CN102110664A - A high-power inverter MOS tube heat dissipation structure - Google Patents

Abstract

The invention relates to the technical field of electronic circuits, in particular to a MOS tube heat dissipation structure of a high-power inverter, which comprises: the MOS tubes are arranged on the circuit board, the radiator is connected with the circuit board, the MOS tubes are connected with the radiator, the circuit board comprises a first circuit board and a second circuit board, and the radiator is arranged between the first circuit board and the second circuit board. The MOS tube is arranged on the first circuit board and the second circuit board, so that more MOS tubes can be installed on the premise of not increasing the sizes of the circuit board and the radiator.

Description

A high-power inverter MOS tube heat dissipation structure

technical field

The invention relates to the technical field of electronic circuits, in particular to a MOS tube heat dissipation structure of a high-power inverter.

Background technique

The high-power inverter MOS tube generates a lot of heat when it is working. If the MOS tube does not have a good heat dissipation effect and the temperature is too high, it may cause the MOS tube to burn out, which may lead to damage to the entire circuit board.

The traditional high-power inverter MOS tube heat dissipation adopts the method shown in Figure 1. The high-power inverter MOS tube is installed on the circuit board, and the radiator is also installed on the circuit board. The MOS tube is in contact with the radiator. When the circuit is working, the MOS tube The heat dissipated is quickly dissipated by the radiator. If the power of the circuit is large, the number of MOS tubes will be more. According to the current heat dissipation structure of the MOS tubes, only the length of the radiator and the circuit board can be increased to supply all the MOS tubes. Heat dissipation, which will increase the volume of the chassis, and at the same time, with this heat dissipation structure, the air volume is divergent, and the heat dissipation effect is not good.

Some high-power inverter MOS tubes will install ventilation paper to dissipate heat, but it is very troublesome to install ventilation paper.

Contents of the invention

The purpose of the present invention is to provide a high-power inverter MOS tube heat dissipation structure in view of the deficiencies in the prior art, which has good heat dissipation effect and can provide a larger working voltage in a limited space.

The object of the present invention is achieved through the following technical measures:

A high-power inverter MOS tube heat dissipation structure, including: a plurality of MOS tubes, a circuit board, and a radiator, the MOS tubes are arranged on the circuit board, the radiator is connected to the circuit board, the MOS tube is connected to the radiator, and the circuit board includes A circuit board, a second circuit board, and the radiator is arranged between the first circuit board and the second circuit board.

Wherein, a fan is arranged at one end of the circuit board.

Wherein, two ends of the circuit board are respectively provided with fans.

Wherein, the fan is welded on the circuit board.

Wherein, the radiator is welded on the circuit board.

Wherein, a heat conduction pipe is also provided, and the heat conduction pipe is connected with the radiator.

The beneficial effect of the present invention is: a high-power inverter MOS tube heat dissipation structure, including: a plurality of MOS tubes, a circuit board, a radiator, the MOS tube is arranged on the circuit board, the radiator is connected to the circuit board, and the MOS tube is connected to the radiator For connection, the circuit board includes a first circuit board and a second circuit board, and the radiator is arranged between the first circuit board and the second circuit board. The MOS tube is arranged between the first circuit board and the second circuit board, so that more MOS tubes can be installed without increasing the size of the circuit board and the radiator. The invention has a good heat dissipation effect and can be installed in a limited space. More MOS tubes to provide greater working voltage.

Description of drawings

Fig. 1 is the mechanism diagram of prior art;

Fig. 2 is the structural representation of embodiment 1 of the present invention;

Fig. 3 is a schematic structural diagram of a first viewing angle of Embodiment 2 of the present invention;

FIG. 4 is a schematic structural diagram of a second viewing angle of Embodiment 2 of the present invention.

Reference signs:

1——MOS tube

21 - first circuit board

22 - Second circuit board

3 - Radiator

4 - fan.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings.

Example 1

As shown in Figure 2, this embodiment provides a high-power inverter MOS tube heat dissipation structure, including: a plurality of MOS tubes 1, a circuit board, and a radiator 3, the MOS tube 1 is arranged on the circuit board, the radiator 3 and the circuit board connection, the MOS tube 1 is connected to the radiator 3 , the circuit board includes a first circuit board 21 and a second circuit board 22 , and the radiator 3 is arranged between the first circuit board 21 and the second circuit board 22 . The MOS tube 1 is arranged on the first circuit board 21 and the second circuit board 22, so that more MOS tubes 1 can be installed without increasing the size of the circuit board and the heat sink 3. The heat dissipation effect of the present invention is good, and in limited More MOS tubes 1 can be provided in space to provide a larger working voltage.

The fan 4 of this embodiment is welded to the circuit board, so that the fan 4 is fixed more firmly, and the noise when the fan 4 is working will be relatively small. Of course, the fan 4 of the present invention and the circuit board are not necessarily connected by welding, but can also be connected in other ways, such as clamping, as long as there is no creative work, as long as the connection method that can achieve the purpose of fixing the fan 4, it will fall into place. into the protection scope of the present invention.

The radiator 3 of this embodiment is welded to the circuit board. The connection between the radiator 3 and the circuit board of the present invention is not necessarily by welding, but also can be connected in other ways, such as clamping, as long as there is no creative work, as long as it can Reach the connection mode of the purpose of fixing radiator 3, all fall into protection scope of the present invention

One end of the circuit board of the present embodiment is provided with a fan 4, and when the present embodiment is working, the fan 4 will also be energized, so that the heat generated by the MOS tube 1 on the radiator 3 can be quickly extracted to improve the heat dissipation of the present embodiment Effect.

Example 2

As shown in Figures 3 and 4, the difference between this embodiment and Embodiment 1 is that fans 4 are respectively arranged at both ends of the circuit board. When this embodiment works, the fans 4 at both ends also start to work, forming a cooling The air duct makes the cooling effect of this embodiment better.

Example 3

The difference between this embodiment and Embodiment 1 is that no fan 4 is provided, but a heat conduction pipe is provided, and the heat conduction pipe is connected with the radiator 3, and the heat conduction pipe can quickly take away the heat generated by the MOS tube 1 on the radiator 3 , the heat dissipation effect is also very good, and the volume of this embodiment will be smaller.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand , the technical solution of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solution of the present invention.

Claims (6)

1. A high-power inverter MOS tube heat dissipation structure, including: a plurality of MOS tubes, a circuit board, a radiator, the MOS tube is arranged on the circuit board, the radiator is connected with the circuit board, and the MOS tube is connected with the radiator. In that: the circuit board includes a first circuit board and a second circuit board, and the radiator is arranged between the first circuit board and the second circuit board. 2. A high-power inverter MOS tube heat dissipation structure according to claim 1, characterized in that: a fan is arranged at one end of the circuit board. 3. The MOS tube heat dissipation structure of a high-power inverter according to claim 1, wherein fans are respectively arranged at both ends of the circuit board. 4. A high-power inverter MOS tube heat dissipation structure according to claim 2 or 3, characterized in that the fan is welded to the circuit board. 5. A high-power inverter MOS tube cooling structure according to any one of claims 1-3, characterized in that the radiator is welded to the circuit board. 6. A MOS tube heat dissipation structure for a high-power inverter according to claim 1, characterized in that: a heat-conducting tube is also provided, and the heat-conducting tube is connected to the radiator.

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