CN102248494A - Substrate layer, grinding pad and grinding method - Google Patents
Substrate layer, grinding pad and grinding method Download PDFInfo
- Publication number
- CN102248494A CN102248494A CN2010101824392A CN201010182439A CN102248494A CN 102248494 A CN102248494 A CN 102248494A CN 2010101824392 A CN2010101824392 A CN 2010101824392A CN 201010182439 A CN201010182439 A CN 201010182439A CN 102248494 A CN102248494 A CN 102248494A
- Authority
- CN
- China
- Prior art keywords
- top layer
- basalis
- imporosity
- layer
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a substrate layer, a grinding pad and a grinding method. The grinding pad comprises a grinding layer and a substrate layer. The substrate layer is configured below the grinding layer and comprises a porous inner layer and at least a surface layer. The porous inner layer is provided with an upper surface and a lower surface. The surface layer is configured on at least one of the upper and lower surfaces of the porous inner layer, and the hole-pore ratio of the surface layer is not more than 0.3%, or the surface layer is free from of holes and pores. The surface layer provided by the invention can be tightly bonded with an adhesive layer so that the good shearing resistance character is formed between the substrate layer and the adhesive layer, the condition of degumming of the adhesive layer is reduced, and the grinding quality is improved.
Description
Technical field
The present invention relates to a kind of basalis, comprise the grinding pad and the Ginding process of this basalis, relate in particular to and have basalis, grinding pad and the Ginding process of shearing resistance characteristic preferably between a kind of and the adhesion coating.
Background technology
Along with the progress of industry, the planarization processing procedure often is adopted to the processing procedure of producing various elements.In the planarization processing procedure, the cmp processing procedure is often used by industry.In general, the cmp processing procedure be have chemical mixture by supply lapping liquid on grinding pad, and the grinding charge body applied a pressure so that it is pressed on the grinding pad, and makes object and grinding pad carry out relative motion each other.Reach under the chemical action of lapping liquid by the mechanical friction that relative motion produced, remove part object top layer, and make its surface smooth gradually, reach the purpose of planarization.
At present, the known semiconductor wafer uses the grinding pad that possesses multiple layer structure with grinding pad, and its structure includes grinding layer, adhesion coating and basalis haply.Wherein, grinding layer has lapped face, can directly contact with the grinding charge body, can be formed with micropore, groove and/or through hole pattern on it; Basalis is adhered to the grinding layer below and is fixed on the grinder station, be cellular structure, have hole numerous and not of uniform size, the ratio that its hole area accounts for the gross area is called hole than (pore ratio), hole all is greater than 20% than generally speaking, even can be up to 60%; And adhesion coating mainly provides adhesion strength grinding layer and basalis are closely fit together.
When grinding processing procedure, can utilize another adhesion coating that the another side adhesion that basalis does not contact with above-mentioned adhesion coating is fixed on the pedestal of grinder station earlier, utilize this grinding pad that grinding charge body (as wafer or base material) is carried out polish process afterwards again.
Yet, because basalis is a cellular structure, exist many holes not of uniform size everywhere, on the contact-making surface of fitting with adhesion coating, also exist a plurality of holes, in carrying out process of lapping, these holes can push air because of shearing action causes distortion, the air that is squeezed and then push the adhesion coating that originally is attached in the hole, make the contact-making surface between basalis and the adhesion coating produce minute protrusions, along with the increase of milling time, under the shearing continuous action, the contact-making surface between basalis and the adhesion coating is unevenness more, such result can cause and grind quality decline, even influences the accuracy of processing procedure.
Summary of the invention
The purpose of this invention is to provide a kind of basalis, grinding pad and Ginding process, so that have shearing resistance characteristic preferably between basalis and the adhesion coating.
For achieving the above object, the invention provides a kind of grinding pad, comprise grinding layer and basalis, basalis is disposed at the grinding layer below, and include porous internal layer and at least one top layer, wherein the porous internal layer has upper surface and lower surface, and the top layer can have the hole (its hole ratio is not more than 0.3%) of only a few or not have hole fully, and this top layer is disposed at least one of the upper surface of porous internal layer and lower surface.
