CN102242382A - 一种生产航空、航天高尖端产品所用的镀银导体的生产方法 - Google Patents
一种生产航空、航天高尖端产品所用的镀银导体的生产方法 Download PDFInfo
- Publication number
- CN102242382A CN102242382A CN2010101721165A CN201010172116A CN102242382A CN 102242382 A CN102242382 A CN 102242382A CN 2010101721165 A CN2010101721165 A CN 2010101721165A CN 201010172116 A CN201010172116 A CN 201010172116A CN 102242382 A CN102242382 A CN 102242382A
- Authority
- CN
- China
- Prior art keywords
- silver
- washing
- solution
- plated
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 28
- 150000002815 nickel Chemical class 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims abstract description 3
- 239000000243 solution Substances 0.000 claims description 31
- 238000003756 stirring Methods 0.000 claims description 15
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 7
- 239000000047 product Substances 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- RNGFNLJMTFPHBS-UHFFFAOYSA-L dipotassium;selenite Chemical compound [K+].[K+].[O-][Se]([O-])=O RNGFNLJMTFPHBS-UHFFFAOYSA-L 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 claims description 3
- 229910001626 barium chloride Inorganic materials 0.000 claims description 3
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 claims description 3
- 229910000369 cadmium(II) sulfate Inorganic materials 0.000 claims description 3
- 210000005056 cell body Anatomy 0.000 claims description 3
- 239000003153 chemical reaction reagent Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 239000000706 filtrate Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims description 3
- 239000012047 saturated solution Substances 0.000 claims description 3
- 238000003828 vacuum filtration Methods 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 10
- 239000002932 luster Substances 0.000 abstract description 2
- 240000004859 Gamochaeta purpurea Species 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
本发明公开了一种生产航空、航天高尖端产品所用的镀银导体的生产方法，其特征是它包括以下生产步骤：先制备镍盐，再制备镀液，对铜或铜合金导体进行绝缘→化学除油→水洗→化学除锈出光→水洗→弱浸蚀→水洗2次→放入镀液中进行预镀镍→回收→水洗→除膜→水洗2次→预镀银→镀银→回收→水洗2次→钝化→水洗→烘干，即制得镀银导体。本发明镀层厚度均匀，镀层纯度高，致密性好，耐腐蚀性强，色泽亮白持久，可用于航空、航天等高尖端产品。
Description
技术领域
本发明涉及一种镀银导体的生产方法。
背景技术
目前使用最为广泛的镀银工艺仍然是氰化物镀银工艺。因为这种工艺有广泛的适用性，从普通镀银到高速电铸镀银都可以采用，并且镀层性能也比较好。近年也有一些无氰镀银工艺用于工业生产，研发中的无氰镀银工艺就更多，但这些元氰镀液的稳定性和镀层的性能与氰化物镀银比起来，还存在一定差距。开发出可以取代氰化物镀银的新工艺仍然是电镀技术领域的一个重要课题。
发明内容
本发明的目的就是提供一种成本低，性能好，适用航空、航天高尖端产品所用的镀银导体的生产方法。
本发明采用的技术方案是：一种生产航空、航天高尖端产品所用的镀银导体的生产方法，其特征是它包括以下生产步骤：
(1)制备镍盐，把试剂级的NiSO4·7H2O配成250～300g/L的溶液并加热至50～60℃，然后在搅拌的情况下缓慢加入计算好的A液，直至溶液刚好变清，随后继续搅拌0.5h，再静置24h，最后采用真空抽滤的方式除净硫酸根(用BaCl2溶液检验)，得到不含SO4 2-的活性镍盐；
