CN102239034A - Splitting apparatus and cleavage method for brittle material - Google Patents
Splitting apparatus and cleavage method for brittle material Download PDFInfo
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- CN102239034A CN102239034A CN2009801489582A CN200980148958A CN102239034A CN 102239034 A CN102239034 A CN 102239034A CN 2009801489582 A CN2009801489582 A CN 2009801489582A CN 200980148958 A CN200980148958 A CN 200980148958A CN 102239034 A CN102239034 A CN 102239034A
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- 239000000463 material Substances 0.000 title claims abstract description 102
- 238000000034 method Methods 0.000 title claims description 50
- 238000003776 cleavage reaction Methods 0.000 title abstract 8
- 230000007017 scission Effects 0.000 title abstract 8
- 238000001816 cooling Methods 0.000 claims abstract description 47
- 238000005520 cutting process Methods 0.000 claims description 89
- 238000010438 heat treatment Methods 0.000 claims description 35
- 230000033228 biological regulation Effects 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000008439 repair process Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 162
- 239000000758 substrate Substances 0.000 abstract description 66
- 230000001965 increasing effect Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract 5
- 230000035882 stress Effects 0.000 description 30
- 238000009826 distribution Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000006063 cullet Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 230000005476 size effect Effects 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 pottery Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 241000931526 Acer campestre Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 102220008982 rs187686559 Human genes 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Laser Beam Processing (AREA)
Abstract
Provided is a splitting apparatus for a brittle material wherein a highly versatile CO2 laser source is used as a laser source, a cleavage rate is widely increased, and full body cleavage in a straight line is possible so that a cleavage surface does not curve with respect to a planned cleavage line. A row of a first beam radiation region (13), a second beam radiation region (14), and a cooling point (15) is relatively moved along a planned cleavage line (12) on a glass substrate (11). The first beam radiation region (13) is located forward with respect to the second radiation region (14) in the cleavage direction, the second beam irradiation region (14) is an elongated beam along the planned cleavage line, and the cooling point (15) is located at a position away from the rear end of the second beam radiation region (14) by a predetermined distance.
Description
Technical field
The present invention relates to fragile material, especially relate to the segmenting device and the cut-off method that glass for flat panel display are carried out the fragile material that entire body cuts off.Below, as fragile material, be that example is illustrated with glass, but the present invention can also be applicable to fragile materials such as quartz, pottery, semiconductor usually except glass.
Background technology
In glass cuts off, replace the mechanical means that always used in 1st century in the past recently, and use thermal stress scribble method (being designated hereinafter simply as laser scribing) based on the laser irradiation based on diamond chip.
According to laser scribing, can eliminate mechanical means intrinsic shortcoming, promptly because of decline that the caused strength of glass of micro-cracks takes place, when cutting off the caused pollution of generation cullet, be suitable for thickness of slab and have lower limit etc.
The principle of laser scribing is as described below.Glass is only produced local heat and the laser irradiation that do not produce the degree of gasification, fusion or crackle.This moment, glass heats portion will carry out thermal expansion, but was subjected to can't fully expanding from the reaction force of peripheral glass, thereby was that the center produces compression stress with the point of irradiation.Even in the non-heating region of periphery, also can be subjected to further periphery being produced distortion from the pushing of expansion of heating part, consequently produce compression stress.This kind compression stress is a stress radially.When there is compression stress in object, can produce the tensile stress relevant on its orthogonal direction with Poisson's ratio.At this, this direction is a tangential direction.Situation as shown in Figure 9.
To be expression place the radial stress composition σ of the situation that the temperature of the Gaussian distribution of initial point rises with the center to Fig. 9
xWith tangential direction stress component σ
yThe figure of variation.Radial stress composition σ
xBe always compression stress (in Fig. 9, being negative value), but tangential direction stress component σ
yAdding thermal center (-tre) (apart from r=0) for compression stress, and be changed to tensile stress (among Fig. 9 on the occasion of) when the thermal center (-tre) is left from adding.
In the described stress is tensile stress with cutting off relevant.When tensile stress surpasses as the destruction toughness value of material eigenvalue, destroy and take place everywhere and uncontrollable.Under the situation of laser cut-off method, in advance tensile stress is chosen to be this below destruction toughness value, therefore can not destroy.
Yet, when the tensile stress location has be full of cracks, at this be full of cracks front end stress can take place and enlarge, when the stress sampling factor of this stress surpassed the destruction toughness value of material, be full of cracks enlarged.That is, produce in check cutting off.Therefore, by the scan laser point of irradiation, and be full of cracks is prolonged.
The laser scribe method of this glass is at first developed by Condar fourth brother (Kondratenko) family name, and has set up the Japan Patent of patent documentation 1.Figure 10 (a) illustrates the principle of the laser cut-off method of patent documentation 1.Use CO
2Laser is as laser, CO
299% of the energy of the beam spot 1 of laser is absorbed in the surface layer of glass of the degree of depth 3.7 μ m of glass 2, sees through the whole thickness of glass 2.This is because CO
2The absorption coefficient that is absorbed by glass of optical maser wavelength is very big.Even the degree of depth that laser scribing produces is assisted by the conduction of the heat in the glass 24, also only is about 100 μ m usually.
The fragility of glass 2 is strong, by can mechanically cutting off along this line stress application.To be called fracture by the process that applying of this mechanical stress cut off entirely.That is, when adopting the laser scribing method, can not lack this back engineering of fracture in order to cut off glass, practicality is limited owing to need breaking step of breaking, may not necessarily be universal fully.
Consider when using laser beam to cut off this hope of glass fully, in laser scribing, add this back operation of fracture, therefore may not be only just enough by laser scribing.Therefore the technology that the entire body that has been to use laser beam that needs and expect is cut off.Yet, because there are the such several shortcomings of aftermentioned in entire body in cutting off, therefore in patent documentation 1, made the good opinion of laser scribing technology, in the actual effect that entire body is cut off, expressed the position of negating.
As other relevant document formerly with the technology of laser scribing, in patent documentation 2, laser beam is shone on the glass substrate, make along the scanning direction of glass substrate and the laser point LS1 of elongated elliptical shape and form on the Y direction along the distance that the laser point LS2 of the elongated elliptical shape of X-direction leaves predefined regulation.Yet the purpose of the invention that patent documentation 2 is put down in writing is not that to cut off with entire body be purpose completely yet, is purpose to carry out stable laser scribing only.
With respect to this, irradiation sees through and during its a part of absorbed laser 5 to the glass shown in Figure 10 (b) 2, see through light and the whole thickness of slab of glass 2 is produced cut off 6, so glass 2 only just can cut off by this operation and does not need fracture.This cuts off the entire body that is called as based on laser and cuts off.
