CN102156135A - Measuring method and device of laser damaged silicon-based detector - Google Patents
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Abstract
光电探测器是光电检测系统的核心部件,在一些特殊的场合,光电传感器经常要与激光光源配合使用,因而不可避免地存在激光对光电传感器的破坏问题。本发明属光电测试领域,提供了一种激光毁伤硅基探测器的测量方法和装置。根据强激光辐照前后探测器表面形貌、光电流、暗电流以及响应度的变化,判断激光对探测器损伤程度。以前对激光辐照探测器的研究,主要侧重于损伤阈值和损伤机理,对于定量研究探测器损伤过程中暗电流、光电流及响应度变化没有被报道。本发明能够在线检测探测器损伤过程中电学参量及表面形貌的变化,具有全面、准确、方便等优点,适用于硅基单元探测器的损伤检测以及激光诱导探测器的损伤机理研究。可以应用到激光加工、光学部件质量检测、激光器的研制等领域。The photodetector is the core component of the photoelectric detection system. In some special occasions, the photoelectric sensor is often used in conjunction with the laser light source, so there is inevitably the problem of laser damage to the photoelectric sensor. The invention belongs to the field of photoelectric testing and provides a measurement method and device for laser damage silicon-based detectors. According to the changes of the surface morphology, photocurrent, dark current and responsivity of the detector before and after strong laser irradiation, the degree of laser damage to the detector can be judged. Previous studies on laser irradiation detectors mainly focused on the damage threshold and damage mechanism, and the quantitative research on the changes of dark current, photocurrent and responsivity in the process of detector damage has not been reported. The invention can detect the changes of electrical parameters and surface topography during the damage process of the detector on-line, has the advantages of comprehensiveness, accuracy and convenience, and is suitable for the damage detection of silicon-based unit detectors and the damage mechanism research of laser-induced detectors. It can be applied to laser processing, optical component quality inspection, laser development and other fields.
Description
技术领域technical field
本发明涉及一种激光毁伤硅基探测器的测量方法和装置,可以用于光电测试,应用领域包括探测器的研制、激光加工和科学研究等领域。The invention relates to a measurement method and device for laser damage silicon-based detectors, which can be used for photoelectric testing, and the application fields include the development of detectors, laser processing, scientific research and other fields.
背景技术Background technique
光电探测器是光电检测系统的核心部件,广泛的应用于军事、工业、医疗等各领域。在一些特殊的场合,光电传感器经常要与激光光源配合使用,因而不可避免地存在激光对光电传感器的破坏问题。探测器被强激光损伤后,性能会发生改变,表现为响应度下降,暗电流上升。Photodetectors are the core components of photoelectric detection systems and are widely used in military, industrial, medical and other fields. In some special occasions, photoelectric sensors are often used in conjunction with laser light sources, so there is inevitably a problem of laser damage to photoelectric sensors. After the detector is damaged by strong laser light, its performance will change, manifested as a decrease in responsivity and an increase in dark current.
国内外学者对于强激光辐照探测器进行了大量的理论和实验工作,主要侧重于激光辐照探测器的损伤阈值和损伤机理研究,而对于探测器损伤后光电流、暗电流和响应度的变化研究的极少。而掌握激光诱导探测器损伤后性能的变化规律对研究激光辐照探测器的损伤机理,提高探测器的抗激光损伤能力具有重要意义。Scholars at home and abroad have done a lot of theoretical and experimental work on strong laser irradiation detectors, mainly focusing on the damage threshold and damage mechanism of laser irradiation detectors, and the photocurrent, dark current and responsivity of detectors after damage Changes are rarely studied. It is of great significance to master the change rule of the performance of laser-induced detector damage to study the damage mechanism of laser-irradiated detectors and improve the ability of detectors to resist laser damage.
