CN102159032B - Process method for manufacturing flexible printed circuit board by adopting die cutting machine - Google Patents

Abstract

The invention discloses a process method for manufacturing a flexible printed circuit board by adopting a die cutting machine, which comprises the following steps: step one, processing the printed circuit into a die cutting tool; step two, cutting out the printed circuit on the metal foil adhesive tape by using a printed circuit die cutting mould by using a die cutting machine, and removing the metal foil waste of the non-printed circuit; thirdly, coating a layer of weak-adhesion film on the metal foil adhesive tape with the die-cut printed circuit; removing the metal foil adhesive tape release layer, and transferring the die-cut printed circuit on the flexible substrate; and fifthly, punching the appearance of the printed circuit board and the circuit via hole according to the printed circuit to obtain the flexible printed circuit board. The invention adopts the process method of manufacturing the flexible printed circuit board by the die cutting machine, changes the traditional manufacturing technology of etching the printed circuit board, greatly reduces the manufacturing cost and the manufacturing period of the printed circuit board, and solves the environmental protection problem caused by the electrolyte discharge treatment of the existing printed circuit board by adopting the etching technology.

Description

A process for manufacturing flexible printed circuit boards using a die-cutting machine

technical field

The invention belongs to the technical field of printed circuit board manufacturing, and relates to a method for manufacturing a flexible circuit board, in particular to a process method for manufacturing a flexible printed circuit board by using a die-cutting machine.

Background technique

Usual printed circuit boards, whether they are rigid or flexible printed circuit boards, generally use etching technology to etch printed circuits on copper foil coated with insulating substrates. Due to the use of etching technology, the waste electrolyte used for etching printed circuits It must be recycled before it can be discharged. Nevertheless, the discharged waste liquid still pollutes the environment to a certain extent, and the damage caused to the environment is still not small. Moreover, the cost of printed circuit boards remains high due to the rise in silver prices, and the printed circuit boards made have poor high voltage resistance.

Contents of the invention

The purpose of the present invention is to provide a process method for manufacturing flexible printed circuit boards using a die-cutting machine. It first makes the printed circuit into a hollow die-cutting tool, and uses the die-cutting machine to die-cut the required printed circuit board on the metal foil tape. Line metal foil, remove the unnecessary part of the waste material, and then put a layer of slightly sticky film on the die-cut printed circuit metal foil, and then transfer the printed circuit metal foil to the flexible film while removing the release layer. Printed circuit boards are made on non-volatile substrates, which changes the environmental protection problems in traditional printed circuit board manufacturing technologies.

The technical solution adopted in the present invention is a process method for manufacturing flexible printed circuit boards using a die-cutting machine, which process method consists of the following steps:

Step 1. Process into die-cutting tools according to the printed circuit;

Step 2, use a die-cutting machine to die-cut the printed circuit metal foil on the metal foil tape with a printed circuit die-cutting tool, and exclude non-printed circuit metal foil waste materials;

Step 3. On the adhesive tape with die-cut printed circuit metal foil, apply a layer of weak adhesive film;

Step 4, while removing the release layer of the metal foil tape, transfer the die-cut printed circuit metal foil to the flexible substrate;

Step 5, punching out the shape of the printed circuit board and the circuit via holes according to the printed circuit to obtain a flexible printed circuit board.

The method for manufacturing flexible printed circuit boards using a die-cutting machine according to the present invention is also characterized in that:

The present invention is a process method for manufacturing flexible printed circuit boards by adopting a die-cutting machine. It first makes a hollow die-cutting tool for die-cutting the printed circuit according to the printed circuit, and uses the die-cutting machine to die-cut out the required parts on the metal foil tape. Printed circuit metal foil, remove the non-printed circuit metal foil waste part, and then put a layer of slightly sticky film on the die-cut printed circuit metal foil tape, and remove the release layer at the same time. Printed wiring foils are transferred to flexible substrates to make printed wiring boards. The invention changes the manufacturing technology of the existing traditional printed circuit board using etching, and at the same time solves the environmental protection problem caused by the electrolyte discharge treatment of the existing printed circuit board using the etching technology.

