CN102218936A - Precise marking device by ultraviolet laser - Google Patents
Precise marking device by ultraviolet laser Download PDFInfo
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- CN102218936A CN102218936A CN2011101284793A CN201110128479A CN102218936A CN 102218936 A CN102218936 A CN 102218936A CN 2011101284793 A CN2011101284793 A CN 2011101284793A CN 201110128479 A CN201110128479 A CN 201110128479A CN 102218936 A CN102218936 A CN 102218936A
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Abstract
The invention discloses a precise marking device by ultraviolet laser. The output end of an ultraviolet regulating Q solid laser is provided with a beam expander; the output end of the beam expander is provided with a scanning current meter; the output end of the scanning current meter is connected with a focus lens; a two-dimensional moving platform is arranged below the focus lens; a light beam emitted by the ultraviolet regulating Q solid laser is irradiated into the beam expander; the beam expander outputs a collimating light beam; the collimating light beam enters the focus lens after passing through the scanning current meter; and the focal point of the light beam which is focused by the focus lens is positioned on the processing workpiece of the two-dimensional moving platform. According to the ultraviolet regulating Q solid laser, the chemical bond of the material is broken to strip modules instead of removing substance by thermal ablation when the ultraviolet laser acts with material because of inherent characteristics, thereby greatly reducing heat affected zones; and ultraviolet processing is also named cold machining, and good edge effect can be obtained. According to the precise marking device, the problems of position precision and effect in the laser marking process can be solved, and the precise marking device is suitable for applying to wafer level marking in a semiconductor field.
Description
Technical field
The present invention relates to the accurate marking device of a kind of Ultra-Violet Laser, be used for the wafer scale mark of semiconductor packages field.
Background technology
Laser marking is to utilize the laser of high-energy-density that workpiece is carried out local irradiation, makes the chemical reaction of skin-material vaporization or generation change color, thereby stays a kind of marking method of permanent marker.Laser marking has engraving and mask imaging dual mode, the mask-type mark is imaged onto surface of the work and the mark of ablating out with laser with reticle pattern, the mark of engraving formula is a kind of high speed global function marking system, laser beam reflects after the flat field optical lens focuses on surface of the work through the two-dimension optical scanning galvanometer, make the material vaporization by the track of setting under the computer control, can get various literal, symbol and pattern etc., character boundary can be from the millimeter to the micron dimension, laser labelling is nonvolatil not easy to wear, this has special meaning to product false proof, is used for electronic devices and components in a large number, integrated circuit is beaten the trade mark model, beat numbering etc. to printed circuit board (PCB).
The laser marking technology has been widely used in all trades and professions, is high-quality, efficient, and wide prospect has been opened up in pollution-free and modern cheaply processing.Along with the continuous expansion of modern laser index carving application, to the device systems miniaturization that laser is made, high efficiency and integrated requirement are also more and more higher.
Ultraviolet band laser technical development in recent years is very fast, because the electron energy band transition takes place in material under the ultraviolet waves laser action, break or weaken intermolecular associative key, thereby realize degrading processing, the processing edge is very neat, therefore is a dark horse in the laser labelling technology, especially is subjected to the attention of microelectronic industry, can realize the sub-micron mark, be widely used in microelectronic.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, provide a kind of mark precision height, line width, the mark heat-affected zone is little and the accurate marking device of the regional big Ultra-Violet Laser of mark.
Purpose of the present invention is achieved through the following technical solutions:
The accurate marking device of Ultra-Violet Laser, comprise laser instrument and beam expanding lens, characteristics are: described laser instrument is the ultraviolet Q-switch solid laser, the output of ultraviolet Q-switch solid laser is provided with beam expanding lens, the output of described beam expanding lens is furnished with scanning galvanometer, the output of described scanning galvanometer is connected with focus lamp, and the arranged beneath of focus lamp has two-dimentional mobile platform; The light beam that described ultraviolet Q-switch solid laser sends is injected beam expanding lens, the light beam of beam expanding lens output collimation, and the light beam of collimation enters focus lamp behind scanning galvanometer, and the beam focus after focus lamp focuses on is positioned on the processing work of two-dimentional mobile platform.
