CN102217193B - Elastic wave filter device and module comprising the elastic wave filter device - Google Patents
Elastic wave filter device and module comprising the elastic wave filter device Download PDFInfo
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- CN102217193B CN102217193B CN200980144079.2A CN200980144079A CN102217193B CN 102217193 B CN102217193 B CN 102217193B CN 200980144079 A CN200980144079 A CN 200980144079A CN 102217193 B CN102217193 B CN 102217193B
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- 239000000758 substrate Substances 0.000 claims abstract description 42
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- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 abstract description 21
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 23
- 230000015572 biosynthetic process Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 9
- 238000009434 installation Methods 0.000 description 9
- 238000010897 surface acoustic wave method Methods 0.000 description 6
- 238000001914 filtration Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6436—Coupled resonator filters having one acoustic track only
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/644—Coupled resonator filters having two acoustic tracks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6489—Compensation of undesirable effects
- H03H9/6493—Side lobe suppression
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
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- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Disclosed is an elastic wave filter device (1) comprising a piezoelectric substrate (10) and elastic wave filters (4, 5) and parallel resonators (3A, 3B) provided on the piezoelectric substrate (10). The elastic wave filter device (1) comprises ground ports (GND1, GND2, GND3). The elastic wave filters (4, 5) comprise input-side resonators (4A, 4C, 4E, 5A, 5C, 5E) and output-side resonators (4B, 4D, 5B, 5D). The input-side resonators (4A, 4C, 4E, 5A, 5C, 5E) are connected between a receiving input port (IN) and a ground port (GND1). The output-side resonators (4B, 4D, 5B, 5D) are connected between receiving output ports (OUT1, OUT2) and a ground port (GND1). The parallel resonators (3A, 3B) are connected parallel to an output line and, at the same time, are connected respectively to the ground ports (GND2, GND3).
Description
Technical field
The present invention relates to one connects the acoustic wave filter device of acoustic wave filter and trap in parallel (trap) notch cuttype and possesses the module of acoustic wave filter device on piezoelectric substrate.
Utilize the vibration on piezoelectric substrate surface elastic surface wave, utilize the vibration of piezoelectric substrate inside bulk acoustic wave (bulk acoustic wave), utilize the acoustic wave filter device of the electricapparatus vibration of the boundary acoustic wave etc. of the vibration of stacked piezoelectric substrate boundary face to be used in the RF filter etc. of pocket telephone.
As an example of acoustic wave filter device, there is such device: multiple port elastic wave resonators are (following, only be called resonator (resonator)) in elastic wave propagation direction, arrange, and make it vertical coupling and become multi-mode filter (multimode filter), and, this multi-mode filter is connected and inserted in parallel trap resonator (trap resonators), become the device (for example,, with reference to patent documentation 1) that notch cuttype connects.
Fig. 1 is the circuit diagram of the configuration example of the existing acoustic wave filter device of explanation.
This acoustic wave filter device possesses the multi-mode filter 111, series connection trap resonator 101,102,107,108 and the trap resonator in parallel 103,104,109,110 that are made up of multiple resonators 105 and multiple resonator 106.
Multiple resonators 105, its IDT electrode is separately connected with input line, and the 2nd IDT electrode is separately connected with earth connection.Multiple resonators 106, its IDT electrode is separately connected with output line, and the 2nd IDT electrode is separately connected with earth connection.Multiple resonators 105,106 are alternately arranged and vertical coupling in elastic wave propagation direction, form multi-mode filter 111.
101,102 series connection of series connection trap resonator are inserted into input line, and 107,108 series connection of series connection trap resonator are inserted into output line.Trap resonator in parallel 103,104 parallel connections are inserted between input line and earth connection, and trap resonator 109,110 parallel connections in parallel are inserted between output line and earth connection.