The present invention also provides a kind of basalis, the grinding layer that is used for the liner grinding pad, this basalis comprises porous internal layer and top layer, the porous internal layer has upper surface and lower surface, the top layer can have the hole (its hole ratio is not more than 0.3%) of only a few or not contain hole fully, and this top layer is disposed at least one of the upper surface of porous internal layer and lower surface.
The present invention also provides a kind of Ginding process, is used to grind substrate, and this Ginding process comprises the following steps.At first, provide grinding pad.Then, substrate is exerted pressure to be pressed on the grinding pad.Then, provide relative motion to substrate and grinding pad.Wherein, grinding pad comprises grinding layer and basalis.Basalis is disposed at the grinding layer below, and basalis comprises porous internal layer and at least one top layer.The porous internal layer has upper surface and lower surface.The top layer can have the hole (its hole ratio is not more than 0.3%) of only a few or not contain hole fully, and this top layer is disposed at least one of the upper surface of porous internal layer and lower surface.
Based on above-mentioned, because the top layer in the basalis provided by the present invention, its hole ratio is not more than 0.3% or even do not contain hole, do not contain on the top layer under the situation of any hole, do not have any hole on the contact-making surface that top layer and adhesion coating are fitted, just do not have certainly existing because of basalis have that cellular structure causes and adhesion coating between the uneven phenomenon of contact-making surface produce.And work as under the situation that contains the only a few hole in the top layer (the hole ratio is not more than 0.3%), the hole number of being assembled on the contact-making surface of fitting with adhesion coating is few, though these holes also can push air because of shearing action causes distortion, but because hole number is few, few adhesion coating that originally is attached in the hole of pushing to assembling enough extruding air, the unevenness of contact-making surface can't be caused, also the grinding quality can be do not had influence on.
Therefore, basalis provided by the present invention can pass through this top layer and adhesion coating fluid-tight engagement, and makes to have shearing resistance characteristic preferably between basalis and the adhesion coating.In addition, in grinding pad provided by the present invention,, so can reduce the chance that adhesion coating comes unstuck because the basalis in the grinding pad has hole than being not more than 0.3% or even do not contain the top layer of hole.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the profile of the grinding pad of first embodiment of the invention.
Fig. 2 is the profile of the grinding pad of second embodiment of the invention.
Fig. 3 is the profile of the grinding pad of third embodiment of the invention.
Fig. 4 is the sweep electron microscope figure (SEM) of the basalis of one embodiment of the invention.
Fig. 5 is the flow chart of the Ginding process of one embodiment of the invention.
The main element symbol description:
10: pedestal; 100: grinding pad;
102: grinding layer; 104: basalis;
106: the porous internal layer; 108: the top layer;
110: upper surface; 112: lower surface;
114: hole; 116,118: adhesion coating;
S100, S102, S104: step numbers.
The specific embodiment
Fig. 1 is the profile of the grinding pad of first embodiment of the invention.Fig. 2 is the profile of the grinding pad of second embodiment of the invention.Fig. 3 is the profile of the grinding pad of third embodiment of the invention.Fig. 4 is the sweep electron microscope figure (SEM) of the basalis of one embodiment of the invention.
Referring to figs. 1 through Fig. 3, disclosed grinding pad 100 comprises grinding layer 102 and basalis 104 simultaneously.Wherein, grinding layer 102 is made by macromolecular material, and macromolecular material for example is a polyurethane (PU), and grinding layer 102 has a lapped face, can directly contact with grinding charge body (as wafer or base material), can be formed with micropore, groove and/or through hole pattern on it.
Basalis 104 is used for the grinding layer 102 of liner grinding pad 100.Basalis 104 fits in grinding layer 102 belows, and basalis 104 comprises porous internal layer 106 and at least one top layer 108.Wherein, top layer 108 is an imporosity structure, and the hole with only a few does not even contain any hole, so this top layer 108 also can be described as imporosity top layer 108.
