CN102099653A - A method and means for measuring positions of contact elements of an electronic components - Google Patents
A method and means for measuring positions of contact elements of an electronic components Download PDFInfo
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- CN102099653A CN102099653A CN2009801278488A CN200980127848A CN102099653A CN 102099653 A CN102099653 A CN 102099653A CN 2009801278488 A CN2009801278488 A CN 2009801278488A CN 200980127848 A CN200980127848 A CN 200980127848A CN 102099653 A CN102099653 A CN 102099653A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000006073 displacement reaction Methods 0.000 claims abstract description 14
- 238000004422 calculation algorithm Methods 0.000 claims description 16
- 238000005286 illumination Methods 0.000 claims description 2
- 238000013507 mapping Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/55—Depth or shape recovery from multiple images
- G06T7/593—Depth or shape recovery from multiple images from stereo images
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
A method and means for measuring positions of contact elements (2, 3) of an electronic component that utilizes scaling factors in x, y and z dimensions is disclosed herein. The scaling factors are determined during calibration procedures which also establish the camera-to-camera relationship of the system. The calibration maps image point recorded in the first camera (4) for each point of the contact element to corresponding image point recorded in the second and third camera (5, 6) as part of the process to obtain the displacement between a first image point and a second image point to determine the height difference between different contact elements.
Description
Invention field
The present invention relates to the Machine Vision Detection field and and electronic component on the location survey of osculating element.
Background of invention
In the prior art, the positioning method of osculating element and device are generally on the electronic component: adopt two cameras to become certain triangulation angle, take respectively and obtain first image and second image, thereby measure osculating element position with respect to the electronic equipment bottom surface on Z-direction.The degree of accuracy of the osculating element position of said determination is used to take the influence of triangulation angle between two cameras of first and second images.The restrictive condition that also has a trigonometric calculations degree of accuracy is because employed data are to get from two-dimensional signal.The degree of accuracy of triangulation angle in addition also is subjected to the influence of optical distortion, and non-uniform lighting also can cause equation derivation mistake.Therefore, the location of osculating element needs effectively a kind of and is not subjected to the three-dimensional positioning method that uncertain factor influences in calibration and measuring process.
Summary of the invention
The present invention relates to a kind of method of measuring each osculating element position on the electronic component, this method may further comprise the steps: described osculating element is put into aligned spaces; Described osculating element throws light on; By having a camera on the first picture plane that extends in parallel with calibration plane, take first image of the described osculating element of record; Write down second image of described osculating element by No. two camera; Handle first picture point that described first image is determined at each described osculating element on each described osculating element, wherein said each first picture point is meant the location point on each described osculating element; Handle second picture point that described second image is determined at each described osculating element on each described osculating element; Wherein described second picture point of each described osculating element and the described first picture point correspondence are same point on each described osculating element; Measure the 3rd picture point on second image by the location map algorithm; And being determined at displacement between the above second picture point of described second image and the 3rd picture point, wherein said the 3rd picture point is the point of the described first picture point rectangular projection on described calibration plane.
The present invention also relates to a kind of device of measuring each osculating element position on the electronic component, this device comprises: being used to throw light on is placed on the lighting source of osculating element described in the normed space in advance; A camera and No. two cameras; A described camera and No. two cameras are respectively applied for first and second images of taking the described osculating element of record; One treating apparatus, this device is connected with No. two cameras with a described camera, in order to the position that obtains first picture point of each osculating element on described first image and on second image position of second picture point, described first picture point of each described osculating element and the second picture point correspondence are same point on each described osculating element, on described second image, obtain the position of the 3rd picture point by the location map algorithm, described the 3rd picture point is by the described first picture point rectangular projection gained, and the displacement of measuring described second picture point and the 3rd picture point.
Can also comprise No. three extra cameras, be used to compensate a camera record and No. two unwritten picture point of camera, the increase of No. three cameras can be shortened the required time of whole detection.
The accompanying drawing summary
Read the following illustrative embodiment of describing in detail in conjunction with the accompanying drawings, can be easily aware of and understand above-mentioned and others of the present invention, feature and advantage fully, similar characteristics is represented by same parts in institute's drawings attached,
Wherein:
Figure 1A and 1B are the distribution schematic diagrams of camera and illumination among the present invention;
Fig. 2 A, 2B, 2C are respectively first, second and the 3rd images by the BGA element of No., No. two and No. three camera record;
Fig. 3 is a kind of layered mask version that is used to calibrate;
Fig. 4 A, 4B, 4C are the calibration that obtains by No. one, No. two and No. three camera images with mask;
Fig. 5 is the mapping algorithm of the coordinate of from first to second calibration image;
Fig. 6 is a location principle of the present invention.
Detailed Description Of The Invention
The inventive method is designed for the three-dimensional position of osculating element on the automatic calculating electronic component, above-mentioned electronic component can be BGA (Ball Grid Array, ball grid array)/CSP (Chip Scale Packaging, chip-scale package), the inverse bonding chip device, leaded device (the small-sized square planar package of QFP, the encapsulation of TSOP thin-type small-size) and unleaded device (MLP 24 pin mold Lead-free in Electronic Packaging, QFN quad flat non-pin package).The present invention can calculate the three-dimensional position of osculating element combination on the individual devices, for example the BGA/CSP assembling device (1) with leaded device as shown in Figure 1 automatically.