Such acoustic wave filter device is configured to the chip being wholely set with piezoelectric substrate conventionally.And the chip carrying of this acoustic wave filter device carries out modularization in the module such as ceramic substrate or printed base plate matrix.Now, the grounding connection electrode that multiple ground connection marks in Fig. 1 are represented is set to separately respectively piezoelectric substrate surface can be because of the restriction difficulty of chip size, therefore schematic diagram is as shown in Figure 2 such, and earth connection is concentrated in together, and is jointly connected with single grounding connection electrode.
Patent documentation 1:JP Unexamined Patent 7-131290 communique
But in the situation that acoustic wave filter device is made as to module composition, the wiring on the module matrix till the outside terminal of module plays acoustic wave filter device has spurious impedance.
Therefore, although being arranged at the grounding connection electrode on piezoelectric substrate surface is connected with the external ground terminal of module via spurious impedance, but due to the effect of spurious impedance, the attenuation characteristic of acoustic wave filter or separation (isolation) characteristic has the possibility of deterioration.
Summary of the invention
, the object of the invention is to for this reason, a kind of acoustic wave filter device is provided and possesses its module, it can suppress the attenuation characteristic of acoustic wave filter device and filter, the deterioration of stalling characteristic due to the effect of the spurious impedance of connecting wiring.
The present invention is a kind of acoustic wave filter device, is provided with acoustic wave filter and trap in parallel on piezoelectric substrate, and acoustic wave filter device of the present invention possesses the first grounding connection electrode and the second grounding connection electrode.Acoustic wave filter is coupled input side resonator and outlet side resonator.Input side resonator is connected between input line and earth connection.Outlet side resonator is connected between output line and earth connection.Trap in parallel is connected between earth connection and input line or earth connection and output line.The first grounding connection electrode is arranged at piezoelectric substrate surface, and the earth connection of input side resonator is connected with the earth connection of outlet side resonator.The second grounding connection electrode and the first grounding connection electrode separation and be arranged at piezoelectric substrate surface, connect the earth connection of trap in parallel.
In this formation, multiple resonators of acoustic wave filter are connected with the first grounding connection electrode on piezoelectric substrate surface, trap in parallel be connected with the second grounding connection electrode of the first grounding connection electrode separation.Therefore, connecting wiring for the spurious impedance of the first grounding connection electrode by acting in conjunction in multiple resonators of acoustic wave filter.In addition, connecting wiring is independent with the spurious impedance that acts on acoustic wave filter for the spurious impedance of the second grounding connection electrode, only trap in parallel is worked.
Preferably make input side resonator and outlet side resonator possess the separately IDT electrode being connected with input-output line and the 2nd IDT electrode being connected with earth connection.In this case, input side resonator and outlet side resonator can alternately be arranged in elastic wave propagation direction, the one IDT electrode can be arranged with the 2nd IDT electrode in the direction vertical with elastic wave propagation direction, the one IDT electrode and the 2nd IDT electrode, the configuration sequence in input side resonator can be contrary with the configuration sequence in outlet side resonator.
According to such formation, dispose an IDT electrode of input side resonator and the 2nd IDT electrode of outlet side resonator in the both sides of acoustic wave filter.Therefore, the 2nd IDT electrode of the 2nd IDT electrode of input side resonator and outlet side resonator is connected from different grounding connection electrodes, circuit formation easily becomes simple.But, in this case, if implement modularization,, because of the impact of spurious impedance, can produce the deterioration of attenuation characteristic or the stalling characteristic of filter, therefore, even in the situation that being this formation, also preferably the 2nd IDT electrode is separately connected with common grounding connection electrode.
Module of the present invention, possesses: above-mentioned acoustic wave filter device; With the module matrix that has carried acoustic wave filter device, described module matrix can possess earth terminal on its installed surface, and this earth terminal connects the first grounding connection electrode and the second grounding connection electrode.
According to this invention, the spurious impedance acting in conjunction of the connecting wiring of the first grounding connection electrode based on to acoustic wave filter device, in multiple resonators of acoustic wave filter, is worked independently with the spurious impedance that acts on trap in parallel.Therefore, can the attenuation characteristic of rejects trap or the deterioration of stalling characteristic.
