CN102194023B - Configuration device and method for preventing congestion - Google Patents
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Abstract
本发明是一种用于电路布局的防止壅塞配置装置及方法,防止壅塞配置装置包含分析模块、定义模块及扩展模块。分析模块用以对电路布局进行绕线壅塞状态分析以产生分析结果。定义模块用以根据该分析结果于该电路布局定义出壅塞区域及邻近于壅塞区域的一分享区域。该壅塞区域的电子元件密度是高于该分享区域的电子元件密度。扩展模块用以将该壅塞区域内的多个电子元件重新配置于该壅塞区域及该分享区域。
The present invention is an anti-congestion configuration device and method for circuit layout. The anti-congestion configuration device includes an analysis module, a definition module and an expansion module. The analysis module is used for analyzing the winding congestion state of the circuit layout to generate analysis results. The defining module is used for defining a congested area and a shared area adjacent to the congested area in the circuit layout according to the analysis result. The electronic component density of the congested area is higher than that of the shared area. The expansion module is used to reconfigure the multiple electronic components in the congested area to the congested area and the shared area.
Description
技术领域 technical field
本发明是与电路布局有关,特别地,关于一种防止壅塞配置装置及方法,用以将电路布局中的壅塞区域内的电子元件向外扩展分布至其附近电子元件密度较低的区域,藉以降低原本难以绕线的壅塞区域的电子元件密度,使其变为可绕线的区域。The present invention is related to circuit layout, in particular, to an anti-congestion arrangement device and method for expanding and distributing the electronic components in the congested area in the circuit layout to the area with a lower density of electronic components nearby, so as to Reduce electronic component density in otherwise difficult-to-wire congested areas, making them wire-routable areas.
背景技术 Background technique
随着电子科技不断地发展,各式各样的电子产品的体积愈来愈轻薄短小,但其具备的功能亦愈来愈多。因此,在面积相当小的芯片中必须设置有数目非常庞大的各种电子元件,才足以应付电子产品的实际需求。With the continuous development of electronic technology, various electronic products are becoming thinner and smaller in size, but they have more and more functions. Therefore, a very large number of various electronic components must be arranged in a chip with a relatively small area to meet the actual needs of electronic products.
然而,于某些电路布局中,由于某一区域内的电子元件太多,亦即该区域的电子元件密度过大,使得该区域的某些电子元件间的绕线(routing)难以进行,因而无法通过设计规则检查(design rule checking),导致该电路布局无法正常运作。However, in some circuit layouts, because there are too many electronic components in a certain area, that is, the density of electronic components in this area is too high, it is difficult to perform routing between some electronic components in this area. Failed to pass the design rule checking (design rule checking), resulting in the circuit layout not working properly.
请参照图1A及图1B,图1A及图1B是绘示先前技术中当电路布局的电子元件密度为75%时的示意图。如图1A及图1B所示,很明显地,由于电路布局1中的各电子元件10并未完全紧密地排列在一起,亦即各电子元件10之间仍存在着许多可供绕线的空间,故电路布局1并未出现有任何难以绕线的壅塞区域。Please refer to FIG. 1A and FIG. 1B . FIG. 1A and FIG. 1B are schematic diagrams illustrating when the density of electronic components in the circuit layout is 75% in the prior art. As shown in FIG. 1A and FIG. 1B, it is obvious that since the electronic components 10 in the circuit layout 1 are not completely closely arranged together, that is, there are still many spaces available for winding between the electronic components 10. , so the circuit layout 1 does not have any congested areas that are difficult to route.
然而,当电路布局1的电子元件密度变得更高时,情况显然出现变化。请参照图1C及图1D,图1C及图1D是绘示先前技术中当电路布局的电子元件密度升高至90%时的示意图。如图1C及图1D所示,由于原本图1A的电路布局1中的许多绕线空间均已被电子元件10′填入,因而导致图1C的电路布局1出现许多难以绕线的壅塞区域,如同图1D所示的壅塞状态指针V1~V3(箭号处)即代表电路布局1中的垂直方向的壅塞区域。However, the situation obviously changes when the electronic component density of the circuit layout 1 becomes higher. Please refer to FIG. 1C and FIG. 1D . FIG. 1C and FIG. 1D are schematic diagrams illustrating when the density of electronic components in the circuit layout increases to 90% in the prior art. As shown in FIG. 1C and FIG. 1D , since many wiring spaces in the original circuit layout 1 of FIG. 1A have been filled by electronic components 10 ′, there are many congestion areas that are difficult to wire in the circuit layout 1 of FIG. 1C . As shown in FIG. 1D , the congestion status pointers V1 - V3 (at the arrows) represent the vertical congestion area in the circuit layout 1 .