(2)制备预镀银溶液，KCN70-80g/L，KAg(CN)2，5-7g/L，混合制得预镀银溶液；制备镀银镍合金溶液，按溶液质量比KAg(CN)230-80g/L，KCN10-30g/L，K2CO310-20g/L，CdSO40.2-0.3g/L，糖精0.1-0.2g/L；配位剂100-150g/L；镍盐5-10g/L；亚硒酸钾1-2g/L，准备上述物质，在PH13-14；温度20-40摄氏度进按下述方法进行制备溶液，首先在镀槽中盛装1/2槽体积的去离子水，加入配方中所要求的其它辅料，将溶液加热到70℃，并不断搅拌；待完全溶解后加入1-1.5g/L活性炭，搅拌1h后过滤；在滤液中加入去离子水，当接近到规定液面时，在不断搅拌的情况下加入CdSO4、亚硒酸钾、糖精和活性镍盐饱和溶液；
(3)对铜或铜合金导体进行绝缘→化学除油→水洗→化学除锈出光→水洗→弱酸浸蚀→水洗2次→放入镀银镍合金溶液中进行预镀镍→回收→水洗→除膜→水洗2次→在预镀银溶液预镀银→放入镀银镍合金溶液中镀银→回收→水洗2次→钝化→水洗→烘干，即制得镀银导体。
本发明的有益效果是：
1.镀银铜线都是采用低电阻优质铜线，保证产品有良好的导电性能。
2.镀层厚度均匀，与铜线呈完全同心状态。
3.镀层纯度高(含银99.99％以上)，致密性好，耐腐蚀性强，色泽亮白持久。
4.镀层与铜线表面呈完全状态，于高温下性能也十分稳定，抗老化性好。
5.可焊性好，焊接时可不使用助焊剂，可防止助焊剂对产品腐蚀，省略防腐手续，提高生产效率。
6.镀银层密度大，不易氧化脱银粉，减少电线生产过程中脱银粉所造成的问题：银粉堵塞定位孔造成中途短线；银粉降低电线的绝缘强度。
具体实施方式
本发明一种生产航空、航天高尖端产品所用的镀银导体的生产方法，其特征是它包括以下生产步骤：
(1)制备镍盐，把试剂级的NiSO4·7H2O配成250～300g/L的溶液并加热至50～60℃，然后在搅拌的情况下缓慢加入计算好的A液，直至溶液刚好变清，随后继续搅拌0.5h，再静置24h，最后采用真空抽滤的方式除净硫酸根(用BaCl2溶液检验)，即可得到不含SO4 2-的活性镍盐；
(2)制备镀液，制备预镀银溶液，KCN70-80g/L，KAg(CN)2，5-7g/L，混合制得预镀银溶液；制备镀银镍合金，KAg(CN)2，30-80g/L，KCN10-30g/L，K2CO310-20g/L，CdSO40.2-0.3g/L，糖精0.1-0.2g/L；配位剂100-150g/L；镍盐5-10g/L；亚硒酸钾1-2g/L，PH13-14；温度20-40摄氏度；
(3)在镀槽中盛装1/2槽体积的去离子水，加入配方中所要求的其它辅料，将溶液加热到70℃，并不断搅拌。待完全溶解后加入1-1.5g/L活性炭，搅拌1h后过滤；在滤液中加入去离子水，当接近到规定液面时，在不断搅拌的情况下加入CdSO4、亚硒酸钾、糖精和活性镍盐饱和溶液；
(4)对铜或铜合金导体进行绝缘→化学除油→水洗→化学除锈出光→水洗→弱浸蚀→水洗2次→放入镀液中进行预镀镍→回收→水洗→除膜→水洗2次→预镀银→镀银→回收→水洗2次→钝化→水洗→烘干，即制得镀银导体。
Claims (1)
1.一种生产航空、航天高尖端产品所用的镀银导体的生产方法，其特征是它包括以下生产步骤：
(1)制备镍盐，把试剂级的NiSO4·7H2O配成250～300g/L的溶液并加热至50～60℃，然后在搅拌的情况下缓慢加入计算好的A液，直至溶液刚好变清，随后继续搅拌0.5h，再静置24h，最后采用真空抽滤的方式除净硫酸根(用BaCl2溶液检验)，得到不含SO4 2-的活性镍盐；
(2)制备预镀银溶液，KCN70-80g/L，KAg(CN)2，5-7g/L，混合制得预镀银溶液；制备镀银镍合金溶液，按溶液质量比KAg(CN)230-80g/L，KCN10-30g/L，K2CO310-20g/L，CdSO40.2-0.3g/L，糖精0.1-0.2g/L；配位剂100-150g/L；镍盐5-10g/L；亚硒酸钾1-2g/L，准备上述物质，在PH13-14；温度20-40摄氏度进按下述方法进行制备溶液，首先在镀槽中盛装1/2槽体积的去离子水，加入配方中所要求的其它辅料，将溶液加热到70℃，并不断搅拌；待完全溶解后加入1-1.5g/L活性炭，搅拌1h后过滤；在滤液中加入去离子水，当接近到规定液面时，在不断搅拌的情况下加入CdSO4、亚硒酸钾、糖精和活性镍盐饱和溶液；
(3)对铜或铜合金导体进行绝缘→化学除油→水洗→化学除锈出光→水洗→弱酸浸蚀→水洗2次→放入镀银镍合金溶液中进行预镀镍→回收→水洗→除膜→水洗2次→在预镀银溶液预镀银→放入镀银镍合金溶液中镀银→回收→水洗2次→钝化→水洗→烘干，即制得镀银导体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101721165A CN102242382A (zh) | 2010-05-11 | 2010-05-11 | 一种生产航空、航天高尖端产品所用的镀银导体的生产方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101721165A CN102242382A (zh) | 2010-05-11 | 2010-05-11 | 一种生产航空、航天高尖端产品所用的镀银导体的生产方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102242382A true CN102242382A (zh) | 2011-11-16 |
Family
ID=44960616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101721165A Pending CN102242382A (zh) | 2010-05-11 | 2010-05-11 | 一种生产航空、航天高尖端产品所用的镀银导体的生产方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102242382A (zh) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572337A (zh) * | 2012-07-23 | 2014-02-12 | 江门市蓬江区亿晶五金电子有限公司 | Led支架电镀中的镍上银工艺 |
