CN102129813A - Decorative element and method of making the same - Google Patents
Decorative element and method of making the same Download PDFInfo
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Abstract
Description
技术领域technical field
本发明是有关于一种加饰元件及其制作方法,且特别是有关于一种具有全像图案的加饰元件及其制作方法。The present invention relates to a decorative element and a manufacturing method thereof, and in particular to a decorative element with a holographic pattern and a manufacturing method thereof.
背景技术Background technique
信用卡、纸钞、支票及其它重要的文件等都需具有特定的标志或特征以避免被拷贝或是盗用。现今的拷贝设备及复制技术不断地改进,所以必须发展出新的防伪技术。全像图是一种绕射光学元件,其被广泛地应用于验证、保全、防卫或相似的目的上。举例而言,信用卡上的全像鸽子影像以及全像球形影像都是为了这些目的而设计的。Credit cards, banknotes, checks and other important documents need to have specific signs or characteristics to avoid being copied or embezzled. Today's copying equipment and copying technology are constantly improving, so new anti-counterfeiting technology must be developed. A hologram is a diffractive optical element that is widely used for authentication, security, defense or similar purposes. For example, the holographic pigeon image on the credit card and the holographic spherical image are designed for these purposes.
使用全像技术以达到防伪目的的理由主要在于全像影像无法通过扫描或是印刷等方式复制,且对于熟知全像技术者也不容易以全像的形式进行伪造。目前,全像图案的应用方式是将全像图案制作于纸或是薄膜上以构成所需的卷标或是标志。然后,再将具有全像图案的卷标或标志贴到元件的表面上以作为防伪的设计。The reason for using holographic technology to achieve anti-counterfeiting purposes is that holographic images cannot be copied by scanning or printing, and it is not easy for those who are familiar with holographic technology to forge in the form of holographic images. At present, the application method of the holographic pattern is to make the holographic pattern on paper or film to form a required label or sign. Then, a label or logo with a holographic pattern is pasted on the surface of the element as an anti-counterfeiting design.
不过,黏贴所使用的黏着材料可能因为风化、氧化或其它的作用而劣化,所以贴附于元件上的卷标或是标志可靠性较差而容易自元件的表面上被剥除。另外,贴附的方式也可能使得构成全像影像的结构容易被磨损或是刮伤而失去可辨识度。However, the adhesive material used for pasting may deteriorate due to weathering, oxidation or other effects, so the label or mark attached to the component has poor reliability and is easily peeled off from the surface of the component. In addition, the way of attaching may also make the structure constituting the holographic image easy to be worn or scratched and lose its visibility.
发明内容Contents of the invention
本发明的目的在于提出一种加饰元件,其具有全像图案以提供防伪功能。The purpose of the present invention is to provide a decorative element with a holographic pattern to provide anti-counterfeit function.
本发明的目的还在于提出一种制作加饰元件的方法以使加饰元件具有全像图案。The object of the present invention is also to propose a method for producing a decorative element so that the decorative element has a holographic pattern.
本发明提供一种加饰元件,其包括一本体、一全像层以及一黏着层。全像层配置于本体上并包括一透光底层以及一反射层。透光底层具有一凹凸结构,而反射层共形地覆盖该凹凸结构以形成多个全像图案,其中反射层位于本体以及透光底层之间。黏着层配置于本体的一表面以及全像层之间。The invention provides a decorative element, which includes a body, a holographic layer and an adhesive layer. The holographic layer is disposed on the body and includes a light-transmitting bottom layer and a reflective layer. The light-transmitting bottom layer has a concave-convex structure, and the reflective layer conformally covers the concave-convex structure to form multiple holographic patterns, wherein the reflective layer is located between the body and the light-transparent bottom layer. The adhesive layer is disposed between a surface of the body and the holographic layer.
在本发明的一个实施例中,上述表面为一非平面,而全像层共形于该非平面。In one embodiment of the invention, the above-mentioned surface is a non-planar surface, and the holographic layer is conformal to the non-planar surface.
在本发明的一个实施例中,上述透光底层为一耐久层(durable layer)。In one embodiment of the present invention, the light-transmitting bottom layer is a durable layer.
在本发明的一个实施例中,上述透光底层为一离型层。In one embodiment of the present invention, the transparent bottom layer is a release layer.