Description of drawings

Fig. 1 is a schematic diagram of a flexible printed circuit board manufactured by a die-cutting machine of the present invention;

Fig. 2 is a schematic diagram of the process of removing the release layer of the metal foil tape in step 4 of the present invention, and transferring the die-cut printed circuit onto the flexible substrate.

In the figure, 1. Flexible substrate, 2. Printed circuit metal foil, 3. Release layer, 4. Slightly sticky film.

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

A process method for manufacturing a flexible printed circuit board by using a die-cutting machine, the process method is composed of the following steps:

Step 1. Process into die-cutting tools according to the printed circuit;

Step 2, use a die-cutting machine to die-cut the printed circuit metal foil on the metal foil tape with a printed circuit die-cutting tool, and exclude non-printed circuit metal foil waste materials;

Step 3. On the metal foil tape with die-cut printed circuit, apply a layer of weak adhesive film;

Step 4, while removing the release layer of the metal foil tape, transfer the die-cut printed circuit metal foil to the flexible substrate;

Step 5, punching out the shape of the printed circuit board and the circuit via holes according to the printed circuit to obtain a flexible printed circuit board.

The flexible printed circuit board described in the present invention may be a double-sided board, and the conductive ink is poured into the circuit conduction holes connecting the two sides through screen printing, so as to connect the circuits on the two sides of the printed circuit board.

The present invention is a technology different from the existing traditional printed circuit board which uses etching to corrode the printed circuit. It is a process method for manufacturing flexible printed circuit boards by using a die-cutting machine. For the hollow die-cutting tool of the circuit, use a die-cutting machine to die-cut the required printed circuit metal foil 2 on the metal foil tape, and remove the metal foil waste part of the non-printed circuit on the metal foil tape for recycling, leaving only the mold Cut the printed circuit metal foil 2, then put a layer of slightly sticky film 4 on the die-cut printed circuit metal foil 2, and then remove the release layer 3, transfer the printed circuit metal foil 2 to the flexible base Material 1 on. Finally, according to different printed circuits, punch out the shape of the printed circuit board and the circuit conduction hole, peel off the slightly sticky film 4, and then make a flexible printed circuit board.

The flexible printed circuit board made by the present invention is single-sided. If it is a double-sided printed circuit board, the conductive ink is poured into the circuit conduction holes connecting the two sides of the printed circuit board through screen printing, and the printed circuit board is connected. Lines on both sides.

The present invention uses a die-cutting machine to manufacture a process for flexible printed circuit boards, and the flexible base material 1 of the printed circuit board used is a PET board, or a PVC board, PE, PP board.

The invention changes the manufacturing technology of traditional printed circuit boards using etching, greatly reduces the manufacturing cost and cycle of printed circuit boards, and at the same time solves the environmental protection problems caused by the electrolyte discharge treatment of the existing printed circuit boards using etching technology. .

The above-described embodiment is only an example of the present invention, and is not used to limit the implementation and scope of rights of the present invention. All equivalent changes and modifications made according to the content described in the patent protection scope of the present application shall be included in the application of the present invention. within the scope of the patent.

Claims (1)

1. a process that adopts die-cutting machine to make flexibility printed circuit board, is characterized in that, this process is comprised of following steps:

Step 1, be processed into the cross cutting fixture according to printed wire;

Step 2, employing die-cutting machine go out printed wire with printed wire cross cutting fixture cross cutting on the metal forming adhesive tape, and get rid of the metal forming expense material of non-printed wire;

Step 3, on the adhesive tape of the good printed wire metal forming of cross cutting, the weak adhesive membrane of multiple last layer;

Step 4, be posted the printed wire metal forming of cross cutting on flexible substrate removing the metal forming adhesive tape in the shape layer;

Step 5 is gone out printed substrate profile and line conduction hole according to printed wire, obtains flexibility printed circuit board.

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