The material of porous internal layer 106 for example right and wrong porous top layer 108 by made with a kind of material, porous internal layer 106 has identical chemical constitution with the material on imporosity top layer 108, and its material for example is the mixture by low density polyethylene (LDPE) or low density polyethylene (LDPE) and ethylene vinyl acetate.On processing procedure, porous internal layer 106 can form by same foaming processing procedure with imporosity top layer 108, by control foamed time and blowing temperature commaterial is formed simultaneously and have porous internal layer 106 and imporosity top layer 108.In other words, porous internal layer 106 and imporosity top layer 108 are formed in one made, are not that independent formation is rejoined (or applying) together, and there is no tangible hierarchical relationship between porous internal layer 106 and the imporosity top layer 108.In detail, though porous internal layer 106 all is " layer " with the title on imporosity top layer 108 in this manual, but in fact from the sweep electron microscope figure (SEM) of Fig. 4 as can be seen porous internal layer 106 do not have tangible seam with imporosity top layer 108, be a kind of double-decker that forms from body.
Porous internal layer 106 has upper surface 110 and lower surface 112, and have a plurality of small holes 114 not of uniform size in the porous internal layer 106, the pore-size distribution of these holes 114 for example is 10 μ m～400 μ m, in one embodiment, the average pore size of these holes 114 can be 100 μ m～250 μ m.
Wherein, imporosity top layer 108 can optionally only contain the hole of only a few or not have hole fully, and the hole in the imporosity top layer 108 is not more than 0.3% than (pore ratio) and (for example is: be not more than 0.2% in one embodiment; Be not more than 0.1%; Perhaps or even 0%), be the ratio that hole area in the imporosity top layer 108 accounts for the gross area at this hole that is among the present invention to be mentioned that will illustrate earlier than (pore ratio) its definition, the hole ratio is not more than 0.3% i.e. representative and is less than or equal to 0.3%.Though imporosity top layer 108 still has a plurality of small holes in this embodiment, but compared with existing basalis cellular structure (its hole ratio is greater than 20%), reduced many on its pore quantity, though therefore still have hole the factor amount really very little, few can't the gathering to the contact-making surface between imporosity top layer 108 and adhesion coating has sufficient amount to be enough to cause the extruding air to push the generation minute protrusions, makes the contact-making surface unevenness and then causes the phenomenon of grinding quality decline to take place.
Certainly, the producer can decide hole ratio in the imporosity top layer 108 by control foamed time and blowing temperature, hole in the imporosity top layer 108 is 0% than (pore ratio) in one embodiment, does not promptly contain hole in the imporosity top layer 108 fully.Owing to do not contain hole fully, just do not have hole certainly and accumulate on the contact-making surface between imporosity top layer 108 and the adhesion coating, more do not have and make contact-making surface uneven and then cause and grind the phenomenon that quality descends and take place.
Simultaneously, imporosity top layer 108 optionally is disposed at least one of the upper surface 110 of porous internal layer 106 and lower surface 112, specifically imporosity top layer 108 can only be disposed at the upper surface 110 of porous internal layer 106, or only be disposed at the lower surface 112 of porous internal layer 106, very the person can be disposed at the upper surface 110 and the lower surface 112 of porous internal layer 106 simultaneously, the producer can adjust the mode of production according to the demand of product, produces the imporosity top layer 108 that is disposed at diverse location or has different hole ratios.
As shown in Figure 1, imporosity top layer 108 is disposed on the upper surface 110 of porous internal layer 106, configuration according to this, and imporosity top layer 108 is between porous internal layer 106 and grinding layer 102.
As shown in Figure 2, imporosity top layer 108 is disposed on the lower surface 112 of porous internal layer 106, configuration according to this, and imporosity top layer 108 is between the pedestal 10 of porous internal layer 106 and grinder station.
