CN102214554B - Brushing device used for wafer - Google Patents

Abstract

The invention discloses a scrubbing device for wafers. The scrubbing device for wafers comprises: a frame; a support, the support is arranged on the frame to support the wafer rotatably on the support and the first and second brush assemblies, the first and second brush assemblies are installed on the frame oppositely and spaced apart to be used for brushing the two side surfaces of the wafer respectively, wherein the first brush assembly and the second brush assembly each include: an active rotating disc, the active rotating disc is rotatably installed on the frame; a brush, the brush is rotatably installed on the active rotating disc and the rotation axis of the active rotating disc is parallel to the brush The axis of rotation; and the driving assembly, the driving assembly is respectively connected with the active rotating disc and the brush to respectively drive the active rotating disc and the brush to rotate around their respective rotating axes. The brushing device for wafers according to the embodiments of the present invention can keep the surface of the brushes wet, thereby improving the cleaning effect of the wafers.

Description

Scrubbing unit for wafers

technical field

The invention relates to the field of semiconductor manufacturing, in particular to a cleaning device for wafers.

Background technique

The chemical mechanical polishing process of wafers (hereinafter referred to as CMP process) is recognized as an effective technology for achieving global planarization, and is widely used in the field of chip manufacturing. However, after the wafer CMP process, surface dirt such as organic compounds, particles, and metal impurities remain on the wafer surface, and surface dirt will affect the next process of the wafer, which will seriously damage the performance and reliability of the chip. For this reason, it is necessary to scrub the wafer after the CMP process to remove its surface dirt.

In the existing scrubbing device for wafers, the rotating shaft directly drives the brush to rotate and squeeze the wafer for scrubbing, and the brush is disengaged when the manipulator grasps and places the wafer. When the existing scrubbing device for wafers is shut down, the wetting condition of the brush surface cannot be guaranteed, so if it is directly restarted, the wafer cleaning effect will be affected. In order to ensure the wetting condition of the brush surface when restarting, if the brush is replaced, the cost will be greatly increased; and if the liquid is directly injected into the sealing cavity and the brush is soaked, the dynamic seal of the brush spindle may introduce two Secondary pollution; if the brush is taken out for infiltration and then installed, it will waste manpower and equipment space and may introduce secondary pollution.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art.

Therefore, an object of the present invention is to provide a scrubbing device for wafers that can keep the brush surface wet.

In order to achieve the above object, according to an embodiment of the present invention, a scrubbing device for wafers is proposed, and the scrubbing device for wafers includes: a frame; a support, and the support is arranged on the frame for rotatably supporting the wafer on the support; and first and second brush assemblies, the first and second brush assemblies are mounted on the machine oppositely and spaced apart from each other The racks are used to brush the two side surfaces of the wafer respectively, wherein the first brush assembly and the second brush assembly each include: an active rotating disk, which is rotatably installed on the machine On the frame; the brush, the brush is rotatably installed on the active rotating disk and the axis of rotation of the active rotating disk is parallel to the axis of rotation of the brush, so as to be driven by the active rotating disk making the brushes revolve around the axis of rotation of the active rotating disk; and a driving assembly, the driving assembly is respectively connected with the driving rotating disk and the brush to drive the driving rotating disk and the brushes respectively. The brushes rotate about respective axes of rotation.

According to the brushing device for wafers according to the embodiment of the present invention, the brush is driven to revolve around the rotation axis of the active rotating disk by setting the active rotating disk, since the rotating axis of the active rotating disk is parallel to The axis of rotation of the brush (that is, the axis of rotation of the active rotating disk does not coincide with the axis of rotation of the brush), so the dynamic seal of the active rotating disk is not in contact with the liquid. At least most of the brushes are submerged in the liquid, and the entire surface of the brushes can be wetted by the rotation of the brushes, so that the cleaning effect of the wafer can be improved. Moreover, the brush can realize self-cleaning through rotation, thereby prolonging the service life of the brush. In addition, the amount of extrusion between the brush and the wafer can be adjusted by driving the brush to revolve around the rotation axis of the active rotating disc, thereby further improving the cleaning effect of the wafer.

