CN102248303A - Picosecond laser device for processing blood vessel stent - Google Patents
Picosecond laser device for processing blood vessel stent Download PDFInfo
- Publication number
- CN102248303A CN102248303A CN2011100065411A CN201110006541A CN102248303A CN 102248303 A CN102248303 A CN 102248303A CN 2011100065411 A CN2011100065411 A CN 2011100065411A CN 201110006541 A CN201110006541 A CN 201110006541A CN 102248303 A CN102248303 A CN 102248303A
- Authority
- CN
- China
- Prior art keywords
- picosecond laser
- blood vessel
- output end
- output
- vessel stent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title abstract description 10
- 210000004204 blood vessel Anatomy 0.000 title abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 25
- 230000033001 locomotion Effects 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 4
- 230000003287 optical effect Effects 0.000 abstract 2
- 238000012805 post-processing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Media Introduction/Drainage Providing Device (AREA)
Abstract
The invention relates to a picosecond laser device for processing a blood vessel stent. An optical isolator is arranged at the output end of a picosecond laser; the output end of the optical isolator is connected with a beam expanding mirror; a 45-degree reflecting mirror is arranged at the output end of the beam expanding mirror; the output end of the 45-degree reflecting mirror is connected with a focusing mirror; the output end of the focusing mirror is connected with a cutting nozzle; the cutting nozzle is opposite to a two-dimensional motion control platform; the 45-degree reflecting mirror is also connected with a charge coupled device (CCD) lens; the CCD lens is connected with the CCD; the two-dimensional motion control platform comprises an X-axis transmission unit doing forward and backward feed movement and a Y-axis transmission unit doing 360-degree rotary movement; and the Y-axis transmission unit doing 360-degree rotary movement is arranged on the X-axis transmission unit doing forward and backward feed movement. The picosecond laser focuses light beams within 10 mu m by a cutting nozzle system; the two-dimensional motion platform controls a pipe material to move forwards and backwards and rotate; and the blood vessel stent is processed by utilizing the advantages of the picosecond laser, so that aftertreatment after the blood vessel stent is subjected to laser cutting is reduced and the properties of the blood vessel stent are improved.
Description
Technical field
The present invention relates to a kind of laser process equipment, relate in particular to a kind of picosecond laser device that is used to process intravascular stent.
Background technology
Traditional metallic blood vessel bracket utilizes YAG or optical-fiber laser that stainless steel pipe is carried out Carving Machining and forms, and finishes through aftertreatment technologys such as overpickling electrobrightenings then.But, along with of the raw material utilization of metal pipe materials such as L605NITI as intravascular stent, it is more and more difficult to find that in process aftertreatment technology becomes, and increasing to the influence of support, the aftertreatment technology of support is also more and more unstable, causes the quality instability of support, test is found, the support post processing is very big to raw-material intravascular stent influences such as L605NITI, deals with improperly, can cause major defects such as support fracture.How to reduce the influence of post processing to support, very urgent.
The appearance of drug stent is processed with very high requirement to the blind groove in blind hole, and traditional YAG and optical fiber are difficult to satisfy processing request because heat affecting is big.Therefore, utilize picosecond laser that support is carried out blind hole blind groove processing existence technical advantage clearly.By discovering, post processing is very big to the degree of dependence of laser cutting.If obtain good cutting effect by laser cutting, post processing will become does not so simply even need very much.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of picosecond laser device that is used to process intravascular stent is provided.
Purpose of the present invention is achieved through the following technical solutions:
Be used to process the picosecond laser device of intravascular stent, it is characterized in that: the output of picosecond laser is provided with optoisolator, the output of optoisolator is connected with beam expanding lens, the output of beam expanding lens is furnished with 45 degree speculums, the output of 45 degree speculums connects focus lamp, the output of focus lamp connects cutting head, and cutting head is right against two dimensional motion control platform; 45 degree speculums also are connected the CCD camera lens, and the CCD camera lens is connected CCD; The X-axis delivery unit of feed motion and the Y-axis delivery unit that 360 ° rotatablely move before and after described two dimensional motion control platform comprises, 360 ° of Y-axis delivery units that rotatablely move are installed on the X-axis delivery unit of front and back feed motion.