As shown in Figure 3, imporosity top layer 108 is disposed on the upper surface 110 of porous internal layer 106 and on the lower surface 112 simultaneously, configuration according to this, on the imporosity top layer 108 of upper surface 110 between porous internal layer 106 and grinding layer 102, and on the imporosity top layer 108 of lower surface 112 between the pedestal 10 of porous internal layer 106 and grinder station.
Wherein, the thickness on imporosity top layer 108 for example is greater than 5 μ m, and in one embodiment, the thickness on imporosity top layer 108 can be 8 μ m～35 μ m.The thickness on imporosity top layer 108 is selected, and the parameter in the time of can making by adjustment basalis 104 is controlled, and for example is to adjust batch employed mold surface temperature of production, or adjusts continous way and produce employed roller surface temperature.The surface temperature of mould or roller for example be lower than 30 ℃, 20 ℃, 10 ℃ or or even be lower than 5 ℃, generally speaking, the surface temperature of mould or roller is low more, the thickness on the imporosity top layer 108 that produces is thick more.In addition, also can produce the basalis that the surface has the porous top layer earlier, with process heating of porous top layer and pressurization, make the top layer become the imporosity top layer again, wherein can control the thickness on imporosity top layer by adjusting temperature and pressure parameter.And the surface roughness on imporosity top layer 108 for example is less than 15 μ m.For instance, the surface roughness on imporosity top layer 108 for example is 3 μ m～10 μ m.On processing procedure, can be before imporosity top layer 108 and adhesion coating applying, earlier a surface treatment (surface treatment) program being implemented on imporosity top layer 108 increases the surface adhesion force on imporosity top layer 108, and wherein surface treatment program can be plasma treatment (plasma treatment).
In addition, grinding pad 100 also comprises adhesion coating 116, is disposed between grinding layer 102 and the basalis 104, in order to grinding layer 102 and basalis 104 are fitted and form grinding pad 100.The material of adhesion coating 116 for example is that (Pressure Sensitive Adhesive abbreviates as: PSA) pressure-sensing glue.
As shown in Figure 1, when disposing imporosity top layer 108 on the upper surface 110 of porous internal layer 106, because the hole (the hole ratio is not more than 0.3%) that imporosity top layer 108 has only a few, even do not contain any hole, do not contain on the top layer under the situation of any hole, do not have any hole on the contact-making surface that top layer and adhesion coating are fitted, just do not have certainly existing because of basalis have that cellular structure causes and adhesion coating between the uneven phenomenon of contact-making surface produce.And work as under the situation that contains the only a few hole in the top layer (the hole ratio is not more than 0.3%), imporosity top layer 108 (basalis 104) only has only a few on the contact-making surface of fitting with adhesion coating 116 hole, in polish process is carried out, imporosity top layer 108 (basalis 104) can be reduced when being subjected to shearing action and caused hole distortion extruding air to cause the contact-making surface of 116 of basalis 104 and adhesion coatings to produce the chance of minute protrusions generation, still can fit tightly, and then make grinding layer 102 and basalis 104 in grinding the process of processing procedure, can keep good tacky state with adhesion coating 116.
As shown in Figure 2, when the lower surface 112 of porous internal layer 106 disposes imporosity top layer 108, the one side that does not contact with porous internal layer 106 on imporosity top layer 108 can be bonding with the one side of another adhesion coating 118, and the another side of adhesion coating 118 then is bonded on the pedestal 10 of grinder station.In the same manner, because the hole (the hole ratio is not more than 0.3%) that imporosity top layer 108 has only a few, perhaps even do not contain any hole, therefore imporosity top layer 108 (basalis 104) with the bonding contact-making surface of adhesion coating 118 on only have the hole of only a few or do not contain hole fully, in polish process is carried out, the chance that causes hole distortion extruding air to cause the contact-making surface generation minute protrusions of 118 of basalis 104 and adhesion coatings can be reduced in imporosity top layer 108 (basalis 104) when being subjected to shearing action, still can fit tightly, and then make grinding pad 100 in grinding the process of processing procedure, can keep good tacky state with grinder station with adhesion coating 118.