Brief description of the drawings
Fig. 1 is the figure of the circuit example of the existing acoustic wave filter device of explanation.
Fig. 2 is the figure of the circuit example of the existing acoustic wave filter device of explanation.
Fig. 3 be the explanation configuration example that possesses the module of the acoustic wave filter device of the 1st execution mode of the present invention want portion's sectional view and circuit diagram.
Fig. 4 is the upward view of the electrode pattern example of the circuit forming surface of the acoustic wave filter device shown in key diagram 3.
Fig. 5 is the exploded view of the electrode pattern example of the electrode layer of the module shown in key diagram 3.
Fig. 6 is the figure that the electrode pattern example of the circuit forming surface of the acoustic wave filter device of using in emulation is described.
Fig. 7 is the figure of the filtering characteristic of explanation emulation.
Fig. 8 is the circuit diagram of the configuration example of the acoustic wave filter device of the 2nd execution mode.
Fig. 9 is the circuit diagram of the configuration example of the acoustic wave filter device of the 3rd execution mode.
(symbol description)
1: acoustic wave filter device
TX: transtation mission circuit
RX: receiving circuit
2A, 2B: series resonator
3A: parallel resonator
3A, 3B: parallel resonator
4,5: acoustic wave filter
4A, 4C, 4E, 5A, 5C, 5E: input side resonator
4B, 4D, 5B, 5D: outlet side resonator
10: piezoelectric substrate
IN: receive input port
GND1, GND2, GND3: grounding ports
OUT1, OUT2: receive output port
100: module
20: module matrix
Ant: antenna terminal
Gnd1, Gnd2: earth terminal
Rx1, Rx2: receive lead-out terminal
Tx: send input terminal
Line1, line2, line3, line7: ground connection wiring
Line2, line3: ground connection wiring
Line4, line5: receive output wiring
Line6: receive input wiring
Embodiment
The 1st execution mode
Fig. 3 is the figure that the summary of the explanation module that possesses the acoustic wave filter device of the 1st execution mode forms, with figure (A) be equal modules want portion's sectional view, be the circuit diagram of equal modules with scheming (B).
The module 100 of present embodiment is the forming of chip that carries acoustic wave filter device 1 on the module matrix 20 being made up of the multilayer board of 5 layers of structure.Module matrix 20 with the installed surface of chip carrying face opposition side on possess installation terminal described later, and being formed with internal wiring, this internal wiring is connected with terminal each installation with each connectivity port (connecting electrode) of acoustic wave filter device 1.Acoustic wave filter device 1 is the chip that is provided with the transtation mission circuit TX of duplexer and SAW (surface acoustic wave) filter of receiving circuit RX in the circuit forming surface of piezoelectric substrate 10.This chip is mounted on module matrix 20 according to circuit forming surface and the opposed mode of module matrix 20, and each connectivity port is connected by boss (bump) with the electrode of module matrix 20.
Transtation mission circuit TX is uneven input-uneven output type, and the connectivity port of the transmission input of transtation mission circuit TX sends input terminal Tx via the internal wiring of module matrix 20 and the installation of module matrix 20 with terminal and be connected.The connectivity port of the transmission output of transtation mission circuit TX is that antenna terminal Ant is connected via the internal wiring of module matrix 20 and the installation of module matrix 20 with terminal.In addition the coil that, this antenna terminal Ant arranges via the internal wiring as module matrix 20 is that earth terminal Gnd2 is connected with the installation terminal of module matrix 20.
Receiving circuit RX is uneven input-balance output type (balun type: cling to homotopy type) receiving circuit, possesses acoustic wave filter 4,5, series resonator 2A, 2B and parallel resonator 3A, 3B as circuit element portion.In addition, possess reception input port IN, reception output port OUT1, OUT2 and grounding ports GND1, GND2, the GND3 as connectivity port.