By adopting entire body to cut off, except the technical characterictic that above-mentioned laser cut-off method has, also produce the entire body that can carry out that free curve cuts off etc. that does not need to rupture and cut off distinctive advantage, in dull and stereotyped manufacturing process, can obtain big improvement.The applicant has proposed the motion of patent documentation 3,4 etc. at this entire body technology of cutting off.
No. 3027768 communique of [patent documentation 1] Japan Patent
[patent documentation 2] international brochure that discloses No. 03/008168
[patent documentation 3] TOHKEMY 2007-76077 communique
[patent documentation 4] TOHKEMY 2007-261885 communique
The cutting off of patent documentation 1 is not that entire body cuts off so need the situation of breaking step of breaking and limited by practical to narrate in the above.Cut off in the technology in the entire body that patent documentation 3,4 is proposed, use the high CO of versatility based on laser
2Laser is during as LASER Light Source, most ofly absorbed by the surface of glass, therefore can't be suitable for same as before.And, cut off in the technology as patent documentation 1 is pointed in entire body, owing to so-called size effect is cut off the position when workpiece end is left, the speed of cutting off significantly descends, and when cutting off the position near the end of glass, the shortcoming of cutting off the face bending is arranged.According to Figure 11, the shortcoming that this size effect causes is described.
Illustrate that at first first shortcoming that the entire body of glass is cut off is a low speed.In Figure 11 (a), consider glass plate 2 is cut off into width W
1And W
2The situation of bigger state.Along cutting off line 7 on cutting off direction 3 during scan laser 5, because the heating that the laser irradiation produces produces tensile stress according to above-mentioned principle on glass plate 2, glass plate 2 is cut off along the track while scan of laser 5.In Figure 11 (a), represented this distortion turgidly, moving of the reality of the glass after cutting off is about several microns.
At this moment, cut off the width W of glass plate 2 of the both sides of line 7
1And W
2When big, the sweep speed of laser 5 significantly descends.At first in order to cut off the required tensile stress F of glass plate 2
0And F
1Must surpass resistance to above-mentioned distortion.This drag effect is on the area of glass plate 2, when the width W of glass plate 2
1And W
2Enlarge markedly when big.Therefore cutting off owing to must overcome big resistance and carry out of glass plate 2 need reduce the sweep speed of laser 5 and relativity ground increases the heat that adds that laser 5 produces.
Consequently, the sweep speed of laser 5 is necessary for low speed, and therefore there is boundary naturally in the speed of cutting off.The distance of this tendency in the end of position of cutting off line 7 and glass plate 2 is remarkable more when big more, i.e. the width W of the glass plate 2 after the cutting off of Figure 11 (a)
1And W
2Remarkable more when big more.For example, the width W of the glass plate 2 after cutting off
1And W
2For 500mm apart from the time, the sweep speed of laser 5 then can't not carried out entire body and cuts off if significantly be not decreased to about 10mm/s.
Then, illustrate that another shortcoming that the entire body of fragile material is cut off is that the face that cuts off of fragile material is with respect to the fact of cutting off the precalculated position bending.Shown in explanation among Figure 11 (a), along cutting off line 7 cutting off during scan laser 5 on cutting off direction 3 by acting on the tensile stress F of glass plate 2
0And F
1And along carrying out on the face direction.Exist when unbalanced when the above-mentioned resistance with respect to both sides this moment, cuts off face and want the power of bending to work with respect to cutting off preset lines.This situation is shown in Figure 11 (b).In Figure 11 (b), width W
3Hour, width W
3The resistance of side is little, and therefore crooked big, the face that the cuts off back-flexing that illustrates after cutting off becomes arciform situation.The width W of the glass plate 2 of this tendency after cutting off
1And W
3Unbalanced, a side width W especially
3Special hour especially remarkable.In this case as mentioned above, the actual situation for about several microns of the distortion of workpiece has been carried out the expansion expression more significantly.
Summary of the invention
The present invention is used to solve the problem of above-mentioned prior art, its purpose is to provide a kind of and realizes having based on the high-quality of the thermal stress cut-off of laser and the speed of cutting off is significantly increased, and cut off face can be not crooked and can carry out the segmenting device and the cut-off method of the fragile material that entire body cuts off as the crow flies with respect to cutting off preset lines.
The segmenting device of fragile material of the present invention is with respect to the preset lines of cutting off of the supposition on the fragile material, heat described fragile material from being formed on this initial be full of cracks one side of cutting off on the preset lines along the described preset lines of cutting off, cut off position that preset lines heats and relatively move and cut apart described fragile material by making along described, the segmenting device of described fragile material is characterised in that, possess:, described fragile material irradiating laser beam is generated the laser beam irradiation means of heating part along the described preset lines of cutting off; The cooling body that described fragile material is carried out local cooling in the position at the rear of the described heating part on the described moving direction that cuts off preset lines, described laser beam irradiation means comprises: at described heating part, form the first beam irradiation portion of the first laser beam irradiation area that is positioned at described moving direction the place ahead; At described heating part, cut off the second beam irradiation portion that preset lines forms the second laser beam irradiation area of elongated shape along described at the rear of the described moving direction of the described first laser beam irradiation area.
In the segmenting device of fragile material of the present invention, the laser power that imposes on the first laser beam irradiation area that is formed by the described first beam irradiation portion is preferably greater than the laser power that imposes on the second laser beam irradiation area that is formed by the described second beam irradiation portion.According to this structure, can apply in order to cut off the required heat energy of fragile material fragile material expeditiously.
In addition, in the segmenting device of fragile material of the present invention, the laser power density of the first laser beam irradiation area that is formed by the described first beam irradiation portion preferably is lower than the laser power density of the second laser beam irradiation area that is formed by the described second beam irradiation portion.According to this structure, can not make the melt surface of fragile material and apply in order to cut off the required heat energy of fragile material.
In addition, in the segmenting device of fragile material of the present invention, with respect to cool position, the position of the first laser beam irradiation area that forms by the described first beam irradiation portion along the described distance variable that cuts off the direction of preset lines, wherein, this cool position is to utilize described cooling body that local cooling is carried out and the cool position of formation in the position of leaving from the rear end of the described second laser beam irradiation area.According to this structure, can make fragile material inside thermal diffusion through the time state variation.
In this case, the distance of the position of the described first laser beam irradiation area and described cool position also can be set based on the speed of cutting off of described fragile material and at least one side of thickness.According to this structure, can adjust and be set in the heated fragile material of the first laser beam irradiation area to the time that cooling begins, and/or, adjust the time that arrives the back side of fragile material based on the temperature conduction of thermal diffusion of setting.
In addition, in the segmenting device of fragile material of the present invention, the shape of the described first laser beam irradiation area also can be a circular.According to this structure, the laser from the irradiation of the first beam irradiation portion intactly can be used or only change beam diameter ground and use.