在本发明的一个实施例中,上述加饰元件还包括一油墨层,其配置于透光底层以及黏着层之间。In an embodiment of the present invention, the above-mentioned decorative element further includes an ink layer disposed between the light-transmitting bottom layer and the adhesive layer.
在本发明的一个实施例中,上述反射层的一材质包括由铝、铜、镍、锌、铬、银、钛、钨、金、铂、锡、镁所组成的族群。In an embodiment of the present invention, a material of the reflective layer includes a group consisting of aluminum, copper, nickel, zinc, chromium, silver, titanium, tungsten, gold, platinum, tin, and magnesium.
本发明还提供一种加饰元件的制作方法,包括以下步骤:在一基材上形成一全像层,且该全像层具有多个全像图案。在全像层上形成远离基材的一黏着层。进行一加饰工艺形成一本体,以使全像层通过黏着层共形地配置于本体的一表面。The present invention also provides a method for making a decoration element, which includes the following steps: forming a holographic layer on a base material, and the holographic layer has a plurality of holographic patterns. An adhesive layer is formed on the holographic layer away from the substrate. A decoration process is performed to form a body, so that the hologram layer is conformally configured on a surface of the body through the adhesive layer.
在本发明的一个实施例中,上述在基材上形成该全像层的方法包括:在基材上形成一透光底层;在透光底层上进行一图案转移工艺以形成远离基材的一凹凸结构;以及在透光底层上形成一反射层,且反射层共形地覆盖凹凸结构。在一实施方式中,在透光底层上进行图案转移工艺的方法包括在透光底层上进行一压印工艺以形成远离基材的凹凸结构。另外,在凹凸结构上形成反射层的方法包括进行一蒸镀工艺或是一溅镀工艺。举例而言,反射层可在凹凸结构形成于透光底层之前形成。另外,反射层也可以在凹凸结构形成于透光底层之后形成。在形成反射层之前,加饰元件的制作方法还包括在透光底层上形成一罩幕层以遮蔽凹凸结构的一部分;以及在形成反射层之后,移除罩幕层以使反射层暴露凹凸结构的此部分。In one embodiment of the present invention, the method for forming the holographic layer on the substrate includes: forming a light-transmitting bottom layer on the substrate; performing a pattern transfer process on the light-transmitting bottom layer to form a a concave-convex structure; and a reflective layer is formed on the light-transmitting bottom layer, and the reflective layer conformally covers the concave-convex structure. In one embodiment, the method for performing a pattern transfer process on the light-transmitting bottom layer includes performing an embossing process on the light-transmitting bottom layer to form a concave-convex structure away from the substrate. In addition, the method for forming the reflective layer on the concave-convex structure includes performing an evaporation process or a sputtering process. For example, the reflective layer can be formed before the concave-convex structure is formed on the transparent bottom layer. In addition, the reflective layer can also be formed after the concave-convex structure is formed on the light-transmitting bottom layer. Before forming the reflective layer, the manufacturing method of the decorative element further includes forming a mask layer on the light-transmitting bottom layer to cover a part of the concave-convex structure; and after forming the reflective layer, removing the mask layer so that the reflective layer exposes the concave-convex structure this section of the .
在本发明的一个实施例中,上述进行加饰工艺的方法包括:将基材及配置于其上的全像层放置于一模具中;在模具中注入一塑料材料;自模具射出本体以及全像层;以及自全像层分离基材。在一种实施方式中,基材在本体以及全像层自模具射出的同时自全像层分离。另外,基材也可以在本体以及全像层自模具射出之后自全像层分离。In one embodiment of the present invention, the method for performing the decoration process includes: placing the base material and the hologram layer disposed thereon in a mold; injecting a plastic material into the mold; injecting the body and the hologram from the mold. and separating the substrate from the holographic layer. In one embodiment, the substrate is separated from the holographic layer at the same time as the body and the holographic layer are ejected from the mould. In addition, the substrate may be separated from the holographic layer after the body and the holographic layer are ejected from the mold.
在本发明的一个实施例中,上述加饰工艺包括通过一模内转印工艺将全像层贴附于本体的该表面上。In one embodiment of the present invention, the above decoration process includes attaching the holographic layer on the surface of the main body through an in-mold transfer process.
