CN102218233A - Special antifoaming agent for circuit board - Google Patents
Special antifoaming agent for circuit board Download PDFInfo
- Publication number
- CN102218233A CN102218233A CN2011101397471A CN201110139747A CN102218233A CN 102218233 A CN102218233 A CN 102218233A CN 2011101397471 A CN2011101397471 A CN 2011101397471A CN 201110139747 A CN201110139747 A CN 201110139747A CN 102218233 A CN102218233 A CN 102218233A
- Authority
- CN
- China
- Prior art keywords
- defoamer
- weight portions
- parts
- dispersant
- organosilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002518 antifoaming agent Substances 0.000 title abstract description 6
- 229920000570 polyether Polymers 0.000 claims abstract description 12
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 9
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 9
- 235000021355 Stearic acid Nutrition 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 8
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims abstract description 8
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000008117 stearic acid Substances 0.000 claims abstract description 8
- 239000004094 surface-active agent Substances 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims description 25
- 239000013530 defoamer Substances 0.000 claims description 19
- 230000035484 reaction time Effects 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 12
- -1 polyoxyethylene Polymers 0.000 claims description 10
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 230000002209 hydrophobic effect Effects 0.000 claims description 6
- 150000002885 octadecanoids Chemical class 0.000 claims description 6
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims description 6
- 229920006395 saturated elastomer Polymers 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 5
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 5
- 229940008099 dimethicone Drugs 0.000 claims description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 5
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 5
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 4
- 241001272567 Hominoidea Species 0.000 claims description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 claims description 4
- 229920001289 polyvinyl ether Polymers 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 235000006708 antioxidants Nutrition 0.000 description 4
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000957 no side effect Toxicity 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000035479 physiological effects, processes and functions Effects 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Detergent Compositions (AREA)
- Degasification And Air Bubble Elimination (AREA)
Abstract
The invention discloses a special antifoaming agent for circuit board, comprising the following ingredients: 0.04-0.12 weight portions of dispersant, 2-6 weight portions of organosilicon, 0.4-1.2 weight portions of surfactant, 0.05-0.1 weight portions of adhesion agent, 0.05-0.1 weight portions of antioxidant, 0.05-0.1 weight portions of stearic acid, and 94-99 weight portions of polyether. Compared with the prior art, the special antifoaming agent for circuit board disclosed in the invention has same characteristics with polyether antifoaming agent such as high temperature resistance, strong alkalis resistance and the like, and has characteristics of organosilicon such as good defoaming effect, low surface activity, no pollution, low physical inertia and the like, with the advantages of environmental protection, low cost, and good performance, having a wide application prospect.
Description
Technical field
The present invention relates to chemical material field, specifically a kind of special circuit plate defoamer.
Background technology
The research starting of China aspect defoamer compared with the market that has abroad come to the ripening period than later, also has no small gap.At present, the research of domestic defoamer mainly concentrates on based on polysiloxanes, by block copolymerization or graft copolymerization, introduces polyether segment on polysiloxanes, through modification, reduces its dissolubility in oil, its froth breaking is renderd a service be enhanced.Polyether type defoamer is nontoxic, easy to use, dispersed, heat endurance and chemical stability are good; But it has a significant disadvantages to be broken that the bubble rate is low, in case produced a large amount of foams, it can not once put out effectively, could slowly deal with problems but need newly add a certain amount of defoamer.The organosilicon high effective antifoaming agent obtains develop rapidly, and the product that is fit to the new varieties new model of different environments for use constantly produces, and application surface is also constantly in expansion.The organosilicon high effective antifoaming agent has froth breaking usefulness height, anti-oxidant, nontoxic, tasteless, the plurality of advantages that has no side effect, but it is poor to press down bubble power, and in weaving, when dyeing uses, owing to the silicon spot not easy cleaning be restricted.
Summary of the invention
Technical assignment of the present invention provides a kind of special circuit plate defoamer.
Technical assignment of the present invention realizes that in the following manner this defoamer is prepared by the batching of following weight portion proportioning: 0.04 part～0.12 part of dispersant; 2 parts～6 parts of organosilicons; 0.4 part～1.2 parts in surfactant; 0.05 part～0.1 part of tackifier; 0.05 part～0.1 part in antioxidant; 0.05 part～0.1 part of stearic acid; 94 parts～99 parts of polyethers;
Production technology is as follows:
An amount of dispersant, organosilicon are added in the reactor, stir, 100 ℃～150 ℃ of control reaction temperatures, reaction time 2～7h, reaction finishes and is cooled to room temperature, in reactor, add proper amount of surfactant and tackifier again, stir 60 ℃～70 ℃ of control reaction temperatures, reaction time 1～2h, reaction finishes and is cooled to room temperature, in reactor, add an amount of antioxidant, stearic acid and polyethers then, stir, 50 ℃～60 ℃ of control reaction temperatures, reaction time 0.5～1h promptly gets special circuit plate defoamer;
Described dispersant is a hydrophobic silica;
Described organosilicon is dimethicone or methyl phenyl silicone oil;
Described surfactant is aliphatic alcohol polyethenoxy (25) ether (peregal 0-25), APES or polyoxyethylene poly-oxygen propylene aether modified polyorganosiloxane;
Described tackifier are sodium carboxymethylcellulose or polyvinylether;
Described antioxidant is 2,6-di-t-butyl-4-sylvan or four [3-(3,5-di-t-butyl-4 hydroxyphenyl) propionic acid] quaternary amyl alcohol ester;
Described stearic acid is saturated octadecanoid acid;
Described polyethers is the polyoxyethylene polyoxypropylene propylene glycol.