Further, the accurate marking device of above-mentioned Ultra-Violet Laser, wherein, described ultraviolet Q-switch solid laser is that output wavelength is the ultraviolet Q-switch solid laser of 355nm or 266nm.
Further, the accurate marking device of above-mentioned Ultra-Violet Laser, wherein, described focus lamp is the F-Theta mirror.
Again further, the accurate marking device of above-mentioned Ultra-Violet Laser wherein, is equipped with getter device on the described two-dimentional mobile platform.
The substantive distinguishing features of technical solution of the present invention and progressive being mainly reflected in:
Adopt the ultraviolet Q-switched pulse laser, Ultra-Violet Laser, is not to remove material by thermal ablation, but by the chemical bond that interrupts material molecule is peeled off with material effects the time because of its inherent characteristic, can greatly reduce the heat-affected zone; Ultra-Violet Laser processing is called cold working again, can obtain good edge effect; Solve positional precision and effect problem in the laser marking process, be specially adapted to the mark of semiconductor applications wafer scale and use, realized micron and sub-micron mark.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: organigram of the present invention.
The implication of each Reference numeral among the figure:
1-ultraviolet Q-switch solid laser; The 2-beam expanding lens; The 3-scanning galvanometer; The 4-focus lamp; 5-two dimension mobile platform.
The specific embodiment
As shown in Figure 1, the accurate marking device of Ultra-Violet Laser, comprise laser instrument and beam expanding lens, laser instrument is that output wavelength is the ultraviolet Q-switch solid laser 1 of 355nm or 266nm, the pulsewidth of ultraviolet Q-switch solid laser 1 is a nanosecond order, the output of ultraviolet Q-switch solid laser 1 is provided with beam expanding lens 2, the output of beam expanding lens 2 is furnished with scanning galvanometer 3, the output of scanning galvanometer 3 is connected with focus lamp 4, focus lamp 4 is the F-Theta mirror, and focus lamp 4 is moved up and down by Electric Machine Control, and then control beam focus position, the arranged beneath of focus lamp 4 has two-dimentional mobile platform 5, on the two-dimentional mobile platform 5 getter device is installed; The light beam that ultraviolet Q-switch solid laser 1 sends is injected beam expanding lens 2, the light beam of beam expanding lens 2 output collimations, and the light beam of collimation enters focus lamp 4 behind scanning galvanometer 3, and the beam focus after focus lamp 4 focuses on is positioned on the processing work of two-dimentional mobile platform 5.
During laser marking, the laser that ultraviolet Q-switch solid laser 1 sends focuses on the work piece surface, during with material effects, is not to remove material by thermal ablation, but by the chemical bond that interrupts material molecule is peeled off, and forms mark.Limited because of the scanning area of scanning galvanometer, the mark of small breadth inner laser is controlled separately by scanning galvanometer, and the large format mark moves splicing by platform and the common control of scanning galvanometer is finished.During mark, the getter device in mark zone suction gasification or crushing material.By high-resolution assist location image system, the cursor position of can fighting each other is accurately located, and the whole mark precision of equipment is controlled in the 10um.
Adopting output wavelength is 355nm ultraviolet Q-switched pulse laser, Ultra-Violet Laser with material effects the time, is not to remove material by thermal ablation because of its inherent characteristic, but molecule is peeled off by the chemical bond that interrupts material, make in this way greatly to reduce the heat-affected zone; Ultra-Violet Laser processing is called cold working again, can obtain good edge effect.
The invention solves positional precision and effect problem in the laser marking process, also enlarged the application of laser marking simultaneously, be specially adapted to the mark of semiconductor applications wafer scale and use in little manufacturing field; With respect to traditional laser mark printing device, the present invention has many advantages, effectively reduces diffraction effect as the ultraviolet short wavelength, can realize micron and sub-micron mark.