本发明提供了一套激光毁伤硅基探测器的测量方法和装置,采用CCD成像技术获得强激光辐照前后探测器表面形貌图像,采用电流检测技术测量激光辐照前后光电流、暗电流以及探测器响应度的变化,根据表面形貌和响应性能的变化判定激光对探测器的损伤情况。该实验装置准确、简洁、易于操作,能对激光辐照探测器表面损伤进行实时监测,适用于激光辐照硅基单元探测器损伤效应的研究。The invention provides a set of measurement method and device for laser damage silicon-based detectors, adopts CCD imaging technology to obtain detector surface topography images before and after strong laser irradiation, uses current detection technology to measure photocurrent, dark current and The change of the responsivity of the detector is used to determine the damage of the laser to the detector according to the change of the surface topography and response performance. The experimental device is accurate, simple and easy to operate, and can monitor the surface damage of the laser irradiation detector in real time, and is suitable for the research on the damage effect of the laser irradiation silicon-based unit detector.
发明内容Contents of the invention
研究强激光辐照下,探测器被损伤程度与电学性能变化的关系,对于研究激光辐照探测器的损伤机理,提高探测器的抗激光损伤能力具有重要意义。本发明提供了一套可直观检测探测器被激光诱导损伤后,表面形貌、光电流、暗电流的测量方法和装置。该装置包含激光辐照系统,CCD成像系统,电流检测系统。Studying the relationship between the damage degree of the detector and the change of electrical properties under strong laser irradiation is of great significance for studying the damage mechanism of the laser irradiation detector and improving the anti-laser damage ability of the detector. The invention provides a set of measurement methods and devices for visually detecting the surface topography, photocurrent and dark current of a detector after being damaged by laser. The device includes a laser irradiation system, a CCD imaging system, and a current detection system.
激光辐照系统包含有Nd:YAG激光器(1),激光衰减器(2),分光片(3),激光能量计(4),会聚透镜(5)。由Nd:YAG激光器发出的激光,经过激光衰减器、分光镜、会聚透镜垂直辐照在探测器表面。衰减器可以调节入射激光的能量大小,分光镜和能量计可以实时监测入射激光的能量,样品被固定在调整架上,可以方便的进行调节。The laser irradiation system includes a Nd:YAG laser (1), a laser attenuator (2), a beam splitter (3), a laser energy meter (4), and a converging lens (5). The laser light emitted by the Nd:YAG laser is vertically irradiated on the surface of the detector through the laser attenuator, the beam splitter and the converging lens. The attenuator can adjust the energy of the incident laser, and the spectroscope and energy meter can monitor the energy of the incident laser in real time. The sample is fixed on the adjustment frame, which can be adjusted conveniently.
电流检测系统由He-Ne激光器(8),衰减器(9),测试电路(10)和光电检流计(11)组成。探测器依据内光电效应进行工作,在入射激光功率不太大的情况下,探测器工作在线性区。探测器对入射光的响应度是光电探测器的一项重要指标,跟入射光波长相关,即在某一波长λ光的光功率辐射下,所输出的电压V(λ)、电流I(λ)不一样,所以有电压光谱响应率RV和电流光谱响应率RI之分,记为The current detection system consists of a He-Ne laser (8), an attenuator (9), a test circuit (10) and a photoelectric galvanometer (11). The detector works according to the internal photoelectric effect. When the incident laser power is not too large, the detector works in the linear region. The responsivity of the detector to the incident light is an important index of the photodetector, which is related to the wavelength of the incident light, that is, under the optical power radiation of a certain wavelength λ light, the output voltage V(λ) and current I(λ ) are different, so there are voltage spectral responsivity R V and current spectral responsivity R I , denoted as
式中P(λ)为波长λ时入射光功率;V(λ)为光电探测器在入射光功率P(λ)作用下的输出信号电压,I(λ)为光电探测器在入射光功率P(λ)作用下的电流信号。实验中,用He-Ne激光作为参考光,通过测量探测器对He-Ne激光的光电流,可以得到探测器的响应度。探测器被激光损伤后,暗电流上升,响应度下降。所以,比较损伤前后,探测器响应度的变化就可以确定探测器的被损伤情况。In the formula, P(λ) is the incident light power at the wavelength λ; V(λ) is the output signal voltage of the photodetector under the action of the incident light power P(λ), and I(λ) is the photodetector at the incident light power P The current signal under the action of (λ). In the experiment, the He-Ne laser is used as the reference light, and the responsivity of the detector can be obtained by measuring the photocurrent of the detector to the He-Ne laser. After the detector is damaged by laser, the dark current increases and the responsivity decreases. Therefore, comparing the change of the detector responsivity before and after the damage can determine the damage of the detector.