As shown in Figure 3, when the upper surface 110 of porous internal layer 106 and lower surface 112 dispose imporosity top layer 108 simultaneously, imporosity top layer 108 (basalis 104) with the bonding contact-making surface of adhesion coating 116 and adhesion coating 118 on only have the hole of only a few or do not contain hole fully, in polish process is carried out, imporosity top layer 108 (basalis 104) can be reduced when being subjected to shearing action and caused hole distortion extruding air to cause the contact-making surface of 118 of basalis 104 and adhesion coating 116 and adhesion coatings to produce the chance of minute protrusions generation, still can fit tightly with adhesion coating 116 and adhesion coating 118, and then make grinding layer 102 and basalis 104 in grinding the process of processing procedure, can keep good tacky state, and make grinding pad 100 in grinding the process of processing procedure, can keep good tacky state with grinder station.
In the present invention, in order to confirm the effect of grinding pad provided by the invention, done the shearing resistance experiment.
Experimental example
Below, by carrying out actual experiment test the characteristic of basalis in the grinding pad of present embodiment is described.In experiment test, employed method of testing and sample are set as follows.
Shearing resistance method of testing:, measure the shearing resistance of basalis and hold time with ASTM D3654 standard method of test.
The material of adhesion coating: acryl is glue (acrylic-based adhesive).
Sample: grinding pad all gets grinding layer and basalis applying by adhesion coating.Experimental example 1 is to have different basalises with the difference of comparative example 1.
Experimental example 1: basalis with porous internal layer and imporosity top layer.
Comparative example 1: have identical materials and pore space structure with experimental example 1, but the basalis that does not have the imporosity top layer, be its top layer for having porous basalis, for example be that resulting basalis is removed on the imporosity top layer in the basalis of experimental example 1.
Below, will be in following table 1 in order to the interpretation of describing the adhesion characteristic between basalis and adhesion coating.
Table 1
| Experimental example 1 | Comparative example 1 | |
| Shearing resistance hold time (hour) | 74 | 14 |
| Is there there the generation minute protrusions during actual the grinding? | Do not have | Have |
As seen from Table 1, in experimental result, by experimental example 1 and comparative example 1 as can be known, it is 74 hours that the shearing resistance that has the experimental example 1 on imporosity top layer in the basalis is held time, held time 14 hours than the shearing resistance with porous top layer comparative example 1, its improvement amplitude surpasses 400%.In grinding processing procedure, grinding pad must still can keep under the shearing action not coming off bearing for a long time, thus shearing resistance to hold time be the epochmaking index of test grinding pad usefulness.In view of the above, be to need the basalis that will have the imporosity top layer badly to exist.
In shearing resistance is held time test, after fitting with adhesion coating 116 or adhesion coating 118 in imporosity top layer 108 in the basalis 104, when imporosity top layer 108 was applied shearing, 118 of basalis 104 and adhesion coating 116 or adhesion coatings had first and hold time.For having identical materials and pore space structure, but the basalis that does not have the imporosity top layer, be and have porous top layer and identical adhesion coating when fitting after-applied identical shearing, for example be when removing porous internal layer 106 behind the imporosity top layer 108 and identical adhesion coating and fit after-applied identical shearing, have second between basalis 104 and adhesion coating and hold time, first holds time lacks 20% and (for example is: as many as few 50%, 100%, 200%, 300%, 400% or 500%) than second as many as of holding time.
Based on above-mentioned, because the imporosity top layer 108 in the basalis 104 only has the hole of only a few or does not contain hole fully, therefore basalis 104 can pass through imporosity top layer 108 and adhesion coating 116 or adhesion coating 118 fluid-tight engagement, and makes to have shearing resistance characteristic preferably between basalis 104 and the adhesion coating.
Fig. 5 is the flow chart of the Ginding process of one embodiment of the invention.This Ginding process is applicable to the grinding substrate.