在本发明的一个实施例中,上述加饰成型元件的制作方法还包括在形成黏着层之前,在全像层上形成一图案层。In an embodiment of the present invention, the method for manufacturing the decorative molding element further includes forming a pattern layer on the holographic layer before forming the adhesive layer.
在本发明的一个实施例中,上述加饰成型元件的制作方法还包括:在形成全像层之前,在基材上形成一离型层以使离型层位于基材以及全像层之间;以及在形成本体之后,将基材以及离型层自全像层上分离。In one embodiment of the present invention, the method for making the above-mentioned decorative molding element further includes: before forming the hologram layer, forming a release layer on the base material so that the release layer is located between the base material and the hologram layer ; and after forming the body, separating the substrate and the release layer from the holographic layer.
综上所述,具有全像图案的全像层通过一加饰成型的技术形成于一元件的一本体上。因此,全像图案可免于损害以延长其使用寿命,并改善全像层的可靠性。因此,全像层可提供理想的防伪功能。To sum up, the holographic layer with the holographic pattern is formed on a body of an element through a decorative molding technique. Thus, the holographic pattern is protected from damage to prolong its useful life and improve the reliability of the holographic layer. Therefore, the holographic layer can provide an ideal anti-counterfeiting function.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附图式做详细说明。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.
附图说明Description of drawings
图1A至图1E说明本发明的一个实施例的一种加饰元件的制作方法。1A to 1E illustrate a method of manufacturing a decorative element according to an embodiment of the present invention.
图2A至图2D说明本发明的另一个实施例的一种加饰元件的制作方法。2A to 2D illustrate a method of manufacturing a decorative element according to another embodiment of the present invention.
图3A至图3D说明一种具有局部全像图案的加饰元件的制作方法。3A to 3D illustrate a method of manufacturing a decorative element with a partial hologram pattern.
图4A以及图4B说明本发明的又一个实施例的一种加饰元件的局部的制造工艺。4A and 4B illustrate a partial manufacturing process of a decorative element according to another embodiment of the present invention.
图5A为本发明的再一个实施例的加饰元件的剖面示意图。FIG. 5A is a schematic cross-sectional view of a decorative element according to yet another embodiment of the present invention.
图5B为复合全像图案的俯视示意图。FIG. 5B is a schematic top view of a composite hologram pattern.
其中,附图标记说明如下:Wherein, the reference signs are explained as follows:
10:滚轮10: Roller
12:凸起图案12: raised pattern
100、200、300、400、500:元件100, 200, 300, 400, 500: components
110:基材110: Substrate
120、220、320、420:全像层120, 220, 320, 420: Holographic layers
122、222a:离型层122, 222a: release layer
124、224、324:凹凸结构124, 224, 324: concave-convex structure
126、326:反射层126, 326: reflective layer
130:黏着层130: Adhesive layer