由于电路布局所包含的电子元件的种类及数目随着科技的进展及实际使用的需求而不断增加,电路布局内所产生的壅塞现象势必更为严重。然而,传统上针对上述问题的解决方式很可能造成电路布局中的电子元件彼此间的相对位置关系产生改变,使得电路布局因而无法通过时间限制(time constraint),或是需要牺牲电路布局中的部分空间,导致电路布局中额外的面积损失(area penalty)。Since the types and numbers of electronic components included in the circuit layout are increasing continuously with the development of technology and the demand of actual use, the congestion phenomenon in the circuit layout is bound to become more serious. However, the traditional solutions to the above problems may cause changes in the relative positional relationship between the electronic components in the circuit layout, so that the circuit layout cannot pass the time constraint, or part of the circuit layout needs to be sacrificed. space, resulting in an additional area penalty in the circuit layout.
发明内容 Contents of the invention
本发明的目的是提供一种防止壅塞配置装置及防止壅塞配置方法,可避免电路布局中额外的面积损失。The object of the present invention is to provide an anti-congestion configuration device and an anti-congestion configuration method, which can avoid additional area loss in circuit layout.
根据本发明一方面是提供一种防止壅塞配置装置,该防止壅塞配置装置应用于一电路布局。该防止壅塞配置装置包含一分析模块、一定义模块及一扩展模块。该分析模块用以对该电路布局进行一绕线壅塞状态分析以产生一分析结果。该定义模块用以根据该分析结果于该电路布局定义出一壅塞区域及邻近于该壅塞区域的一分享区域,其中该壅塞区域的电子元件密度高于该分享区域的电子元件密度。该扩展模块用以将该壅塞区域内的多个电子元件重新配置于该壅塞区域及该分享区域。According to one aspect of the present invention, an anti-congestion configuration device is provided, and the anti-congestion configuration device is applied to a circuit layout. The anti-congestion configuration device includes an analysis module, a definition module and an expansion module. The analysis module is used for analyzing the state of winding congestion on the circuit layout to generate an analysis result. The defining module is used for defining a congestion area and a sharing area adjacent to the congestion area in the circuit layout according to the analysis result, wherein the density of electronic components in the congestion area is higher than that of the sharing area. The expansion module is used to reconfigure the multiple electronic components in the congested area to the congested area and the shared area.
根据本发明另一方面是提供一种防止壅塞配置方法,该防止壅塞配置方法是应用于一电路布局中。首先,该方法对该电路布局进行一绕线壅塞状态分析以产生一分析结果;接着,该方法根据该分析结果于该电路布局定义出一壅塞区域以及邻近于该壅塞区域的一分享区域,其中该壅塞区域的电子元件密度高于该分享区域的电子元件密度。之后,该方法将该壅塞区域内的多个电子元件重新配置于该壅塞区域及该分享区域。Another aspect of the present invention is to provide an anti-congestion configuration method, which is applied in a circuit layout. First, the method performs a winding congestion state analysis on the circuit layout to generate an analysis result; then, the method defines a congestion area and a sharing area adjacent to the congestion area in the circuit layout according to the analysis result, wherein The density of electronic components in the congested area is higher than the density of electronic components in the shared area. Afterwards, the method reconfigures the plurality of electronic components in the congested area to the congested area and the shared area.
本发明相较于先前技术的有益技术效果是,本发明的防止壅塞配置装置及方法是将原本仅配置于壅塞区域内的这些电子元件加以向外扩展分布至壅塞区域与其附近具有较低电子元件密度的分享区域,藉以降低壅塞区域原本较高的电子元件密度,使得该壅塞区域能够由原本难以绕线的区域变成可绕线的区域,并且壅塞区域与分享区域的电子元件密度变得较为平均。更重要的是,在经过本发明的防止壅塞配置装置及方法处理后,该电路布局的所有电子元件彼此间的相对位置关系仍维持不变,使得该电路布局仍能通过时间限制,并且对于该电路布局而言,将不会为了消除壅塞区域而产生任何额外的面积损失。Compared with the prior art, the beneficial technical effect of the present invention is that the anti-congestion arrangement device and method of the present invention expand and distribute the electronic components originally only arranged in the congested area to the congested area and its vicinity with lower electronic components Density sharing area, so as to reduce the originally high density of electronic components in the congested area, so that the congested area can be changed from an area that is difficult to wire to an area that can be wound, and the density of electronic components in the congested area and the shared area becomes relatively average. More importantly, after being processed by the anti-congestion configuration device and method of the present invention, the relative positional relationship between all electronic components of the circuit layout remains unchanged, so that the circuit layout can still pass the time limit, and for the As far as the circuit layout is concerned, there will be no additional area loss in order to eliminate the congested area.
