therein.
Substrate comprises for the supply opening to first liquid stream supply first liquid, for the first liquid passage to second liquid stream supply second liquid and for discharge the second liquid passage of second liquid from second liquid stream.
According to above-mentioned exemplary embodiment of the present invention, can make second liquid flow in the second liquid stream being formed in stream formation parts.Therefore can control the temperature of ink jet print head, particularly discharge the temperature of component substrate.
In addition, can carry out with circulation second liquid the ink jet print head that cooling its temperature rises due to the heat producing effectively in exhaust energy producing component by serviceability temperature controlling organization is cooling.
The invention is not restricted to cooling.For example, temperature control device can be used to heating and circulation second liquid, to ink jet print head is adjusted to suitable temperature.
The formation that stream forms parts is not particularly limited.But preferably stream forms the nozzle array that parts comprise that multiple outlets by being communicated with spatially each other and first liquid stream form.In addition, for each nozzle array, form at least one supply opening.Fig. 6, Fig. 7 and Fig. 8 illustrate the example that wherein forms a supply opening with rectangular aperture along a nozzle array.But, can form multiple supply openings for a nozzle array.
In addition,, except first liquid stream, stream forms parts and is also configured for carrying out temperature controlled second liquid stream.The formation of second liquid stream is not particularly limited.But preferably second liquid stream is arranged along the nozzle array longitudinal direction of nozzle array (that is, along).In addition, preferably second liquid stream is arranged along the both sides of all nozzle arrays.
Quantity for second liquid stream does not limit, and can have one or two above second liquid streams.For example, with reference to figure 7, form a second liquid stream, this second liquid stream comprises to it supplies the liquid inlet of second liquid and the liquid outlet from its discharge second liquid.
Further preferably, even if also arrange second liquid stream along the both sides of whole nozzle array when only there is a second liquid stream.In addition expectation, beeline in the horizontal plane between each exhaust energy producing component and second liquid stream (d) roughly the same with reference in figure 7.
Can in each second liquid stream, form first liquid passage and the second liquid passage in a substrate.In addition, can in a second liquid stream, form multiple first liquid passages and multiple second liquid passage.Not special restriction.In addition,, from the viewpoint of the efficiency of liquid-circulating, preferably for second stream, form a first liquid passage and a second liquid passage.
As mentioned above, according to the substrate in the liquid discharging head of this exemplary embodiment, in a side relative with the surface that is furnished with stream formation parts above, comprise sunk part.In the bottom of sunk part, connect a substrate and form all supply openings.Substrate and support component are engaged at the place, bottom of sunk part, and supply opening and intake are communicated with each other.
Support component comprises for the intake to supply opening supply first liquid.In addition, support component comprises for the first liquid path of the first liquid passage supply second liquid to a substrate and for discharge the second liquid path of second liquid from second liquid passage.
Liquid-circulating mechanism is sent to first liquid path by second liquid from second liquid path.The intake of support component can comprise the liquid supply part for supplying liquid.Liquid supply part can comprise the function for accommodating second liquid.
For be used to form the service duct that forms and the method for passing away on ink-jet substrate, have no particular limits.From the viewpoint of design, preferably use the dry etching such as RIE to be vertically formed service duct and passing away.But, from the viewpoint of time and cost, by utilization, be dry-etched in that on general wafer, to form little through hole be unpractical.
On the other hand, if make the attenuation of whole ink-jet substrate, can effectively form through hole with dry etching.But if make the attenuation of whole ink-jet substrate, strength decreased, make to produce warpage because stream forms the stress of parts in ink-jet substrate, and productivity ratio may greatly be reduced.
In order to address this is that, as shown in Figure 6, a side relative in that side with being furnished with stream formation parts above of ink-jet substrate forms sunk part.Place, bottom at sunk part engages support component and ink-jet substrate.
As a result, when maintaining the intensity of ink-jet substrate, can use dry etching effectively in sunk part, to form ink-jet supply opening, service duct and passing away.More particularly, because the edge of ink-jet substrate has predetermined thickness, therefore can maintain intensity.In addition,, owing to forming black supply opening and service duct in the bottom of the sunk part of thin substrates, therefore can the size of opening be formed littlely.