Acoustic wave filter 4 is vertical coupled resonance type SAW filters that 5 resonator 4A～4E of alternative arrangement make its vertical coupling in elastic wave propagation direction, and is connected in reception input port IN and receives between output port OUT1.Acoustic wave filter 5 is vertical coupled resonance type SAW filters that 5 resonator 5A～5E of alternative arrangement make its vertical coupling in elastic wave propagation direction, and is connected in reception input port IN and receives between output port OUT2.By making the dephased signal of acoustic wave filter 4, the 5 mutual tool of output, receiving circuit RX is balanced output.
Resonator 4A, 4C, 4E, 5A, 5C, 5E are respectively input side resonators, possess the IDT electrode (not shown) being connected with input line and the 2nd IDT electrode (not shown) being connected with earth connection.Resonator 4B, 4D, 5B, 5D are respectively outlet side resonators, possess the IDT electrode (not shown) being connected with output line and the 2nd IDT electrode (not shown) being connected with earth connection.The earth connection being connected respectively with resonator 4A～4E, 5A～5E be jointly connected as the grounding ports GND1 of the first grounding connection electrode of the present invention.The output line being connected with resonator 4B, 4D is connected with common reception output port OUT1.The output line being connected with resonator 5B, 5D is connected with common reception output port OUT2.
Series resonator 2A series connection is inserted into the input line of acoustic wave filter 4, and series resonator 2B series connection is inserted into the input line of acoustic wave filter 5, and works as series connection trap separately.These input lines are connected with common reception input port IN.
Parallel resonator 3A is inserted into from acoustic wave filter 4 output lines and divides inconsistent parallel wire, and works as trap in parallel.This parallel connection trap be connected as the grounding ports GND2 of the second grounding connection electrode of the present invention.Parallel resonator 3B is inserted into from the output line of acoustic wave filter 5 and divides inconsistent parallel wire, and works as trap in parallel.This parallel wire be connected as the grounding ports GND3 of the second grounding connection electrode of the present invention.
Receiving input port IN is connected with the antenna terminal Ant of terminal with the installation as module matrix 20 via the reception input wiring line6 of the inside of module matrix 20.Receive output port OUT1, OUT2 reception output wiring line4, the line5 via the inside of module matrix 20, receive lead-out terminal Rx1, Rx2 with the installation of module matrix 20 with terminal and be connected.Grounding ports GND1, GND2, GND3 are connected with the ground connection wiring line7 of module matrix 20 inside via ground connection wiring line1, line2, the line3 of the inside of module matrix 20.Then, be connected with the earth terminal Gmd1 of terminal with the installation as module matrix 20 via this ground connection wiring line7.
In the above acoustic wave filter device 1 forming, the earth connection being connected with acoustic wave filter 4,5 is all jointly connected with grounding ports GND1 on piezoelectric substrate 10.In addition, the parallel wire being connected with parallel resonator 3A is connected on piezoelectric substrate 10 with grounding ports GND2, and the parallel wire being connected with parallel resonator 3B is connected on piezoelectric substrate 10 with grounding ports GND3.
Therefore, the spurious impedance acting in conjunction of the ground connection of module matrix 20 wiring line1 is in whole resonator of acoustic wave filter 4,5.In addition, the spurious impedance of the wiring of the ground connection of module matrix 20 line2, line3 is independent with the spurious impedance that acts on acoustic wave filter 4,5.Therefore, can the attenuation characteristic of rejects trap or the deterioration of stalling characteristic.
Next, the concrete circuit diagram case of above-mentioned acoustic wave filter device 1 and module 100 is described.
Fig. 4 is the upward view that represents the circuit forming surface of acoustic wave filter device 1.Fig. 5 is the exploded view that the electrode layer to arranging on module matrix 20 is looked up.
Acoustic wave filter device 1 is provided with the circuit pattern that becomes receiving circuit RX and transtation mission circuit TX in the circuit forming surface of piezoelectric substrate 10.And, in the circuit pattern that becomes receiving circuit RX, be provided with the multiple IDT electrodes that become elastic wave filtering 4,5, series resonator 2A, 2B and parallel resonator 3A, 3B.
