CN102157660A - Semiconductor packaging structure - Google Patents

Abstract

The invention discloses a semiconductor packaging structure, which comprises a bowl-shaped carrier, a semiconductor element and an electrode pin. The semiconductor element is supported on the bowl-cup carrier and positioned in the containing cup groove of the bowl-cup carrier, and the electrode pin is electrically connected with the semiconductor element through an electric connection wire. At least one channel is concavely arranged on the part of the groove wall of the accommodating cup groove, which is positioned between the semiconductor element and the electrode pin, and the electric connecting wire passes through the channel. Therefore, the length of the routing and the cost of the wire are reduced, and the electric connecting wire is protected.

Description

Semiconductor Package Structure

technical field

The present invention relates to a packaging structure, especially a packaging structure suitable for semiconductor components such as integrated circuits (Integrated Circuits; IC) or light emitting diodes (Light Emitting Diode; LED).

Background technique

Due to the advantages of long life, small size, high shock resistance, low heat generation and low power consumption, light-emitting diodes have been widely used in indicator lights or light sources of household appliances and various instruments. In recent years, due to the development of light-emitting diodes towards multi-color and high-brightness, their application range has been expanded to various portable electronic products, as a backlight for small displays, and has become a new lighting concept that combines power saving and environmental protection. light source.

Please refer to FIG. 1, which shows a partial schematic diagram of an existing LED packaging structure. The existing LED packaging structure mainly includes a bowl carrier 1, a LED chip 2 such as a blue or red LED chip, and an anode terminal. Pin 3 , a negative pole pin 4 , and a lens layer 8 . The LED chip 2 is fixed in the bowl groove 5 defined by the bowl carrier 1 .

The LED chip 2 is electrically connected to the anode pin 3 and a cathode pin 4 through two electrical connecting wires 7 . The lens layer 8 covers the LED chip 2 , the electrical connection wire 7 , and part of the positive pin 3 and part of the negative pin 4 .

As far as the existing structure is concerned, the groove wall 6 of the bowl and cup groove 5 is a complete ring, so when operating the wiring step of the electrical connecting wire 7, it is necessary to make the electrical connecting wire 7 cross the groove wall 6 to connect the light emitting diode chip 2 and the corresponding pins.

Contents of the invention

The invention provides a semiconductor packaging structure, which reduces the required length of the electrical connection wires between the semiconductor element and the external pins in the structure to save costs, and the electrical connection wires can be better protected before the protective layer is formed. The semiconductor packaging structure provided by the present invention also has the advantage of reducing damage to electrical connection wires caused by colloid hardening and shrinkage when the protective layer is an LED lens colloidal material.

The semiconductor packaging structure of the present invention includes a bowl carrier, a semiconductor element, and an electrode pin. The cup carrier defines a cup accommodating groove, and the semiconductor element is carried on the cup carrier and located in the cup accommodating groove.

The electrode pins are electrically connected to the semiconductor element through an electrical connection line. At least one channel is recessed in the part of the groove wall of the accommodating cup groove located between the semiconductor element and the electrode pin, wherein the electrical connection wire passes through the channel.

Through the above structure, not only the length of the gold wire is reduced, the difficulty of wire bonding across the cup groove is reduced, but also the gold wire is properly protected to avoid wire arc damage caused by human or equipment collisions in the subsequent packaging process , tearing off and so on.

The above-mentioned cup carrier may include a metal bearing part and an insulating frame, the semiconductor element is supported on the metal bearing part, and the insulating frame defines a cup accommodating groove.

The above-mentioned electrode pins may or may not protrude from one side of the insulating frame. The metal bearing part and the electrode pins can be made of the same material and come from the same metal sheet. The metal bearing part may further include an auxiliary fixing hole, and a part of the insulating frame body fills the auxiliary fixing hole to strengthen the bonding force.

The above-mentioned electrode pin may include a groove for placing a Zener diode. The semiconductor element can be a light emitting diode chip or an integrated circuit chip.

Description of drawings

FIG. 1 is a partial schematic diagram of an existing LED package structure;

FIG. 2 is an exploded view of the semiconductor package structure of the first preferred embodiment of the present invention;

3 is a perspective view of a semiconductor package structure in a first preferred embodiment of the present invention;

FIG. 4 is a perspective view of a semiconductor package structure according to a second preferred embodiment of the present invention.

[Description of main component symbols]

Cup carrier 1 LED chip 2

Positive pin 3 Negative pin 4

Bowl groove 5 groove wall 6

Electrical connection wire 7 Lens layer 8

Bowl cup carrier 10 Accommodating cup slots 101, 201

Channel 102, 103, 202, 203 Metal bearing part 11

Insulation frame 12 side 121, 122, 204, 205

Positive electrode pins 13, 22 Wire section 131, 141

External introduction section 132, 142 Groove 133, 143

Negative electrode pin 14, 23 Semiconductor element 15, 21

Electrical connection wire 16, 17 Auxiliary fixing hole 18

Detailed ways

Referring to FIGS. 2 and 3 , it is an exploded view and a perspective view of a semiconductor package structure according to a preferred embodiment of the present invention. A semiconductor packaging structure includes a bowl cup carrier 10, a positive electrode pin 13, a negative electrode pin 14, and a semiconductor element 15, wherein the bowl cup carrier 10 is composed of a metal bearing part 11, and a roughly quadrilateral An insulating frame body 12 is formed. The semiconductor element 15 in this embodiment is a light emitting diode (LED) chip.