In addition, according to this exemplary embodiment, when maintaining substrate strength, can the opening of black supply opening be formed littlely, make effectively to form high density nozzle and make ink jet print head miniaturization.Traditionally, generally by the crystal anisotropy etching of silicon substrate, form black supply opening.But owing to carrying out etching with the gradient of being scheduled in crystal anisotropy etching, therefore the opening of black supply opening becomes large.
In addition as mentioned above, from the viewpoint of time and cost, by utilizing dry etching to be vertically formed black supply opening, be unpractical.In addition, if by making the attenuation of whole ink-jet substrate reduce the opening of black supply opening, reduced as mentioned above intensity, and become the warpage of easy generation ink-jet substrate.In order to address this is that, according to this exemplary embodiment, all black supply openings are disposed in the bottom of sunk part, and the opening size of black supply opening can be reduced.As a result, can form nozzle and can make ink jet print head miniaturization with high density.
In addition, owing to not making the attenuation of whole ink-jet substrate, and the periphery of substrate has predetermined thickness, therefore can maintain intensity, and not produce warpage.Particularly, according to the present invention, at stream, form on parts and black stream formation temperature control stream discretely.Therefore this exemplary embodiment has realized the better technology that wherein can the opening of black supply opening and fluid passage be formed littlely.
With reference to figure 6, as mentioned above, by adhesive 4, engage ink-jet substrate 1 and support component 2.Ink-jet substrate 1 comprises sunk part in a side relative with the surface that is furnished with stream formation parts 3 above.Ink-jet substrate 1 is engaged to support component 2 at the place, bottom of sunk part.
In the bottom of sunk part, connect ink-jet substrate and form whole black supply openings 8, multiple service duct 11 and multiple passing away 13.China ink supply opening 8, multiple service duct 11 are formed by the through hole with the sidewall vertical with respect to the surface direction of ink-jet substrate 1 with multiple passing aways 13.
Support component 2 comprises for supply black black intake (intake) 9 to black supply opening 8.In addition, for the feed lines to service duct 11 supply temperature control liquid (support component 2 comprises, first liquid path) 12 and for the discharge path from passing away 13 discharge temperature control liquid (that is, second liquid path) 14.Can use liquid-circulating mechanism that temperature control liquid is sent to feed lines 12 from discharge path 14.
Place, bottom at sunk part joins support component 2 to ink-jet substrate 1, and black supply opening 8 and black intake 9, service duct 11 and feed lines 12 and passing away 13 and discharge path 14 are communicated with each other.Ink jet print head can comprise the black supply part (not shown) for supply black storage China ink to the black intake 9 of support component 2.
In addition, as mentioned above, according to this exemplary embodiment, for a nozzle array, form a black supply opening 8.In the bottom of sunk part, along nozzle array, with rectangular shape, form the opening of multiple black supply openings 8.
In addition, support component 2 comprises the convex shape installing in sunk part, and black intake 9, feed lines 12 and discharge path 14 have opening on the upper surface of bossing.When engaging, each black intake 9 is arranged to each black supply opening 8 and is communicated with, and forms multiple arrays.
In addition, preferably, support component has the bossing mating with the sunk part of a substrate.Can make this support component with forming method.
As mentioned above, according to this exemplary embodiment, ink-jet substrate is included in the sunk part that a side (back side) relative with the surface that is furnished with stream formation parts above forms.Be used to form the method for sunk part with according to first exemplary embodiment describe the same.
According to this exemplary embodiment, stream forms the nozzle array that parts comprise that multiple black outlets by being communicated with spatially each other and first liquid stream form.For each nozzle array, form at least one supply opening, and all supply opening is formed in the bottom of sunk part.In addition,, with reference to figure 6, Fig. 7 and Fig. 8, along a nozzle array, form a supply opening with rectangular aperture.But this is not restriction, and can form multiple supply openings for a nozzle array.