In addition, in the segmenting device of fragile material of the present invention, the shape of the described first laser beam irradiation area also can be the shape after the central portion of circular is cut off with the width of regulation.According to this structure, can improve the linearity of the face of cutting off.
In this case, first laser beam that forms the described first laser beam irradiation area also can set at central portion from the light path of the laser of the described first beam irradiation portion regulation width shelter and generate.According to this structure, can make the irradiation area of first laser beam be shaped as the shape that the central portion of circular is cut off with the width of regulation with very simple method.
In addition, in the segmenting device of fragile material of the present invention, second laser beam that forms the described second laser beam irradiation area also can make to repair by diffraction optical element or plano-convex cylindrical lens from the laser of the LASER Light Source of the described second beam irradiation portion and generate.According to this structure, can form the irradiation position shape of second laser beam non-circular with very simple method.
In addition, in the segmenting device of fragile material of the present invention, also can also possess the initial be full of cracks that forms initial be full of cracks in the end of cutting off preset lines of fragile material and form mechanism, and the described first beam irradiation portion and the second beam irradiation portion are moved along the described preset lines of cutting off from the position of described initial be full of cracks.According to this structure, can be used in the be full of cracks of cutting off of carrying out fragile material with low threshold value and enlarge beginning.
In addition, in the segmenting device of fragile material of the present invention, described laser beam irradiation means also can comprise joins the laser power more than 50% to the described first beam illuminated portion and the described second beam illuminated portion is joined beam splitter less than 50% laser power.According to this structure, a laser beam device is just enough, can reduce cost.
The cut-off method of fragile material of the present invention heats along the preset lines of cutting off of fragile material, make described fragile material and described position of heating relatively move and cut off described fragile material along the described preset lines of cutting off, the cut-off method of described fragile material is characterised in that, form initial be full of cracks in described fragile material end of cutting off on the preset lines, with described initial be full of cracks is that starting point utilizes first laser beam and second laser beam to carry out the heating of described fragile material, described first laser beam is to be positioned at along the beam in the place ahead of the described moving direction that cuts off preset lines with respect to described second laser beam, described second laser beam is to cut off the beam that preset lines is an elongated shape along described, and the part cooling is carried out in the position of leaving assigned position from the rear end of described second laser beam.
[invention effect]
First and second laser beam among the present invention for example can be used usually the surface laser employed CO that rules
2Laser.When second laser beam is carried out cutting off of fragile material, by first laser beam the place ahead of cutting off the precalculated position is heated, thereby the heat energy that second laser beam is produced carries out heat conduction to the thickness direction of fragile material effectively, produces the breaking of the back side of arrival fragile material then under cool position by assigned position is cooled off.Therefore, by the first beam irradiation portion, the second beam irradiation portion and cooling body are relatively moved along the precalculated position of cutting off of fragile material, and heating and ensuing cooling by first and second laser beam can be carried out fragile material entire body and cut off along cutting off the precalculated position.
So, according to the present invention, can realize having high-quality based on the thermal stress cut-off of laser, and compared with prior art, the entire body that can significantly increase fragile material is cut off speed.And, only fragile material is separated, thereby can significantly suppress to follow breaking step of breaking and the cullet that produce by thermal stress based on laser.In addition, cutting off face can be not crooked and can cut off as the crow flies with respect to cutting off preset lines.
Description of drawings
Fig. 1 is the position relation of laser beam of principle of the expression cut-off method that is used to illustrate fragile material of the present invention and the concept map of temperature characterisitic, (a) be the irradiation position of expression first laser beam, the conceptual top view of the mutual position relation of the irradiation position of second laser beam and cool position, (b) being the figure of the temperature curve of heating when glass baseplate surface overlaps that carry out of first laser beam in the presentation graphs 1 (a) and second laser beam, (c) is the conceptual top view of phenomenon of the dislocation of first laser beam in the key diagram 1 (a) and second laser beam.
Fig. 2 is the concept nature stereogram of major part of principle that is used to illustrate the cut-off method of fragile material of the present invention.
Fig. 3 is the concept map of structure of chopping up apparatus of embodiment 1 of the cut-off method of expression fragile material of the present invention.
Fig. 4 be used to describe in detail fragile material of the present invention cut-off method principle major part analyse and observe concept map, be laterally to analyse and observe concept map (a), (b) be A-A ' the line cutaway view of Fig. 4 (a).
Fig. 5 is the stereogram of explanation by the face that cuts off of the glass substrate that cut-off method cut off of fragile material of the present invention.
Fig. 6 is the concept map of the structure of the chopping up apparatus among the embodiment 2 of cut-off method of expression fragile material of the present invention.
Fig. 7 is the position relation of the laser beam among the embodiment 2 of cut-off method of expression fragile material of the present invention and the concept map of temperature characterisitic, (a) being the conceptual top view of the mutual position relation of the irradiation position of irradiation position, second laser beam of expression first laser beam and cool position, (b) is the figure of the temperature curve of heating when glass baseplate surface overlaps that carry out of first laser beam in the presentation graphs 7 (a) and second laser beam.
When Fig. 8 is the single face of the alkali-free glass that initial heat is imposed on thickness 0.7mm among the embodiment of cut-off method of fragile material of the present invention, through the time described the Temperature Distribution figure of the situation that the glass temperature inside changes.
Fig. 9 is that expression is used to illustrate the radial stress composition σ when temperature that the thermal stress of laser cut-off method produces the Gaussian distribution that the center is placed initial point of principle rises
xWith tangential direction stress component σ
yThe performance plot of variation.
Figure 10 is the concept nature stereogram that the laser cut-off method of glass in the past is described, (a) is surface line, (b) is the schematic diagram when cutting apart entirely.
Figure 11 is the concept nature stereogram of size effect that the laser cut-off method of glass in the past is described, (a) is the figure that cuts off the big situation of width of the both sides of expression glass plate, (b) is the one-sided figure that cuts off the little situation of width of expression glass plate.
Figure 12 is the machining experiment result's that cuts off of the entire body of the alkali-free glass of expression used thickness 0.7mmt figure.
The specific embodiment
Below, describe accompanying drawing and principle of the present invention and embodiment in detail.In the following description, with the glass substrate be example explanation fragile material.
Fig. 3 is the figure of structure that schematically shows the full segmenting device of glass substrate of one embodiment of the present invention.Glass substrate 11 is positioned on the movable workbench 32, and movable workbench 32 moves on X-Y plane by the X-Y drive unit.In the drawings, only represent that the Y-axis of the moving direction of glass drives the servomotor 33 and the axle of usefulness, and omitted the diagram of X-axis drive system.