A kind of special circuit plate defoamer of the present invention is compared with prior art, the characteristic such as high temperature resistant, anti-highly basic that not only has the polyethers defoamer, render a service characteristics such as strong, that surface-active is low, pollution-free, the physiology inertia is low but also have the organosilicon froth breaking, be a kind of environment-friendly type, low cost, function admirable has the defoamer of broad prospect of application.
The specific embodiment
Embodiment 1:
0.04kg hydrophobic silica and 2kg dimethicone are added in the reactor, stir, 100 ℃ of control reaction temperatures, reaction time 2h, reaction finishes and is cooled to room temperature, adds 0.4kg aliphatic alcohol polyethenoxy (25) ether (peregal 0-25), 0.05kg sodium carboxymethylcellulose again in reactor, stir, 60 ℃ of control reaction temperatures, reaction time 1h, reaction finishes and is cooled to room temperature, in reactor, add 0.05kg2 then, 6-di-t-butyl-4-sylvan, 0.05kg saturated octadecanoid acid and 94kg polyoxyethylene polyoxypropylene propylene glycol stir, 50 ℃ of control reaction temperatures, reaction time 0.5h promptly gets special circuit plate defoamer.
Embodiment 2:
0.12kg hydrophobic silica and 6kg methyl phenyl silicone oil are added in the reactor, stir, 150 ℃ of control reaction temperatures, reaction time 7h, reaction finishes and is cooled to room temperature, adds 1.2kg APES, 0.1kg polyvinylether again in reactor, stir, 70 ℃ of control reaction temperatures, reaction time 2h, reaction finishes and is cooled to room temperature, [3-(3 to add 0.1kg four then in reactor, 5-di-t-butyl-4 hydroxyphenyl) propionic acid] quaternary amyl alcohol ester, 0.1kg saturated octadecanoid acid and 99kg polyoxyethylene polyoxypropylene propylene glycol stir, 60 ℃ of control reaction temperatures, reaction time 1h promptly gets special circuit plate defoamer.
Embodiment 3:
0.8kg hydrophobic silica and 4kg dimethicone are added in the reactor, stir, 130 ℃ of control reaction temperatures, reaction time 5h, reaction finishes and is cooled to room temperature, adds 0.8kg polyoxyethylene poly-oxygen propylene aether modified polyorganosiloxane, 0.08kg sodium carboxymethylcellulose again in reactor, stir, 65 ℃ of control reaction temperatures, reaction time 1.5h, reaction finishes and is cooled to room temperature, in reactor, add 0.08kg2 then, 6-di-t-butyl-4-sylvan, 0.08kg saturated octadecanoid acid and 97kg polyoxyethylene polyoxypropylene propylene glycol stir, 55 ℃ of control reaction temperatures, reaction time 0.8h promptly gets special circuit plate defoamer.
Claims (2)
1. a special circuit plate defoamer is characterized in that the batching preparation of this defoamer by following weight portion proportioning: 0.04 part～0.12 part of dispersant; 2 parts～6 parts of organosilicons; 0.4 part～1.2 parts in surfactant; 0.05 part～0.1 part of tackifier; 0.05 part～0.1 part in antioxidant; 0.05 part～0.1 part of stearic acid; 94 parts～99 parts of polyethers;
Described dispersant is a hydrophobic silica;
Described organosilicon is dimethicone or methyl phenyl silicone oil;
Described surfactant is aliphatic alcohol polyethenoxy (25) ether, APES or polyoxyethylene poly-oxygen propylene aether modified polyorganosiloxane;
Described tackifier are sodium carboxymethylcellulose or polyvinylether;
Described antioxidant is 2,6-di-t-butyl-4-sylvan or four [3-(3,5-di-t-butyl-4 hydroxyphenyl) propionic acid] quaternary amyl alcohol ester;
Described stearic acid is saturated octadecanoid acid;
Described polyethers is the polyoxyethylene polyoxypropylene propylene glycol.