If form multiple supply openings for a nozzle array, can in support component, for the each supply opening being communicated with same nozzle array, arrange intake.In addition, can form an intake for the multiple supply openings that are communicated with nozzle array.
In addition, preferably use dry etching to form black supply opening 8, service duct 11 and passing away 13.If use dry etching, can be formed with respect to the surface direction of ink-jet substrate be vertical to side surface, and can make opening size less.In addition,, except using dry etching, can form black supply opening 8, service duct 11 and passing away 13 with laser.
According to the 3rd exemplary embodiment of the present invention, with reference to Fig. 6, describing is wherein the example of cooling flowing path according to the temperature control stream of the second exemplary embodiment (that is, the second stream).
With reference to figure 6, to the thick silicon substrate of 1.0mm, form ink-jet substrate 1 with 0.3mm.On the front of ink-jet substrate 1, form multiple exhaust energy producing components 7, such as heater.In addition the stream forming on ink-jet substrate 1, forms parts 3 and forms black stream 5 and outlet 6.
In addition, stream forms parts 3 and forms the cooling flowing path 10 that cooling medium flows therein.The silicon substrate that forms ink-jet substrate 1 has the crystal orientation of <100> face.Below black outlet 6, arrange exhaust energy producing component 7.
For each nozzle array, form the black supply opening 8 that pro connects ink-jet substrate 1 from composition surface to ink-jet substrate 1.Ink-jet substrate 1 ground that pro connects from composition surface to ink-jet substrate 1 is formed for supplying the service duct 11 of cooling medium and for discharge the passing away 13 of cooling medium from cooling flowing path 10, to be communicated with a part for cooling flowing path to cooling flowing path 10.
Support component 2 comprises for supplying black black intake 9 to black supply opening 8.In addition, use adhesive 4 to engage support component 2 and ink-jet substrate 1 makes black intake 9 corresponding to black supply opening 8.In addition, support component 2 comprises for supplying the feed lines 12 of cooling medium to service duct 11 and for discharge the discharge path 14 of cooling medium from passing away 13.
From hot viewpoint, can select the liquid that its thermal capacity is large and stable (such as water) as cooling medium.In addition, can use that discharge from black outlet 6 and be recorded in China ink recording medium as cooling medium.
Can be by pressurizeing to pushed out fluid transfer medium from liquid outlet from liquid inlet.In addition, can be by be sucked out transmission cooling liquid medium from liquid outlet.Can use can fluid transfer various pumps as drive source.Pump is arranged in the main body of ink-jet printer, and can be connected with the cooling medium opening 13 of ink gun 1.
As mentioned above, realized the ink gun that cooling medium can circulate therein, made greatly to improve the hot discharge producing due to bubble (bubbling).As a result, even when time per unit is inputted energy increase to the end, also can reduce the temperature rise of head during recording.Therefore can reduce such as the black discharge rate for every one page and change or discharge the problem unstable at high temperature, and can improve continuous recording capability and record reliability.
In addition, as shown in Figure 7, preferably arrange cooling flowing path 10, make surround the cooling flowing path of nozzle array and produce the beeline along surface direction (horizontal direction) between hot heater 7 (with reference to d) becoming for each heater constant in figure 7 being arranged as.
With reference to figure 7, heater 7 is disposed under outlet 6.If constant apart from d, discharge equably heat, make to make to become consistent for the heat radiation of each nozzle.
According to the present invention, thermal diffusion layer can be disposed on a substrate to expand to second liquid stream from the foaming part of exhaust energy producing component top.More particularly, the thermal diffusion layer being formed by metal is formed on exhaust energy producing component top and expands to second liquid stream.
Utilize this configuration, the heat producing can be sent to second liquid stream effectively in exhaust energy producing component.In addition, thermal diffusion layer can also be used as resistance to cavitation (cavitation-resistant) film.
To describe the 4th exemplary embodiment below in detail.Fig. 9 is the amplification sectional view that the part of being surrounded by the dotted line frame X shown in Fig. 6 is shown.