In addition, acoustic wave filter 4,5 possesses respectively 3 input side resonators and 2 outlet side resonators, and by each resonator alternative arrangement in the elastic wave propagation direction of transverse direction in the drawings.In addition, the standby IDT electrode being connected with input-output line of each syntonizer and the 2nd IDT electrode being connected with earth connection, an IDT electrode is arranged on longitudinal direction in the figure vertical with elastic wave propagation direction with the 2nd IDT electrode.Input side resonator, according at substrate center side configuration the one IDT electrode, is configured in the order of substrate upper end side (or substrate lower end side) configuration the 2nd IDT electrode, and in outlet side resonator, configuration sequence is contrary.
In addition, in this circuit pattern, possess become receive input port IN electrode part, become receive output port OUT1 electrode part, become receive output port OUT2 electrode part, become the electrode part of grounding ports GND1 and become grounding ports GND2 electrode part, become the electrode part of grounding ports GND3.The electrode corresponding with these each connectivity ports, is connected with the electrode of module matrix 20 via boss electrode.
Module matrix 20 is from chip carrying face to installed surface, possesses 6 electrode layers (A)～(F).
Electrode layer (A) is arranged on the chip carrying face of module matrix 20, possesses multiple electrodes of each connectivity port of having carried acoustic wave filter device 1.Particularly, possess and carry the reception input port IN of receiving circuit RX and form the electrode that receives input wiring line6, carry and receive output port OUT1 and form the electrode that receives output wiring line4, carry and receive output port OUT2 and form the electrode that receives output wiring line5, carry grounding ports GND1 and form the electrode of ground connection wiring line1, carry grounding ports GND2 and form the electrode of ground connection wiring line2, carry grounding ports GND3 and form the electrode of ground connection wiring line3, and be connected with multiple electrodes of each connectivity port of transtation mission circuit TX.
Electrode layer (B) is formed between the ground floor substrate and second layer substrate of multilayer board of module matrix 20, possesses the multiple electrodes that are connected with each electrode of electrode layer (A) with through hole.Particularly, possess the reception input wiring line6 that forms receiving circuit RX electrode, form receive output wiring line4 electrode, form receive output wiring line5 electrode, form ground connection wiring line1 electrode, form ground connection wiring line2 electrode, form the electrode of ground connection wiring line3 and become multiple electrodes of the internal wiring of transtation mission circuit TX.
Electrode layer (C) is formed between the second layer substrate and the 3rd laminar substrate of multilayer board of module matrix 20, possesses the multiple electrodes that are connected with each electrode of electrode layer (B) with through hole.Particularly, possess the reception input wiring line6 that forms receiving circuit RX electrode, form receive output wiring line4 electrode, form the inside grounding connection electrode that receives the electrode of output wiring line5, ground connection wiring line1 is connected with ground connection wiring line3 with ground connection wiring line2 and the multiple electrodes that become the internal wiring of transtation mission circuit TX.
Electrode layer (D) is formed between the 3rd laminar substrate and the 4th laminar substrate of multilayer board of module matrix 20, possesses the multiple electrodes that are connected with each electrode of electrode layer (C) with through hole.Particularly, possess the reception input wiring line6 that forms receiving circuit RX electrode, form receive output wiring line4 electrode, form receive output wiring line5 electrode, be connected with the inside grounding connection electrode of electrode layer (C) and form ground connection connect up line7 inside grounding connection electrode and become multiple electrodes of the internal wiring of transtation mission circuit TX.
Electrode layer (E) is formed between the 4th laminar substrate and layer 5 substrate of multilayer board of module matrix 20, possesses the multiple electrodes that are connected with each electrode of electrode layer (D) with through hole.Particularly, possess the reception input wiring line6 that forms receiving circuit RX electrode, form receive output wiring line4 electrode, form receive output wiring line5 electrode, form multiple electrodes of ground connection wiring line7 and become multiple electrodes of the internal wiring of transtation mission circuit TX.
