CN102143645B - Cover layer and printed circuit board with same - Google Patents
Cover layer and printed circuit board with same Download PDFInfo
- Publication number
- CN102143645B CN102143645B CN 201010103057 CN201010103057A CN102143645B CN 102143645 B CN102143645 B CN 102143645B CN 201010103057 CN201010103057 CN 201010103057 CN 201010103057 A CN201010103057 A CN 201010103057A CN 102143645 B CN102143645 B CN 102143645B
- Authority
- CN
- China
- Prior art keywords
- coverlay
- adhesion coating
- microns
- thickness
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a cover layer and a printed circuit board with the same. The cover layer comprises a substrate with a protection effect and an electrical insulation effect and an adhesive layer for adhering the cover layer to a flexible copper clad laminate, wherein the substrate is provided with opposite first and second surfaces; and the adhesive layer comprises a silicon-containing additive and fixedly covers the first surface of the substrate. Since the silicon-containing additive is added into the adhesive layer, the cover layer has high hardness; the cover layer can be attached to the surface of the flexible copper clad laminate to prepare the printed circuit board and is particularly suitable for preparing the flexible printed circuit board with flexural property; and when used for the flexible printed circuit board, the cover layer has mechanical protection and electrical insulation performance, and furthermore, a phenomenon of forming a large amount of adhesive smear in a drilling process is effectively improved on the premise of not influencing the flexural property of the flexible printed circuit board, and the adverse effect of drilled adhesive smear on a subsequent machining process is effectively reduced.
Description
Technical field
The present invention relates to a kind of coverlay and use the printed circuit board (PCB) of this coverlay, the especially a kind of coverlay that the glue slag produces and printed circuit board (PCB) with this coverlay of can reducing when boring.
Background technology
Printed circuit board (PCB) is material indispensable in electronic product, and along with the growth of consumption electronic products demand, also grows with each passing day for the demand of printed circuit board (PCB) thereupon.Due to flexible printed wiring board (FPC, FLEXIBLE PRINTED CIRCUIT) but have the characteristics such as flexibility and three-dimensional space distribution, emphasize at the technicalization electronic product to be widely used at present computer and ancillary equipment thereof, communication product and consumption electronic products etc. under the development trend of compact, flexibility.
Generally speaking, flexible printed wiring board is made of copper clad laminate (FCCL) and coverlay (CL).In this flexible printed circuit board structure, generally use plastic film as coverlay, perhaps utilize screen printing technology to form one deck thin insulating ink lay as coverlay.Yet, in the flexible printed wiring board processing procedure, for the inside and outside layer circuit that makes this flexible printed wiring board communicates, must carry out Drilling operation on this flexible printed wiring board, thereby follow-up in the hole the inside and outside layer of copper facing conducting circuit, when Drilling operation, in the process of friction fast, can produce the high heat of high temperature due to drill bit and sheet material, cause the softening even liquefaction of resinous principle in coverlay, and be covered with hole wall, namely become the glue slag after cooling.The residual glue slag of hole wall can affect the roughness of hole wall, is unfavorable for the combination of internal layer copper and hole wall copper, and therefore, the formed glue slag of Drilling operation often produces suitable puzzlement to successive process.
Go at present the mode of de-smear, mostly adopt the slag machine (PlasmaDesmear Machine) or circuit board is soaked in makes the stripping of glue slag in medicament of removing photoresist.Yet, no matter adopt above-mentioned which kind of mode all can increase the step of processing procedure, therefore, still need a kind of coverlay that the glue slag produces that reduces.
Summary of the invention
In order to overcome defects; the invention provides a kind of coverlay and have the printed circuit board (PCB) of this coverlay; this coverlay hardness is higher; when being applied to printed circuit board (PCB), not only plays this coverlay the effect of mechanical protection and electric insulation; and can effectively reduce the glue slag that produces in boring procedure; be beneficial to the following process processing procedure, this coverlay is particularly useful for having the flexible printed wiring board of flexural property.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of coverlay; comprise the base material with protective effect and electric insulation effect and the adhesion coating that is used for coverlay is adhered to copper clad laminate; described base material has first and second relative surface; contain silicon-containing additive in described adhesion coating, described adhesion coating fixedly is covered in the first surface of described base material.