With reference to figure 9, on the front of the silicon substrate of ink-jet substrate 1, form dielectric film 41 and passivating film 42.Heater 7 (that is, exhaust energy producing component) is included in dielectric film 41 and passivating film 42.Dielectric film 41 and passivating film 42 are formed by the film (such as silicon oxide film or silicon nitride film) that meets corresponding function.
In the black discharge method that uses heat to bubble, when bubble collapse, produce cavitation (cavitation), this may destroy heater 7 and cause disconnecting.In order to reduce the destruction causing due to cavitation, generally on passivating film 42, arrange the film of resistance to cavitation.According to the present invention, preferably on passivating film 42, form the film of resistance to cavitation 43.
Consider intensity and flexibility, metal is used to form the film of resistance to cavitation.In addition, among metal, use tantalum (Ta) to form the film of resistance to cavitation.
Owing to using metal to form the film of resistance to cavitation 43, therefore very high with film (that is, dielectric film 41 and passivating film 42) phase specific thermal conductivity around.Therefore, as shown in Figure 9, by expand to the region contiguous with cooling flowing path 10 from heater 7 tops, arrange the film of resistance to cavitation 43, become can be energetically by the thermal diffusion being produced by heater 7 to cooling flowing path 10.
As a result, further improve cooling effectiveness, and can reduce due to the deterioration of discharging continuously the print quality causing.Preferably, the film of resistance to cavitation expands to the basal surface of cooling flowing path 10 and formation cooling flowing path 10 from the foaming part of heater 7 tops.
Fig. 7 is the plane that the 5th exemplary embodiment of the present invention is shown, and can determine that the layout of cooling flowing path 10 and the position of service duct 11 and passing away 13 are to meet its function.For example, can go out as shown in Figure 10 A and 10 B to arrange cooling flowing path 10, service duct 11 and passing away 13.
With reference to figure 10A, along the both sides of nozzle array, arrange multiple cooling flowing paths 10.Service duct 11 and passing away 13 are arranged in terminal part office at each cooling flowing path 10.Utilize this configuration, can reduce flow resistance, and can easily transmit cooling medium.
With reference to figure 10B, form a cooling flowing path 10, and arrange close to each other passing away 13 and service duct 11.Cooling flowing path 10 starts near liquid inlets service duct 11 to extend along the both sides of each nozzle array, and arrives near liquid outlet passing away 13, and is arranged to and roughly surrounds each nozzle array.Go out as shown in Figure 10 B, can between nozzle array, form two or more cooling flowing paths.
Figure 11 A, Figure 11 B, Figure 11 C, Figure 11 D, Figure 11 E, Figure 11 F and Figure 11 G are the technique sectional views illustrating according to the manufacture method of the ink jet print head of the 6th exemplary embodiment of the present invention.With reference to figure 11A, be provided with ink-jet substrate 101.On ink-jet substrate 101, form heater 102 and the drive circuit (not shown) being connected with heater 102.
With reference to figure 11B, form the stream moulding material 103 of black stream and cooling flowing path 10.Because stream moulding material 103 must be removed in subsequent technique, therefore can form stream moulding material 103 with aluminium or soluble resin.The moulding material of China ink stream is also referred to as the first moulding material, and the moulding material of cooling flowing path is called as the second moulding material.
With reference to figure 11C, organic resin, and is formed stream and forms parts 104 to cover stream moulding material 103 by spin coating and baking.Then form black outlet 105.
If it is photosensitive forming the organic resin of stream formation parts 104, can be by exposing and developing to form black outlet 105.In addition,, if organic resin is not photosensitive, can form black outlet 105 by laser treatment or photoetching and etching.
If stream forms parts 104, to be formed on stream moulding material 103, stream form the thickness of parts may be in the terminal part office attenuation of nozzle array, and therefore hinder in nozzle array and bubble uniformly.In order to address this is that, Japanese Patent Application Publication No.10-157150 has discussed the pattern that is further provided as substrate (base) in nozzle array outside, to improve the flatness of stream formation parts.According to this exemplary embodiment, also can be used as this substrate will form the stream moulding material forming in the position of cooling flowing path.