Electrode layer (F) is formed on the installed surface of module matrix 20, possesses multiple installation terminals.Particularly, possess the reception input wiring line6 that is connected with receiving circuit RX antenna terminal Ant, be connected with receive output wiring line4 reception lead-out terminal Rx1, be connected with receive output wiring line5 reception lead-out terminal Rx2, be connected with the ground connection wiring earth terminal Gnd1 of line7 and the transmission input terminal Tx of transtation mission circuit TX and earth terminal Gnd2.In addition, earth terminal Gnd2 is the reception input wiring line6 difference from being connected with antenna terminal Ant at electrode layer (C), via the internal wiring of coiled type that is arranged at electrode layer (C)～(E) by antenna terminal Ant ground connection.
In the case of being the example of above circuit pattern, with respect to the grounding ports GND1 being connected with the acoustic wave filter 4,5 of acoustic wave filter device 1, being connected the ground connection wiring line1 of the boss electrode, electrode layer (A) of use～(B) and the spurious impedance of the through hole based on from ground floor substrate to the three laminar substrates will work with module matrix 20 sides.In addition, with respect to the grounding ports GND2 being connected with the parallel resonator 3A of acoustic wave filter device 1, be connected the ground connection wiring line2 of the boss electrode, electrode layer (A) of use～(B) and the spurious impedance of the through hole based on from ground floor substrate to the three laminar substrates with module matrix 20 sides and work.In addition, with respect to the grounding ports GND3 being connected with the parallel resonator 3B of acoustic wave filter device 1, be connected the ground connection wiring line3 of the boss electrode, electrode layer (A) of use～(B) and the spurious impedance of the through hole based on from ground floor substrate to the three laminar substrates with module matrix 20 sides and work.
In the example of this circuit pattern, be provided with the ground connection inside grounding connection electrode that line1, line2, line3 be connected with electrode layer (C), (D) that connects up, and be connected with multiple ground connection wiring line7 between these inner grounding connection electrodes and the earth terminal Gnd1 of electrode layer (F).Like this, based on till electrode layer (C)～ground connection wiring line7 and the spurious impedance from the 4th laminar substrate to the through hole of layer 5 substrate (F), grounding ports GND1 to acoustic wave filter device 1, GND2, GND3 work hardly, thereby can the attenuation characteristic of rejects trap or the deterioration of stalling characteristic.
In addition, in the example of this circuit pattern, make grounding ports GND1, GND2, the GND3 oblique configuration not adjacent to each otherly of acoustic wave filter device 1.Like this, further improve the stalling characteristic of filter.
The filtering characteristic of the circuit pattern that next, relatively the circuit pattern based on emulation, above-mentioned and comparative example form.
Fig. 6 (A) is the figure that represents the receiving circuit of the circuit diagram case relatively forming, and Fig. 6 (B) is the figure that represents the receiving circuit of the circuit diagram case of this formation.
In the circuit pattern forming at the comparative example shown in Fig. 6 (A), the formation that the 2nd IDT electrode (substrate outside) of the input side resonator of acoustic wave filter 4,5 is not connected with the electrode part that becomes grounding ports GND2, GND3 with grounding ports GND1 is different from the circuit diagram case of this formation shown in Fig. 6 (B).
Fig. 7 is the figure that the filtering characteristic of the filtering characteristic of this formation and comparative example formation is compared.
In this formation shown in this figure, the nearly all region between downside frequency band and the upside frequency band of passband, magnification ratio can be suppressed to approximately-below 40dB, thus can guarantee large attenuation.On the other hand, in relatively forming, although the frequency of passband or the shape of characteristic waveforms and this formation are roughly the same, be difficult to guarantee on the whole attenuation, nearly all region between downside frequency band and the upside frequency band of passband, only magnification ratio can be suppressed to approximately-below 25dB.