In this mode that shows among Fig. 1, electronic component (1) is placed in the aligned spaces in advance, throw light on by lighting source (7) and (8) in the osculating element on it (2) and (3).A camera (4) is used to take first image of the element bottom shown in Fig. 2 A perpendicular to the calibration plane setting.The second and the 3rd side perspective projection image that No. two cameras (5) and No. three cameras (6) are used to take the electronic component shown in Fig. 2 B and 2C is set.First kind of embodiment of the present invention only needs 2 cameras to measure the three-dimensional position of osculating element on the electronic component.Osculating element on the electronic component that second image can't observe then uses the 3rd camera to take its image.The use of the 3rd camera also can be shortened the whole Image Acquisition time.When using the 3rd camera, be recorded in respectively No. one and No. three cameras in first with the 3rd image on other osculating element position measuring method and install and the method for No. one and No. two camera of use and install identical.Therefore, the embodiment of the invention is only described and is used first and second cameras to carry out the method for operating of location.
Preferably, location between the camera 1 and 2 is according to the mode shown in Figure 1A and the 1B, all directly towards the electronic component setting, in addition, camera 1,2 abides by the principle with 3 placement: all osculating elements on the whole electronic component can be observed by 2 different cameras at least.For example, Figure 1A has shown that with 1B three cameras are located at different x, y, z coordinate, and the position that all thus osculating elements may be in all can be observed by at least 2 different cameras.
Before beginning, the osculating element location needs the equipment of measuring three-dimensional osculating element is calibrated.This calibration is in order to obtain position X1 in first image and the relation between the position X3 in corresponding second image, for example by a picture point rectangular projection in the calibration plane gained.The mask that is used to calibrate (9) as shown in Figure 3.It comprises many predetermined marks, and these marks can adopt the square of accurately knowing its position to represent.Mask (9) comprises the substrate that is used for placing in advance tested electronic component, and this substrate comprises the glassy layer that multilayer is treated, and is arranged on the glass-base in the mode of array.Adopt high-precision screen printing that square is printed on the every glassy layer.The thickness of all glassy layers all is accurately known, and all marks of accurately printing all can be detected easily by camera simultaneously.Though indicate in the drawings, previous described calibration also can be substituted by other similarly calibration usefulness mask with mask, for example from pinpoint aspect projection, have the mask of vertical structure.
In order to obtain accurate calibration, be printed on the position and the size of calibrating and all need be accurate to 0.1 micron with the mask upper block.The calibration with mask across scope and volume be defined as calibrated space on x, y and z direction.Therefore, when calibration with mask when x, y and z direction have covered bigger space and scope, measure bigger electronic component and need adopt bigger space.In the measuring process of carrying out then, the residing plane of osculating element needn't be positioned on the calibration plane (11) fully, as long as the residing plane of osculating element can be measured within the aligned spaces of being set up.
The calibration that Fig. 4 A, 4B and 4C have shown respectively No. one, No. two and No. three cameras are taken separately is with first, second and the 3rd image of mask.Because single as calibration can be identified with the square mark on the mask, so can measure mapping algorithm in the calibration process, can be used for further the mapping between the image as shown in Figure 5.Fig. 4 A and 4B are respectively the calibration image of the calibration of No. (4) and No. two cameras (5) record with mask.Shown in Fig. 4 A and 4B, calibration steps comprises identical square (10) (11) or in first image of being taken by No. (4) and No. two cameras (5) (Fig. 4 A) and the mensuration of similar characteristics (Fig. 4 A) present position in second image (Fig. 4 B).Derive the location map algorithm from the position of each corresponding feature of measuring first and second images.As shown in Figure 5, at the coordinate of the first image mid point (111), map to its corresponding point (111 ') in second image.Therefore, this plane (11) are calibration plane, because its lip-deep marker characteristic is pixel mapping to the second image that is used on first plane of delineation.
With reference to figure 5, utilize the bilinear interpolation technology to measure the coordinate of all positions between any two marks.For example the position that X1 is ordered in first image is represented with dx and dy, with reference to the coordinate (111), (112), (221) and (222) that are become by rectangle formation on first image.X3 point on second image is the point that X1 rectangular projection obtains on first image, uses dx ' and dy ' expression.Obtain the location map algorithm between first picture point and the second image epigraph point on first image by measuring relation between related dx and dx ' and related dy and the dy ', wherein the second image epigraph point is the point that is obtained on standard flat by the first picture point rectangular projection.For example, on related first plane of delineation on X1 and second plane of delineation location map algorithm of X 3 and the related dx of x-coordinate and dx ' and the related dy of y-coordinate and dy ' be associated.The use location mapping algorithm is measured the point that is positioned at second plane of delineation in measuring process then, and this point is that the first picture point rectangular projection is in the calibration plane gained.