附图说明 Description of drawings
关于本发明的优点与精神可以通过以下结合附图对本发明的较佳实施例的详述得到进一步的了解,其中:The advantages and spirit of the present invention can be further understood through the following detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings, wherein:
图1A及图1B是绘示先前技术中电路布局的电子元件密度为75%时的示意图。FIG. 1A and FIG. 1B are schematic diagrams illustrating a circuit layout in the prior art when the density of electronic components is 75%.
图1C及图1D是绘示先前技术中电路布局的电子元件密度为90%时的示意图。FIG. 1C and FIG. 1D are schematic diagrams illustrating a circuit layout in the prior art when the density of electronic components is 90%.
图2是绘示根据本发明的第一具体实施例的防止壅塞配置装置的功能方块图。FIG. 2 is a functional block diagram illustrating an anti-congestion configuration device according to a first embodiment of the present invention.
图3A是绘示定义模块根据分析结果于电路布局定义壅塞区域及分享区域的示意图。FIG. 3A is a schematic diagram illustrating that the definition module defines a congested area and a shared area in a circuit layout according to an analysis result.
图3B及图4A~图4C是绘示电路布局中的电子元件由原本的位置O移至T的示意图。3B and FIGS. 4A-4C are schematic diagrams illustrating the movement of electronic components from the original position O to T in the circuit layout.
图5A~图5C是绘示电子元件经由扩展模块移动后的位置刚好位于高电子元件密度区域时的处理方式。5A to 5C illustrate the processing method when the position of the electronic components after being moved through the expansion module is just located in the high electronic component density area.
图6A及图6B是绘示扩展模块仅移动电路布局中的组合元件而循序元件维持固定不动的示意图。6A and 6B are schematic diagrams illustrating that the expansion module only moves the combined elements in the circuit layout while the sequential elements remain fixed.
图7A及图7B是绘示扩展模块仅移动电路布局中的其中一种电子元件模块的示意图。7A and 7B are schematic diagrams illustrating that the expansion module only moves one of the electronic component modules in the circuit layout.
图8是绘示根据本发明的第二具体实施例的防止壅塞配置方法的流程图。FIG. 8 is a flowchart illustrating a congestion prevention configuration method according to a second embodiment of the present invention.
具体实施方式 Detailed ways
根据本发明的第一具体实施例为一种防止壅塞配置装置。于此实施例中,该防止壅塞配置装置是应用于一电路布局,并且该电路布局包含多个电子元件。至于这些电子元件的种类与数目及各电子元件彼此间的耦接关系并无一定的限制,端视实际需求而定。The first embodiment according to the present invention is an anti-congestion configuration device. In this embodiment, the anti-congestion configuration device is applied to a circuit layout, and the circuit layout includes a plurality of electronic components. The type and number of these electronic components and the coupling relationship between the electronic components are not limited, and it depends on actual needs.
请参照图2,图2是绘示应用于该电路布局的防止壅塞配置装置的功能方块图。如图2所示,防止壅塞配置装置2包含分析模块20、定义模块22、扩展模块24及设定模块26。其中,分析模块20耦接至定义模块22;定义模块22及设定模块26分别耦接至扩展模块24。接下来,将分别就防止壅塞配置装置2的各模块及其功能进行介绍。Please refer to FIG. 2 . FIG. 2 is a functional block diagram illustrating an anti-congestion configuration device applied to the circuit layout. As shown in FIG. 2 , the anti-congestion configuration device 2 includes an analysis module 20 , a definition module 22 , an extension module 24 and a setting module 26 . Wherein, the analysis module 20 is coupled to the definition module 22 ; the definition module 22 and the setting module 26 are respectively coupled to the extension module 24 . Next, each module and its function of the anti-congestion configuration device 2 will be introduced respectively.
于此实施例中,分析模块20的主要功用在于对该电路布局进行一绕线壅塞状态分析,并据以产生一分析结果。实际上,分析模块20可针对该电路布局的各个区域内的电子元件密度是否高于一默认值进行分析,藉以产生当时关于该电路布局的各区域的绕线壅塞状态的分析结果,举例而言,分析结果可类似前述图1A~图1D所示,但不以此为限。In this embodiment, the main function of the analysis module 20 is to perform a winding congestion state analysis on the circuit layout, and generate an analysis result accordingly. In fact, the analysis module 20 can analyze whether the density of electronic components in each area of the circuit layout is higher than a default value, so as to generate an analysis result about the state of winding congestion in each area of the circuit layout at that time, for example , the analysis results may be similar to those shown in the foregoing FIGS. 1A-1D , but not limited thereto.