In addition, the scrubbing device for wafers according to the embodiments of the present invention may have the following additional technical features:

According to an embodiment of the present invention, the drive assembly includes: a self-rotation shaft and a revolution shaft, the revolution shaft is rotatably mounted on the frame and connected with the driving rotating disk to drive the driving rotating disk to rotate , wherein the revolution shaft is sleeved on the rotation shaft, the rotation axis of the revolution shaft coincides with the rotation axis of the rotation shaft; the driving motor unit is connected to the rotation shaft and the public rotation shaft respectively The rotating shaft is connected to drive the rotation shaft and the revolution shaft to rotate around their respective rotation axes; and the transmission member is connected to the rotation shaft and the brush respectively so that the rotation shaft passes through the The transmission member drives the brush to rotate.

According to an embodiment of the present invention, a housing chamber is defined inside the active rotating disk, the first end of the rotation shaft protrudes into the housing chamber and is rotatably mounted on the inner wall of the driving rotating disk, so The first end of the brush protrudes into the housing cavity and is rotatably mounted on the active rotating disk, wherein the transmission member is arranged in the housing cavity and is connected to the first end of the rotation shaft respectively. It is connected with the first end of the brush. The structure of the first brush assembly and the second brush assembly can be made more efficient by defining the housing chamber in the active rotating disk and setting the transmission member in the housing chamber. compact.

According to an embodiment of the present invention, the transmission member includes a meshing first gear and a second gear, wherein the first gear is sleeved on the first end of the rotation shaft, and the second gear is sleeved on the on the first end of the brush.

According to an embodiment of the present invention, the transmission member includes a first magnetic wheel and a second magnetic wheel spaced apart from each other, wherein the first magnetic wheel is sleeved on the first end of the rotation shaft, and the first magnetic wheel The two magnetic wheels are set on the first end of the brush.

According to an embodiment of the present invention, each of the first brush assembly and the second brush assembly further includes: a driven rotating disk, the driven rotating disk is rotatably mounted on the frame and the The rotation axis of the driven rotating disk coincides with the rotating axis of the driving rotating disk, wherein the first end of the brush is rotatably mounted on the driving rotating disk and the second end is rotatably mounted on the driving rotating disk. On the driven rotating disk, the driving rotating disk drives the driven rotating disk to rotate through the brush. In this way, the brush can be rotated more stably (including revolution and rotation).

According to an embodiment of the present invention, each of the first brush assembly and the second brush assembly further includes: a connecting rod, the first end of which is connected to the active rotating disk and the second end is connected to The driven rotating disk is connected, wherein the rotating axis of the connecting rod coincides with the rotating axis of the driving rotating disk. In this way, the driving rotating disk and the driven rotating disk can stop rotating at the same time, that is, the driving rotating disk and the driven rotating disk can be synchronized.

According to an embodiment of the present invention, the rotation axis of the active rotating disk of the first brush assembly and the rotation axis of the active rotating disk of the second brush assembly form an angle α, where 0°≤α< 4 degrees.

According to an embodiment of the present invention, the distance between the rotation axis of the active rotating disk and the rotation axis of the brush in the first brush assembly and the second brush assembly is greater than that of the brush The radius of the brush. In this way, the whole brush can be submerged in the liquid when the dynamic seal of the active rotating disk is not in contact with the liquid, even when the scrubbing device for wafers is in a shutdown state, the The entire surface of the brushes is wetted, which further improves the cleaning effect of the wafer.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

1 is a schematic structural view of a scrubbing device for a wafer according to an embodiment of the present invention;

2 is a schematic diagram of scrubbing the surface of a wafer using a scrubbing device for a wafer according to an embodiment of the present invention; and

3 is a schematic diagram of a scrubbing device for wafers in different working states according to an embodiment of the present invention, wherein A indicates that the scrubbing device is in a shutdown state and the brush is immersed in the liquid, and B indicates that the scrubbing device is in after scrubbing C indicates that the scrubbing device is in the scrubbing state and the brush squeezes the wafer from both sides of the wafer.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and It is not to indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, or operate in a particular orientation, and thus should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be mechanical connection or electrical connection, or two The internal communication of each element may be directly connected or indirectly connected through an intermediary. Those skilled in the art can understand the specific meanings of the above terms according to specific situations.

A scrubbing device for a wafer according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 2 . As shown in FIGS. 1 and 2 , the scrubbing device for wafers according to the embodiment of the present invention includes a frame (not shown in the figure), a support, a first brush assembly 20 and a second brush assembly 30 .

Specifically, the supporting member is disposed on the rack for rotatably supporting the wafer 40 on the supporting member. The first brush assembly 20 and the second brush assembly 30 are oppositely and spaced apart from each other and installed on the frame for brushing the two side surfaces of the wafer 40 respectively.