The laser oscillator that is used for heating glass uses CO in the present embodiment
2Laser instrument 21 and CO
2Laser instrument 25 these two.From CO
2The laser beam 22 that laser instrument 21 penetrates is reflected mirror 23 to the reflection of vertical below, is trimmed to the beam diameter of regulation by collector lens 24.Need to prove, the beam that has passed through collector lens 24 intactly shines the surface of glass substrate 11, but sometimes by being configured in the shape generation local deformation that makes beam on the beam transfer path as the beam shelter 35 (with reference to Fig. 6) that beam subtracts the portion of declining.In a word, by laser beam 22, on glass substrate 11, form the first beam irradiation area that first laser beam is shone.Which position the first beam irradiation area on the glass substrate 11 is formed on is carried out the position adjustment by the angle of turning back that changes speculum 23.In Fig. 3, the angle initialization that turns back of speculum 23 is near 90 °, but carries out the position adjustment of the first beam irradiation area by the position that changes this angle and regulate collector lens 24 simultaneously between 80 ° to 110 °.Perhaps, form the unit that the speculum 23 and the relative position of collector lens 24 are fixed, move horizontally and can carry out the position adjustment of the first beam irradiation area along the optical axis direction of laser beam 22 by making this unit.
From CO
2The laser beam 26 that laser instrument 25 penetrates is via beam expander 27, and the mirror 28 that is reflected is to the reflection of vertical below.The laser beam 26 of beam diameter φ 4mm is by beam expander 27, and beam diameter enlarges into about 4 times, becomes the beam of φ 16mm.Beam after the expansion is trimmed to elongated beam by diffraction optical element 29, thereby forms the second beam irradiation area that second laser beam is shone on glass substrate 11.
The rear of the second beam irradiation area that shines in second laser beam is provided with cooling device 30.As cooling device 30, use the cooling jet of two bobbin formulas, from the inner cylindrical tube injection water, from outer cylinder pipe inspection air.By water and Air mixing medium are sprayed towards glass, cool off point and on glass substrate 11, form.Be provided with initial be full of cracks in the place ahead of first laser beam and form device 31.Initial be full of cracks forms device 31 and possesses diamond cutter in the bottom, and has the elevating mechanism that this diamond cutter is moved up and down.Drive the interlock of the servomotor 33 of usefulness by elevating mechanism and Y-axis, and can form initial be full of cracks in the end of glass substrate 11.
Need to prove, in the present embodiment, used two CO
2Laser instrument, but also can only use a CO
2Laser instrument, and on the beam transfer path, dispose beam splitter, be divided into two paths and carry out the beam transmission.In this case, the apportionment ratio of the energy that beam splitter carries out is preferably given the energy distribution more than 50% the first laser beam side in irradiation the place ahead, and will give the second laser beam side at irradiation rear less than 50% energy distribution.
Fig. 1 (a) is the conceptual top view of the mutual position relation of the irradiation position of irradiation position, second laser beam of first laser beam of glass baseplate surface of principle of the expression cut-off method that is used to illustrate fragile material of the present invention and cool position, Fig. 1 (b) is the figure of first laser beam of presentation graphs 1 (a) and the temperature curve of heating when glass baseplate surface overlaps that second laser beam is carried out, and Fig. 1 (c) is the conceptual top view of phenomenon of the dislocation of first laser beam of key diagram 1 (a) and second laser beam.Fig. 2 is the concept nature stereogram of major part of principle that is used to illustrate the cut-off method of fragile material of the present invention.
Shown in Fig. 1 (a), the basic principle of the cut-off method of fragile material of the present invention be along glass substrate 11 cut off preset lines 12, dispose the first beam irradiation area 13, the second beam irradiation area 14 and cooling point (or cool position) 15 successively from the place ahead of cutting off.
As shown in Figure 3, the first beam irradiation area 13 utilizes the speculum 23 will be from CO
2The laser beam 22 of laser instrument 21 makes it pass through the beam diameter that regulation was adjusted and generated to collector lens 24 to the prescribed direction reflection, and its cross sectional shape is circular or oval, in the scope of this specification and claims book they is generically and collectively referred to as circular.The first beam irradiation area 13 is only to produce local heat and the laser beam of intensity that do not produce the degree of fusion or crackle on glass substrate 11.
The second beam irradiation area 14 is positioned at the rear of the first beam irradiation area 13, and it is elongated shape that its cross sectional shape is trimmed to along the direction of cutting off preset lines 12 of glass substrate 11.That is, shown in Fig. 1 (a), the second beam irradiation area 14 is to be the long non-circular beam of length b of width than its right angle orientation along the length a of the direction of cutting off preset lines 12 of glass substrate 11.Being preferably about 26～30 with respect to the ratio a/b of the length b of width in the elongated non-circular beam along the length a of the length direction that cuts off preset lines 12.
Utilize the beam expander 27 will be from CO
2The laser beam 26 of laser instrument 25 is extended to the diameter of the multiplying power of regulation, be reflected mirror 28 after the prescribed direction reflection, it repaired by diffraction optical element or the such beam burring machine 29 of plano-convex cylindrical lens generate the elongated non-circular beam of this kind.The second beam irradiation area 14 also is only to produce local heat and the laser beam of intensity that do not produce the degree of fusion or crackle on glass substrate 11.
Then action is described.In Fig. 2, at first, form device 31 by initial be full of cracks and form initial be full of cracks 16 in the end of cutting off preset lines 12 of glass substrate 11.Should initial be full of cracks 16 be original positions of cutting off of glass substrate 11.Then, the servomotor 33 that drives usefulness by Y-axis makes the glass substrate 11 that is positioned on the workbench 32 move along the Y direction, begins the heating of glass from the direction of the initial be full of cracks 16 suitable with the original position of cutting off preset lines 12 of glass substrate 11.Shown in Fig. 1 (a), therefore the first beam irradiation area 13, the second beam irradiation area 14 and cooling point 15 alignment arrangements can as one man move along the direction of cutting off preset lines 12 in a straight line.At this moment, shown in Fig. 1 (c), owing to adjust not enough, and preset lines 12 is cut off when staggering small value Δ d with respect to glass substrate 11 in the center of the center of the first beam irradiation area 13 and the second beam irradiation area 14, the face quality badness of the glass section of cutting apart, therefore need correctly carry out the position adjustment, so that do not stagger with respect to cutting off preset lines 12 in the center of the center of the first beam irradiation area 13 and the second beam irradiation area 14.