接着,定义模块22即可根据分析模块20所得到的分析结果于该电路布局中定义出电子元件密度相对较高的壅塞区域以及邻近于壅塞区域且电子元件密度相对较低的一分享区域。之后,扩展模块24即可重新配置原本位于壅塞区域内的这些电子元件,使得这些电子元件能够向外扩展而分布于该壅塞区域及该分享区域内。Next, the definition module 22 can define a congested area with a relatively high density of electronic components and a shared area adjacent to the congested area with a relatively low density of electronic components in the circuit layout according to the analysis result obtained by the analysis module 20 . Afterwards, the expansion module 24 can reconfigure the electronic components originally located in the congested area, so that the electronic components can expand outward and be distributed in the congested area and the shared area.
举例而言,如图3A所示,假设分析模块20所得到的分析结果为电路布局3中的区域30的电子元件密度过高,因此,定义模块22即根据上述分析结果将电路布局3中的区域30定义为壅塞区域,并且进一步将电路布局3中位于壅塞区域30附近的区域31及32定义为第一分享区及第二分享区。其中,第一分享区31较靠近于壅塞区域30,而第二分享区32则位于第一分享区31的外侧。For example, as shown in FIG. 3A , it is assumed that the analysis result obtained by the analysis module 20 is that the density of electronic components in the region 30 in the circuit layout 3 is too high. The area 30 is defined as a congested area, and areas 31 and 32 near the congested area 30 in the circuit layout 3 are further defined as a first sharing area and a second sharing area. Wherein, the first sharing area 31 is closer to the congested area 30 , and the second sharing area 32 is located outside the first sharing area 31 .
值得注意的是,此实施例中的壅塞区域30、第一分享区31及第二分享区32的形状均为圆形,但在实际应用中,电路布局的壅塞区域及分享区域是由一长宽比因子决定,故使用者可通过设定不同的长宽比因子来改变壅塞区域及分享区域的形状,例如正方形、长方形或椭圆形等形状,并无一定的限制。此外,定义模块22所定义的电路布局3的壅塞区域及分享区域的数目亦可视分析模块20实际分析结果而定,并无一定的限制。It is worth noting that the shapes of the congestion area 30, the first sharing area 31 and the second sharing area 32 in this embodiment are all circular, but in practical applications, the congestion area and the sharing area of the circuit layout are formed by a long The aspect ratio factor is determined, so the user can change the shape of the congestion area and the sharing area by setting different aspect ratio factors, such as square, rectangle or ellipse, without certain restrictions. In addition, the number of the congested area and the shared area of the circuit layout 3 defined by the definition module 22 may also depend on the actual analysis result of the analysis module 20 , and there is no certain limitation.
如图3A所示,电路布局3的壅塞区域30、第一分享区31及第二分享区32是以C(cx,cy)为圆心由内向外形成同心圆,其中壅塞区域30的半径为cr,第一分享区31的半径为psr,第二分享区32的半径为ssr,并且ssr>psr>cr。假设电路布局3的一电子元件原本的位置为O(ox,oy),oc_diff为O(ox,oy)至C(cx,cy)的距离,x_diff为oc_diff的水平分量,y_diff为oc_diff的垂直分量。As shown in FIG. 3A , the congestion area 30 , the first sharing area 31 and the second sharing area 32 of the circuit layout 3 form concentric circles from inside to outside with C(c x , cy ) as the center, wherein the radius of the congestion area 30 is cr, the radius of the first sharing area 31 is psr, the radius of the second sharing area 32 is ssr, and ssr>psr>cr. Assuming that the original position of an electronic component in circuit layout 3 is O(o x , o y ), oc_diff is the distance from O(o x , o y ) to C(c x , cy ) , x_diff is the horizontal component of oc_diff, y_diff is the vertical component of oc_diff.
如图3B所示,若电子元件原本的位置O(ox,oy)是位于壅塞区域30内,而经由扩展模块24移动至T(tx,ty)。该电子元件移动后的位置T(tx,ty)将会被限制于壅塞区域30及第一分享区31的范围内,并且移动后的位置T的坐标(tx,ty)可通过下列方程式1~3求得:As shown in FIG. 3B , if the original position O( ox , o y ) of the electronic component is located in the congested area 30 , it moves to T(t x , ty ) via the expansion module 24 . The moved position T(t x , ty ) of the electronic component will be limited within the congested area 30 and the first shared area 31, and the coordinates (t x , ty ) of the moved position T can be passed The following equations 1 to 3 are obtained:
sca_fac=psr/cr (方程式1)sca_fac=psr/cr (Equation 1)
tx=cx+(x_diff*sca_fac) (方程式2)t x =c x +(x_diff*sca_fac) (equation 2)
ty=cy+(y_diff*sca_fac) (方程式3)t y =c y +(y_diff*sca_fac) (Equation 3)
其中,方程式1所述的扩展比例sca_fac为第一分享区31的半径psr相对于壅塞区域30的半径cr的比例,亦即扩展比例sca_fac为壅塞区域30的中心点C至壅塞区域30的边界的距离相对于壅塞区域30的中心点C至第一分享区31的边界的距离的比例,但不以此为限。Wherein, the expansion ratio sca_fac described in Equation 1 is the ratio of the radius psr of the first sharing area 31 to the radius cr of the congestion area 30, that is, the expansion ratio sca_fac is the distance from the center point C of the congestion area 30 to the boundary of the congestion area 30 The ratio of the distance from the center point C of the congested area 30 to the boundary of the first sharing area 31 , but not limited thereto.