| WO2014179506A1 (en) * | 2013-05-03 | 2014-11-06 | Tyco Electronics Corporation | Electroplating contacts with silver-alloys in a basic bath |
| CN104299719A (zh) * | 2013-07-17 | 2015-01-21 | 河南九发高导铜材股份有限公司 | 一种单晶铜银复合导线及其制备方法 |
| WO2015110099A1 (de) * | 2014-01-27 | 2015-07-30 | Harting Kgaa | Elektrolytisches bad |
| CN105154933A (zh) * | 2015-08-21 | 2015-12-16 | 无锡桥阳机械制造有限公司 | 一种镍银合金电镀液及其电镀方法 |
| CN109295445A (zh) * | 2018-08-31 | 2019-02-01 | 扬州虹扬科技发展有限公司 | 一种镀银铜线的电镀后处理工艺 |
| CN109554733A (zh) * | 2018-12-13 | 2019-04-02 | 上海万生合金材料有限公司 | 一种铜线表面处理方法 |
-
2010
- 2010-05-11 CN CN2010101721165A patent/CN102242382A/zh active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572337A (zh) * | 2012-07-23 | 2014-02-12 | 江门市蓬江区亿晶五金电子有限公司 | Led支架电镀中的镍上银工艺 |
| WO2014179506A1 (en) * | 2013-05-03 | 2014-11-06 | Tyco Electronics Corporation | Electroplating contacts with silver-alloys in a basic bath |
| CN104299719A (zh) * | 2013-07-17 | 2015-01-21 | 河南九发高导铜材股份有限公司 | 一种单晶铜银复合导线及其制备方法 |
| WO2015110099A1 (de) * | 2014-01-27 | 2015-07-30 | Harting Kgaa | Elektrolytisches bad |
| CN105154933A (zh) * | 2015-08-21 | 2015-12-16 | 无锡桥阳机械制造有限公司 | 一种镍银合金电镀液及其电镀方法 |
| CN109295445A (zh) * | 2018-08-31 | 2019-02-01 | 扬州虹扬科技发展有限公司 | 一种镀银铜线的电镀后处理工艺 |
| CN109554733A (zh) * | 2018-12-13 | 2019-04-02 | 上海万生合金材料有限公司 | 一种铜线表面处理方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107313084B (zh) | 一种碱性无氰镀银电镀液及镀银方法 | |
| CN102242382A (zh) | 一种生产航空、航天高尖端产品所用的镀银导体的生产方法 | |
| CN102277601B (zh) | 含辅助配位剂的无氰镀银电镀液 | |
| CN102691081B (zh) | 一种电镀银溶液及电镀方法 | |
| CN102168290A (zh) | 无氰镀银电镀液及其制备方法和电镀方法 | |
| CN108060442B (zh) | 一种铜铝复合排表面制备锌铜复合镀层的方法 | |
| CN105274545A (zh) | 一种铝合金的电镀或化学镀的前处理方法及其用途 | |
| CN101709494B (zh) | Cu-Zn-Sn三元合金无氰仿金电镀液及其使用方法 | |
| CN101760768A (zh) | 一种无氰镀银用电镀液及无氰镀银方法 | |
| CN102363884B (zh) | 一种锌合金压铸件的表面处理工艺 | |
| CN105088293A (zh) | 一种新型无氰镀银电镀液及电镀工艺 | |
| CN110923757B (zh) | 一种无氰碱铜电镀液及其使用方法 | |
| CN103334147A (zh) | 一种利用脉冲电镀制备镍包铝粉复合镀层的方法 | |
| CN102181892B (zh) | 提高镍层上无氰镀银层结合力的方法 | |
| CN105671602A (zh) | 一种无氰亚硫酸盐的Au-Cu合金电镀液及应用 | |
| CN103757671A (zh) | 一种在低碳钢板表面碱性电镀铜的电镀溶液和电镀方法 | |
| CN104120462B (zh) | 钢帘线无氰亚铜电镀黄铜及黄铜镀层的钝化方法 | |
| CN106591897B (zh) | 一种无氰离子液体镀铜溶液及镀铜工艺 | |
| CN103789803B (zh) | 一种无氰铜锡合金电镀液及其制备方法 | |
| CN111188070A (zh) | 一种ic封装板电镀镍银金的制作方法 | |
| CN103540970B (zh) | 一种无氰镀银的方法 | |
| CN103540978B (zh) | 一种碱性无氰电镀Ag-Ni合金的方法 | |
| CN102383178B (zh) | 一种用于汽车插接件电镀端子镀层的退镀液 | |
| CN102002742B (zh) | 一种镀液配方及配制方法及在铝基板上电镀的方法 | |
| CN104514019A (zh) | 一种无氰镀银电镀液及电镀方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111116 |