With reference to figure 11D, sunk part 106 is formed at the back side of ink-jet substrate 101, and becomes and the composition surface of support component.Can form sunk part by the crystal anisotropy etching of utilizing aqueous slkali.If utilize crystal anisotropy etching, can form diaphragm (not shown) and protect stream to form parts 104.
With reference to figure 11E, connect ink-jet substrate 101 ground and form black supply opening 107, service duct 108 and passing away 109.Can utilize and use the dry etching of the photoresist mask with predetermined patterns of openings to form through hole.Rich construction skill as an example of dark silicon etching technology is preferred as dry etching method.
With reference to figure 11F, stream moulding material 103 is dissolved and be removed from black supply opening 107, service duct 108, passing away 109 and black outlet 105.Then form black stream 110 and cooling flowing path 111.The material that forms parts by being considered to shaped material and stream is selected the remover of stream moulding material 103.If moulding material is aluminium, can use acid or aqueous slkali as remover, and if moulding material is organic resin, can use can elution organic resin solvent.
With reference to figure 11G, adhesive 116 is used at the place, bottom of sunk part 106 support component 112 and 101 combinations of ink-jet substrate.Support component 112 comprises for supplying black intake 113 to black supply opening 107, for supplying the feed lines 114 of cooling medium to service duct 108 and for discharge the discharge path 115 of cooling medium from passing away 109.
Below with reference to Fig. 4 and Fig. 5, describe the manufacture method of ink jet print head in detail.The invention is not restricted to the exemplary embodiment that will describe below.
Fig. 4 A illustrates and uses ink-jet substrate 101 and the stream that silicon forms to form parts 105.On the front of ink-jet substrate 101, form etching stop layer 123 and heater 102 (that is, exhaust energy producing component).
In addition, above heater 102 and etching stop layer 123, form insulating barrier (not shown).By the thick aluminium of sputter 500nm, form etching stop layer 123.By carrying out plasma chemistry vacuum moulding machine (CVD), form the thick oxidation film of 700nm using as this insulating barrier.The thickness of ink-jet substrate 101 is 700 μ m.In addition, on the back side of ink-jet substrate, form the heat oxide film 106 that its thickness is 600nm.
On the front of ink-jet substrate, form the moulding material 103 of black stream.Utilize positive photoresist to be formed into shaped material 103.Above ink-jet substrate 101 and moulding material 103, form stream and form parts 104.Can also form the adhesiveness that the adhesive layer (not shown) being formed by polyetheramides resin bed improves stream and form parts and ink-jet substrate.
Use polyetheramides resin on the back side of ink-jet substrate 101, to be formed for forming the back side masks 107 of sunk part.With reference to figure 4B, it is solution influenced that the front surface that the resist 108 of formation protectiveness protects stream to form parts 105 and ink-jet substrate is avoided alkaline etching.By Tokyo Ohka Kougyou Co., " OBC " that Ltd. manufactures is used as the resist of protectiveness.
With reference to figure 4C, by the back side of ink-jet substrate being immersed in tetramethylammonium hydroxide aqueous solution (22wt%, 83 ℃) 12 hours, carry out crystal anisotropy etching with back side masks 107.Therefore form the sunk part that comprises composition surface 109.The degree of depth (that is, the distance from original back position to composition surface 109) of sunk part is 600 μ m.
With reference to figure 4D, then remove back side masks 107 and heat oxide film 106.
With reference to figure 4E, form black supply opening mask 110.Photosensitive material (by AZ Electronic Materials Co., the AZP4620 " ProductName " that Ltd manufactures) is used as the material of black supply opening mask 110.In addition, this material, by using spraying equipment (by EVG Co., the EVG 150 " ProductName " that Ltd. manufactures) to be applied equably, is exposed and develops, and the formation patterns of openings corresponding with black supply opening.
With reference to figure 4F, carry out dry etching with black supply opening mask 110, and on ink-jet substrate 101, form black supply opening 111.RIE is used as dry etching method.