140:本体140: Ontology
142:表面142: surface
222b、322:透光底层222b, 322: transparent bottom layer
326’:反射材料层326': layer of reflective material
350:罩幕层350: Mask layer
460:油墨层460: ink layer
C:复合全像图案C: composite hologram pattern
H:全像图案H: Holographic pattern
具体实施方式Detailed ways
图1A至图1E说明本发明的一实施例的一种加饰元件的制作方法。请先参照图1A,在一基材110上形成一离型层122,其中离型层122的形成方法可以是进行一涂布工艺以将一离型(透明)材料涂布于基材110上。在本实施例中,基材110的材质可为聚对苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚萘二甲酸乙二醇酯(polyethylene naphthalate,PEN)、二醇变性聚乙烯对苯二甲酸酯(polyethylene glycol-co-cyclohexane-1,4dimethanol terephthalate,PETG)、热塑性聚胺基甲酸酯(thermalplastic polyurethane,TPU)、聚胺酯(polyurethane,PU)、聚丙烯(polypropylene,PP)、聚碳酸酯(polycarbonate,PC)、非结晶化聚对苯二甲酸二醇酯(amorphous polyethylene terephthalate,APET)、聚氯乙烯(polyvinyl chloride,PVC)、聚苯乙烯(Polystyrene,PS)三醋酸纤维素(triacetyl cellulose,TAC)、压克力(polymethylmethacrylate,PMMA)、苯乙烯-甲基丙烯酸甲酯共聚物(MMA-St,MS)或环状烯烃聚合物(cyclo olefincopolymer,COC)等高分子材料,或者可由两种或两种以上上述高分子材料组成者等,但不以此为限。另外,基材110为可挠性的材料以利于后续工艺。1A to 1E illustrate a method for manufacturing a decorative element according to an embodiment of the present invention. Please refer to Fig. 1A first, form a
离型层122可为具有热可固化特性或是紫外光可固化特性的一透明树脂材料。离型层122通常是一种低表面张力膜层,其由诸如蜡、石蜡或聚硅氧等材料中的一种制备而来,或是一种高度平滑不渗透的膜层,由诸如辐射可固化的多官能基丙烯酸酯、聚硅氧丙烯酸酯、环氧化物、乙烯基酯、烯丙基与乙烯化物、不饱和的聚酯或其混合物等材料中的一种制备而来。离型层120的材料可包含选自于环氧化物、聚胺酯、聚酰亚胺、聚酰胺、三聚氰胺甲醛、脲甲醛、与酚甲醛所组成的族群的一种缩合聚合物、共聚合物、混合物或复合物。The
接着,请参照图1B,在离型层122上进行如压印工艺等的一图案转移工艺。在压印工艺期间,具有多个凸起图案12的一滚轮10用以接触并施压于离型层122上以使凸起图案12转移至离型层122上而形成一凹凸结构124。凹凸结构124在本实施例中位于离型层122远离基材110的一侧。值得注意的是,凸起图案12根据一预定影像的光学干涉条纹而制作的,可具有两个或两个以上反射面,而不限定于图1B所绘示的形式。另外,图1B中所绘示的滚轮10可由一具有凸起图案12的平板所取代,以将预设影像的光学干涉条纹转移至离型层122上。Next, referring to FIG. 1B , a pattern transfer process such as an embossing process is performed on the
具体而言,压印工艺可以为一热压工艺或是其它在本领域中所使用的工艺,而本发明并不特别地限定。也就是说,凹凸结构124的形成方式并不限于图1B所绘示的制作步骤。另外,离型层122可通过加热或是照射紫外光的方式加以固化,以提供一固定的图案。在一实施例中,离型层122的厚度实质上为1μm至30μm。Specifically, the embossing process may be a hot pressing process or other processes used in the field, but the present invention is not particularly limited. That is to say, the method of forming the concave-
之后,如图1C所示,在凹凸结构124上形成一反射层126,以构成一全像层120。形成反射层126的方法可以是一蒸镀工艺或是一溅镀工艺。反射层126实质上共形于凹凸结构124以使反射层126反射的光线可通过干涉作用呈现出一全像影像。因此,凹凸图案124以及覆盖于上的反射层126在全像层120中定义出多个全像图案H。在一实施例中,反射层126的一材料可为铝、铜、镍、锌、铬、银、钛、钨、金、铂、锡、镁、金属氧化物、合金氧化物或其所组成的族群。Afterwards, as shown in FIG. 1C , a
之后,请参照图1D以及图1E,在反射层126上形成一黏着层130并使全像层120贴附于一元件100的本体140上。黏着层130的材质例如可由诸如聚丙烯酸酯(polyacrylate)、聚甲基丙烯酸酯(polymethacrylate)、聚苯乙烯(polystyrene)、聚碳酸酯(polycarbonate)、聚胺酯(polyurethane)、聚酯(polyester)、聚酰胺(polyamide)、环氧树脂(epoxy resin)、乙烯乙酸乙烯酯共聚合物(EVA,ethylene vinyl acetate)、热塑性弹性体(thermoplastic elastomer)或类似者、或是其共聚合物(copolymer)、混合物(blend)或复合物之一的材料所形成。具体而言,基材110可随之被移除以形成具有全像层120的元件100。值得一提的是,全像图案H夹于离型层122以及本体140之间。因此,全像图案H不会轻易地被损害而具有理想的可靠性。After that, referring to FIG. 1D and FIG. 1E , an