举例而言,如图4A及图4B所示,假设cr=10,psr=20,ssr=100,而壅塞区域30、第一分享区31及第二分享区32的边界(亦即圆周)分别为B1、B2及B3,若移动前的电子元件是分别位于壅塞区域30内的位置C(0,0)、D(5,0)及E(10,0),则根据上述方程式1及2即可求得移动后的电子元件的位置分别为C′(0,0)、D′(10,0)及E′(20,0)。For example, as shown in FIG. 4A and FIG. 4B , assuming that cr=10, psr=20, and ssr=100, the boundaries (that is, the circumference) of the congestion area 30, the first sharing area 31, and the second sharing area 32 are respectively B1, B2 and B3, if the electronic components before moving are respectively located in the positions C(0, 0), D(5, 0) and E(10, 0) in the congestion area 30, then according to the above equations 1 and 2 That is to say, the positions of the moved electronic components are C'(0,0), D'(10,0) and E'(20,0).
也就是说,扩展模块24将会依照一相关于一psr/cr比例(即第一分享区31的半径psr除以壅塞区域30的半径cr)的一数值将壅塞区域30内的各电子元件重新配置于壅塞区域30及第一分享区31的范围内,因而拉大各电子元件之间的距离,使得各电子元件的分布变得较为松散,故壅塞区域30的电子元件密度自然能够随的大幅降低。That is to say, the expansion module 24 will redistribute each electronic component in the congested region 30 according to a value related to a psr/cr ratio (that is, the radius psr of the first sharing region 31 divided by the radius cr of the congested region 30 ). It is arranged within the range of the congested area 30 and the first sharing area 31, thereby increasing the distance between the electronic components and making the distribution of the electronic components relatively loose, so the density of the electronic components in the congested area 30 can naturally be greatly increased. reduce.
同理,若电子元件原本的位置O(ox,oy)是位于第一分享区31或第二分享区32内,则该电子元件经由扩展模块24移动后的位置T(tx,ty)将会被限制于第二分享区32的范围内。T点的坐标位置(tx,ty)可通过下列方程式4~6求得:Similarly, if the original position O(o x , o y ) of the electronic component is located in the first sharing area 31 or the second sharing area 32, the position T(t x , t y ) will be limited within the scope of the second sharing area 32. The coordinate position (t x , ty ) of point T can be obtained by the following equations 4~6:
sca_fac=psr+((oc_diff-cr)*(ssr-psr)/(ssr-cr)) (方程式4)sca_fac=psr+((oc_diff-cr)*(ssr-psr)/(ssr-cr)) (equation 4)
tx=cx+(x_diff*sca_fac/oc_diff) (方程式5)t x =c x +(x_diff*sca_fac/oc_diff) (equation 5)
ty=cy+(y_diff*sca_fac/oc_diff) (方程式6)t y =c y +(y_diff*sca_fac/oc_diff) (Equation 6)
其中,方程式4所述的扩展比例sca_fac是相关于壅塞区域30的中心点C至第二分享区32的边界B3的距离(亦即第二分享区32的半径ssr)、壅塞区域30的中心点C至第一分享区31的边界B2的距离(亦即第一分享区31的半径psr)、壅塞区域30的中心点C至壅塞区域30的边界B1的距离(亦即壅塞区域30的半径cr)及壅塞区域30的中心点C至电子元件原本的位置O的距离。更详细地说,方程式4所述的扩展比例sca_fac是与第二分享区32相对于整个第一分享区31与第二分享区32的比例有关,但不以此为限。Wherein, the expansion ratio sca_fac described in equation 4 is the distance from the center point C of the congestion area 30 to the boundary B3 of the second sharing area 32 (that is, the radius ssr of the second sharing area 32), the center point of the congestion area 30 The distance from C to the boundary B2 of the first sharing area 31 (i.e. the radius psr of the first sharing area 31), the distance from the central point C of the congestion area 30 to the boundary B1 of the congestion area 30 (i.e. the radius cr of the congestion area 30 ) and the distance from the center point C of the congestion area 30 to the original position O of the electronic component. More specifically, the expansion ratio sca_fac described in Equation 4 is related to the ratio of the second sharing area 32 to the entire first sharing area 31 and the second sharing area 32 , but it is not limited thereto.