With reference to figure 4G, remove the black supply opening mask 110 forming on the back side of ink-jet substrate 101, and then remove etching stop layer 103 and insulating barrier.
With reference to figure 4H, remove the resist 108 of protectiveness.In addition, remove moulding material 103, form black stream 112, and manufactured discharge component substrate.
In the bottom surface of sunk part, engage the support component obtaining by above-mentioned manufacture method and discharge component substrate, black supply opening 111 and black intake are communicated with each other.Therefore obtain ink jet print head (with reference to figure 1).Aluminium oxide is used to form support component.
The technique shown in execution graph 4 and Fig. 5 when ink-jet substrate is Spherulite.Then ink-jet substrate is cut out in section (dicing) technique, and becomes the single ink-jet substrate going out as shown in FIG..Then applying adhesive around the black intake in support component, and support component is engaged with ink-jet substrate 20.
In addition, ink-jet substrate and ink jet print head are carried out to electrical connection (not shown).
Used and utilized the ink jet print head of above-mentioned manufacture method manufacture to carry out printing endurancing.Obtained following result, that is, the reliability of the sealing between each color is high, even and if also realized the high reliability that records during flying print carrying out.
In addition, with reference to Fig. 1 and Fig. 4, describe the size of the ink jet print head forming by above-mentioned manufacture method in detail, to effect of the present invention is shown particularly.
Below with reference to Fig. 1, describe according to the size of the ink jet print head of this exemplary embodiment.The opening size of China ink supply opening is 100 μ m.Distance b between the black supply opening of adjacent nozzle array is 1100 μ m.From the black supply opening that is positioned at edge, to the distance c of the along continuous straight runs of the fringe region of the sunk part at the back side, be 300 μ m.
From the marginal portion of the sunk part at the back side, to the distance d of the marginal portion of ink-jet substrate, be 500 μ m.Therefore the width w of whole ink-jet substrate becomes 4100 μ m.Then can obtain the width W of the bonding part of 800 μ m.
Fig. 5 is the sectional view that traditional ink jet print head is shown.With reference to figure 5, at the back side except sunk part, (that is, the minimum surface of the ink-jet substrate in Fig. 5) located to join traditional ink mist recording substrate to support component.As a result, if obtain be equivalent to the bonding part shown in Fig. 1 width W width W ', as shown in Figure 5, whole ink-jet substrate becomes larger.
More particularly, the width of bonding part " W ' " is set to 800 μ m similarly with the size of above-mentioned exemplary embodiment.In this case, the opening size a ' of the black supply opening shown in Fig. 5 is 100 μ m.Distance b between the black supply opening of adjacent nozzle array ' because the crystal orientation of silicon substrate becomes greatly, that is, become 1950 μ m.In addition, c ' becomes 150 μ m, and d ' becomes 500 μ m.Therefore the width w ' of whole ink-jet substrate becomes 5500 μ m, and it is larger.
As mentioned above, according to the present invention, can guarantee the enough contact areas between support component and a substrate, and can make the compact in size of a substrate.
According to the present invention, can in the case of not reducing the productivity ratio of a substrate, provide highly reliably and have the liquid discharging head of high heat-sinking capability.As a result, according to liquid discharging head of the present invention, can tackle the increase of print speed.
In addition, according to other aspects of the invention, can provide the liquid discharging head that there is durability and can be miniaturized.In other words, according to the present invention, in the intensity that maintains a substrate, can reduce the size of supply opening, make can carry out miniaturization when maintaining durability.In addition,, owing to forming outlet with high density, therefore can also improve discharging performance.
Although reference example embodiment has described the present invention, should be appreciated that and the invention is not restricted to disclosed exemplary embodiment.Thereby the scope of following claim comprises all modifications, equivalent construction and function by being given the widest explanation.
