CN102196678A - Laminating process for high-copper thickness thick core plate of printed circuit board - Google Patents
Laminating process for high-copper thickness thick core plate of printed circuit board Download PDFInfo
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- CN102196678A CN102196678A CN201010119650XA CN201010119650A CN102196678A CN 102196678 A CN102196678 A CN 102196678A CN 201010119650X A CN201010119650X A CN 201010119650XA CN 201010119650 A CN201010119650 A CN 201010119650A CN 102196678 A CN102196678 A CN 102196678A
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- vacuum
- pressing
- press
- hydraulic press
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 34
- 239000010949 copper Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010030 laminating Methods 0.000 title abstract 2
- 238000005086 pumping Methods 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 37
- 239000003245 coal Substances 0.000 claims description 36
- 238000013461 design Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000003350 kerosene Substances 0.000 abstract 6
- 238000003475 lamination Methods 0.000 abstract 2
- 239000003351 stiffener Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a laminating process for a high-copper thickness thick core plate of a printed circuit board, which comprises on the steps of: designing a flow resistance edge of an inner layer high-copper thickness thick core plate, changing a vacuum pumping way of a vacuum thermal kerosene press and improving a self press plate program of a vacuum thermal kerosene press. The solid flow resistance edge is provided with oblique grooves, and the oblique grooves are distributed in the corresponding in-plate pattern and the pattern opening; the vacuum pumping way is changed from a one simple vacuum pumping pump-one vacuum thermal kerosene press into two parallel connected vacuum pumping pump-one vacuum thermal kerosene press; when the vacuum thermal kerosene press carries out hot press, the vacuum is pumped for three minutes, and then the plate is laminated; the vacuum thermal kerosene press rapidly reaches the vacuum environment at the initial phase of hot press, the non-gas combination between the high-copper thickness thick core plate and a semi-solidifying piece is effectively ensured, and the requirement for no resin cavity during the lamination of the high-copper thickness thick core plate is met; and by adopting the process disclosed by the invention, no resin cavity and zero rejection rate during the lamination of the high-copper thickness thick core plate are realized.
Description
Technical field:
The present invention relates to a kind of printed circuit board (PCB) process technology, relate in particular to the thick central layer process for pressing of a kind of printed circuit board (PCB) high-copper.
Background technology:
At present, domestic medium-sized and small enterprises and part large-sized print circuit board processing enterprise, pressing is produced and is all adopted vacuum hot coal hydraulic press to carry out the multi-layer sheet compacting, existing printed circuit board (PCB) exist the thick central layer of a kind of internal layer high-copper (central layer thickness 1.0mm and more than, more than the thick 2OZ of copper reaches), the resin cavitation very easily appears in vacuum hot coal hydraulic press when this type of central layer of pressing, traditional MASS LAM pressing has two kinds of improvement methods, a kind of is that edges of boards choked flow limit is designed to copper point choked flow PAD, in the press vacuum, make in the plate that gas is discharged rapidly everywhere, do not remain between thick central layer of high-copper and the prepreg; Another kind is to change more advanced electrothermal (need not to vacuumize) press, realizes that the pressing prepreg combines with the no resin between the thick central layer of high-copper is empty, and then cost is too high but be replaced with advanced electrothermal press, is unfavorable for the company cost saving.
Above-mentioned two kinds are improved technology, can bring another quality abnormal after preceding a kind of improvement, are unfavorable for quality control; A kind of then cost in back is too high, is unfavorable for the company cost saving.
Patent of invention " press fit device of a kind of printed substrate and stiffener and method ", the patent No. is " 20071019658.4 ", it provides a kind of press fit device, printed substrate and stiffener are placed between described top die and the dip mold, described stiffener also is provided with binding agent between described printed substrate and stiffener between described printed substrate and packing material; Make described printed substrate and described stiffener pressing, in this process, described stiffener is coated by described packing material and is fixing, adopts the press fit device and the method for this invention, even if apply bigger pressure, can between stiffener and printed substrate slippage not appear yet.But also there is following problem in this method: in the pressing pressurized process, the solation of edges of boards colloidal state prepreg loses and will increase greatly, causes in the plate, edges of boards are in uneven thickness, causes that the edges of boards thickness of slab approaches partially to cause scrapping, and is unfavorable for quality control.
Summary of the invention:
The technical problem to be solved in the present invention is, provides a kind of thick central layer of high-copper that can either solve to form resin cavity problem in the pressing process, can effectively save the new technology of company cost again.
For solving the problems of the technologies described above, the technical solution used in the present invention is, the thick central layer process for pressing of a kind of printed circuit board (PCB) high-copper, comprise the design of the thick central layer choked flow of internal floor height copper limit, vacuum hot coal hydraulic press vacuumizes the change of mode, and vacuum hot coal hydraulic press carries the improvement of pressing plate program, in the design procedure of the thick central layer choked flow of described internal layer high-copper limit, solid choked flow limit is made in central layer choked flow limit open the oblique groove design, the true mode of taking out vacuum hot coal hydraulic press makes 2 into takes out true pump and vacuumizes, and vacuumizes rear fender during hot pressing earlier.