Described base material adopts polymeric film substrate, wherein said polymer can be but be not limited to polyimides (PI), polyethylene terephthalate (PET), polyaniline (PANI), Polyethylene Naphthalate (PEN), triacetyl glycerine or Merlon (PC), preferably polyimides (PI) or polyethylene terephthalate (PET).The thickness of described base material is 7.5～50 microns, preferably 7.5～45 microns, and more preferably 7.5～25 microns, the required mechanical protection of printed circuit board (PCB) to be provided and to take into account the required flexibility of flexible printed wiring board.
described adhesion coating is coated on the first surface of base material and is formed through crosslinking curing by the epoxy resin that is added with silicon-containing additive, wherein, described silicon-containing additive, as silicon dioxide, can increase the integral hardness of coverlay, aluminium hydroxide not in coverlay of the present invention, help to improve the integrally-built stability of coverlay, by weight percentage, described silicon-containing additive accounts for 15～40% of described adhesion coating solid content, preferably 15～35%, more preferably 15～30%, so that coverlay has suitable hardness, and then in follow-up printed circuit board drilling processing procedure, can effectively reduce adhesion coating because of the shortcoming of high temperature or high heat residual a large amount of glue slags in the hole of friction generation fast, keep simultaneously the required flexural property of flexible printed wiring board.The thickness of described adhesion coating is 10～40 microns, preferably 10～35 microns, and more preferably 10～30 microns.
Described coverlay also comprises the release film that is covered on described adhesion coating outer surface and is used for keeping adhesion coating viscosity.The thickness of described release film is 60～150 microns, preferably 65～140 microns, and more preferably 70～120 microns.
Coverlay of the present invention owing to having added silicon-containing additive in adhesion coating, makes coverlay of the present invention have the characteristic of high rigidity, and aluminium hydroxide not, can be used for printed circuit board (PCB), is specially adapted to flexible printed wiring board.The release film that will have during use on the coverlay of above-mentioned characteristic removes, and then by the adhesion coating on coverlay, coverlay is adhered on described copper clad laminate surface, forms the printed circuit board (PCB) with coverlay of the present invention.When coverlay of the present invention was applied to printed circuit board (PCB), in the process of carrying out Drilling operation, no matter use radium-shine or machine drilling, adhesion coating all significantly reduced because of high temperature or high heat residual glue slag in the hole of friction fast.On the other hand, use the printed circuit board (PCB) of coverlay made of the present invention, with flexural property, be applicable to make flexible printed wiring board.
the invention has the beneficial effects as follows: coverlay of the present invention, owing to having added silicon-containing additive in adhesion coating, make coverlay of the present invention have the characteristic of high rigidity, coverlay of the present invention can fit in the copper clad laminate surface and make printed circuit board (PCB), be specially adapted to make the flexible printed wiring board with flexural property, when coverlay of the present invention is used for flexible printed wiring board, not only have mechanical protection and electrical insulation properties concurrently, more can be under the prerequisite that does not affect the flexible printed wiring board flexural property, effectively improve the phenomenon that forms a large amount of glue slags in the Drilling operation process, effectively reduce boring glue slag for the adverse effect of following process processing procedure.
Description of drawings
Fig. 1 is coverlay profile of the present invention;
Fig. 2 is the profile that the present invention is covered with the coverlay of release film;
Fig. 3 is the printed circuit board (PCB) profile with coverlay of the present invention.
Embodiment
Below by particular specific embodiment, embodiments of the present invention are described, those of ordinary skills can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented by other different mode,, under not departing from disclosed category, can carry out different modifications and change that is.
Embodiment 1: a kind of coverlay 1, used thickness is that the polyimide film of 12.5 microns is as the base material 11 of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, after solidifying, formation thickness is the adhesion coating 12 of 25 microns, wherein silicon dioxide accounts for the 23.5wt% of adhesion coating solid content, forms coverlay as shown in Figure 1.Then, be that the release film 13 of 75 microns conforms to adhesion coating 12 with thickness, get final product to get coverlay of the present invention, as shown in Figure 2.When above-mentioned coverlay is used for printed circuit board (PCB), the release film 13 on coverlay 1 is removed, then by the adhesion coating 12 on coverlay, coverlay is adhered on described copper clad laminate 2 surfaces, form the printed circuit board (PCB) with coverlay of the present invention, as shown in Figure 3.
Embodiment 2: a kind of coverlay 1, used thickness is that the polyimide film of 12.5 microns is as the base material 11 of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, after solidifying, formation thickness is the adhesion coating 12 of 25 microns, wherein silicon dioxide accounts for the 28.1wt% of adhesion coating solid content, forms coverlay as shown in Figure 1.Then, be that the release film 13 of 75 microns conforms to adhesion coating 12 with thickness, get final product to get coverlay of the present invention, as shown in Figure 2.When above-mentioned coverlay is used for printed circuit board (PCB), the release film 13 on coverlay 1 is removed, then by the adhesion coating 12 on coverlay, coverlay is adhered on described copper clad laminate 2 surfaces, form the printed circuit board (PCB) with coverlay of the present invention, as shown in Figure 3.