Above, as described, in the module 100 of acoustic wave filter device 1 that possesses present embodiment, via the grounding ports GND1 of acoustic wave filter device 1, make the spurious impedance acting in conjunction of the connecting wiring based on module side in multiple resonators of elasticity filter 4,5.In addition, make to work independently with the spurious impedance of parallel resonator 3A, 3B effect.Like this, can the attenuation characteristic of rejects trap or the deterioration of stalling characteristic.
In addition, in the present embodiment, although possess acoustic wave filter 4,5, and earth connection is separately connected with common grounding ports GND1, if but earth connection is connected with common grounding ports with outlet side resonator with the input side resonator of acoustic wave filter separately, can implement the present invention, can be configured to: acoustic wave filter 4,5 is connected with other grounding ports respectively.
In addition, at this, as acoustic wave filter 4,5, series resonator 2A, 2B and parallel resonator 3A, 3B, show with the surface elasticity wave device example of each that forms them, but in addition, even if border elastic wave equipment, bulk acoustic wave device, also can preferably implement the present invention.
In addition, at this, as acoustic wave filter 4,5, show the formation of vertical coupled resonance type equipment, but in addition, as long as possessing the coupled mode of the IDT electrode being connected with earth connection, no matter be the equipment of which kind of coupled mode, can both preferably implement the present invention.
Next, the acoustic wave filter device of the 2nd execution mode of the present invention is described.
The 2nd execution mode
Acoustic wave filter device 11 is chips of the vertical coupled mode SAW filter of uneven input-balance output type, possesses acoustic wave filter 14 and trap in parallel 13 as circuit element portion.In addition, possess uneven input port IN, balance output end mouth OUT and grounding ports GND1, the GND2 as connectivity port.
Acoustic wave filter 14 is connected between uneven input port IN and balance output end mouth OUT, possesses 1 input side resonator 14A, 2 outlet side resonator 14B and 2 reflector 14C.Input side resonator 14A, a side of its IDT electrode be connected from the input line of uneven input port IN, the opposing party of IDT electrode be connected from the earth connection of grounding ports GND1.Outlet side resonator 14B is disposed at the both sides of input side resonator 14A, a side of IDT electrode be connected from the output line of balance output end mouth OUT, the opposing party of IDT electrode be connected from the earth connection of grounding ports GND1.Dispose reflector 14C in the both sides of resonator 14A, 14B.
Trap 13 in parallel is connected between uneven input port IN and grounding ports GND2, possesses resonator 13A and reflector 13B.Resonator 13A, a side of its IDT electrode be connected from the input line of uneven input port IN, the opposing party of IDT electrode be connected from the earth connection of grounding ports GND2.
In this formation, the whole earth connection being connected with acoustic wave filter 14, and trap in parallel 13 differences, be connected with single grounding ports GND1.Therefore the spurious impedance that, acts on grounding ports GND1 by acting in conjunction in whole resonator of acoustic wave filter 14.In addition, act on the spurious impedance and the spurious impedance independence that acts on acoustic wave filter 14 of grounding ports GND2.Therefore, can the attenuation characteristic of rejects trap or the deterioration of stalling characteristic.
Next, the acoustic wave filter device of the 3rd execution mode of the present invention is described.
Acoustic wave filter device 21 is chips of the vertical coupled mode SAW filter of uneven input-uneven output type, possesses acoustic wave filter 24 and trap in parallel 23 as circuit element portion.In addition, possess as the uneven input port IN of connectivity port, uneven output port OUT and grounding ports GND1, GND2.
Acoustic wave filter 24 is connected between uneven input terminal IN and uneven lead-out terminal OUT, possesses 2 input side resonator 24B, 1 outlet side resonator 24A and 2 reflector 24C.Input side resonator 24B is disposed at the both sides of outlet side resonator 24A, a side of IDT electrode be connected from the input line of uneven input port IN, the opposing party of IDT electrode be connected from the earth connection of grounding ports GND1.Outlet side resonator 24A, a side of its IDT electrode be connected from the output line of uneven output port OUT, the opposing party of IDT electrode be connected from the earth connection of grounding ports GND1.Dispose reflector 24C in the both sides of resonator 24A, 24B.