Further, the picosecond laser device of intravascular stent is processed in above-mentioned being used to, and the output of described focus lamp is provided with the protection eyeglass.
Substantive distinguishing features and obvious improvement that technical solution of the present invention is outstanding are mainly reflected in:
Picosecond laser focuses in 10 microns light beam by the cutting head system, by the forward-reverse and the rotation of two-dimensional motion platform control tubing; Whole system of processing is operated and is driven by software control system, thereby reaches accurate cutting merit intravascular stent function; Utilize the advantage of picosecond laser that intravascular stent is processed, post processing after the minimizing intravascular stent laser cutting, the performance of raising intravascular stent also can satisfy the accurate processing of the blind groove of blind hole simultaneously, improve the working (machining) efficiency and the qualification rate of support, improve the resistance to overturning of support.Picosecond laser is applied to intravascular stent processing, optimize the laser processing technology parameter, reach best cutting effect, improve cut quality, reduce last handling process.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: light channel structure principle schematic of the present invention.
The implication of each Reference numeral sees the following form among the figure:
The specific embodiment
As shown in Figure 1, be used to process the picosecond laser device of intravascular stent, the output of picosecond laser 1 is provided with optoisolator 2, the output of optoisolator 2 is connected with beam expanding lens 3, the output that the output of beam expanding lens 3 is furnished with 45 degree speculums, 4,45 degree speculums 4 connects focus lamp 7, and the output of focus lamp 7 connects 0.5mm cutting head 9,0.5mm cutting head 9 is right against two dimensional motion control platform 10, the output of focus lamp 7 is provided with protection eyeglass 8; 45 degree speculums 4 also are connected CCD camera lens 5, and CCD camera lens 5 is connected CCD6; The X-axis delivery unit of feed motion and the Y-axis delivery unit that 360 ° rotatablely move before and after two dimensional motion control platform 10 comprises, 360 ° of Y-axis delivery units that rotatablely move are installed on the X-axis delivery unit of front and back feed motion.
Picosecond laser 1 is an infrared laser, and wavelength is 1064nm, frequency 100K～1MKHZ, mean power 30W.The cutting head system comprises CCD coaxial image display system, optoisolator, beam-expanding collimation 45 degree reflecting optics, focusing lens, eyeglass is installed on the adjustable device, realizes adjustable focal length, and light beam is vertically adjustable, and light beam is focused on below 10 microns, realize accurate cutting.Cutting head can carry out beam-expanding collimation to light beam, and focus is regulated, and makes laser vertical focus on the rapidoprint surface, and beam diameter is below 10 microns.Dispose simultaneously coaxial CCD video system, monitor cutting process in real time and regulate focus at the cutting head top.Two-dimensional motion control platform is fixed on the marble base, adopts high-accuracy linear electric motors to drive, feeding before and after the X-axis delivery unit, and the rotation of Y-axis delivery unit, diaxon moves simultaneously and realizes the control of support cutting process.The platform precision reaches positive and negative 2 microns, and repetitive positioning accuracy is positive and negative 1 micron.The tubing chucking device is arranged on the platform, and, satisfy the automatic feed cutting, reach continuous cutting and produce function in batches, enhance productivity by pneumatic element control.A fixedly tubing sleeve is installed under cutting head, is improved cutting accuracy.
During concrete the application, picosecond laser focuses in 10 microns light beam by the cutting head system, and forward-reverse and rotation by two-dimensional motion platform control tubing comprise the auto-feed function.Whole system of processing is operated and is driven by software control system, thereby reaches accurate cutting merit intravascular stent function.Utilize the advantage of picosecond laser that intravascular stent is processed, the post processing after the minimizing intravascular stent laser cutting, the performance of raising intravascular stent.Also can satisfy simultaneously the accurate processing of the blind groove of blind hole.Improve the working (machining) efficiency and the qualification rate of support, improve the resistance to overturning of support.