It is emphasized that: above only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (4)
1. the accurate marking device of Ultra-Violet Laser, comprise laser instrument and beam expanding lens, it is characterized in that: described laser instrument is the ultraviolet Q-switch solid laser, the output of ultraviolet Q-switch solid laser is provided with beam expanding lens, the output of described beam expanding lens is furnished with scanning galvanometer, the output of described scanning galvanometer is connected with focus lamp, and the arranged beneath of focus lamp has two-dimentional mobile platform; The light beam that described ultraviolet Q-switch solid laser sends is injected beam expanding lens, the light beam of beam expanding lens output collimation, and the light beam of collimation enters focus lamp behind scanning galvanometer, and the beam focus after focus lamp focuses on is positioned on the processing work of two-dimentional mobile platform.
2. the accurate marking device of Ultra-Violet Laser according to claim 1, it is characterized in that: described ultraviolet Q-switch solid laser is that output wavelength is the ultraviolet Q-switch solid laser of 355nm or 266nm.
3. the accurate marking device of Ultra-Violet Laser according to claim 1, it is characterized in that: described focus lamp is the F-Theta mirror.
4. the accurate marking device of Ultra-Violet Laser according to claim 1 is characterized in that: on the described two-dimentional mobile platform getter device is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101284793A CN102218936A (en) | 2011-05-18 | 2011-05-18 | Precise marking device by ultraviolet laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101284793A CN102218936A (en) | 2011-05-18 | 2011-05-18 | Precise marking device by ultraviolet laser |
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| Publication Number | Publication Date |
|---|---|
| CN102218936A true CN102218936A (en) | 2011-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101284793A Pending CN102218936A (en) | 2011-05-18 | 2011-05-18 | Precise marking device by ultraviolet laser |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103551741A (en) * | 2013-10-18 | 2014-02-05 | 昆山思拓机器有限公司 | Processing device and process for conductive rubber pad |
| CN106827825A (en) * | 2017-02-16 | 2017-06-13 | 镭动激光科技（苏州）有限公司 | A kind of Ultra-Violet Laser marking machine |
| CN108526696A (en) * | 2018-02-26 | 2018-09-14 | 大族激光科技产业集团股份有限公司 | A kind of method and apparatus carrying out stamp mark to silicon rod using laser |
| CN109108467A (en) * | 2018-10-12 | 2019-01-01 | 英诺激光科技股份有限公司 | A kind of device and method using laser peeling optical fibre coat |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1058740A (en) * | 1991-07-22 | 1992-02-19 | 中国科学院安徽光学精密机械研究所 | Uv laser micro-flag printer |
| CN202115116U (en) * | 2011-05-18 | 2012-01-18 | 苏州德龙激光有限公司 | Ultraviolet laser accurate marking device |
-
2011
- 2011-05-18 CN CN2011101284793A patent/CN102218936A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1058740A (en) * | 1991-07-22 | 1992-02-19 | 中国科学院安徽光学精密机械研究所 | Uv laser micro-flag printer |
| CN202115116U (en) * | 2011-05-18 | 2012-01-18 | 苏州德龙激光有限公司 | Ultraviolet laser accurate marking device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103551741A (en) * | 2013-10-18 | 2014-02-05 | 昆山思拓机器有限公司 | Processing device and process for conductive rubber pad |
| CN106827825A (en) * | 2017-02-16 | 2017-06-13 | 镭动激光科技（苏州）有限公司 | A kind of Ultra-Violet Laser marking machine |
| CN108526696A (en) * | 2018-02-26 | 2018-09-14 | 大族激光科技产业集团股份有限公司 | A kind of method and apparatus carrying out stamp mark to silicon rod using laser |
| CN108526696B (en) * | 2018-02-26 | 2020-06-09 | 大族激光科技产业集团股份有限公司 | Method and device for marking silicon rod with codes by using laser |
| CN109108467A (en) * | 2018-10-12 | 2019-01-01 | 英诺激光科技股份有限公司 | A kind of device and method using laser peeling optical fibre coat |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant after: Suzhou Delphi Laser Co., Ltd. Applicant after: Jiangyin Deli Laser Equipment Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant before: Suzhou Delphi Laser Co., Ltd. Applicant before: Jiangyin Deli Laser Equipment Co., Ltd. |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111019 |