The thick central layer process for pressing of the above a kind of printed circuit board (PCB) high-copper, it is characterized in that, oblique groove is opened on described solid choked flow limit, its oblique groove is distributed in figure and figure opening part in the corresponding plate, the mode that vacuumizes by simple 1 vacuum pumping pump to 1 vacuum hot coal hydraulic press, change 2 vacuum pumping pumps in parallel into to 1 vacuum hot coal hydraulic press, during the hot pressing of vacuum hot coal hydraulic press, take out 3 minutes capable again pressing plates of vacuum earlier.
The present invention has that the thick central layer pressing of high-copper does not have resin cavity and cost-effective advantage is: the recessing of solid choked flow limit designs, help the discharge of gas everywhere in the plate more, the oblique groove design of solid choked flow limit is under the prerequisite that does not influence the gas discharge, can be good at reducing the solation mistake of colloidal state prepreg again, play the choked flow effect, it is thin partially effectively to prevent edges of boards, the mode of vacuumizing make into 2 vacuum pumping pumps in parallel to 1 vacuum hot coal hydraulic press after, the true degree of taking out of press is brought up to 750mmHg by original 700mmHg, the gas that vacuum hot coal hydraulic press is discharged is more, vacuumize and the pressing plate of vacuum hot coal hydraulic press carries out program synchronously and changes into and vacuumize 3 minutes earlier again after the pressing plate program, residual gas in the vacuum hot coal hydraulic press further reduces, fully satisfied the thick central layer of the high-copper under the vacuum environment and combined, reached the requirement that high-copper thick central layer pressing does not have the resin cavity with no gas between prepreg.
Description of drawings:
Fig. 1 edges of boards choked flow limit design vertical view that oblique notches, a is oblique groove width 2mm;
The existing vacuum hot coal hydraulic press of Fig. 2 vacuumizes the mode end view;
I, II are vacuum hot coal hydraulic press, and A, B are vacuum pumping pump, separately at a press;
Vacuum hot coal hydraulic press after Fig. 3 improves vacuumizes the mode end view;
I, II are vacuum hot coal hydraulic press, and A, B are vacuum pumping pump, all can use simultaneously two press.
Embodiment:
Below in conjunction with Figure of description, the present invention is further set forth, but the present invention's scope required for protection is not limited to the scope that execution mode is described.
Multi-layer sheet internal layer machining process route is as follows:
Material → pre-treatment → coating → exposure → development → etching → take off film → AOI → palm fibre/melanism → walkthrough (molten, riveted) → row's plate → pressing plate → brill location hole → pressing plate moulding → outer layer process left by substrate.
The present invention relates generally to the solid choked flow of the thick central layer of internal floor height copper limit and opens oblique groove, its oblique groove is distributed in figure and figure opening part in the corresponding plate, vacuum hot coal hydraulic press vacuumizes changing to of mode 2 vacuum pumping pumps in parallel to 1 vacuum hot coal hydraulic press, and vacuumize and the pressing plate of vacuum hot coal hydraulic press carries out program synchronously and change into and vacuumize 3 minutes pressing plate programs more earlier.
In the enforcement of the thick central layer process for pressing of printed circuit board (PCB) high-copper of the present invention shown in Figure 1, before production, by CAM350 software, the choked flow limit of edges of boards is designed to shape among the figure one, carry out light again and paint the film, transfer to the internal layer production that exposes, there is 1～12 oblique groove on the choked flow limit after etching.In the present embodiment, original vacuum pumping pump A and newly-increased vacuum pumping pump B, vacuum hot coal hydraulic press to closure vacuumizes, in the thick central layer of the high-copper of pressing and the prepreg gas with 1～12 the rapid dissipation of oblique groove, vacuumizing in 1 minute of vacuum hot coal hydraulic press reaches 750mmHg, via vacuumizing 3 minutes programs of pressing plate more earlier, gas further reduces in the vacuum hot coal hydraulic press, reaches the purpose of vacuum; The present invention has compared with prior art increased choked flow edge figure and has opened the oblique groove design, on original vacuum hot coal hydraulic press, be equivalent to newly-increased vacuum pumping pump, two vacuum hot coal hydraulic presses carried out pressing plate material loading time phase difference 1 hour, guarantee that every vacuum hot coal hydraulic press is heating up and kissing and press section can obtain the effect that two vacuum pumps vacuumize, vacuumize and the pressing plate of vacuum hot coal hydraulic press carries out program synchronously and changes into and vacuumize 3 minutes pressing plate programs more earlier, make vacuum hot coal hydraulic press reach vacuum environment rapidly in the starting stage of hot pressing, guaranteed that effectively the thick central layer of high-copper combines with no gas between prepreg, having satisfied the thick central layer pressing of high-copper does not have the requirement in resin cavity, can realize that with technology of the present invention high-copper thick central layer pressing do not have resin cavity zero scrappage.