在本实施例中,形成元件100的本体140的方法可以是一加饰工艺,而加饰工艺的步骤例如以下描述。首先,将基材110以及设于其上的全像层120放置于一未绘示的模具中。在此步骤中,模具可以是制作本体140的一种模型治具。然后,将一本体材料填充于未绘示的模具中并随之将本体140以及全像层120由未绘示的模具中射出。此时,在本体140以及全像层120由未绘示的模具中射出的同时基材110可自全像层120上分离。另外,在其它的实施方式中,基材110也可在本体140以及全像层120由未绘示的模具中射出之后才自全像层120上分离。In this embodiment, the method of forming the
依照上述的工艺步骤进行的工艺即可称为一模内加饰工艺。在一实施例中,上述步骤中的本体材料可以是一塑料材料,例如聚碳酸酯(polycarbonate,PC)、聚丙烯(polypropylene,PP)、压克力(polymethylmethacrylate,PMMA)、苯乙烯甲基丙烯酸甲酯共聚物(MMA-St,MS)、丙烯晴-丁二烯-苯乙烯(acrylonitrile butadiene styrene,ABS)、聚苯乙烯(polystyrene,PS)、聚对苯二甲酸乙二醇酯(polyethylene terephthalate,PET)以及聚缩荃(polyoxymethylene,POM)所组成的群组,但不以此为限。并且,上述工艺步骤可以依照一传统的射出成形工艺进行。不过,本实施例的加饰工艺不限于上述制作步骤,举例而言,加饰工艺可以为一模内转印工艺(in-mold rolling process)、一层合工艺(laminating process)、一热成形工艺(thermoforming)、一吹模工艺(blowmolding)、一冲压工艺(stamping process)、一压模工艺(compression molding)、上述工艺的组合工艺,以将全像层120结合到元件100的本体140上。The process carried out according to the above process steps can be called an in-mold decoration process. In one embodiment, the body material in the above steps can be a plastic material, such as polycarbonate (polycarbonate, PC), polypropylene (polypropylene, PP), acrylic (polymethylmethacrylate, PMMA), styrene methacrylic acid Methyl ester copolymer (MMA-St, MS), acrylonitrile butadiene styrene (ABS), polystyrene (polystyrene, PS), polyethylene terephthalate (polyethylene terephthalate) , PET) and polyoxymethylene (POM), but not limited thereto. Moreover, the above process steps can be performed according to a conventional injection molding process. However, the decoration process of this embodiment is not limited to the above-mentioned manufacturing steps. For example, the decoration process can be an in-mold rolling process, a laminating process, a thermoforming process (thermoforming), a blow molding process (blowmolding), a stamping process (stamping process), a compression molding process (compression molding), a combination of the above processes to bond the holographic layer 120 to the
在本实施例中,元件100的本体140设有全像层120,而全像图案H夹在离型层122以及黏着层130之间。因此,全像图案H可受到保护而防止被刮伤或损坏。如此一来,在元件100被使用一段时间之后,全像图案H仍维持清晰锐利的样貌而容易达到辨识的作用。若采用全像图案H作为防伪标记,可提供理想且可靠性佳的防伪作用。此外,本实施例的全像图案120透过加饰工艺制作而与本体140结合,因而全像图案120共形于本体140的一表面142。并且,无论本体140的形状为何,全像图案140都可形成于其表面142上。也就是说,全像图案120可紧密地贴附于任何形态的表面上,例如一曲面、一粗糙面或是一尖锐的表面,而使全像层120的实用性大幅地提高。也因此,具有全像图案H的元件100可拥有多样化的设计。In this embodiment, the