CCD成像系统包括白光二极管(12),成像透镜(13),面阵CCD(14)和计算机(15)。白光二极管距离探测器约5cm左右,与探测器的夹角约为30℃左右,He-Ne激光与探测器的角度约为25℃左右。通过调节探测器样品、透镜和CCD之间的距离,使探测器在CCD表面成清晰的像。通过计算机将探测器表面形貌图像存储下来。强激光辐照后,再次记录探测器的表面形貌图片,并与激光辐照前的图像进行比较,确定探测器的损伤情况。The CCD imaging system comprises a white light diode (12), an imaging lens (13), an area array CCD (14) and a computer (15). The white light diode is about 5cm away from the detector, and the angle between it and the detector is about 30°C, and the angle between the He-Ne laser and the detector is about 25°C. By adjusting the distance between the detector sample, lens and CCD, the detector can form a clear image on the surface of the CCD. The image of the surface topography of the detector is stored by the computer. After strong laser irradiation, record the surface topography picture of the detector again, and compare it with the image before laser irradiation to determine the damage of the detector.
附图说明Description of drawings
附图1是激光诱导光电探测器损伤多参数测量方法和装置示意图;Accompanying drawing 1 is the schematic diagram of laser-induced photodetector damage multi-parameter measurement method and device;
附图2是光电流和暗电流测试电路;Accompanying drawing 2 is photocurrent and dark current test circuit;
附图3是不同功率密度的激光辐照下探测器暗电流的变化;Accompanying drawing 3 is the change of detector dark current under the laser irradiation of different power densities;
附图4是不同功率密度的激光辐照下探测器响应度的变化;Accompanying drawing 4 is the change of detector responsivity under the laser irradiation of different power densities;
附图5是探测器被功率密度3.53×107w/cm2激光辐照后的表面形貌图片;Accompanying drawing 5 is the photo of the surface topography of the detector after being irradiated by laser with a power density of 3.53×10 7 w/cm 2 ;
附图6是探测器被功率密度3.66×108w/cm2激光辐照后的表面形貌图片;Attached Figure 6 is a picture of the surface morphology of the detector after being irradiated by a laser with a power density of 3.66×10 8 w/cm 2 ;
附图7是探测器被功率密度3.92×108w/cm2激光辐照后的表面形貌图片;Accompanying drawing 7 is the photo of the surface topography of the detector after being irradiated by laser with a power density of 3.92×10 8 w/cm 2 ;
附图8是探测器被功率密度4.51×109w/em2激光辐照后的表面形貌图片。Figure 8 is a picture of the surface topography of the detector after being irradiated by a laser with a power density of 4.51×10 9 w/em 2 .
具体实施方式Detailed ways
实施实例:以硅基PIN光电探测器(型号GT102,光敏面直径2mm)为例,研究不同功率密度的Nd:YAG激光辐照下,PIN光电探测器的表面形貌、光电流、暗电流及响应度的变化,并分析探测器性能改变与损伤程度的关系。Implementation example: Taking silicon-based PIN photodetector (model GT102, photosensitive surface diameter 2mm) as an example, study the surface morphology, photocurrent, dark current and Changes in responsivity, and analyze the relationship between detector performance changes and damage levels.