Claims (9)
1. a liquid discharging head, comprising:
Stream forms parts; described stream forms parts and is configured for the liquid flow path of discharging the outlet of liquid and being communicated with described outlet; and comprise multiple nozzle arrays, each nozzle array in described multiple nozzle arrays is formed by the described outlet being communicated with spatially each other and described liquid flow path;
Substrate, described substrate comprises the exhaust energy producing component that produces the energy for discharging liquid, and for each nozzle array, is formed for to the supply opening of described liquid flow path supply liquid in described substrate; And
Support component, described support component comprises the intake for supply liquid to described supply opening,
Wherein said substrate comprises sunk part, in the place, bottom of described sunk part, states a substrate attenuation, and described sunk part is formed on a side relative with the surface that is furnished with described stream formation parts above,
Wherein all supply openings are connected described substrate and are formed in the bottom of described sunk part, and
Wherein said substrate and described support component are engaged at the place, bottom of described sunk part, and described supply opening and described intake are communicated with each other.
2. liquid discharging head according to claim 1, wherein said supply opening is formed along described nozzle array.
3. liquid discharging head according to claim 1, wherein said sunk part forms by anisotropic etching.
4. liquid discharging head according to claim 1, wherein said sunk part forms by crystal anisotropy etching.
5. liquid discharging head according to claim 4, wherein said substrate is that the silicon substrate that has a crystal orientation of <100> face by use forms.
6. liquid discharging head according to claim 5, the bottom of wherein said sunk part is the <100> face forming by crystal anisotropy etching, and this <100> face becomes the composition surface of described substrate and described support component.
7. according to the liquid discharging head described in any one in claim 1 to 6, wherein:
Described stream forms parts and also forms the second liquid stream that second liquid flows therein;
Wherein for the first liquid passage to described second liquid stream supply second liquid and for the second liquid passage of discharging second liquid from described second liquid stream, be formed on described substrate, and
Wherein said stream forms parts and described substrate and is formed and described second liquid stream, described first liquid passage and described second liquid passage is formed communicate with each other, and the liquid flow path being communicated with described outlet and described supply opening are formed and communicate with each other.
8. liquid discharging head according to claim 7, wherein said second liquid stream comprises the liquid outlet of being supplied the liquid inlet of second liquid and discharging second liquid by it from described second liquid stream to described second liquid stream by it, and
Wherein said liquid inlet is connected with described first liquid passage, and described liquid outlet is connected with described second liquid passage.
9. liquid discharging head according to claim 7, the thermal diffusion layer wherein being formed by metal is formed on described exhaust energy producing component, so that expands to described second liquid stream.
Applications Claiming Priority (6)
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| JP2010-115232 | 2010-05-19 | ||
| JP2010115232 | 2010-05-19 | ||
| JP2010115233 | 2010-05-19 | ||
| JP2010-115233 | 2010-05-19 | ||
| JP2011099580A JP5717527B2 (en) | 2010-05-19 | 2011-04-27 | Liquid discharge head |
| JP2011-099580 | 2011-04-27 |
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| CN102248794A CN102248794A (en) | 2011-11-23 |
| CN102248794B true CN102248794B (en) | 2014-05-07 |
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| WO2018186844A1 (en) * | 2017-04-05 | 2018-10-11 | Hewlett-Packard Development Company, L.P. | Fluid ejection die heat exchangers |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172011A (en) * | 1996-06-07 | 1998-02-04 | 佳能株式会社 | Liquid ejection, supply method, liquid ejection head, ejection head frame and ejection device |
| US6796019B2 (en) * | 1998-06-19 | 2004-09-28 | Lexmark International, Inc. | Process for making a heater chip module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10157050A (en) * | 1996-11-28 | 1998-06-16 | Dainippon Screen Mfg Co Ltd | Apparatus and method for regulating joint in split plotting |
| JP2005125516A (en) * | 2003-10-21 | 2005-05-19 | Canon Inc | Ink jet recording head and its manufacturing process |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172011A (en) * | 1996-06-07 | 1998-02-04 | 佳能株式会社 | Liquid ejection, supply method, liquid ejection head, ejection head frame and ejection device |
| US6796019B2 (en) * | 1998-06-19 | 2004-09-28 | Lexmark International, Inc. | Process for making a heater chip module |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2005-125516A 2005.05.19 |
| JP特开平10-157050A 1998.06.16 |
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