Then, from the position and the first beam irradiation area 13 that is formed on the initial be full of cracks 16 on the glass substrate 11, the state of the direction unanimities that the second beam irradiation area 14 and cooling point 15 are arranged begins to make first laser beam and the irradiation of second laser beam also simultaneously from cooling device 30 ejector refrigeration agent, and make the glass substrate 11 that is positioned on the workbench 32 when the Y direction moves by servomotor 33, make the first beam irradiation area 13 along the preset lines 12 of cutting off that is positioned in the glass substrate 11 on the workbench 32, the arrangement of the second beam irradiation area 14 and the cooling point 15 that cold-producing medium cooled off relatively moves and begins to cut off effect.
Shown in Fig. 1 (a), the basic principle of the cut-off method of fragile material of the present invention is that the preset lines 12 of cutting off along glass substrate 11 disposes the first beam irradiation area 13, the second beam irradiation area 14 and cooling point 15 successively from the place ahead of cutting off.The forefront that cuts off of 13 pairs of glass substrates 11 of the first beam irradiation area carries out preheating, and this position is become the state before will beginning to cut off by the follow-up second beam irradiation area, 14 heating.Fig. 1 (b) is the temperature curve on glass substrate 11 surfaces of this moment.Promptly, the temperature curve 141 that the second beam irradiation area 14 is produced is overlapping with the temperature curve 131 that the first beam irradiation area 13 produces, and the position of the lip-deep irradiated second beam irradiation area 14 of glass substrate 11 is heated to form and will begins to cut off high temperature before.The heat that this heating produces carries out the heat conduction along the thickness direction of glass substrate 11.
Be preheated and during the glass substrate 11 ejector refrigeration agent of the elongated second beam irradiation area, 14 heated states to the first beam irradiation area 13 of circular from cooling device 30, as shown in Figure 2, the be full of cracks that enlarges from initial be full of cracks 16 under cooling point is advanced along the depth direction of glass substrate 11, and this be full of cracks is along with glass substrate 11 and the first beam irradiation area 13, the second beam irradiation area 14 and cool off further advancing along the preset lines 12 of cutting off of glass substrate 11 to relatively moving of Y direction of an arrangement of 15.Consequently, on the whole thickness of slab of glass substrate 11, produce the face 17 that cuts off.
Further describe this situation according to Fig. 4.Fig. 4 be used for describing in detail Fig. 2 fragile material of the present invention cut-off method principle major part analyse and observe concept map, be laterally to analyse and observe concept map (a), (b) be A-A ' the line cutaway view of Fig. 4 (a).
The arrangement that makes the first beam irradiation area 13, the second beam irradiation area 14 and cooling point 15 is with respect to glass substrate 11 during along the Y scanning direction, glass substrate 11 at first is heated at the first beam irradiation area 13, the heat that this heating produces is along with carrying out heat conduction to the scanning of Y direction to the back side of glass substrate 11 direction, thus in glass substrate 11 formation heating region 130.Then, glass substrate 11 is heated at the second beam irradiation area 14, and the heat that this heating produces is along with carrying out heat conduction to the scanning of Y direction to the back side of glass substrate 11 direction, thus in glass substrate 11 formation heating region 140.The cooling of the cooling point 15 at the rear portion of the second beam irradiation area 14 is similarly along with carrying out the heat conduction to the scanning of the Y of glass substrate 11 direction to the back side of glass substrate 11 direction, thus glass substrate 11 in formation cooled region 150.
Consequently, the heat distribution of the glass substrate 11 under the cooling point 15 is shown in Fig. 4 (b), in the glass substrate 11, the cooling effects that cooling point 15 produces are being heated near the back side heating region 130 and the heating region 140 by second beam irradiation area 14 heating continuous with it by the first beam irradiation area 13, under the cooling point, be full of cracks is advanced along the depth direction of glass substrate 11, reaches the back side of glass substrate 11 and is cut off in whole thickness of slab direction.This phenomenon is along with to the scanning of the Y of glass substrate 11 direction and advance along the preset lines 12 of cutting off of glass substrate 11, arrives the cutting off of the back side of glass substrate 11 along cutting off preset lines 12.
Fig. 8 is the figure of expression with respect to the Temperature Distribution of the thickness direction of glass.In above-mentioned use in the explanation of Fig. 4 (a), about situation to the heat propagation of the thickness direction of glass, illustrated heat linear function ground from the surface of glass to the back side with the simple situation about propagating of constant speed.Yet in fact the propagation of the heat of glass inside should calculate based on the thermal diffusion equation, thus illustration this equation is applicable to alkali-free glass and a result calculating.
To be hypothesis applied 20J/cm to the single face of the alkali-free glass of thickness 0.7mm, infinitely-great size to the figure of Fig. 8
2Uniform heat distribution the time, how the Temperature Distribution of calculated thickness direction changes, and its result is formed the figure of figure.The transverse axis of figure is represented the degree of depth of heat propagation, promptly represents the thickness (mm) of glass, and the longitudinal axis represents that temperature rises, and represents promptly glass is from original state how many temperature that risen.Many the curves of putting down in writing in the figure are that the elapsed time after the initial heating is made state variation as parameter, and this is for a plurality of figures of overlapping expression.
Only initially apply 20J/cm by single face to glass
2Heat, just can make heated glass face moment surpass 400 ℃, but the surface temperature of glass sharply descends afterwards.The heating surface side is when temperature descends, and to the not rear side transmission of heating, so rear side produces temperature and rise, and becomes to surpass 100 ℃ degree slightly from the heat on surface.The parameter in elapsed time is being calculated from arriving time of 1.0 seconds 10 of samplings, the order short since the elapsed time is T1=30msec, T2=40msec, T3=50msec, T4=75msec, T5=100msec, T6=200msec, T7=300msec, T8=400msec, T9=700msec, T10=1000msec.From this figure as can be known, after T1 is 30msec, have 400 ℃ big temperature difference at the surface and the back side of the glass of thickness 0.7mm, but temperature difference relaxes into about 50 ℃ after T6 is 200msec.Then, after T7 was 300msec, temperature difference weakened into 30 ℃, and the surface and the back side become roughly the same temperature.
Using CO
2In the present embodiment of laser instrument, the heat energy of being supplied with by first laser beam of the place ahead of forward direction irradiation propagates into the back side of glass, can effectively utilize the feature that is used for the energy that entire body cuts off thereby have.Cut off in order to carry out this kind entire body, and need make the heat energy that is absorbed by glass surface in glass, evenly to carry out thermal diffusion to a certain degree.So, along cutting off preset lines, the distance L which kind of degree is set between the irradiation area of the cooling point and first laser beam is a big event.At this, the translational speed of glass is V, and when the traveling time that the below spent that is moved to the cooling point by the glass surface of first laser beam irradiation was τ, the relation of L=V τ was set up.As mentioned above, roughly the same for the temperature at the surface that makes glass and the back side, and need for 200 to 300msec time.That is, when the translational speed of glass is 180mm/s, the distance of mobile 36mm in the elapsed time of 200msec, and in the elapsed time of 300msec the distance of mobile 54mm.Therefore, as the distance L between the irradiation area of the cooling point and first laser beam, need design the distance of 36mm at least, the distance that decision design 54mm is above.