图2A至图2D说明本发明的另一个实施例的一种加饰元件的制作方法。请参照图2A,在本实施例中,一离型层222a、一耐久层222b以及一反射层126依序地被形成于基材110上。基材110可以是一PC基材、一PET基材或是上述实施例所述的材料构成的基材。反射层126的一材料可为铝、铜、镍、锌、铬、银、钛、钨、金、铂、锡、镁、金属氧化物、合金氧化物或其所组成的族群。在此,离型层222a用以暂时地接合耐久层222b以及基材110,而在后续的工艺中将由耐久层222b上分离。耐久层222b例如可以是一热固化材料或是一紫外光可固化材料。一般来说,离型层222a的材质例如是硅氧烷或是硅胶等以提供暂时接合的作用。在一实施例中,离型层122的厚度可以为1μm至30μm。2A to 2D illustrate a method of manufacturing a decorative element according to another embodiment of the present invention. Referring to FIG. 2A , in this embodiment, a
随后,请参照图2B,在基材110上进行一图案转移工艺以形成一全像层220。在此步骤中,一凹凸结构224将形成于耐久层222b的一表面(未绘示)上,而反射层126则共形于凹凸结构224。具体来说,图案转移工艺可以是一般压印(imprinting)工艺、热压印(hot embossing)工艺等工艺。与前述实施例的压印工艺相似地,具有多个凸起图案的一平板或是一滚轮在本实施例中也被用以转移图案,其中这些凸起图案是根据一预设影像的光学干涉条纹制作而成的。换言之,凹凸结构224及覆盖其上的反射层126共同构成多个全像图案H。Subsequently, referring to FIG. 2B , a pattern transfer process is performed on the
接着,请同时参照图2C与图2D,在全像层220上形成一黏着层130并进行一加饰工艺以完成图2D所绘示的元件200。本实施例所采用的加饰工艺可采用前述实施例所提及的工艺。亦即,设有离型层222a、全像层220以及黏着层130的基材110可被放置于一模具中,并且将一热熔的塑料材料注入于模具中以进行加饰工艺。如此一来,全像层220可紧密地配置于元件200的一本体140的一表面142上。随之,进行一射出工艺以将本体140射出并使离型层222a自全像层220上分离。值得一提的是,离型层222a的设置在本实施例中有助于将基材110自全像层220上分离。尤其是,元件200可通过进行一模内转印工艺的方式形成,以将全像层220结合于本体140上。Next, referring to FIG. 2C and FIG. 2D , an
在本实施例中,加饰工艺有助于透过黏着层130紧密地将全像层220结合至本体140的表面142上以使全像层220具有良好的可靠性。在一实施例中,全像层220可通过加饰工艺而嵌入于本体140中,且全像图案H被夹于耐久层222b以及本体140之间。因此,全像图案H不容易被刮伤或是损坏。再者,全像层220共形于本体140的表面142以使得表面142可以为一平面或是一非平面。整体而言,相较于现有的将具有全像图案的纸贴附于一元件的一平坦表面上的设计而言,本实施例的设计有助于提高元件200的设计多样性,且本实施例的全像层220具有较佳的可靠性。In this embodiment, the decoration process helps to tightly bond the
在其它的实施方式中,反射层126可以局部地形成于基材110上以制作一局部全像图案。特别是,图3A至图3D说明一种具有局部全像图案的加饰元件的制作方法。In other embodiments, the
请参照图3A,提供一基材110以及配置其上的一透光底层322。此处的透光底层322可由以上所描述的工艺加以制作而具有一凹凸结构324。此外,一离型层(未绘示)可配置于透光底层322与基材110之间,即如图2B中所绘示,或是透光底层322自身即为一离型层。Referring to FIG. 3A , a
另外,在本步骤中,在透光底层322上形成一罩幕层350以遮蔽透光底层322的一部分表面。罩幕层350的材质可以是一聚合体材料,其包括有聚胺酯(polyurethane)、压克力(polymethylmethacrylate,PMMA)、环氧树脂(epoxyresin)、聚酯(polyester)或上述材料的一组合。此外,通过一蒸镀工艺或是一溅镀工艺在基材110上形成一反射材料层326’。在本实施例中,反射材料层326’例如是共形地覆盖透光底层322被罩幕层350所暴露出来的另一部分表面以及覆盖罩幕层350。In addition, in this step, a
然后,请参照图3B,移除罩幕层350以形成局部暴露出透光底层322的一反射层326。在本实施例中,反射层326与凹凸结构324共同形成多个全像图案H。反射层326局部地配置于基材110上以使全像图案H局部地设置于全像层320中。Then, referring to FIG. 3B , the
接着,请参照图3C与图3D,在全像层320上形成黏着层130,并进行以上实施例所描述的加饰工艺以形成元件300,其具有本体140以及本体140表面上的全像层320。本实施例与上述实施例相仿,全像层320可以通过黏着层130配置于本体140上。不过,本实施例中,全像图案H仅局部地分布于本体140的表面,而有助于提高本体140的设计多样性。Next, referring to FIG. 3C and FIG. 3D , an