The first brush assembly 20 and the second brush assembly 30 each include an actively rotating disc 100, a brush 200 and a drive assembly. The active rotating disk 100 is rotatably installed on the frame. The brush 200 is rotatably installed on the active rotating disc 100, and the axis of rotation of the active rotating disc 100 is parallel to the axis of rotation of the brush 200, so that the brush 200 can rotate around the direction of the active rotating disc 100 under the drive of the active rotating disc 100. The axis of rotation performs a revolution. The driving assembly is respectively connected with the active rotating disc 100 and the brush 200 to drive the active rotating disc 100 and the brush 200 to rotate around their respective rotation axes.

According to the embodiment of the present invention, the scrubbing device for wafers drives the brush 200 to revolve around the axis of rotation of the active rotating disk 100 by setting the active rotating disk 100, since the rotating axis of the active rotating disk 100 is parallel to the rotation of the brush 200 axis (that is, the axis of rotation of the active rotating disk 100 does not coincide with the axis of rotation of the brush 200), so that at least most of the brush 200 can be submerged in the liquid without the dynamic seal of the active rotating disk 100 being in contact with the liquid , and the entire surface of the brush 200 can be wetted by the rotation of the brush 200 , thereby improving the cleaning effect of the wafer 40 . Moreover, the brush 200 can realize self-cleaning through rotation, so that the service life of the brush 200 can be extended. In addition, the amount of extrusion between the brush 200 and the wafer 40 can be adjusted by driving the brush 200 to revolve around the rotation axis of the active rotating disc 100 , thereby further improving the cleaning effect of the wafer 40 .

The revolution refers to the rotation of the brush 200 around the rotation axis of the active rotating disk 100 , and the autorotation refers to the rotation of the brush 200 around its own rotation axis.

In some embodiments of the present invention, as shown in FIG. 2 , the driving assembly may include an autorotation shaft 310 , a revolution shaft 320 , a driving motor unit (not shown in the figure) and a transmission member. The revolution shaft 320 can be rotatably installed on the frame, and the revolution shaft 320 can be connected with the driving rotating disk 100 to drive the driving rotating disk 100 to rotate, wherein the revolution shaft 320 can be sleeved on the rotation shaft 310, and the revolution shaft 320 The axis of rotation may coincide with the axis of rotation of the spin axis 310 . The driving motor unit can be respectively connected with the rotation shaft 310 and the revolution shaft 320 to respectively drive the rotation shaft 310 and the revolution shaft 320 to rotate around their respective rotation axes. The transmission member can be respectively connected with the rotation shaft 310 and the brush 200 so that the rotation shaft 310 drives the brush 200 to rotate through the transmission member. Specifically, the revolving shaft 320 may be rotatably mounted on the frame through a bearing 710 .

In a specific example of the present invention, the drive motor unit may include a rotation axis drive motor and a revolution axis drive motor. Wherein, the autorotation shaft driving motor can be connected with the autorotation shaft 310 to drive the rotation shaft 310 to rotate, and the revolution shaft driving motor can be connected with the revolution shaft 320 to drive the revolution shaft 320 to rotate. In this way, the rotation axis 310 and the revolution axis 320 can rotate independently, that is, when the rotation axis 310 rotates, the revolution axis 320 can stand still; when the revolution axis 320 rotates, the rotation axis 310 can stand still. Specifically, the rotation shaft driving motor can be directly connected to the rotation shaft 310, and the revolution shaft driving motor can be connected to the revolution shaft 320 through a belt, so that the assembly of the rotation shaft driving motor and the revolution shaft driving motor can be avoided. when a conflict arises.

As shown in FIG. 2 , in some examples of the present invention, an accommodating cavity 110 may be defined in the active rotating disk 100, the first end of the rotation axis 310 may extend into the accommodating cavity 110, and the first end of the rotation axis 310 may It is rotatably installed on the inner wall of the active rotating disk 100, the first end of the brush 200 can extend into the housing cavity 110, and the first end of the brush 200 can be rotatably installed on the active rotating disk 100, wherein the The transmission part can be arranged in the receiving cavity 110, and the transmission part can be connected with the first end of the rotation shaft 310 and the first end of the brush 200 respectively. The structure of the first brush assembly 20 and the second brush assembly 30 can be made more compact by defining the receiving chamber 110 in the active rotating disk 100 and by arranging the transmission member in the receiving chamber 110 .