So, the distance L which kind of degree is set between the irradiation area of the cooling point and first laser beam is to depend on the translational speed of glass or the thickness of glass.More specifically, be that pyroconductivity, specific heat, the density of glass is relevant with the physical constant of the Speed of diffusion of glass inside.And, also relevant with the boundary condition at the back side of glass.That is, no matter the back side of glass fixed by the mechanism of connecting airtight with metallic work table, floated over still that airborne mechanism is fixing all not to have an influence.
In the present embodiment, under the cooling point, advance along the depth direction of glass substrate 11 in essence from the be full of cracks that initial be full of cracks 16 has enlarged, therefore act on glass substrate 11 can not take place along the tensile stress on the face direction unbalanced, 12 can be crooked and cut off face 17 with respect to cutting off preset lines.And the thermal stress of only utilizing laser to produce makes before the be full of cracks and then on the face that cuts off 17 that forms can not produce micro-cracks, and the mechanical strength of the glass substrate 11 after the cut-out is also high.
With the end on the preset lines 12 of cutting off of initial be full of cracks 16 opposition sides, cut off required sufficient tensile stress and disappear for glass being carried out entire body, so the face that cuts off of entire body cuts off 17 and stops during near the end of opposition side.At this moment, as shown in Figure 5, the residual zone 18 that has not generation to cut off face 17 in the end of glass substrate 15.Do not produce the face 17 that cuts off in this zone 18, but be formed with marking groove 19 on the surface.Therefore, can utilize easy fracture mechanism that glass is cut off fully in case of necessity.Therefore in this case, glass substrate 11 is cut off by entire body on the roughly whole length of processing length, can significantly suppress to follow the generation of the cullet of breaking step of breaking.
[embodiment 1]
In glass severing device shown in Figure 3, as the first beam irradiation area 13, utilize speculum 23 with power output 165W from CO
2The laser beam 22 of laser instrument 21 makes it carry out optically focused by collector lens 24 to the reflection of vertical below.Consequently, on glass substrate 11, form the circular beam irradiation area of beam diameter 15mm near Gaussian distribution.As the second beam irradiation area 14, utilize from the laser beam 26 of power output 98W, the beam diameter 4mm of CO2 laser instrument 25 ejaculations.This laser beam 26 is via beam expander 27, and is expanded beam diameter 16mm, and the mirror 28 that is reflected then transmits to the vertical below.When the laser beam of beam diameter 16mm was passed through diffraction optical element 29, forming length a on glass substrate 11 was that 26mm, width b are the elongated beam of 1mm.
So, utilize first laser beam that the first beam irradiation area 13 is applied the power of 165W, utilize second laser beam second beam irradiation area 14 to be applied the power of 98W.That is, above glass substrate 11, consider the loss that beam transmits, and the heat energy that will impose on the first beam irradiation area 13 is set greater than the heat energy that imposes on the second beam irradiation area 14 for.
In addition, about laser power density, the laser power density in the first laser irradiation area territory 13 is 0.93W/mm
2, the laser power density in the second laser irradiation area territory 13 is 3.77W/mm
2That is, the laser power density of the first beam irradiation area 13 is set at the laser power density that is lower than the second laser irradiation area territory 13.
As glass substrate 11, the alkali-free glass of used thickness 0.7mm, total length 580mm.As cooling device, use the cooling jet of two bobbin formulas, from the inner cylindrical tube injection water, from outer cylinder pipe inspection air.The rear end of the second beam irradiation area 14 is set at 5mm with the distance of cooling point 15.The relative movement distance of the arrangement of the glass substrate 11 and the first beam irradiation area 13, the second beam irradiation area 14 and cooling point 15, promptly the process velocity that cuts off with glass is that 180mm/s processes.Consequently, can carry out entire body on the length of the 540mm except the terminal part of about 40mm of glass substrate 11 cuts off.The linearity precision of cutting off of this moment is in ± 250 μ m.Under same condition, even when in the position of having left 15mm from end face this glass of width 290mm, length 580mm being cut off, the linearity precision also is ± 250 μ m, is not subjected to the influence of the bending that so-called size effect produces.
The beam diameter of the first beam irradiation area 13 is 10mm～16mm, when the distance of the rear end of the second beam irradiation area 14 and cooling point 15 is changed between 3～7mm, has obtained the roughly the same result that cuts off.Need to prove, with regard to sweep speed, improving CO
2In the time of the power of laser instrument 21,25, by increasing cooling point and the distance of the second beam irradiation area 14 and the distance of the second beam irradiation area 14 and the first beam irradiation area 13, and can further gather way.And, even the length a of the elongated non-circular second beam irradiation area 14 changes in 26～30 scope with respect to the ratio a/b of width b, also can obtain the roughly same result that cuts off.
[embodiment 2]
Fig. 6 is the concept map of the chopping up apparatus of the fragile material among the expression embodiment 2.Be used to the beam curve that heats shown in Fig. 7.This beam curve is in glass severing device shown in Figure 7, and the beam shelter 35 of width by regulation blocks the beam curve that the central portion from the output beam of collector lens 24 of the first beam irradiation area 13 obtains.For example, the metal bar of configuration diameter phi 2mm on the course of the beam that transmits beam.Like this, the part of first laser beam is by the metal bar shading, so the part of shadow is called in projection to some extent on the glass substrate, so this part is not heated.In embodiment 2, shown in Fig. 7 (a), the shape of the first beam irradiation area 130 becomes the shape that the width w with regulation cuts off the central portion of circular.The blocking part 133 of Rack w in the first beam irradiation area 130 is set at beam width e than the second beam irradiation area 14 when big slightly, on the surface of glass, the heating region institute superposed part that the heating region that the first beam irradiation area 130 produces and second laser beam produce no longer exists.Therefore, the temperature curve of the glass baseplate surface of the first beam irradiation area 13 and the second beam irradiation area 14 can be divided into and being used for cutting off the heat energy 141 that heats on the preset lines and the heat energy 131 that the part of the both sides of preset lines heats being cut off in clamping as Fig. 7 (b).
The process of cutting off of present embodiment 2 situation with embodiment 1 in itself is identical, can carry out entire body similarly to Example 1 and cut off.Need to prove, in embodiment 1, be used for being supplied to as first laser beam and shining the laser beam of cutting off on the preset lines and the overlapping heat energy of the second beam irradiation area 14 cutting off the heat energy that heats on the preset lines.Yet, according to this embodiment 2, be used for only supplying with by first laser beam 14 to cutting off the heat energy that heats on the preset lines, therefore the setting of the laser power of irradiation becomes easy.As its result, have the advantage that improves the linearity precision, on whole length 540mm, can carry out entire body with interior precision and cut off with ± 100 μ m.