如图4A及图4C所示,若移动前的电子元件是分别位于第一分享区31或第二分享区32内的位置E(10,0)、F(15,0)、G(20,0)、H(50,0)及I(100,0),则根据上述方程式4~6即可得到移动后的电子元件的位置分别为E′(20,0)、F′(24.44,0)、G′(28.88,0)、H′(55.56,0)及I′(100,0),均位于第二分享区32内。As shown in Fig. 4A and Fig. 4C, if the electronic components before moving are located in positions E(10, 0), F(15, 0), G(20, 0), H(50, 0) and I(100, 0), then according to the above equations 4 to 6, the positions of the moved electronic components can be obtained as E′(20,0), F′(24.44,0 ), G′ (28.88, 0), H′ (55.56, 0) and I′ (100, 0), all located in the second sharing area 32 .
也就是说,原本位于第一分享区31或第二分享区32内的各电子元件经由扩展模块24移动后,扩展模块24将会依照一相关于sca_fac/oc_diff的比例的一数值拉大各电子元件之间的距离,使得原本位于第一分享区31的电子元件均移至范围较大的第二分享区32,藉以避免从壅塞区域30移至第一分享区31的电子元件导致原本电子元件密度较低的第一分享区31的电子元件密度因而大幅升高。That is to say, after the electronic components originally located in the first sharing area 31 or the second sharing area 32 are moved through the expansion module 24, the expansion module 24 will expand each electronic component according to a value related to the ratio of sca_fac/oc_diff. The distance between the components makes the electronic components originally located in the first sharing area 31 move to the second sharing area 32 with a larger range, so as to avoid the electronic components moving from the congested area 30 to the first sharing area 31 from causing the original electronic components Therefore, the density of electronic components in the first shared region 31 with lower density is greatly increased.
请参照图5A~图5C,图5A~图5C是绘示电子元件经由扩展模块移动后的位置刚好位于高电子元件密度区域时的处理方式。如图5A所示,假设中央的长方形为壅塞区域CR,其外侧的长方形为分享区域SR,O(0,0)为原点,电子元件原本的位置在P(1,1),斜线区域则为位于分享区域SR内的高电子元件密度区域HDR。Please refer to FIG. 5A to FIG. 5C . FIG. 5A to FIG. 5C illustrate the processing method when the position of the electronic component is just located in the high electronic component density area after being moved through the expansion module. As shown in Figure 5A, suppose the central rectangle is the congested area CR, the outer rectangle is the sharing area SR, O(0,0) is the origin, the original position of the electronic components is at P(1,1), and the oblique area is is the high electronic component density region HDR located in the sharing region SR.
如图5B所示,由于经过计算后所得到的移动后的电子元件位置为N1(3,2)刚好不幸地位于高电子元件密度区域HDR内,若扩展模块24真的将电子元件移动至N1(3,2),反而更增加HDR区域的电子元件密度,故此一移动并不可行。有鉴于此,本发明提出一种解决之道,是通过曼哈顿距离(Manhattan distance)计算以找出其它数个替代的移动点。依据曼哈顿距离的计算方式,两点之间的距离为两点在标准坐标是上的各绝对轴距的总和。As shown in FIG. 5B, since the calculated position of the electronic component after moving is N1 (3, 2), unfortunately it is located in the high electronic component density area HDR. If the expansion module 24 really moves the electronic component to N1 (3, 2), on the contrary, it increases the density of electronic components in the HDR area, so this movement is not feasible. In view of this, the present invention proposes a solution, which is to find several alternative moving points through Manhattan distance calculation. According to the calculation method of Manhattan distance, the distance between two points is the sum of the absolute wheelbases of the two points on the standard coordinates.
如图5C所示,由于原本求得的N1(3,2)与原本位置P(1,1)的曼哈顿距离=(3-1)+(2-1)=3,故可根据P(1,1)与曼哈顿距离3求得异于N1(3,2)的其它替代移动点N2(1,4)、N3(2,3)及N4(4,1)。既然这些替代移动点N2(1,4)、N3(2,3)及N4(4,1)均未位于高电子元件密度区域HDR内,故扩展模块24即可将电子元件移动至N2(1,4)、N3(2,3)或N4(4,1),且不会造成HDR区域的电子元件密度升高的现象。As shown in Figure 5C, due to the Manhattan distance between the originally obtained N1(3,2) and the original position P(1,1)=(3-1)+(2-1)=3, it can be calculated according to P(1 , 1) Obtain the alternative moving points N2(1,4), N3(2,3) and N4(4,1) different from N1(3,2) with a distance of 3 from Manhattan. Since these alternative moving points N2(1,4), N3(2,3) and N4(4,1) are not located in the high electronic component density region HDR, the expansion module 24 can move the electronic components to N2(1 , 4), N3 (2, 3) or N4 (4, 1), and will not increase the density of electronic components in the HDR area.