What need understand is: the above only is a preferred implementation of the present invention; for those skilled in the art; under the prerequisite that does not break away from the principle of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (2)
1. be used to process the picosecond laser device of intravascular stent, it is characterized in that: the output of picosecond laser (1) is provided with optoisolator (2), the output of optoisolator (2) is connected with beam expanding lens (3), the output of beam expanding lens (3) is furnished with 45 degree speculums (4), the output of 45 degree speculums (4) connects focus lamp (7), the output of focus lamp (7) connects cutting head (9), and cutting head (9) is right against two dimensional motion control platform (10); 45 degree speculums (4) also are connected CCD camera lens (5), and CCD camera lens (5) is connected CCD (6); The X-axis delivery unit of feed motion and the Y-axis delivery unit that 360 ° rotatablely move before and after described two dimensional motion control platform (10) comprises, 360 ° of Y-axis delivery units that rotatablely move are installed on the X-axis delivery unit of front and back feed motion.
2. the picosecond laser device that is used to process intravascular stent according to claim 1 is characterized in that: the output of described focus lamp (7) is provided with the protection eyeglass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065411A CN102248303A (en) | 2011-01-13 | 2011-01-13 | Picosecond laser device for processing blood vessel stent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065411A CN102248303A (en) | 2011-01-13 | 2011-01-13 | Picosecond laser device for processing blood vessel stent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102248303A true CN102248303A (en) | 2011-11-23 |
Family
ID=44976062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100065411A Pending CN102248303A (en) | 2011-01-13 | 2011-01-13 | Picosecond laser device for processing blood vessel stent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102248303A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103212866A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Femtosecond laser device for processing vascular stent by laser |
| CN103212861A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Laser micro processing equipment for double-station thin-walled tubes |
| CN103212826A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Double-station suspension arm type thin-wall tubular product laser microprocessing equipment |
| CN103212842A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Laser cutting equipment for stents |
| CN104199191A (en) * | 2014-09-29 | 2014-12-10 | 光库通讯(珠海)有限公司 | Beam expander and beam-expanding system |
| CN105458494A (en) * | 2014-09-02 | 2016-04-06 | 上海华族激光设备有限公司 | Single-lamp single-rod double-cavity light path system for laser cutting machine |
| TWI569912B (en) * | 2014-12-08 | 2017-02-11 | 國立高雄應用科技大學 | Laser focusing optical module and laser focusing method |
| CN108080800A (en) * | 2017-06-14 | 2018-05-29 | 谢文杰 | Adjustable light beam femto-second laser processing unit (plant) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020017509A1 (en) * | 2000-08-10 | 2002-02-14 | Takashi Ishide | Laser beam machining head and laser beam machining apparatus having same |
| CN101146641A (en) * | 2004-11-25 | 2008-03-19 | 韦斯莱泰克公司 | Method for preparing medical stent |
| JP2008221254A (en) * | 2007-03-09 | 2008-09-25 | Sharp Corp | Laser beam machining apparatus |
| CN101314197A (en) * | 2007-05-31 | 2008-12-03 | 株式会社迪思科 | Laser processing device |
| CN101318264A (en) * | 2008-07-07 | 2008-12-10 | 苏州德龙激光有限公司 | Design method for ultraviolet laser machining apparatus for cutting wafer |
| JP2010214428A (en) * | 2009-03-17 | 2010-09-30 | Disco Abrasive Syst Ltd | Optical system and laser beam machining apparatus |
| CN101885113A (en) * | 2010-06-24 | 2010-11-17 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser machining system |
| CN201931207U (en) * | 2011-01-13 | 2011-08-17 | 苏州德龙激光有限公司 | Picoseconds laser device for processing vessel support |
-
2011
- 2011-01-13 CN CN2011100065411A patent/CN102248303A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020017509A1 (en) * | 2000-08-10 | 2002-02-14 | Takashi Ishide | Laser beam machining head and laser beam machining apparatus having same |
| CN101146641A (en) * | 2004-11-25 | 2008-03-19 | 韦斯莱泰克公司 | Method for preparing medical stent |
| JP2008221254A (en) * | 2007-03-09 | 2008-09-25 | Sharp Corp | Laser beam machining apparatus |