In one embodiment of the present invention, the transmission member may include a meshing first gear 330 and a second gear 340, wherein the first gear 330 may be sleeved on the first end of the rotation shaft 310, and the second gear 340 may be Set on the first end of the brush 200. In this way, the rotation shaft 310 can drive the first gear 330 to rotate, the first gear 330 can drive the second gear 340 to rotate, and then the second gear 340 can drive the brush 200 to rotate. The first gear 330 and the second gear 340 may also be spaced apart from each other, and the first gear 330 and the second gear 340 may be connected by a chain for transmission.

In another embodiment of the present invention, the transmission member may include a first magnetic wheel and a second magnetic wheel spaced apart from each other, wherein the first magnetic wheel may be sleeved on the first end of the rotation shaft 310, The second magnetic wheel can be sleeved on the first end of the brush 200 .

As shown in FIG. 2 , in a specific example of the present invention, the active rotating disk 100 may include a disk body 130 and an end cover 140 , and the end cover 140 may be mounted on the disk body 130 so as to be between the disk body 130 and the end cover 140 An accommodation cavity 110 is defined. Specifically, the end cap 140 may be formed with external threads, the disc body 130 may be formed with internal threads, and the end cap 140 may be threadedly fitted on the disc body 130 . Specifically, the revolution shaft 320 can be connected with the end cover 140, the first end of the rotation shaft 310 can be rotatably installed on the inner wall of the active rotating disk 100 through the bearing 720, and the first end of the brush 200 can be rotatable through the bearing 730. Installed on the active rotating disk 100.

In some embodiments of the present invention, as shown in FIG. 2 , each of the first brush assembly 20 and the second brush assembly 30 may further include a driven rotating disk 400, and the driven rotating disk 400 may be rotatably mounted on the on the frame, and the axis of rotation of the driven rotating disk 400 can coincide with the axis of rotation of the driving rotating disk 100, wherein the first end of the brush 200 can be rotatably mounted on the driving rotating disk 100, and the brush 200 The second end can be rotatably installed on the driven rotating disk 400 , and the driving rotating disk 100 can drive the driven rotating disk 400 to rotate through the brush 200 . Both ends of the brush 200 can be supported by setting the driving rotating disk 100 and the driven rotating disk 400, so that the brush 200 can rotate more stably (including revolution and rotation).

In a specific example of the present invention, the driven rotating disk 400 can be rotatably mounted on the frame through the driven shaft 600, that is, the driven shaft 600 can be rotatably mounted on the frame through the bearing 740 , and the driven shaft 600 can be connected with the driven rotating disk 400 . Specifically, the first end and the second end of the brush 200 may be rotating shafts 210, 220, and the first end and the second end of the brush 200 may be rotatably mounted on the driving rotating disk 100 through bearings 730, 750 respectively. And on the driven rotating disk 400.

In an example of the present invention, both the main plane of the driving rotating disk 100 and the main plane of the driven rotating disk 400 can be elliptical, wherein the revolution axis 320 can be connected with the first focal point of the main plane of the driving rotating disk 100, The driven shaft 600 can be connected with the first focal point of the main plane of the driven rotating disk 400, the first end of the brush 200 can be rotatably installed at the second focal point of the main plane of the driving rotating disk 100, and the brush 200 The second end of can be rotatably mounted at the second focal point of the main plane of the driven rotating disk 400 . The main plane of the driving rotating disk 100 refers to the plane with the largest area of the driving rotating disk 100 , and the main plane of the driven rotating disk 400 refers to the plane with the largest area of the driven rotating disk 400 .

As shown in FIGS. 1 and 2 , in some examples of the present invention, the first brush assembly 20 and the second brush assembly 30 may each further include a connecting rod 500 , and the first end of the connecting rod 500 may be connected to the active rotating disk. 100 , and the second end of the connecting rod 500 can be connected with the driven rotating disk 400 , wherein the rotating axis of the connecting rod 500 can coincide with or be parallel to the rotating axis of the driving rotating disk 100 .

Since the driven rotating disk 400 is driven by the driving rotating disk 100 to rotate, after the driving rotating disk 100 stops rotating, the driven rotating disk 400 will continue to rotate at a certain angle under the action of inertia. By setting the connecting rods 500 respectively connected to the driving rotating disk 100 and the driven rotating disk 400, the driving rotating disk 100 and the driven rotating disk 400 can stop rotating at the same time, that is, the driving rotating disk 100 and the driven rotating disk 400 can be synchronized .