2. special circuit plate defoamer according to claim 1 is characterized in that production technology is as follows:
An amount of dispersant, organosilicon are added in the reactor, stir, 100 ℃～150 ℃ of control reaction temperatures, reaction time 2～7h, reaction finishes and is cooled to room temperature, in reactor, add proper amount of surfactant and tackifier again, stir 60 ℃～70 ℃ of control reaction temperatures, reaction time 1～2h, reaction finishes and is cooled to room temperature, in reactor, add an amount of antioxidant, stearic acid and polyethers then, stir, 50 ℃～60 ℃ of control reaction temperatures, reaction time 0.5～1h promptly gets special circuit plate defoamer;
Described dispersant is a hydrophobic silica;
Described organosilicon is dimethicone or methyl phenyl silicone oil;
Described surfactant is aliphatic alcohol polyethenoxy (25) ether, APES or polyoxyethylene poly-oxygen propylene aether modified polyorganosiloxane;
Described tackifier are sodium carboxymethylcellulose or polyvinylether;
Described antioxidant is 2,6-di-t-butyl-4-sylvan or four [3-(3,5-di-t-butyl-4 hydroxyphenyl) propionic acid] quaternary amyl alcohol ester;
Described stearic acid is saturated octadecanoid acid;
Described polyethers is the polyoxyethylene polyoxypropylene propylene glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101397471A CN102218233A (en) | 2011-05-27 | 2011-05-27 | Special antifoaming agent for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101397471A CN102218233A (en) | 2011-05-27 | 2011-05-27 | Special antifoaming agent for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102218233A true CN102218233A (en) | 2011-10-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101397471A Pending CN102218233A (en) | 2011-05-27 | 2011-05-27 | Special antifoaming agent for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102218233A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102716599A (en) * | 2012-07-03 | 2012-10-10 | 保利民爆济南科技有限公司 | Production technology of silyl ether defoaming agent for fermentation process |
| CN106345148A (en) * | 2016-10-21 | 2017-01-25 | 中国石油集团川庆钻探工程有限公司长庆固井公司 | Siloxane foam inhibitor as well as preparation method and application thereof |
| CN109200632A (en) * | 2018-09-11 | 2019-01-15 | 蓝凤祥 | Multi-functional nontoxic high temperature silicone modified polyether industrial defoaming agent of one kind and preparation method thereof |
| CN110280051A (en) * | 2019-07-09 | 2019-09-27 | 四川省蜀爱新材料有限公司 | A kind of low silicon defoaming agent |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1088128A (en) * | 1992-12-14 | 1994-06-22 | 旅顺联营化工厂 | Mighty defoamer |
| US5712343A (en) * | 1993-08-27 | 1998-01-27 | Wacker-Chemie Gmbh | Preparation of organopolysiloxane microemulsions |
| CA2589344A1 (en) * | 2006-07-01 | 2008-01-01 | Goldschmidt Gmbh | Silicone stabilizers for flame-retarded rigid polyurethane or polyisocyanurate foams |
| CN101357309A (en) * | 2008-09-26 | 2009-02-04 | 贺明波 | Silicon oil foam killer |
| CN101791495A (en) * | 2010-03-19 | 2010-08-04 | 新时代(济南)民爆科技产业有限公司 | Defoamer suitable for amino acid fermentation production |
| CN101884852A (en) * | 2010-06-30 | 2010-11-17 | 南京四新科技应用研究所有限公司 | Method for improving properties of polyether defoaming agent |
-
2011
- 2011-05-27 CN CN2011101397471A patent/CN102218233A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1088128A (en) * | 1992-12-14 | 1994-06-22 | 旅顺联营化工厂 | Mighty defoamer |
| US5712343A (en) * | 1993-08-27 | 1998-01-27 | Wacker-Chemie Gmbh | Preparation of organopolysiloxane microemulsions |
| CA2589344A1 (en) * | 2006-07-01 | 2008-01-01 | Goldschmidt Gmbh | Silicone stabilizers for flame-retarded rigid polyurethane or polyisocyanurate foams |
| CN101357309A (en) * | 2008-09-26 | 2009-02-04 | 贺明波 | Silicon oil foam killer |
| CN101791495A (en) * | 2010-03-19 | 2010-08-04 | 新时代(济南)民爆科技产业有限公司 | Defoamer suitable for amino acid fermentation production |
| CN101884852A (en) * | 2010-06-30 | 2010-11-17 | 南京四新科技应用研究所有限公司 | Method for improving properties of polyether defoaming agent |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102716599A (en) * | 2012-07-03 | 2012-10-10 | 保利民爆济南科技有限公司 | Production technology of silyl ether defoaming agent for fermentation process |
| CN102716599B (en) * | 2012-07-03 | 2014-01-01 | 保利民爆济南科技有限公司 | Production technology of silyl ether defoaming agent for fermentation process |
| CN106345148A (en) * | 2016-10-21 | 2017-01-25 | 中国石油集团川庆钻探工程有限公司长庆固井公司 | Siloxane foam inhibitor as well as preparation method and application thereof |
| CN109200632A (en) * | 2018-09-11 | 2019-01-15 | 蓝凤祥 | Multi-functional nontoxic high temperature silicone modified polyether industrial defoaming agent of one kind and preparation method thereof |
| CN110280051A (en) * | 2019-07-09 | 2019-09-27 | 四川省蜀爱新材料有限公司 | A kind of low silicon defoaming agent |
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Application publication date: 20111019 |