Figure 12 has summed up to carry out whether having realized when glass cuts off experiment the result that entire body is cut off in the structure of processing unit (plant) shown in Figure 3.As beam curve, used the method for first beam irradiation of the circular shown in Fig. 1 (a).The glass that uses is the alkali-free glass of thickness 0.7mmt.As the order of processing, adopt the method that with certain interval (30mm) glass of the width 550mm of profile and machine direction length 290mm is cut into long narrow shape from a side end face.
Record from the table of Figure 12 as can be known, the laser power P1 that shines the first beam irradiation area is set at when shining the laser power P2 of the second beam irradiation area, can realizes that entire body cuts off (with reference to processing conditions #1, #5, #6, #9, #10, #11) with good state.Laser power P1 and laser power P2 are set at when identical in fact, and the surplus length of cutting of glass terminal part has elongated slightly tendency (with reference to processing conditions #2, #7).On the other hand, laser power P1 is during less than laser power P2, can't realize that entire body cuts off, and it is elongated or cut off the preferred processing results (with reference to processing conditions #3, #4, #8) such as face quality badness of face to obtain the surplus length of cutting of glass terminal part.Especially in order to realize process velocity (for example more than the 200mm/s) fast, be effective (with reference to processing conditions #9, #10, #11) and set for laser power P1 much larger than laser power P2.And when the process velocity V-arrangement was become 230mm/s, the distance L of the cool position and the first beam irradiation area was set at 95mm.During with the relational expression of described numerical value substitution L=V τ, can obtain the value of τ=413 (msec).This value τ represents to be moved to the elapsed time that cool position spends by the irradiation of first laser beam institute heated glass surface.On the other hand, the figure according to described analog result shown in Figure 8 obtains following investigation result, that is, figure forms smooth state, as arriving the thermally equilibrated time, needs the above elapsed time of 200msec or 300msec.This elapsed time τ=413 (msec) this value is the above value of 300msec, therefore with based on the investigation result of Fig. 8 contradiction not.That is, distinguished with regard to the distance L of the cool position and the first beam irradiation area,, then set distance L longer corresponding to this if process velocity V is accelerated.
[industrial applicibility]
The current diamond cutter that utilizes of the cut-out of the glass that uses in the flat-panel monitor such as LCD, plasma display carries out, thereby presents the necessity of the matting after the needed cut-out of cullet of generation or because of degradation problem under existing of the micro-cracks caused intensity.The segmenting device of fragile material of the present invention and cut-off method can be used in cutting off of various fragile materials such as the cutting off of the employed glass of flat-panel monitor such as LCD, plasma display, quartz, pottery, semiconductor.When the segmenting device of fragile material of the present invention and cut-off method are imported the manufacture process of flat-panel monitor etc., can expect the big effect of the weakness that improves process velocity, processing quality, economy etc. and overcome prior art etc.
[symbol description]
11 glass substrates
12 cut off preset lines
13 first laser beam
14 second laser beam
15 coolings point or cool position
16 initially be full of cracks
17 cut off face
18 do not produce the zone of cutting off face
19 marking groove
21 CO
2Laser instrument
22 laser beam
23 speculums
24 collector lenses
25 CO
2Laser instrument
26 laser beam
27 beam expanders
28 speculums
29 beam burring machines
30 cooling devices
31 initial be full of cracks form device
32 workbench
33 X-Y drive units
The temperature curve that 131 first laser beam produce
133 shield portions
The temperature curve that 141 second laser beam produce
Claims (17)
1. the segmenting device of a fragile material, it is with respect to the preset lines of cutting off of the supposition on the fragile material, heat described fragile material from being formed on this initial be full of cracks one side of cutting off on the preset lines along the described preset lines of cutting off, cut off position that preset lines heats and relatively move and cut apart described fragile material by making along described, the segmenting device of described fragile material is characterised in that to possess:
Along the described preset lines of cutting off, described fragile material irradiating laser beam is generated the laser beam irradiation means of heating part;
The cooling body that described fragile material is carried out local cooling in the position at the rear of the described heating part on the described moving direction that cuts off preset lines,
Described laser beam irradiation means comprises:
At described heating part, form the first beam irradiation portion of the first laser beam irradiation area that is positioned at described moving direction the place ahead;
At described heating part, cut off the second beam irradiation portion that preset lines forms the second laser beam irradiation area of elongated shape along described at the rear of the described moving direction of the described first laser beam irradiation area.
2. the segmenting device of fragile material according to claim 1 is characterized in that,
The laser power that imposes on the first laser beam irradiation area that is formed by the described first beam irradiation portion is greater than the laser power that imposes on the second laser beam irradiation area that is formed by the described second beam irradiation portion.
3. the segmenting device of fragile material according to claim 1 and 2 is characterized in that,
The laser power density of the first laser beam irradiation area that is formed by the described first beam irradiation portion is lower than the laser power density of the second laser beam irradiation area that is formed by the described second beam irradiation portion.
4. the segmenting device of fragile material according to claim 1 is characterized in that,
The position of the first laser beam irradiation area that forms by the described first beam irradiation portion with respect to cool position along the described distance variable that cuts off the direction of preset lines, wherein, this cool position is to utilize described cooling body that local cooling is carried out and the cool position of formation in the position of leaving from the rear end of the described second laser beam irradiation area.
5. the segmenting device of fragile material according to claim 4 is characterized in that,
The position of the described first laser beam irradiation area and the distance of described cool position are set based on the speed of cutting off of described fragile material and at least one side of thickness.
6. the segmenting device of fragile material according to claim 1 is characterized in that,
The described first laser beam irradiation area be shaped as circular.
7. the segmenting device of fragile material according to claim 1 is characterized in that,
The shape of the described first laser beam irradiation area is the shape after the central portion of circular is cut off with the width of regulation.
8. the segmenting device of fragile material according to claim 7 is characterized in that,
First laser beam that forms the described first laser beam irradiation area set at central portion from the light path of the laser of the described first beam irradiation portion regulation width shelter and generate.
9. the segmenting device of fragile material according to claim 1 is characterized in that,
Second laser beam that forms the described second laser beam irradiation area makes to repair by diffraction optical element or plano-convex cylindrical lens from the laser of the LASER Light Source of the described second beam irradiation portion and generates.
10. the segmenting device of fragile material according to claim 1 is characterized in that,
Also possess the initial be full of cracks that forms initial be full of cracks in the end of cutting off preset lines of fragile material and form mechanism, and the described first beam irradiation portion and the second beam irradiation portion are moved along the described preset lines of cutting off from the position of described initial be full of cracks.