于实际应用中,使用者并不一定想要通过扩展模块24将所有位于壅塞区域CR内的电子元件均向外移动,亦即使用者有可能仅欲移动其中部分的电子元件。此时,使用者即可通过设定模块26设定原本位于壅塞区域CR内的所有电子元件中哪些电子元件需要被重新配置以及哪些电子元件维持固定不动。In practical applications, the user does not necessarily want to move all the electronic components in the congested area CR outward through the expansion module 24 , that is, the user may only want to move some of the electronic components. At this point, the user can set which electronic components among all the electronic components originally located in the congestion region CR need to be reconfigured and which electronic components remain fixed through the setting module 26 .
举例而言,如图6A所示,假设有多个组合元件(combination cell)c(例如或门(ORgate)和与非门(NAND gate))及多个循序元件(sequential cell)s(例如触发器(flip-flop)、锁相器(latch)和时脉栅控器(clock gate))均位于电路布局的壅塞区域CR内,为了能够维持该电路布局的嵌入延迟(insertion delay)的时脉行为(clock behavior),因此,使用者即可通过设定模块26设定仅有组合元件c会被移动,扩展模块24即会根据此一设定仅向外移动组合元件c,至于所有循序元件s的位置则维持固定不动。For example, as shown in Figure 6A, assume that there are multiple combination cells (combination cells) c (such as OR gates (ORgate) and NAND gates (NAND gate)) and multiple sequential cells (sequential cells) s (such as trigger The flip-flop, latch and clock gate are all located in the congestion region CR of the circuit layout, in order to maintain the clock of the insertion delay of the circuit layout Therefore, the user can set only the combination element c to be moved through the setting module 26, and the expansion module 24 will only move the combination element c outward according to this setting, as for all sequential elements The position of s remains fixed.
此外,如图7A所示,假设电路布局中总共包含三种电子元件模块,其中仅有电子元件模块CM的分布情形处于难以绕线的壅塞状态,其余两种电子元件模块AM及BM则均处于可绕线状态。此时,使用者即可通过设定模块26设定仅移动电子元件模块CM,扩展模块24即会根据此一设定仅向外移动电子元件模块CM,至于其它种类的电子元件模块AM及BM的位置则会维持固定不动。In addition, as shown in FIG. 7A , assuming that the circuit layout contains a total of three types of electronic component modules, only the distribution of the electronic component module CM is in a congested state that is difficult to wire, and the other two electronic component modules AM and BM are in a congested state. Coilable state. At this time, the user can set only the electronic component module CM to be moved through the setting module 26, and the expansion module 24 will only move the electronic component module CM outward according to this setting, as for other types of electronic component modules AM and BM The position will remain fixed.
根据本发明的第二具体实施例为一种防止壅塞配置方法。于此实施例中,该防止壅塞配置方法应用于一电路布局中,并且该电路布局包含多个电子元件。请参照图8,图8是绘示该防止壅塞配置方法的流程图。The second specific embodiment according to the present invention is an anti-congestion configuration method. In this embodiment, the anti-congestion configuration method is applied to a circuit layout, and the circuit layout includes a plurality of electronic components. Please refer to FIG. 8 , which is a flow chart illustrating the anti-congestion configuration method.
如图8所示,首先,该方法执行步骤S10,对该电路布局进行绕线壅塞状态分析以产生一分析结果。接着,该方法执行步骤S11,根据该分析结果于该电路布局定义出一壅塞区域以及邻近于该壅塞区域的一分享区域。实际上,该壅塞区域及该分享区域的形状是由一长宽比因子决定,故其形状可随着该长宽比因子的不同而为圆形、椭圆形、正方形、长方形或其它形状,并无一定的限制。As shown in FIG. 8 , firstly, the method executes step S10 , analyzing the state of winding congestion on the circuit layout to generate an analysis result. Next, the method executes step S11 , defining a congested area and a shared area adjacent to the congested area in the circuit layout according to the analysis result. In fact, the shapes of the congestion area and the sharing area are determined by an aspect ratio factor, so their shapes can be circular, oval, square, rectangular or other shapes depending on the aspect ratio factor, and There are no certain restrictions.
于此实施例中,该分享区域包含一第一分享区及一第二分享区,以该壅塞区域为中心,由内向外依序为该壅塞区域、该第一分享区及该第二分享区,但不以此为限。In this embodiment, the sharing area includes a first sharing area and a second sharing area, with the congested area as the center, the congested area, the first sharing area and the second sharing area in sequence from inside to outside , but not limited to this.