With reference to Fig. 5, at first, carry out step S100, grinding pad is provided.Grinding pad for example is the grinding pad 100 among the embodiment of Fig. 1 to Fig. 3.Grinding pad includes grinding layer and basalis, basalis fits in the grinding layer below, include porous internal layer and top layer (imporosity top layer), wherein the porous internal layer has upper surface and lower surface, top layer (imporosity top layer) can have the hole (its hole ratio is not more than 0.3%) of only a few or not contain hole (its hole ratio is 0%) fully, and this top layer (imporosity top layer) can optionally only fit in the upper surface of porous internal layer, or only fit in the following top layer of porous internal layer, or fit in simultaneously the porous internal layer on, lower surface.
Then, carry out step S102, substrate is exerted pressure to be pressed on the above-mentioned grinding pad, substrate is contacted with grinding pad.
Then, carry out step S104, provide relative motion, substrate is ground, and reach the purpose of planarization to utilize grinding pad to substrate and grinding pad.
In sum, in one embodiment, disclosed basalis, can and adhesion coating between have shearing resistance characteristic preferably.In one embodiment, disclosed grinding pad, the contact-making surface that can reduce between basalis and adhesion coating produces the chance that minute protrusions takes place.
Though the present invention discloses as above with embodiment; but it is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can suitably change or be equal to replacement, so protection scope of the present invention should be as the criterion with the scope that claims were defined.
Claims (32)
1. a grinding pad is characterized in that, comprising:
One grinding layer; And
One basalis is disposed at described grinding layer below, and described basalis comprises:
One porous internal layer has a upper surface and a lower surface; And
At least one top layer, its hole ratio is not more than 0.3%, and is disposed at described porous internal layer
On at least one of described upper surface and described lower surface.
2. grinding pad according to claim 1 is characterized in that, described top layer is an imporosity top layer, and its hole ratio is 0%.
3. grinding pad according to claim 2 is characterized in that, described porous internal layer and described imporosity top layer are by same material, one-body molded made.
4. grinding pad according to claim 2 is characterized in that, the thickness on described imporosity top layer is greater than 5 μ m.
5. grinding pad according to claim 2 is characterized in that, the thickness on described imporosity top layer is 8 μ m～35 μ m.
6. according to each described grinding pad in the claim 2 to 5, it is characterized in that the surface roughness on described imporosity top layer is less than 15 μ m.
7. grinding pad according to claim 6 is characterized in that, the surface roughness on described imporosity top layer is 3 μ m～10 μ m.
8. according to each described grinding pad in the claim 2 to 5, it is characterized in that the pore-size distribution of the hole in the described porous internal layer is 10 μ m～400 μ m.
9. grinding pad according to claim 8 is characterized in that, the average pore size of the hole in the described porous internal layer is 100 μ m～250 μ m.
10. grinding pad according to claim 1 is characterized in that, described basalis is made by the mixture of low density polyethylene (LDPE) or low density polyethylene (LDPE) and ethylene vinyl acetate.
11., it is characterized in that according to each described grinding pad in the claim 2 to 5, also comprise an adhesion coating, be disposed between described grinding layer and the described basalis or between a described basalis and the grinder station at least one.
12. grinding pad according to claim 11, it is characterized in that, described basalis and described adhesion coating adhesion test after shearing resistance is held time, when described imporosity top layer is applied a shearing, having one first between described basalis and described adhesion coating holds time, when described porous internal layer is applied described shearing, have one second between described basalis and described adhesion coating and hold time, described first more described second as many as few 20% of holding time of holding time.
13., it is characterized in that described imporosity top layer comprises the imporosity top layer once plasma treatment according to each described grinding pad in the claim 2 to 5.
14. a basalis is used for a grinding layer of liner one grinding pad, it is characterized in that, comprising:
One porous internal layer has a upper surface and a lower surface; And
One top layer, its hole ratio is not more than 0.3%, and is disposed at least one of the described upper surface of described porous internal layer and lower surface.
15. basalis according to claim 14 is characterized in that, described top layer is an imporosity top layer, and its hole ratio is 0%.