The first brush assembly 20 and the second brush assembly 30 may have the same structure, or may be slightly different, as long as the first brush assembly 20 and the second brush assembly 30 have the same function. For example, the transmission member of the first brush assembly 20 may include a first gear and a second gear meshed with each other, and the transmission member of the second brush assembly 30 may include a first magnetic wheel and a second gear set apart from each other. Two magnetic wheels. The possible differences between the first brush assembly 20 and the second brush assembly 30 are not listed here.

The rotation axis of the active rotating disk 100 of the first brush assembly 20 may be parallel to the rotation axis of the active rotating disk 100 of the second brush assembly 30 .

In some embodiments of the present invention, the angle α between the rotation axis of the active rotating disk 100 of the first brush assembly 20 and the rotation axis of the active rotating disk 100 of the second brush assembly 30 may be greater than 0 degrees. When brushing the surface of the wafer 40, the first brush assembly 20 and the second brush assembly 30 clamp the wafer 40, because the axis of rotation of the active rotating disk 100 of the first brush assembly 20 and the second brush assembly 30 An included angle α greater than 0 degrees may be formed between the axes of rotation of the active rotating disc 100, when the brushes 200 of the first brush assembly 20 and the brushes 200 of the second brush assembly 30 rotate in opposite rotation directions , the vertical downward frictional force acting on the wafer 40 by the brush 200 of the first brush assembly 20 and the brush 200 of the second brush assembly 30 can be gradually from one side of the wafer 40 to the other side. The increased gradient distribution thereby generates a torque on the wafer 40 that drives the rotation of the wafer 40 .

Wherein, the range of α may be 0 degree α<4 degree, advantageously, 0.5 degree<α<2.5 degree. If α is greater than 4 degrees, the scrubbing effect of the middle portion of the wafer is poor due to the large tilt angle; if the angle is too small, the generated torque may not be sufficient to drive the wafer 40 to rotate.

As shown in FIG. 2 , in some embodiments of the present invention, the distance between the rotation axis of the active rotating disk 100 and the rotation axis of the brush 200 in the first brush assembly 20 and the second brush assembly 30 can be greater than the radius of the brush 200. In other words, the distance between the rotation axis of the active rotating disk 100 of the first brush assembly 20 and the rotation axis of the brush 200 of the first brush assembly 20 may be greater than the radius of the brush 200 . The distance between the rotation axis of the active rotating disk 100 of the second brush assembly 30 and the rotation axis of the brush 200 of the second brush assembly 30 may be greater than the radius of the brush 200 . In this way, the entire brush 200 can be located on one side of the rotation axis of the active rotating disk 100, so that the entire brush 200 can be immersed in the liquid when the dynamic seal of the active rotating disk 100 is not in contact with the liquid. In other words, even when the scrubbing device for wafers according to the embodiment of the present invention is in a shutdown state, the entire surface of the brush 200 can be wetted, thereby further improving the cleaning effect of the wafer 40 .

The supporting member may be known, for example, the supporting member may include multiple (eg two) rollers 10 , which will not be described in detail here.

The process of scrubbing the wafer 40 using the scrubbing device for wafers according to an embodiment of the present invention will be described below with reference to FIG. 3 . Fig. 3 shows schematic diagrams of the brushing device for wafers in different working states according to an embodiment of the present invention, wherein A indicates that the brushing device is in a shutdown state and the brush is immersed in the liquid, and B indicates that the brushing device is in the brushing state. After the end of the standby state and the brush releases the wafer to be removed, C shows that the scrubbing device is in the scrubbing state and the brush squeezes the wafer from both sides of the wafer.

As shown in FIG. 3 , when the scrubbing device for wafers according to the embodiment of the present invention is in a shutdown state, the brush 200 is at position A, and the entire brush 200 can be immersed in the liquid to keep its surface wet. When the wafer 40 is scrubbed by the scrubbing device for wafers, the driving motor unit can drive the revolution shaft 320 to rotate, and the revolution shaft 320 can drive the active rotating disk 100 to rotate, and then the active rotating disk 100 can drive the brush 200 Rotate (revolving) to C position, and can adjust the squeeze amount between the brush 200 and the wafer 40 . Subsequently, the drive motor unit can drive the rotation shaft 310 to rotate, and the rotation shaft 310 can drive the brush 200 to rotate (autorotate) through the transmission member to scrub the wafer 40 (one brush 200 scrubs one side of the wafer 40 surface). After the scrubbing is completed, the active rotating disk 100 can drive the brush 200 to rotate (revolve) to position B so that the brush 200 is detached from the wafer 40, and the wafer 40 can be transported away by a robot arm.