如图1所示,He-Ne激光器(8)输出激光经衰减器(9)后的功率为56uw,此时硅基PIN光电探测器工作在线性区。由光电检流计(11)测量探测器的光电流值为11.76uA,得到损伤前探测器的响应度为0.21uA/uw,测得探测器的暗电流值为0.001nA。调节白光二极管(12)、成像透镜(13)和面阵CCD(14),使探测器样品在CCD上成像,并用计算机进行存储。Nd:YAG激光(1)经衰减器(2)、分光镜(3)、会聚透镜(5)辐照在样品(6)表面,并且和He-Ne激光光斑重合。调节激光衰减器,使入射激光能量由小到大逐渐增加。如果在单次脉冲辐照下,探测器发生损伤,更换样品重复上面的实验,可以得到不同功率密度激光单次辐照下,探测器的饱和,轻度损伤,中等损伤,严重损伤等现象。探测器的损伤后存储表面形貌图像,并再次测量探测器的光电流、暗电流数值,与最初的数据进行比较,分析探测器的损伤情况。As shown in Fig. 1, the output laser power of the He-Ne laser (8) after passing through the attenuator (9) is 56uw. At this time, the silicon-based PIN photodetector works in the linear region. The photocurrent value of the detector measured by the photogalvanometer (11) is 11.76uA, the responsivity of the detector before damage is 0.21uA/uw, and the measured dark current value of the detector is 0.001nA. Adjust the white light diode (12), the imaging lens (13) and the area array CCD (14), so that the detector sample is imaged on the CCD, and stored with a computer. The Nd:YAG laser (1) is irradiated on the surface of the sample (6) through the attenuator (2), the beam splitter (3), and the converging lens (5), and coincides with the He-Ne laser spot. Adjust the laser attenuator so that the incident laser energy increases gradually from small to large. If the detector is damaged under a single pulse irradiation, replace the sample and repeat the above experiment, and you can get saturation, mild damage, moderate damage, and severe damage of the detector under a single laser irradiation with different power densities. After the detector is damaged, the surface topography image is stored, and the photocurrent and dark current values of the detector are measured again, and compared with the original data, the damage of the detector is analyzed.
图3和图4描述的是强激光辐照下,探测器暗电流与响应度的变化情况。从图中可以看出,在激光功率密度超过3.54×104w/cm2后,探测器处于饱和状态,表面形貌没有变化,暗电流、光电流和响应度均没有变化。Figure 3 and Figure 4 describe the changes of the dark current and responsivity of the detector under strong laser irradiation. It can be seen from the figure that after the laser power density exceeds 3.54×10 4 w/cm 2 , the detector is in a saturated state, the surface morphology does not change, and the dark current, photocurrent and responsivity do not change.
当入射激光功率密度达到3.53×107w/cm2时,激光辐照后,探测器表面发生轻度的损伤,如图5所示,表面增透膜发生了损伤,导致了He-Ne参考光的透过率减小,此时暗电流增加了0.004uA,响应度下降了3.65%。When the incident laser power density reaches 3.53×10 7 w/cm 2 , the surface of the detector is slightly damaged after laser irradiation, as shown in Figure 5, the surface anti-reflection coating is damaged, resulting in the The light transmittance decreases, the dark current increases by 0.004uA, and the responsivity decreases by 3.65%.
当入射激光功率密度达到3.66×108w/cm2时,激光辐照后,探测器表面发生了较大面积的损伤。如图6所示,表层的损伤区域加大,光敏面内部发生轻微损伤。此时暗电流变化明显,增加了0.414uA,响应度也发生明显改变,下降了12.3%。When the incident laser power density reaches 3.66×10 8 w/cm 2 , a large area of damage occurs on the detector surface after laser irradiation. As shown in Figure 6, the damaged area of the surface layer is enlarged, and slight damage occurs inside the photosensitive surface. At this time, the dark current changes significantly, increasing by 0.414uA, and the responsivity also changes significantly, decreasing by 12.3%.