16. basalis according to claim 15 is characterized in that, described porous internal layer and described imporosity top layer are by same material, one-body molded made.
17. basalis according to claim 15 is characterized in that, the thickness on described imporosity top layer is greater than 5 μ m.
18. basalis according to claim 17 is characterized in that, the thickness on described imporosity top layer is 8 μ m～35 μ m.
19., it is characterized in that the surface roughness on described imporosity top layer is less than 15 μ m according to each described basalis in the claim 15 to 18.
20. basalis according to claim 19 is characterized in that, the surface roughness on described imporosity top layer is 3 μ m～10 μ m.
21., it is characterized in that the pore-size distribution of the hole in the described porous internal layer is 10 μ m～400 μ m according to each described basalis in the claim 15 to 18.
22. basalis according to claim 21 is characterized in that, the average pore size of the hole in the described porous internal layer is 100 μ m～250 μ m.
23. basalis according to claim 14 is characterized in that, described basalis is made by the low density polyethylene (LDPE) or the mixture of low density polyethylene (LDPE) and ethylene vinyl acetate.
24., it is characterized in that described imporosity top layer comprises the imporosity top layer once plasma treatment according to each described basalis in the claim 15 to 18.
25. a Ginding process is used to grind a substrate, it is characterized in that, comprising:
One grinding pad is provided;
Described substrate is applied a pressure to be pressed on the described grinding pad; And
Provide a relative motion to described substrate and described grinding pad, wherein said grinding pad comprises:
One grinding layer; And
One basalis is disposed at described grinding layer below, and described basalis comprises:
One porous internal layer has a upper surface and a lower surface; And
At least one top layer, its hole ratio is not more than 0.3%, and is disposed at least one of the described upper surface of described porous internal layer and described lower surface.
26. Ginding process according to claim 25 is characterized in that, described top layer is an imporosity top layer, and its hole ratio is 0%.
27. Ginding process according to claim 26 is characterized in that, described porous internal layer and described imporosity top layer are by same material, one-body molded made.
28. Ginding process according to claim 26 is characterized in that, the thickness on described imporosity top layer is greater than 5 μ m.
29., it is characterized in that the surface roughness on described imporosity top layer is less than 15 μ m according to each described Ginding process in the claim 26 to 28.
30., it is characterized in that the pore-size distribution of the hole in the described porous internal layer is 10 μ m～400 μ m according to each described Ginding process in the claim 26 to 28.
31. Ginding process according to claim 25 is characterized in that, described basalis is made by the low density polyethylene (LDPE) or the mixture of low density polyethylene (LDPE) and ethylene vinyl acetate.
32., it is characterized in that described imporosity top layer comprises the imporosity top layer once plasma treatment according to each described Ginding process in the claim 26 to 28.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101824392A CN102248494A (en) | 2010-05-19 | 2010-05-19 | Substrate layer, grinding pad and grinding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101824392A CN102248494A (en) | 2010-05-19 | 2010-05-19 | Substrate layer, grinding pad and grinding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102248494A true CN102248494A (en) | 2011-11-23 |
Family
ID=44976247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101824392A Pending CN102248494A (en) | 2010-05-19 | 2010-05-19 | Substrate layer, grinding pad and grinding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102248494A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107498454A (en) * | 2017-09-21 | 2017-12-22 | 南安市友和五金制品有限公司 | A kind of manufacture craft of abrasive disk |