Claims (4)
1. thick central layer process for pressing of printed circuit board (PCB) high-copper, it is characterized in that: comprise the design of the thick central layer choked flow of internal floor height copper limit, vacuum hot coal hydraulic press vacuumizes the change of mode, and vacuum hot coal hydraulic press carries the improvement of pressing plate program, in the design procedure of the thick central layer choked flow of described internal layer high-copper limit, solid choked flow limit is made in central layer choked flow limit open oblique groove design, vacuum hot coal hydraulic press is taken out true mode and is made 2 into and take out true pump and vacuumize, and vacuumizes rear fender during hot pressing earlier.
2. the thick central layer process for pressing of a kind of printed circuit board (PCB) high-copper according to claim 1 is characterized in that: oblique groove is opened on described solid choked flow limit, and its oblique groove is distributed in figure and figure opening part in the corresponding plate.
3. the thick central layer process for pressing of a kind of printed circuit board (PCB) high-copper according to claim 1, it is characterized in that: the mode that vacuumizes by simple 1 vacuum pumping pump to 1 vacuum hot coal hydraulic press, change 2 vacuum pumping pumps in parallel into to 1 vacuum hot coal hydraulic press, during the hot pressing of vacuum hot coal hydraulic press, take out 3 minutes capable again pressing plates of vacuum earlier.
4. the thick central layer process for pressing of a kind of printed circuit board (PCB) high-copper according to claim 3, it is characterized in that: the vacuum hot coal hydraulic press to closure vacuumizes, in the thick central layer of the high-copper of pressing and the prepreg gas with 1～12 the rapid dissipation of oblique groove, vacuumizing in 1 minute of vacuum hot coal hydraulic press reaches 750mmHg, via vacuumizing 3 minutes programs of pressing plate more earlier, gas further reduces in the vacuum hot coal hydraulic press, reaches the purpose of vacuum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010119650XA CN102196678A (en) | 2010-03-05 | 2010-03-05 | Laminating process for high-copper thickness thick core plate of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010119650XA CN102196678A (en) | 2010-03-05 | 2010-03-05 | Laminating process for high-copper thickness thick core plate of printed circuit board |
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| Publication Number | Publication Date |
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| CN102196678A true CN102196678A (en) | 2011-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010119650XA Pending CN102196678A (en) | 2010-03-05 | 2010-03-05 | Laminating process for high-copper thickness thick core plate of printed circuit board |
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| CN (1) | CN102196678A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361532A (en) * | 2011-09-30 | 2012-02-22 | 东莞市五株电子科技有限公司 | Multilayer printed circuit board and manufacturing process thereof |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN115133089A (en) * | 2022-09-01 | 2022-09-30 | 浙江晨阳新材料有限公司 | Shaping device and method for proton exchange membrane fuel monocell |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301994A (en) * | 1999-08-25 | 2001-07-04 | 希普雷公司 | Conveyer belt type vacuum applicator and method for applying anti-corrosion film on printed circuit |
| JP2004071827A (en) * | 2002-08-06 | 2004-03-04 | Taiyo Ink Mfg Ltd | Method for manufacturing multilayer printed wiring board |
| CN1960606A (en) * | 2005-11-02 | 2007-05-09 | 比亚迪股份有限公司 | Vacuum and high-pressure method of drying film for multiple layers of flexible circuit board |
| CN1964602A (en) * | 2005-11-09 | 2007-05-16 | 比亚迪股份有限公司 | A multilayer circuit board and its manufacture method |
-
2010
- 2010-03-05 CN CN201010119650XA patent/CN102196678A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301994A (en) * | 1999-08-25 | 2001-07-04 | 希普雷公司 | Conveyer belt type vacuum applicator and method for applying anti-corrosion film on printed circuit |
| JP2004071827A (en) * | 2002-08-06 | 2004-03-04 | Taiyo Ink Mfg Ltd | Method for manufacturing multilayer printed wiring board |
| CN1960606A (en) * | 2005-11-02 | 2007-05-09 | 比亚迪股份有限公司 | Vacuum and high-pressure method of drying film for multiple layers of flexible circuit board |
| CN1964602A (en) * | 2005-11-09 | 2007-05-16 | 比亚迪股份有限公司 | A multilayer circuit board and its manufacture method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361532A (en) * | 2011-09-30 | 2012-02-22 | 东莞市五株电子科技有限公司 | Multilayer printed circuit board and manufacturing process thereof |
| CN102361532B (en) * | 2011-09-30 | 2014-04-02 | 东莞市五株电子科技有限公司 | Multilayer printed circuit board and manufacturing process thereof |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN115133089A (en) * | 2022-09-01 | 2022-09-30 | 浙江晨阳新材料有限公司 | Shaping device and method for proton exchange membrane fuel monocell |
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Application publication date: 20110921 |