Trap in parallel is connected between uneven input terminal IN and grounding ports GND2, possesses resonator 23A and reflector 23B.Resonator 23A, a side of its IDT electrode be connected from the input line of uneven input port IN, the opposing party of IDT electrode be connected from the earth connection of grounding ports GND2.
In this formation, the whole earth connection connecting from acoustic wave filter 24 is different with trap in parallel 23, is connected with single grounding ports GND1.Therefore the spurious impedance that, acts on grounding ports GND1 by acting in conjunction in whole resonator of acoustic wave filter 24.In addition, act on the spurious impedance and the spurious impedance independence that acts on acoustic wave filter 24 of grounding ports GND2.Therefore, can the attenuation characteristic of rejects trap or the deterioration of stalling characteristic.
Although can implement the present invention according to above each execution mode, but scope of the present invention is not to be represented by above-mentioned execution mode, but represented to there is the content of equivalents and all changes within the scope of it all within the scope of the present invention with claims by claims.
Claims (3)
1. an acoustic wave filter device, on piezoelectric substrate, be provided with acoustic wave filter and the trap in parallel with at least one pair of IDT electrode, described acoustic wave filter make to be connected in the input side resonator between input line and earth connection and be connected in output line and earth connection between outlet side resonator be coupled, described trap in parallel is connected between earth connection and described input line or earth connection and described output line, one side of at least one pair of IDT electrode of described trap in parallel is connected in input line or output line, the opposing party is connected in earth connection
Described acoustic wave filter device, possesses:
The first grounding connection electrode, it is arranged at described piezoelectric substrate surface, and the earth connection of described input side resonator is connected with the earth connection of described outlet side resonator; With
The second grounding connection electrode, itself and described the first grounding connection electrode separation and be arranged at described piezoelectric substrate surface, connect the earth connection of described trap in parallel.
2. acoustic wave filter device according to claim 1, is characterized in that,
Described input side resonator and described outlet side resonator are alternately arranged in elastic wave propagation direction, the opposite direction of the direction of the link position to earth connection of described input side resonator and the link position to earth connection of described outlet side resonator.
3. a filter module, possesses:
Acoustic wave filter device described in claim 1 or 2; With
Carry the module matrix of described acoustic wave filter device,
Described module matrix possesses earth terminal on its installed surface, and this earth terminal connects described the first grounding connection electrode and described the second grounding connection electrode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-283104 | 2008-11-04 | ||
| JP2008283104 | 2008-11-04 | ||
| PCT/JP2009/065933 WO2010052969A1 (en) | 2008-11-04 | 2009-09-11 | Elastic wave filter device and module comprising the elastic wave filter device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102217193A CN102217193A (en) | 2011-10-12 |
| CN102217193B true CN102217193B (en) | 2014-11-05 |
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| CN200980144079.2A Active CN102217193B (en) | 2008-11-04 | 2009-09-11 | Elastic wave filter device and module comprising the elastic wave filter device |
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| US (1) | US8319585B2 (en) |
| EP (1) | EP2346166B1 (en) |
| JP (1) | JP5056952B2 (en) |
| KR (1) | KR101232242B1 (en) |
| CN (1) | CN102217193B (en) |
| WO (1) | WO2010052969A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2010052969A1 (en) | 2010-05-14 |
| EP2346166A1 (en) | 2011-07-20 |
| EP2346166B1 (en) | 2017-01-11 |
| JPWO2010052969A1 (en) | 2012-04-05 |
| KR20110076968A (en) | 2011-07-06 |
| KR101232242B1 (en) | 2013-02-12 |
| CN102217193A (en) | 2011-10-12 |
| JP5056952B2 (en) | 2012-10-24 |
| US8319585B2 (en) | 2012-11-27 |
| EP2346166A4 (en) | 2015-04-01 |
| US20110193654A1 (en) | 2011-08-11 |
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