| CN108326729A (en) * | 2017-01-19 | 2018-07-27 | 智胜科技股份有限公司 | Polishing pad and polishing method |
| CN108687653A (en) * | 2017-03-31 | 2018-10-23 | 智胜科技股份有限公司 | Polishing pad and polishing method |
| CN114800254A (en) * | 2022-03-21 | 2022-07-29 | 安徽禾臣新材料有限公司 | Wax-free pad for polishing and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077153A (en) * | 1996-11-29 | 2000-06-20 | Sumitomo Metal Industries, Limited | Polishing pad and apparatus for polishing a semiconductor wafer |
| CN1671509A (en) * | 2002-05-23 | 2005-09-21 | 卡伯特微电子公司 | Microporous polishing pads |
| CN1684799A (en) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | Polishing pad for planarization |
| CN101184582A (en) * | 2005-04-25 | 2008-05-21 | 卡伯特微电子公司 | Multi-layer polishing pad material for cmp |
-
2010
- 2010-05-19 CN CN2010101824392A patent/CN102248494A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077153A (en) * | 1996-11-29 | 2000-06-20 | Sumitomo Metal Industries, Limited | Polishing pad and apparatus for polishing a semiconductor wafer |
| CN1671509A (en) * | 2002-05-23 | 2005-09-21 | 卡伯特微电子公司 | Microporous polishing pads |
| CN1684799A (en) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | Polishing pad for planarization |
| CN101184582A (en) * | 2005-04-25 | 2008-05-21 | 卡伯特微电子公司 | Multi-layer polishing pad material for cmp |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108326729A (en) * | 2017-01-19 | 2018-07-27 | 智胜科技股份有限公司 | Polishing pad and polishing method |
| CN108326729B (en) * | 2017-01-19 | 2020-04-24 | 智胜科技股份有限公司 | Polishing pad and polishing method |
| US10828745B2 (en) | 2017-01-19 | 2020-11-10 | Iv Technologies Co., Ltd. | Polishing pad and polishing method |
| CN108687653A (en) * | 2017-03-31 | 2018-10-23 | 智胜科技股份有限公司 | Polishing pad and polishing method |
| CN107498454A (en) * | 2017-09-21 | 2017-12-22 | 南安市友和五金制品有限公司 | A kind of manufacture craft of abrasive disk |
| CN114800254A (en) * | 2022-03-21 | 2022-07-29 | 安徽禾臣新材料有限公司 | Wax-free pad for polishing and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101825734B1 (en) | Polishing pad with foundation layer and polishing surface layer | |
| TWI410299B (en) | Polishing pad, use thereof and method for making the same | |
| US10201886B2 (en) | Polishing pad and method for manufacturing the same | |
| CN102248494A (en) | Substrate layer, grinding pad and grinding method | |
| JPH0623664A (en) | Sheet-form resilient foam and jig for polishing wafer by using it | |
| CN104625945B (en) | Polishing pad and method of manufacturing the same | |
| WO2009086557A1 (en) | Chemical-mechanical planarization pad | |
| US20080287047A1 (en) | Polishing pad, use thereof and method for making the same | |
| CN111745534A (en) | Polishing pad for minimizing defect incidence and method for preparing the same | |
| CN109202693B (en) | Leak-proof polishing pad and method of manufacturing the same | |
| TWI510328B (en) | Base layer, polishing pad including the same and polishing method | |
| CN105619237A (en) | Non-wax polishing adsorption pad and manufacturing method thereof | |
| TW201513970A (en) | Polishing pad and method for making the same | |
| JP5222070B2 (en) | Polishing pad | |
| CN101298132B (en) | Composite polishing pad and manufacturing method thereof | |
| US20090252949A1 (en) | Composite sheet for mounting a workpiece and the method for making the same | |
| EP4169717A1 (en) | Method of manufacturing headlining using moisture-curing adhesive and headlining manufactured thereby | |
| KR102700222B1 (en) | Polishing pad and preparing method of semiconductor device using the same | |
| US20080268227A1 (en) | Complex polishing pad and method for making the same | |
| KR102410612B1 (en) | Polishing pad and preparing method of semiconductor device using the same | |
| US12134162B2 (en) | Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same | |
| CN115958525A (en) | Polishing pad and method for manufacturing semiconductor device using the same | |
| JP2014086568A (en) | Retainer ring, polishing device using the same and polishing method | |
| JP2010082703A (en) | Cushion sheet for polishing pad | |
| CN104511830B (en) | Composite polishing pad and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111123 |