| CN101314197A (en) * | 2007-05-31 | 2008-12-03 | 株式会社迪思科 | Laser processing device |
| CN101318264A (en) * | 2008-07-07 | 2008-12-10 | 苏州德龙激光有限公司 | Design method for ultraviolet laser machining apparatus for cutting wafer |
| JP2010214428A (en) * | 2009-03-17 | 2010-09-30 | Disco Abrasive Syst Ltd | Optical system and laser beam machining apparatus |
| CN101885113A (en) * | 2010-06-24 | 2010-11-17 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser machining system |
| CN201931207U (en) * | 2011-01-13 | 2011-08-17 | 苏州德龙激光有限公司 | Picoseconds laser device for processing vessel support |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103212866A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Femtosecond laser device for processing vascular stent by laser |
| CN103212861A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Laser micro processing equipment for double-station thin-walled tubes |
| CN103212826A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Double-station suspension arm type thin-wall tubular product laser microprocessing equipment |
| CN103212842A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Laser cutting equipment for stents |
| CN103212861B (en) * | 2012-01-19 | 2015-08-26 | 昆山思拓机器有限公司 | A kind of laser micro-processing equipment of double thin-wall pipes |
| CN103212826B (en) * | 2012-01-19 | 2015-09-30 | 昆山思拓机器有限公司 | The laser micro-processing equipment of double cantilevered thin-wall pipes |
| CN103212866B (en) * | 2012-01-19 | 2016-01-27 | 昆山思拓机器有限公司 | A kind of femtosecond laser of Laser Processing intravascular stent |
| CN103212842B (en) * | 2012-01-19 | 2016-07-06 | 昆山思拓机器有限公司 | A kind of support laser cutting device |
| CN105458494A (en) * | 2014-09-02 | 2016-04-06 | 上海华族激光设备有限公司 | Single-lamp single-rod double-cavity light path system for laser cutting machine |
| CN104199191A (en) * | 2014-09-29 | 2014-12-10 | 光库通讯(珠海)有限公司 | Beam expander and beam-expanding system |
| TWI569912B (en) * | 2014-12-08 | 2017-02-11 | 國立高雄應用科技大學 | Laser focusing optical module and laser focusing method |
| CN108080800A (en) * | 2017-06-14 | 2018-05-29 | 谢文杰 | Adjustable light beam femto-second laser processing unit (plant) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102248303A (en) | Picosecond laser device for processing blood vessel stent | |
| CN107486640B (en) | A kind of laser drilling device and method improving hole taper and inner wall quality | |
| KR101747579B1 (en) | Machining device and machining method | |
| CN113649595B (en) | Annular light spot optical system for metal SLM printing and printing method | |
| CN101658979A (en) | Laser double-faced synchronous machining system and machining method thereof | |
| CN203390386U (en) | Laser processing device | |
| CN201529849U (en) | Laser double-surface synchronous processing system | |
| AU2017252647A1 (en) | Beam steering for laser systems and related methods | |
| CN103170733B (en) | A kind of coaxial laser organisation of working | |
| CN101380696A (en) | A thin-walled tube laser micro-cutting device and method | |
| CN106624389A (en) | Optical fiber cutting device and method based on ultra-short pulse lasers | |
| CN204353654U (en) | The laser aid of cone of nulls degree and back taper groove processing can be realized | |
| CN106646745B (en) | Optical fiber cutting method | |
| CN201931207U (en) | Picoseconds laser device for processing vessel support | |
| CN104690423A (en) | Machining device and method capable of realizing zero taper and reverse taper drilling | |
| CN105033470A (en) | High-quality conicity-controllable drilling machining device and method | |
| CN201295821Y (en) | Diamond micropore-processing machine adopting all-solid-state laser | |
| CN103217741B (en) | System achieving fusing of double clad fiber and glass tapered rod and fusing method | |
| CN204565419U (en) | A kind of processing unit (plant) realizing cone of nulls degree and back taper boring | |
| CN102350591B (en) | Rectangular water waveguide laser processing device | |
| CN207888077U (en) | A kind of infrared picosecond laser diamond cut equipment of 1064nm | |
| CN107127424B (en) | An underwater thermal cutting mechanism observation device and observation method thereof | |
| CN104625437A (en) | Scanning mechanism for precision processing of laser drilling and cutting of special-shaped hole | |
| CN220450036U (en) | Glass cutting device | |
| CN221254423U (en) | Laser cutting device for glass |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant before: Suzhou Delphi Laser Co., Ltd. |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111123 |