Comparative example 1: used thickness is that the polyimide film of 12.5 microns is as the base material of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, after solidifying, formation thickness is the adhesion coating of 25 microns, and wherein silicon dioxide accounts for the 12.0wt% of adhesion coating solid content.Then, be that the release film of 75 microns conforms to adhesion coating with thickness, obtain coverlay.
Comparative example 2: used thickness is that the polyimide film of 12.5 microns is as the base material of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, after solidifying, formation thickness is the adhesion coating of 25 microns, and wherein silicon dioxide accounts for the 45.5wt% of adhesion coating solid content.Then, be that the release film of 75 microns conforms to adhesion coating with thickness, obtain coverlay.
Reference examples: the coverlay FHK0525 that contains aluminium hydroxide of commercially available platform rainbow science and technology.
Test: embodiment 1, embodiment 2, comparative example 1, comparative example 2 and the described coverlay of reference examples are conformed to respectively copper clad laminate, utilize the laser drilling machine to carry out Drilling operation, glue slag in inspection hole, and with outcome record in following table 1.
Table 1
| | Embodiment | 1 | Embodiment 2 | Comparative example 1 | Comparative example 2 | Reference examples |
| Coverlay hardness | 2H | 3H | HB | 6H | 3B | |
| Glue slag observed result in the hole | ○ | ○ | △ | △ | × |
In table, coverlay hardness is with pencil hardometer;
Glue slag observed result mark implication in the table mesopore:
Zero---almost there is no or only have a small amount of glue slag;
△---obviously observe many glue slags;
*---a large amount of glue slags are coated with full hole wall.
By table 1 result as can be known, when coverlay of the present invention is used for making printed circuit board (PCB), in the Drilling operation process, really can reduce the formation of glue slag, avoid follow-up puzzlement of removing de-smear.
Above-mentioned specification and embodiment are only exemplary illustration principle of the present invention and effect thereof, are not to be limitation of the present invention.Any creation that falls in claim scope of the present invention all belongs to the scope that the present invention protects.
Claims (18)
1. coverlay; it is characterized in that: comprise the base material with protective effect and electric insulation effect and the adhesion coating that is used for coverlay is adhered to copper clad laminate; described base material has first and second relative surface; contain silicon-containing additive in described adhesion coating; by weight percentage; described silicon-containing additive accounts for 15～40% of described adhesion coating solid content; described adhesion coating fixedly is covered in the first surface of described base material; described coverlay is aluminium hydroxide not, and the material of described base material adopts polymer.
2. coverlay as claimed in claim 1, it is characterized in that: the thickness of described adhesion coating is 10～40 microns.
3. coverlay as claimed in claim 2, it is characterized in that: the thickness of described adhesion coating is 10～35 microns.
4. coverlay as claimed in claim 3, it is characterized in that: the thickness of described adhesion coating is 10～30 microns.
5. coverlay as claimed in claim 1, it is characterized in that: by weight percentage, described silicon-containing additive accounts for 15～35% of described adhesion coating solid content.
6. coverlay as claimed in claim 5, it is characterized in that: by weight percentage, described silicon-containing additive accounts for 15～30% of described adhesion coating solid content.
7. coverlay as claimed in claim 1, it is characterized in that: described adhesion coating is formed by the epoxy resin cure that is added with silicon-containing additive.
8. coverlay as claimed in claim 1, it is characterized in that: described silicon-containing additive is silicon dioxide.
9. coverlay as claimed in claim 1, it is characterized in that: the thickness of described base material is 7.5～50 microns.
10. coverlay as claimed in claim 9, it is characterized in that: the thickness of described base material is 7.5～45 microns.
11. coverlay as claimed in claim 10 is characterized in that: the thickness of described base material is 7.5～25 microns.
12. coverlay as claimed in claim 1 is characterized in that: described polymer is a kind of in polyimides, polyethylene terephthalate, polyaniline, Polyethylene Naphthalate, triacetyl glycerine and Merlon.
13. coverlay as claimed in claim 12 is characterized in that: described polymer is a kind of in polyimides and polyethylene terephthalate.
14. coverlay as described in one of claim 1 to 13 is characterized in that: described coverlay also comprises the release film that is covered on described adhesion coating outer surface and is used for keeping adhesion coating viscosity.
15. coverlay as claimed in claim 14 is characterized in that: the thickness of described release film is 60～150 microns.
16. coverlay as claimed in claim 15 is characterized in that: the thickness of described release film is 65～140 microns.
17. coverlay as claimed in claim 16 is characterized in that: the thickness of described release film is 70～120 microns.