当入射激光功率密度达到3.92×108w/cm2时,激光辐照后,探测器表面出现了较严重的损伤。如图7所示,损伤区域较大,损伤坑较深。此时探测器的光敏面被损伤,暗电流增加了12.78uA,响应度下降了18.11%。When the incident laser power density reached 3.92×10 8 w/cm 2 , after laser irradiation, serious damage appeared on the detector surface. As shown in Figure 7, the damage area is larger and the damage pit is deeper. At this time, the photosensitive surface of the detector was damaged, the dark current increased by 12.78uA, and the responsivity decreased by 18.11%.
当入射激光功率密度达到4.44×109w/cm2时,强激光辐照后,探测器发生更严重的破坏。如图8所示,损伤区域更大,损伤坑更深,光敏区域遭到严重破坏,导致PN结被部分击穿,此时暗电流急剧增加,达到了2300uA,远远超过了探测器的光电流值,此时探测器已经失去探测能力。When the incident laser power density reaches 4.44×10 9 w/cm 2 , the detector is more severely damaged after strong laser irradiation. As shown in Figure 8, the damage area is larger, the damage pit is deeper, and the photosensitive area is severely damaged, resulting in partial breakdown of the PN junction. At this time, the dark current increases sharply, reaching 2300uA, far exceeding the photocurrent of the detector. value, at this time the detector has lost its detection capability.
从以上的分析能够看出,本发明装置能够实时监测探测器被强激光损伤的整个过程,同时,能够检测在不同的损伤程度下暗电流/光电流和响应度的变化,这对分析激光导致的探测器的损伤机理具有重要的意义。From the above analysis, it can be seen that the device of the present invention can monitor the whole process of the detector being damaged by strong laser in real time, and at the same time, can detect the changes of dark current/photocurrent and responsivity under different damage degrees, which has great impact on the analysis of laser The damage mechanism of the detector is of great significance.
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CN103645373A (en) * | 2013-12-27 | 2014-03-19 | 百力达太阳能股份有限公司 | Method for monitoring dark current |
CN104048813A (en) * | 2014-05-27 | 2014-09-17 | 中国人民解放军总参谋部第五十四研究所 | Method and device for recording laser damage process of optical element |
CN107290637A (en) * | 2017-06-09 | 2017-10-24 | 西北核技术研究所 | Single PN kink type device laser-induced damage analysis method |
CN110530613A (en) * | 2019-09-24 | 2019-12-03 | 中兴光电子技术有限公司 | A kind of silicon optical chip detector responsivity test device and method |
CN112730433A (en) * | 2020-12-25 | 2021-04-30 | 中国工程物理研究院激光聚变研究中心 | Laser damage testing system and method |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103645373A (en) * | 2013-12-27 | 2014-03-19 | 百力达太阳能股份有限公司 | Method for monitoring dark current |
CN104048813A (en) * | 2014-05-27 | 2014-09-17 | 中国人民解放军总参谋部第五十四研究所 | Method and device for recording laser damage process of optical element |
CN104048813B (en) * | 2014-05-27 | 2016-09-07 | 中国人民解放军总参谋部第五十四研究所 | The recording method of a kind of damage from laser optical element process and device thereof |
CN107290637A (en) * | 2017-06-09 | 2017-10-24 | 西北核技术研究所 | Single PN kink type device laser-induced damage analysis method |
CN107290637B (en) * | 2017-06-09 | 2019-10-18 | 西北核技术研究所 | Analysis Method of Laser Damage Effect of Single PN Junction Device |
CN110530613A (en) * | 2019-09-24 | 2019-12-03 | 中兴光电子技术有限公司 | A kind of silicon optical chip detector responsivity test device and method |
CN110530613B (en) * | 2019-09-24 | 2021-05-25 | 中兴光电子技术有限公司 | Silicon optical chip detector responsivity testing device and method |
CN112730433A (en) * | 2020-12-25 | 2021-04-30 | 中国工程物理研究院激光聚变研究中心 | Laser damage testing system and method |
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