The brushing device for wafers according to the embodiment of the present invention can keep the surface of the brush 200 wet, thereby improving the cleaning effect of the wafer 40 .

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (9)

1. a brushing device that is used for wafer is characterized in that, comprising:

Frame;

Strutting piece, described strutting piece are located on the described frame to be used for making described wafer rotatably be supported in described strutting piece; And

The first and second hairbrush assemblies, described the first and second hairbrush assemblies relatively and the interval turn up the soil and be installed on the described frame to be respectively applied to scrub the both side surface of wafer, wherein said the first hairbrush assembly and described the second hairbrush assembly comprise separately:

The active rotation dish, described active rotation dish is rotatably installed on the described frame;

Hairbrush, described hairbrush is rotatably installed on the described active rotation dish and the rotation of described active rotation dish is parallel to the rotation of described hairbrush, so that described hairbrush is revolved round the sun around the rotation of described active rotation dish, described hairbrush is at least part of when being in stopped status is immersed in the liquid;

With

Driven unit, described driven unit link to each other to drive respectively described active rotation dish and described hairbrush around separately rotation rotation with described active rotation dish respectively with described hairbrush.

2. the brushing device for wafer according to claim 1 is characterized in that, described driven unit comprises:

The axis of rotation and hollow shaft, described hollow shaft is rotatably installed on the described frame and with described active rotation dish and links to each other to drive described active rotation disc spins, wherein said hollow shaft is sleeved on the described axis of rotation, and the rotation of described hollow shaft overlaps with the rotation of the described axis of rotation;

Drive motor units, described drive motor units link to each other to drive respectively the described axis of rotation and described hollow shaft around separately rotation rotation with the described axis of rotation respectively with described hollow shaft; With

Driving member, described driving member link to each other with described hairbrush with the described axis of rotation respectively so that the described axis of rotation drives described hairbrush rotation by described driving member.

3. the brushing device for wafer according to claim 2, it is characterized in that, be limited with container cavity in the described active rotation dish, the first end of the described axis of rotation stretches in the described container cavity and is rotatably installed on the inwall of described active rotation dish, the first end of described hairbrush stretches in the described container cavity and is rotatably installed on the described active rotation dish, and wherein said driving member is located in the described container cavity and links to each other with the first end of the described axis of rotation and the first end of described hairbrush respectively.

4. the brushing device for wafer according to claim 3, it is characterized in that, described driving member comprises the first gear and the second gear that is meshed, and wherein said the first gear set is on the first end of the described axis of rotation, and described the second gear set is on the first end of described hairbrush.

5. the brushing device for wafer according to claim 3, it is characterized in that, described driving member comprises the first magnetic wheel and the second magnetic wheel that each interval is arranged, wherein said the first magnetic wheel is sleeved on the first end of the described axis of rotation, and described the second magnetic wheel is sleeved on the first end of described hairbrush.

6. the brushing device for wafer according to claim 1 is characterized in that, described the first hairbrush assembly and described the second hairbrush assembly also comprise separately:

Driven rotating disk, described driven rotating disk is rotatably installed on the described frame and the rotation of described driven rotating disk overlaps with the rotation of described active rotation dish, the first end of wherein said hairbrush is rotatably installed on the described active rotation dish and the second end is rotatably installed on the described driven rotating disk, and described active rotation dish drives described driven rotating disk rotation by described hairbrush.

7. the brushing device for wafer according to claim 6 is characterized in that, described the first hairbrush assembly and described the second hairbrush assembly also comprise separately:

Connecting rod, the first end of described connecting rod link to each other with described active rotation dish and the second end links to each other with described driven rotating disk, and the rotation of wherein said connecting rod overlaps with the rotation of described active rotation dish.

8. the brushing device for wafer according to claim 1, it is characterized in that, be angle α between the rotation of the active rotation dish of the rotation of the active rotation dish of described the first hairbrush assembly and described the second hairbrush assembly, wherein 0 degree≤α＜4 degree.

9. the brushing device for wafer according to claim 1, it is characterized in that, in described the first hairbrush assembly and described the second hairbrush assembly separately the rotation of described active rotation dish and the distance between the rotation of described hairbrush greater than the radius of described hairbrush.

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