11. the segmenting device of fragile material according to claim 1 is characterized in that,
Described laser beam irradiation means comprises joins the laser power more than 50% to the described first beam illuminated portion and the described second beam illuminated portion is joined beam splitter less than 50% laser power.
12. the cut-off method of a fragile material, the preset lines of cutting off along fragile material heats, make described fragile material and described position of heating relatively move and cut off described fragile material along the described preset lines of cutting off, the cut-off method of described fragile material is characterised in that
Form initial be full of cracks in described fragile material end of cutting off on the preset lines, with described initial be full of cracks is that starting point utilizes first laser beam and second laser beam to carry out the heating of described fragile material, described first laser beam is to be positioned at along the beam in the place ahead of the described moving direction that cuts off preset lines with respect to described second laser beam, described second laser beam is to cut off the beam that preset lines is an elongated shape along described, and the part cooling is carried out in the position of leaving assigned position from the rear end of described second laser beam.
13. the cut-off method of fragile material according to claim 12 is characterized in that,
The laser power that imposes on the first laser beam irradiation area that is formed by described first laser beam is greater than the laser power that imposes on the second laser beam irradiation area that is formed by described second laser beam.
14. the cut-off method according to claim 12 or 13 described fragile materials is characterized in that,
The laser power density of the first laser beam irradiation area that is formed by described first laser beam is lower than the laser power density of the second laser beam irradiation area that is formed by described second laser beam.
15. the cut-off method of fragile material according to claim 12 is characterized in that,
The position of the first laser beam irradiation area that forms by described first laser beam with respect to cool position along the described distance variable that cuts off the direction of preset lines, wherein, this cool position is that local cooling is carried out and the cool position of formation in the position of leaving from the rear end of described second laser beam.
16. the cut-off method of fragile material according to claim 15 is characterized in that,
The position of the described first laser beam irradiation area and the distance of described cool position are set based on the speed of cutting off of described fragile material and at least one side of thickness.
17. the cut-off method of fragile material according to claim 12 is characterized in that,
The end of cutting off preset lines at fragile material forms initial be full of cracks, and first laser beam and second laser beam are moved along the described preset lines of cutting off from the position of described initial be full of cracks.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2008-320251 | 2008-12-16 | ||
| JP2008320251 | 2008-12-16 | ||
| PCT/JP2009/070900 WO2010071128A1 (en) | 2008-12-16 | 2009-12-15 | Splitting apparatus and cleavage method for brittle material |
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| Publication Number | Publication Date |
|---|---|
| CN102239034A true CN102239034A (en) | 2011-11-09 |
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| CN2009801489582A Pending CN102239034A (en) | 2008-12-16 | 2009-12-15 | Splitting apparatus and cleavage method for brittle material |
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| JP (1) | JP5562254B2 (en) |
| KR (1) | KR101404250B1 (en) |
| CN (1) | CN102239034A (en) |
| WO (1) | WO2010071128A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013082830A1 (en) * | 2011-12-05 | 2013-06-13 | 深圳市华星光电技术有限公司 | Cutting device and method for glass substrate |
| CN107635934A (en) * | 2015-06-25 | 2018-01-26 | 日本电气硝子株式会社 | The cutting-off method and shearing device of pipe glass and the manufacture method of pipe glass product |
| CN111918747A (en) * | 2018-03-30 | 2020-11-10 | 东京毅力科创株式会社 | Laser processing apparatus and laser processing method |
| US10941070B2 (en) | 2014-02-20 | 2021-03-09 | Corning Incorporated | Methods and apparatus for cutting radii in flexible thin glass |
| CN114761365A (en) * | 2020-02-06 | 2022-07-15 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
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| DE102014116957A1 (en) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optical system for beam shaping |
| DE102014116958B9 (en) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optical system for beam shaping of a laser beam, laser processing system, method for material processing and use of a common elongated focus zone for laser material processing |
| CN107003531B (en) * | 2014-11-19 | 2019-11-29 | 通快激光与系统工程有限公司 | System for asymmetrical optical beam shaping |
| US11008244B2 (en) * | 2015-11-25 | 2021-05-18 | Corning Incorporated | Methods of separating a glass web |
| JP7564537B2 (en) | 2020-12-18 | 2024-10-09 | 株式会社M―Sfc | Laser processing method and laser processing device |
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| JP2006137169A (en) * | 2004-11-12 | 2006-06-01 | Lemi Ltd | Method and apparatus for breaking and cutting fragile material |
| JP2007076930A (en) * | 2005-09-12 | 2007-03-29 | Joyo Kogaku Kk | Method of cutting glass |
| WO2007094348A1 (en) * | 2006-02-15 | 2007-08-23 | Toray Engineering Co., Ltd. | Laser scribing method, laser scribing apparatus and cut substrate cut by using such method or apparatus |
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- 2009-12-15 JP JP2010542973A patent/JP5562254B2/en not_active Expired - Fee Related
- 2009-12-15 KR KR1020117016142A patent/KR101404250B1/en active IP Right Grant
- 2009-12-15 CN CN2009801489582A patent/CN102239034A/en active Pending
- 2009-12-15 WO PCT/JP2009/070900 patent/WO2010071128A1/en active Application Filing
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| JPH08197271A (en) * | 1995-01-27 | 1996-08-06 | Ricoh Co Ltd | Method for cracking brittle material and device for cracking brittle material |
| CN1529648A (en) * | 2001-07-16 | 2004-09-15 | 三星宝石工业株式会社 | Scribing device for fragile material substrate |
| JP2005212364A (en) * | 2004-01-30 | 2005-08-11 | Shibaura Mechatronics Corp | Fracturing system of brittle material and method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013082830A1 (en) * | 2011-12-05 | 2013-06-13 | 深圳市华星光电技术有限公司 | Cutting device and method for glass substrate |
| US10941070B2 (en) | 2014-02-20 | 2021-03-09 | Corning Incorporated | Methods and apparatus for cutting radii in flexible thin glass |
| CN107635934A (en) * | 2015-06-25 | 2018-01-26 | 日本电气硝子株式会社 | The cutting-off method and shearing device of pipe glass and the manufacture method of pipe glass product |
| CN111918747A (en) * | 2018-03-30 | 2020-11-10 | 东京毅力科创株式会社 | Laser processing apparatus and laser processing method |
| CN114761365A (en) * | 2020-02-06 | 2022-07-15 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
| CN114761365B (en) * | 2020-02-06 | 2024-09-10 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010071128A1 (en) | 2010-06-24 |
| JP5562254B2 (en) | 2014-07-30 |
| KR101404250B1 (en) | 2014-06-09 |
| KR20110106360A (en) | 2011-09-28 |
| JPWO2010071128A1 (en) | 2012-05-31 |
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