然后,该方法执行步骤S12,设定原本位于该壅塞区域内需要被重新配置的电子元件。最后,该方法执行步骤S13,重新配置这些电子元件,使得这些电子元件向外扩展而分布于该壅塞区域及该分享区域内。值得注意的是,在经过重新配置这些电子元件的步骤S13后,该电路布局的所有电子元件彼此之间的相对位置关系仍维持不变。Then, the method executes step S12 to set the electronic components that are originally located in the congested area and need to be reconfigured. Finally, the method executes step S13 to reconfigure the electronic components such that the electronic components expand outward and are distributed in the congested area and the shared area. It should be noted that after the step S13 of reconfiguring these electronic components, the relative positional relationship between all the electronic components of the circuit layout remains unchanged.
举例而言,原本位于该壅塞区域内的一第一位置的电子元件可依照相关于一第一扩展比例的一数值向外移至该壅塞区域或该第一分享区内的一第二位置,该第二位置可根据该壅塞区域的中心点、该第一位置及该相关于第一扩展比例的数值计算而得。于实际应用中,该相关于第一扩展比例的数值是与该壅塞区域的中心点至该壅塞区域的边界的距离以及该壅塞区域的中心点至该第一分享区的边界的距离有关,但不以此为限。至于该第二位置的计算方式可参照前述方程式1~3,于此不另行赘述。For example, electronic components originally located at a first location within the congested area may be moved outwards to a second location within the congested area or the first shared area according to a value associated with a first expansion ratio, The second position can be calculated according to the central point of the congested area, the first position and the value related to the first expansion ratio. In practical applications, the value related to the first expansion ratio is related to the distance from the center point of the congestion area to the boundary of the congestion area and the distance from the center point of the congestion area to the boundary of the first sharing area, but This is not the limit. As for the calculation method of the second position, reference may be made to the above-mentioned equations 1-3, which will not be repeated here.
此外,于该分享区域中,原本位于该第一分享区内的一第三位置的电子元件亦可依照相关于一第二扩展比例的一数值进行重新配置后,向外移至该第二分享区内的一第四位置并限制于该第二分享区,其中该第四位置是根据该壅塞区域的中心点、该第三位置及该相关于第二扩展比例的数值计算而得。实际上,该相关于第二扩展比例的数值是与该壅塞区域的中心点至该第二分享区的边界的距离、该壅塞区域的中心点至该第一分享区的边界的距离、该壅塞区域的中心点至该壅塞区域的边界的距离以及该壅塞区域的中心点至该第三位置的距离有关,但不以此为限。至于该第四位置的计算方式可参照前述方程式4~6,于此不另行赘述。In addition, in the sharing area, the electronic components originally located in a third position in the first sharing area can also be reconfigured according to a value related to a second expansion ratio, and then moved outward to the second sharing area. A fourth location within the zone is limited to the second sharing zone, wherein the fourth location is calculated based on the center point of the congested area, the third location, and the value associated with the second expansion ratio. In fact, the value related to the second expansion ratio is the distance from the center point of the congested area to the border of the second sharing area, the distance from the center point of the congested area to the border of the first sharing area, the congested The distance from the central point of the area to the boundary of the congested area and the distance from the central point of the congested area to the third location are related, but not limited thereto. As for the calculation method of the fourth position, reference may be made to the aforementioned equations 4-6, which will not be repeated here.
相较于先前技术,根据本发明的防止壅塞配置装置及方法是将原本仅配置于壅塞区域内的这些电子元件加以向外扩展分布至壅塞区域及其附近具有较低电子元件密度的分享区域,藉以降低壅塞区域原本较高的电子元件密度,使得该壅塞区域能够由原本难以绕线的区域变成可绕线的区域,并且壅塞区域与分享区域的电子元件密度变得较为平均。更重要的是,在经过本发明的防止壅塞配置装置及方法处理后,该电路布局的所有电子元件彼此之间的相对位置关系仍维持不变,使得该电路布局仍能通过时间限制,并且对于该电路布局而言,将不会有任何额外的面积损失产生。Compared with the prior art, the anti-congestion arrangement device and method according to the present invention expand and distribute the electronic components that were originally only arranged in the congested area to the congested area and its nearby sharing areas with lower electronic component density, In order to reduce the originally high density of electronic components in the congested area, the congested area can be changed from an area that is difficult to wire into an area that can be routed, and the density of electronic components in the congested area and the sharing area becomes more even. More importantly, after being processed by the anti-congestion configuration device and method of the present invention, the relative positional relationship between all electronic components of the circuit layout remains unchanged, so that the circuit layout can still pass the time limit, and for As far as the circuit layout is concerned, there will not be any additional area loss.
通过以上较佳具体实施例的详述,是希望能更加清楚描述本发明的特征与精神,而并非以上述所揭露的较佳具体实施例来对本发明的范畴加以限制。相反地,其目的是希望能涵盖各种改变及具相等性的安排于本发明所欲申请的专利范围的范畴内。Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various changes and equivalent arrangements within the scope of the claimed patent scope of the present invention.
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