The metal bearing portion 11 , the positive electrode pin 13 , and the negative electrode pin 14 are from the same punched metal sheet. The positive electrode pin 13 includes a bonding segment 131 and two lead segments 132 located at both ends of the bonding segment 131; similarly, the negative electrode pin 14 includes a bonding segment 141 and two lead segments 142 located at both ends of the bonding segment 141 .

The insulating frame 12 is mainly composed of the aforementioned metal sheet including the metal bearing part 11, the positive electrode pin 13, and the negative electrode pin 14, and covers the metal bearing part 11 and the two electrode pins 13 by injection molding. , 14, and the structure of the insulating frame 12 presents a cup groove 101 . Three grooves 102 , 103 are recessed in the portions of the groove walls on opposite sides of the receiving cup groove 101 between the semiconductor element 15 and the electrode pins 13 , 14 .

In the packaging structure shown in FIG. 3 , the lead-out section 132 of the positive electrode pin 13 and the lead-out section 142 of the negative electrode pin 14 respectively protrude from two opposite sides 121 , 122 of the insulating frame 12 .

The semiconductor element 15 is electrically connected to the external lead segment 132 of the positive electrode pin 13 and the external lead segment 142 of the negative electrode pin 14 through electrical connection wires 16 and 17 (generally gold wires are used).

The following is a brief description of the manufacturing process of the semiconductor element package structure in this example: First, the die-bonding step after the above-mentioned injection molding step is to fix the semiconductor element 15 (LED chip) on the metal supporting part 11 and position it in the accommodating cup groove 101 middle. Then a wire bonding step is performed to electrically connect the semiconductor element 15 and the two electrode pins 13 , 14 with electrical connection wires 16 , 17 .

After the wiring is completed, the electrical connecting wires 16, 17 are all located in the channels 102, 103, thus playing the role of protecting the electrical connecting wires 16, 17. Be careful not to collide and cause arc crushing, tearing and other situations. In addition, since the electrical connecting wires 16, 17 directly pass through the channels 102, 103, unlike the existing structure, which needs to cross the wall of the receiving cup, the length of the gold wire is significantly reduced. Moreover, the difficulty of wire bonding without crossing the wall of the receiving cup groove is lower than that of the existing ones, so it also has the effect of improving the yield rate.

It is worth mentioning that the metal supporting part 11 of this embodiment is also provided with two auxiliary fixing holes 18, so that when the insulating frame body 12 covers the metal supporting part 11 by injection molding, the auxiliary fixing holes 18 are also filled. , so that there is a better combination between the two. In addition, the wire bonding section 131 of the positive electrode pin 13 and the wire bonding section 141 of the negative electrode pin 14 are respectively impacted to form grooves 133 and 143 for placing Zener diodes (not shown).

The LED of the embodiment can be applied to various light sources such as interior decorative lighting, indoor auxiliary lighting, outdoor landscape lighting, street lighting, indicator lights, advertising display lamps, and displays.

Generally speaking, considering the heat conduction effect of the chip, the material of the metal carrying part is preferably iron, aluminum, or copper and other metals with good heat conduction.

Referring to FIG. 4, it is a second embodiment of the present invention. This embodiment shows an integrated circuit (IC) packaging structure, the semiconductor element 21 is an IC chip, and only a single channel 202, 203 is recessed on opposite sides of the accommodating cup groove 201 of the insulating frame. In addition, neither the positive electrode lead out section 22 nor the negative electrode lead out section 23 protrudes from the two opposite sides 204 , 205 of the insulating frame.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments.

Claims (9)

1. semiconductor package comprises:

One bowl of cup carrier defines one ccontaining glass of groove;

Semiconductor element, bearing are on this bowl cup carrier and be positioned at this ccontaining cup groove; And

One electrode pin is electrically connected at this semiconductor element by an electric connection line; It is characterized in that:

The part that the cell wall of this ccontaining cup groove is positioned between this semiconductor element and this electrode pin is concaved with at least one channel, and this electric connection line passes this channel.

2. encapsulating structure as claimed in claim 1 is characterized in that, this bowl cup carrier includes a metal supporting part, reaches an insulation framework, and this semiconductor element bearing is in this metal supporting part, and this insulation framework defines this ccontaining cup groove.

3. encapsulating structure as claimed in claim 2 is characterized in that, this electrode pin is outstanding from a side of this insulation framework.

4. encapsulating structure as claimed in claim 2 is characterized in that, this electrode pin flushes the side in this insulation framework.

5. encapsulating structure as claimed in claim 2 is characterized in that, this metal supporting part and this electrode pin are identical material.

6. encapsulating structure as claimed in claim 2 is characterized in that, this metal supporting part also includes an auxiliary fixing hole, and this insulation framework part is filled in this auxiliary fixing hole.

7. encapsulating structure as claimed in claim 1 is characterized in that, this electrode pin includes a groove.

8. encapsulating structure as claimed in claim 1 is characterized in that, this semiconductor element is a light-emitting diode chip for backlight unit.

9. encapsulating structure as claimed in claim 1 is characterized in that, this semiconductor element is an integrated circuit (IC) chip.

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