18. a printed circuit board (PCB) that has as the described coverlay of one of claim 1 to 13 comprises copper clad laminate, it is characterized in that: described coverlay adheres to described copper clad laminate surface by its adhesion coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010103057 CN102143645B (en) | 2010-01-28 | 2010-01-28 | Cover layer and printed circuit board with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010103057 CN102143645B (en) | 2010-01-28 | 2010-01-28 | Cover layer and printed circuit board with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102143645A CN102143645A (en) | 2011-08-03 |
| CN102143645B true CN102143645B (en) | 2013-05-15 |
Family
ID=44410783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010103057 Active CN102143645B (en) | 2010-01-28 | 2010-01-28 | Cover layer and printed circuit board with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102143645B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057208B (en) * | 2011-10-21 | 2015-05-13 | 松扬电子材料(昆山)有限公司 | Composite cover film |
| CN102970820B (en) * | 2012-11-24 | 2015-06-24 | 中山市东溢新材料有限公司 | Manufacturing process of covering film for flexible printed circuit board |
| CN104451611B (en) * | 2014-12-12 | 2017-11-03 | 广东生益科技股份有限公司 | A kind of mould release membrance with silica coating and preparation method thereof |
| TW201626864A (en) * | 2015-01-13 | 2016-07-16 | 台虹科技股份有限公司 | Cover film with high dimensional stability and manufacturing method of flexible printed circuit board |
| CN105722320A (en) * | 2016-03-18 | 2016-06-29 | 捷讯精密橡胶（苏州）有限公司 | Flexible circuit board |
| TWI634004B (en) * | 2017-01-10 | 2018-09-01 | 台虹科技股份有限公司 | Coverlay structure |
| DE102017001097A1 (en) * | 2017-02-07 | 2018-08-09 | Gentherm Gmbh | Electrically conductive foil |
| CN108184313B (en) * | 2017-12-29 | 2020-06-23 | 东莞市天晖电子材料科技有限公司 | True Blind Via Circuit Board Manufacturing Process |
| CN112778937B (en) * | 2020-12-30 | 2023-03-28 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, cover film and printing screen |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100551201C (en) * | 2007-04-23 | 2009-10-14 | 昆山雅森电子材料科技有限公司 | Flexible printed wiring board |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3840180B2 (en) * | 2002-12-26 | 2006-11-01 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board |
-
2010
- 2010-01-28 CN CN 201010103057 patent/CN102143645B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100551201C (en) * | 2007-04-23 | 2009-10-14 | 昆山雅森电子材料科技有限公司 | Flexible printed wiring board |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-207650A 2004.07.22 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102143645A (en) | 2011-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102143645B (en) | Cover layer and printed circuit board with same | |
| TWI494364B (en) | Resin composition | |
| MY159854A (en) | Resin coated copper foil and method for manufacturing resin coated copper foil | |
| CN102118916B (en) | Heat-conducting covering film | |
| CN101986773B (en) | Method for manufacturing combined rigid/flexible circuit board | |
| KR101241544B1 (en) | The printed circuit board and the method for manufacturing the same | |
| CN201601890U (en) | Cover film | |
| MY149431A (en) | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device | |
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| CN101296562A (en) | Copper foil substrate and method for manufacturing flexible printed circuit board by using same | |
| KR20110127751A (en) | Liquid coverlay for flexible printed circuit boards | |
| CN103619121A (en) | Laminating protective ink for circuit board | |
| TWI700020B (en) | Multilayer printed wiring board, multilayer metal clad laminate, and resin coated metal foil | |
| CN104244603A (en) | Method for manufacturing component-embedded wiring substrate and semiconductor device | |
| CN108419432B (en) | Cover plate, method for manufacturing cover plate, and method for manufacturing flexible circuit board | |
| US20140162072A1 (en) | Thermosetting resin compositions, resin films in b-stage, metal foils, copper clad boards and multi layer build-up boards | |
| TW200709923A (en) | Double-sided flexible printed circuit board and manufacturing method thereof | |
| CN202353923U (en) | Composite covering film | |
| CN101808466B (en) | Manufacturing method of copper-clad plate and glue solution for copper-clad plate | |
| CN104378907A (en) | Circuit board and manufacturing method thereof | |
| CN101437358A (en) | Protective film for printed circuit board and circuit board processing procedure using same | |
| TWI710312B (en) | High-frequency covering film with electromagnetic shielding function and preparing methods thereof | |
| KR101109336B1 (en) | Carrier for manufacturing printed circuit board and manufacturing method of printed circuit board using same | |
| CN203912306U (en) | Laminating protective ink for circuit board | |
| CN201616953U (en) | Heat-conducting covering film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |