CN102157486A - Semiconductor circuit assembly - Google Patents
Semiconductor circuit assembly Download PDFInfo
- Publication number
- CN102157486A CN102157486A CN2011100200860A CN201110020086A CN102157486A CN 102157486 A CN102157486 A CN 102157486A CN 2011100200860 A CN2011100200860 A CN 2011100200860A CN 201110020086 A CN201110020086 A CN 201110020086A CN 102157486 A CN102157486 A CN 102157486A
- Authority
- CN
- China
- Prior art keywords
- contact
- segment
- bearing
- making surface
- arrange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000002131 composite material Substances 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/182—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for flat conductive elements, e.g. flat cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/592—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connections to contact elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/188—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping having an uneven wire-receiving surface to improve the contact
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention relates to a semiconductor circuit assembly which comprises a connecting device (1) provided with a first contact section (2) and formed from a composite film, a connection element (3) provided with a second contact section (4), a housing including a counter bearing (5) for supporting one of the contact sections (2, 4), and a mechanism generating clamping force to forcing the contact section (4) abut against each other. In order to improve the flow bearing capacity of the contact, the first contact section (2) and or the second contact section (4) and/or the counter bearing (5) include respective contact areas (A, B, C, D, E, F), where the contact areas are different from each other. One of the superimposed arranged contact sections (2, 4) deforms when exercising clamping force, where the section is adapted to shape of the other contact section during an electrical contact.
Description
Technical field
The present invention relates to a kind of by claim 1 semiconductor circuit layout as described in the preamble.
Background technology
This semiconductor circuit is arranged for example known by DE 10 2,006 027 482B3.In known semiconductor circuit is arranged, for contact element set in the substrate is used jockey with being used to be connected the joint component connection of external loading joint.What relate at this is a kind of pliable and tough film composite structure (Folienverbund), wherein covers to be added with conductor belt on the upside of the electric insulating film that is made of plastics and downside.Contact set in conductor belt and the substrate for example is connected by soldering.
To electrically contact in order producing, the terminal first set contact-segment of being positioned at of jockey to be bearing on the regional set bearing of housing wall with joint component.Being contained in the recessed crack of housing, crooked spring element forces second contact-segment of joint component supporting first contact-segment.
Known between first contact-segment and second contact-segment electrically contacts and is communicated with, TV structure and can not guarantee whole ground contact between the contact-segment surely all the time.This point especially undesirable heating occurs and causes interference to electrically contact thus when the big electric current of transmission.Under the situation of spring element fracture, can cause in disadvantageous mode in addition: electrically contact at least temporarily and interrupt fully.
Summary of the invention
The objective of the invention is to, eliminate the shortcoming of prior art.Especially will point out that a kind of semiconductor circuit arranges, the salient point that this semiconductor circuit is arranged is to be used for contacting especially reliably between the jockey that is connected with circuit and the joint component.
This purpose is achieved by the feature of claim 1.The present invention conforms with the make of purpose and is learnt by the feature of claim 2 to 10.
According to measure of the present invention, first contact-segment and/or second contact-segment and/or bearing have the contact-making surface that differs from one another, thereby when applying clamping force, at least one contact-segment in two contact-segments of arranging overlappingly deforms and adapts with the shape of another contact-segment under the situation that formation electrically contacts.The salient point that the semiconductor circuit that is proposed is arranged is especially reliably, not to be subject between joint component and the jockey disturb and durable electrically contacting.Proposed by the invention the electrically contacting of foundation has very high current capacity and can simply and inexpensively make.Especially between joint component and jockey, do not need the relative high soldering connection of manufacturing cost, melting welding connection or sintering to connect.
On meaning of the present invention, notion " jockey " especially is interpreted as film composite structure, wherein on pliable and tough ambroin layer or plastic film, cover and be added with one or more conductor belt.Also side and downside are provided with conductor belt to plastic layer thereon.Film composite structure also can be formed by a plurality of plastic layers, and these plastic layers have the conductor belt that is connected between these plastic layers.Each layer can have 10 μ m to the layer thickness between the 500 μ m.
Notion " contact-segment " is interpreted as the conductive segment of joint component and/or jockey.In the zone of contact-segment, conform with the metallization that the destination is set to whole.Contact-segment conforms with the destination and constitutes aspect its size and dimension with corresponding to each other.
With notion " contact-making surface " be interpreted as contact-segment as lower surface, this surface contacts with another contact-making surface bearing and/or another contact-segment.That is to say that each contact-segment in the contact-segment all has two " contact-making surfaces ".Two " contact-making surfaces " of a contact-segment can identical or also can differently be implemented.Bearing and/or pairing bearing can have " contact-making surface " equally.At least one contact-making surface in the stacked contact-making surface has the different in other words type exterior feature of different shapes, thereby when contact-segment was being supported bearing and contacted, a contact-segment of two contact-segments deformed, and wherein contact-making surface shape is sealedly each other by putting.Therefore realize whole basically ground contact between the contact-making surface.
What have advantage is that bearing is arranged on the lower case section.Especially, bearing can be arranged in the zone of wall section.On the upper body section, can be provided with the pairing bearing corresponding with bearing.In this case, can according to simple especially mode when being installed in the upper body section on the lower case section, can on the contact-segment of putting between the two, produce clamping force.That is to say that the contact connection between the contact-segment can realize simultaneously with the installation of shell section in the make that is proposed.Clamping force has advantage ground in this case and produces between the bearing with matching by first contact-segment and second contact-segment being clamped in bearing.In this case, what have advantage is to there is no need to be provided for producing the independent clamping device of clamping force.
Clamping force also can produce by flexible mechanism, and described flexible mechanism forms bearing or pairing bearing.For example can use the lasting flexible layer of making by flexible foamed material, rubber or analog as flexible mechanism.
According to a kind of make with advantage, at least one contact-making surface in the contact-making surface constitutes the type exterior feature that has arch in other words archedly.If the contact-making surface of bearing constitutes archedly, conform with the destination so, another contact-making surface of pairing bearing and its constitute accordingly.Be clamped in by the contact-segment that will for example flatly implement basically between the arch contact-making surface of bearing and pairing bearing, contact-segment deforms and therefore realizes whole ground contact.What can realize similar effect is, for example in two contact-segments only contact-segment have in the contact-making surface of the contact-making surface of arch or contact-segment a contact-making surface archedly the contact-making surface of formation and bearing and pairing bearing flatly constitute.
Have the make of advantage according to another kind, at least one the contact-making surface rolling country in the contact-making surface constitutes the type exterior feature that has waveform in other words.For example, be clamped in by the contact-segment that will have basically the contact-making surface that flatly constitutes between bearing with the waveform contact-making surface that constitutes and the pairing bearing with corresponding to each other, can be safely and guarantee whole contacting between the contact-segment reliably.
According to another kind of make, at least one contact-making surface in the contact-making surface has at least one ware shape lug boss.Conform with the destination and be provided with a large amount of this lug bosses.Ware shape lug boss can be hemispherical ground, the coniform ground of frustum, frustum rib centrum shape ground or analogous shape ground structure.If this ware shape lug boss both had been arranged in the make of correspondence on the contact-making surface of contact-segment, be arranged on again on the contact-making surface of bearing and pairing bearing, can realize contact-segment fixing so in mode with advantage about bearing and/or pairing bearing.That is to say that in this make, joint component no longer can be without a doubt with respect to support movement under stationary state.
According to another kind of make, at least one contact-making surface in the contact-making surface has the protrusion of extension.It for example can be arranged on the conductor belt on first contact-segment at this.That is to say that in this make, therefore first contact-segment has a mind to not whole metallize.If the contact-making surface of second contact-segment flatly constitutes, applying under the situation of clamping force so, second contact-segment is molded on first contact-segment and therefore guarantees that at least whole ground electrically contacts in the zone of conductor belt.
Description of drawings
By accompanying drawing embodiments of the invention are elaborated below.Wherein:
Fig. 1 illustrates the perspective partial view of first make,
Fig. 2 illustrates the perspective partial view of second make,
Fig. 3 illustrates the perspective partial view of the 3rd make,
Fig. 4 illustrates the perspective partial view of the 4th make, and
Fig. 5 illustrates the detailed view according to Fig. 4.
Embodiment
In Fig. 1, adopt Reference numeral 1 to mark jockey, this jockey is formed by film composite structure.Film composite structure comprises the electric insulating film that at least one is made of plastics, and this electric insulating film has metallization at least one side.Metallization for example can be constructed in the mode of conductor belt.Certainly, this metallization can be arranged on the both sides of electric insulation plastic film.Adopt Reference numeral 2 to mark first contact-segment of film composite structure 1.In the zone of first contact-segment, metallization is appearing, yet described metallization can be capped for the purpose that insulate by another ambroin layer in other cases.As seeing from Fig. 1, jockey also can have two first contact-segments 2 on its two ends.First contact-segment 2 has the first contact-making surface A and opposed (can't see) second contact-making surface B here.
Adopt Reference numeral 3 to mark joint component, this joint component is made by sheet material usually.Joint component 3 is used to produce load connector.Adopt Reference numeral 4 to mark second contact-segment of joint component 3.The 3rd contact-making surface C of second contact-segment 4 and opposed the 4th contact-making surface D (not shown here) constitute separately archedly.Bearing 5 can be the part of the lower case section 6 that here only schematically shows.This bearing especially is arranged in the zone of wall of lower case section 6.The 5th contact-making surface of bearing 5 adopts Reference numeral E to mark.
Adopt Reference numeral 7 to mark the pairing bearing, this pairing bearing can (not be shown specifically) part of upper body section here.Here the 6th contact-making surface that constitutes equally archedly adopts Reference numeral F to mark.
In make shown in Figure 1, the 5th and the 6th contact-making surface E, the F of bearing 5 and pairing bearing 7 constitute archedly.Similarly, contact-making surface A, the B of first contact-segment 2 and second contact-segment 4 also constitute archedly.Contact-making surface A, the B of first contact-segment 2 differently constitutes with the type exterior feature of contact-making surface C, the D of second contact-segment 4 on its type exterior feature, that is to say that the former for example can slightly more flatly or more archedly constitute.
In order to contact producing between jockey 1 and the joint component 3, at first second contact-segment 4 is arranged on the bearing 5.Then, settle first contact-segment 2 thereon, and for example connection forces pairing bearing 7 supporting bearing 5 by bolt.By the clamping force that therefore produces, the type exterior feature of the 6th contact-making surface F of at least the first contact-segment 2 and pairing bearing 7 wide with the type of the 5th contact-making surface E of the type exterior feature of contact-making surface C, the D of second contact-segment and bearing 5 in shape at it adapts or is molded on these type exterior features.Therefore, between first contact-segment 2 and second contact-segment 4, form reliably and whole contact.
In second embodiment shown in Figure 2, the 5th contact-making surface E of bearing 5 and the 4th contact-making surface D of second contact-segment 4 flatly constitute.The 6th contact-making surface F of pairing bearing 7 and the 3rd contact-making surface C of second contact-segment 4 become the rolling country structure.Therefore contact-making surface A, the B of first contact-segment 2 can flatly construct or be provided with ripple slightly, thereby this first contact-segment adapts with the shape of the 3rd contact-making surface C and produces whole contact when applying clamping force.
In the 3rd make shown in Figure 3, the electric insulating film 8 of jockey 1 has a plurality of conductor belts 9 on the side thereon.Conductor belt 9 is slightly protuberance and the therefore protrusion of formation extension on the surface of electric insulating film 8.Bearing 5 and pairing bearing 7 have smooth contact-making surface E, F here.Similarly, contact-making surface C, the D of second contact-segment 4 flatly constitute.Bearing 5 is here made by elastomer 9a in the mode that conforms with purpose.When applying clamping force, force second contact-segment 4 supporting first contact-segment (can't see) here by pairing bearing 7.At this, first contact-segment with the acting in conjunction of elastomer 9a under deform, electrically contact closely thereby between first contact-segment and second contact-segment 4, form.
In the make shown in the Figure 4 and 5, contact-making surface A, C, the E of bearing 5, first contact-segment 2 and second contact-segment 4 has lug boss 10 that correspond to each other, ware shape.Ware shape lug boss 10 is rib centrum shape ground and frustum rib centrum shape ground formation here.These ware shape lug bosses are installed on the position that is superimposed, thereby first contact-segment 2 and second contact-segment 4 are not remaining on the bearing 5 on the position of piling up mutually basically not displaceablely.By on its 6th contact-making surface F accordingly the pairing bearing (not shown here) of structure apply clamping force, especially the shape of first contact-segment 2 can adapt with the shape of the shape of second contact-segment 4 and bearing 5 and therefore produce whole and reliable electrical contact.
Reference numerals list
1 connects device
2 first contact sections
3 joint components
4 second contact sections
5 bearings
6 lower case sections
7 pairing bearings
8 electric insulating films
9 conductor belts
The 9a elastomer
The lug boss of 10 ware shapes
A, B, C, D, E, F contact-making surface
Claims (10)
1. semiconductor circuit is arranged, described semiconductor circuit is arranged and comprised:
The jockey (1) that forms by film composite structure, have first contact-segment (2), the joint component (3) with second contact-segment (4),
Have the housing of the bearing (5) that is used to support one of two described contact-segments (2,4) and be used to produce and force stacked described contact-segment (2,4) supporting the mechanism of clamping force each other,
It is characterized in that,
Described first contact-segment (2) and/or described second contact-segment (4) and/or described bearing (5) have the contact-making surface (A, B, C, D, E, F) that differs from one another, thereby when applying described clamping force, at least one contact-segment in two described contact-segments (2,4) of arranging overlappingly deforms and adapts with the shape of another described contact-segment (2,4) under the situation that formation electrically contacts.
2. arrange that by the described semiconductor circuit of claim 1 wherein, described bearing (5) is arranged on the lower case section.
3. arrange that by claim 1 or 2 described semiconductor circuits wherein, the upper body section is provided with the pairing bearing (7) corresponding with described bearing (5).
4. arrange by claim 1 or 2 described semiconductor circuits that wherein, described clamping force produces between the bearing (7) by described first contact-segment (2) and described second contact-segment (4) are clamped in bearing (5) and match.
5. arrange that by claim 1 or 2 described semiconductor circuits wherein, described clamping force produces by flexible mechanism (9a), described flexible mechanism forms described bearing (5) or described pairing bearing (7).
6. arrange that by claim 1 or 2 described semiconductor circuits wherein, at least one contact-making surface in the described contact-making surface (A, B, C, D, E, F) constitutes archedly.
7. arrange by claim 1 or 2 described semiconductor circuits that wherein, at least one the contact-making surface rolling country in the described contact-making surface (A, B, C, D, E, F) constitutes.
8. arrange that by claim 1 or 2 described semiconductor circuits wherein, at least one contact-making surface in the described contact-making surface (A, B, C, D, E, F) has at least one ware shape lug boss (10).
9. arrange that by claim 1 or 2 described semiconductor circuits wherein, at least one contact-making surface in the described contact-making surface (A, B, C, D, E, F) has the protrusion of extension.
10. arrange that by claim 1 or 2 described semiconductor circuits wherein, the protrusion of described extension is arranged on the conductor belt (9) on described first contact-segment (2).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010000834.6 | 2010-01-12 | ||
| DE102010000834 | 2010-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102157486A true CN102157486A (en) | 2011-08-17 |
Family
ID=43627005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100200860A Pending CN102157486A (en) | 2010-01-12 | 2011-01-11 | Semiconductor circuit assembly |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2343780A1 (en) |
| CN (1) | CN102157486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514069A (en) * | 2014-10-13 | 2016-04-20 | 赛米控电子股份有限公司 | Arrangement with power semiconductor module, DC voltage rail and capacitor means |
| CN106059258A (en) * | 2015-04-09 | 2016-10-26 | 赛米控电子股份有限公司 | Arrangement having a power-electronic component and a DC-voltage busbar |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016104283B4 (en) * | 2016-03-09 | 2019-05-16 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor device with a power semiconductor module with a housing |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754720B2 (en) * | 1987-04-10 | 1995-06-07 | Electrical connection terminals for flexible printed circuit boards | |
| GB8826180D0 (en) * | 1988-11-08 | 1988-12-14 | Amp Gmbh | Electrical terminal for foil conductor |
| DE69013964T2 (en) * | 1989-04-21 | 1995-06-01 | Whitaker Corp | Method of connecting flat power cables. |
| US5743747A (en) * | 1997-01-13 | 1998-04-28 | Hughes Electronics | Dimpled connector |
| US6118666A (en) * | 1998-01-12 | 2000-09-12 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed wiring board and connecting structure thereof |
| US6017244A (en) * | 1998-02-09 | 2000-01-25 | The Whitaker Corporation | Interconnection mechanism for flexible printed circuits |
| JP2001273941A (en) * | 2000-03-28 | 2001-10-05 | Sumitomo Wiring Syst Ltd | Assembling method of terminal metal fitting and flat type conductor |
| WO2007131537A1 (en) * | 2006-05-16 | 2007-11-22 | Fci | Connector of flat conductors |
| DE102006027482B3 (en) | 2006-06-14 | 2007-08-16 | Semikron Elektronik Gmbh & Co. Kg | Housed semiconductor circuit arrangement e.g. power semiconductor module, has two conductive layers with contact device to joint surface of semiconductor component, where part of conductive layers is part of another contact device |
-
2010
- 2010-11-25 EP EP10192530A patent/EP2343780A1/en not_active Withdrawn
-
2011
- 2011-01-11 CN CN2011100200860A patent/CN102157486A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514069A (en) * | 2014-10-13 | 2016-04-20 | 赛米控电子股份有限公司 | Arrangement with power semiconductor module, DC voltage rail and capacitor means |
| CN105514069B (en) * | 2014-10-13 | 2019-04-02 | 赛米控电子股份有限公司 | Device with power semiconductor modular, DC voltage busbar connector and capacitor devices |
| CN106059258A (en) * | 2015-04-09 | 2016-10-26 | 赛米控电子股份有限公司 | Arrangement having a power-electronic component and a DC-voltage busbar |
| CN106059258B (en) * | 2015-04-09 | 2020-06-12 | 赛米控电子股份有限公司 | Arrangement with power electronics and DC voltage bus |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2343780A1 (en) | 2011-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110817 |