除了全像图案外,其它的加饰图案,例如油墨图案等,也可以形成于元件的表面,而其对应的制作方法例如绘示于图4A与图4B中。图4A以及图4B说明本发明的又一个实施例的一种加饰元件的局部工艺。请参照图4A,提供基材110以及配置其上的全像层420。此处的全像层420可以是前述实施例所描述的全像层120、220或是320。亦即,全像层420是透过以上所描述的工艺制作而成的,而一离型层(未绘示)可以选择性地配置于基材110与全像层420之间(即如图2B所示)。另外,在全像层420上形成一油墨层460,其中油墨层460可以是彩色油墨层、黑色油墨层或是白色油墨层等以形成所需的油墨图案。In addition to the holographic pattern, other decorative patterns, such as ink patterns, can also be formed on the surface of the element, and the corresponding manufacturing methods are shown in FIG. 4A and FIG. 4B , for example. 4A and 4B illustrate a partial process of a decorative element according to another embodiment of the present invention. Referring to FIG. 4A , a
接着,请参照图4B,全像层420以及油墨层460通过一加饰工艺被贴合于一元件400的一本体140上。具体而言,全像层420与油墨层460是通过一黏着层130贴附于本体140上。加饰工艺的相关步骤可以参照前述实施例所提及的描述因而元件400通过在加饰工艺中同时地射出本体140、全像层140以及油墨层460而形成。另外,元件400可以通过模内加饰工艺的进行以将全像层420以及油墨层460结合至本体140。在其它实施例中,可利用热印盖法(hot stamping)、层合法或热转印法,将具有全像层420以及油墨层460的薄膜贴附于本体140上,以构成元件400。因此,元件400同时具有全像图案H及油墨图案。Next, please refer to FIG. 4B , the
图5A为本发明的再一个实施例的加饰元件的剖面示意图,而图5B为复合全像图案的俯视示意图。请参照图5A,元件500的制作方式例如结合了前述图3A以及图3B的制作步骤。也就是说,全像层320以及油墨层460通过黏着层130共形地贴附于本体140上。FIG. 5A is a schematic cross-sectional view of a decorative element according to yet another embodiment of the present invention, and FIG. 5B is a schematic top view of a composite holographic pattern. Referring to FIG. 5A , the manufacturing method of the
全像层320的全像图案H局部地分布于本体140表面,使得油墨层460可在未被覆盖反射层326的凹凸结构324之间暴露出来。所以,全像图案H与油墨层460可以构成如图5B中所绘示的复合全像图案C。使用者观看复合全像图案C时可以看到局部的全像图案H以及局部的油墨层460。不过,全像图案H与油墨层460可随设计者的需求而调整其相对位置及面积大小以形成所需的复合全像图案C,而图5B仅用以示意地说明而非限定本发明。换言之,在不同的设计需求下,本发明可使元件500表面具有各种图案以呈现不同的外观。The holographic pattern H of the
综上所述,本发明的全像图案通过一加饰工艺形成于一元件的一本体上。全像图案共形于元件本体的表面以提升元件设计的多样性。此外,全像层所构成的全像图案夹于透光底层以及元件本体之间而可避免外界的损坏。因此,提升了全像层的可靠性与使用寿命而提供较佳的防伪作用。To sum up, the holographic pattern of the present invention is formed on a body of an element through a decoration process. The holographic pattern conforms to the surface of the component body to enhance the diversity of component designs. In addition, the hologram pattern formed by the hologram layer is sandwiched between the light-transmitting bottom layer and the element body to avoid external damage. Therefore, the reliability and service life of the holographic layer are improved to provide a better anti-counterfeiting effect.
虽然本发明已以实施例公开如上,然其并非用以限定本发明,任何所属技术领域的技术人员,在不脱离本发明的精神和范围的前提下,当可做些计的更动与润饰,故本发明的保护范围当以后附的权利要求书所界定的为准。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and modifications without departing from the spirit and scope of the present invention. , so the scope of protection of the present invention should be as defined by the appended claims.
Claims (20)
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