With reference to figure 3,4A, 4B and 5 at first passes through pixel coordinate X1 separately in first and second images, and X2 measures the z axis scale factor, such as calibrating with the square on the mask (10).X3 obtains being mapped in point on the calibration plane from X1 point quadrature by the location map algorithm.Because the z of X2 and X3 is known to distance, can measure the z axis scale factor on second image (4B) and the 3rd image (4C) thus.For example, if the distance of X2 and X3 is 10mm, their corresponding distance on second image is 25 pixels, and that z axis scale factor is 10mm/25 pixel=0.4mm/ pixel.
After finishing calibration steps, the position of osculating element on first image that the x-y coordinate position mapping algorithm that usefulness obtains and the z axis scale factor are come measuring element and second image.In addition, the X of osculating element, the distance of Y and Z axle can be by x separately, and the y and the z scaling factor calculate.Because can accurately locate with mask by calibration, so the position finding of osculating element also can be accurate to micron.Calibration operation also is applicable to the calibration of camera to camera, concerns with the position between clear and definite No. (4) and No. two cameras (5).The position relation of No. three cameras and a camera also can be measured by this method.
Since calibrate in the space that is used to measure, the placement of No. one and No. two camera also illustrates, can help to understand measuring principle of the present invention with reference to figure 6.No. two cameras of placement reference of No. three cameras (6) are with respect to the placement of a camera.If an electronic component is put into aligned spaces, the position of an osculating element above it is decided to be the P point with reference to calibration plane p.First image of a camera osculating element is chosen P point simultaneously.Measure the position of the first corresponding picture point X1 of the P point of osculating element on first image.
No. two cameras (5) are taken second image with osculating element that P order, measure the second picture point X2 on second image of P point correspondence.Utilize the location map algorithm with the rectangular projection of P point on calibration plane p, obtain the 2nd P ' point, in second image, the picture point of P ' position is the 3rd picture point X3.If osculating element P localization is in calibration plane p, then X3 then thinks to be in the position of expectation.The position that X3 is ordered in second image obtains by the location map algorithm computation.Displacement between X2 and the X3 is based on such fact: in fact, osculating element can not be accurately positioned on the calibration plane usually, but has one section to need the difference in height Δ Z that measures.According to noted earlier, displacement Z can calculate gained by the product between the scale factor of Z axle in the distance between X3 and the X2 (for example Δ Z ') and second image.
Because the present invention measures the point in the aligned spaces, obviously, those skilled in the art can utilize the present invention to measure distance between any 2, as long as these two is to be positioned at aligned spaces.
The method and system of distance between distance and osculating element and the calibration plane between the osculating element on the measuring sensor in aligned spaces that the present invention relates to, be very practical and effective to those skilled in the art, wherein said element can be the integrated circuit that is provided with osculating element.Therefore above embodiment only supplies explanation the present invention's usefulness, but not limitation of the present invention, category of the present invention and embodiment are limited by each claim.
Claims (12)
1. the positioning method of osculating element (2,3) on the electronic component may further comprise the steps:
Described osculating element (2,3) is placed in the aligned spaces;
Described osculating element (2,3) throws light on;
By having a camera (4) on the first picture plane that extends in parallel with calibration plane, take first image of described osculating element (2,3);
Take second image of described osculating element by No. two cameras (5);
Handle described first image and be determined at first picture point that each described osculating element (2,3) is gone up each described osculating element (2,3), wherein, described each first picture point is the point that is positioned on each described osculating element (2,3);
Handle described second image and be determined at second picture point that each described osculating element (2,3) is gone up each described osculating element (2,3); Wherein, second picture point on described each described osculating element (2,3) and the first picture point correspondence are on the same point of each described osculating element (2,3);
Measure the 3rd picture point on second image by the location map algorithm;
And being determined at displacement between the above second picture point of described second image and the 3rd picture point, wherein said the 3rd picture point is obtained on described calibration plane by the described first picture point rectangular projection.
2. method according to claim 1 is characterized in that described displacement obtains by the product of the coordinate difference of the z axis scale factor and described second picture point and the 3rd picture point.
3. method according to claim 1 is characterized in that, the inventive method also comprises deriving and is used to calculate the described location map algorithm of accurate relative position between described No. one and No. two cameras (5).
4. method according to claim 1 is characterized in that, the inventive method also comprises the z axis scale factor of the displacement that is used to measure described second picture point and described rectangular projection picture point of deriving.
5. method according to claim 1 is characterized in that, also comprises measuring the displacement between any two points in the aligned spaces.
6. positioning apparatus that is used for osculating element on the electronic component (2,3) comprises:
Be used for the lighting source (7,8) that illumination is placed on osculating element described in the normed space (2,3) in advance;
A camera (4) and No. two cameras (5);
A described camera (4) and No. two cameras (5) are respectively applied for first and second images of taking described osculating element (2,3);
One treating apparatus, this device is connected with No. two cameras (5) with a described camera (4), in order to obtain each osculating element (2,3) position of first picture point and each osculating element (2 on described first image, 3) position of second picture point on second image, each described osculating element (2,3) described first picture point and the second picture point correspondence are at each described osculating element (2,3) on the same point, on described second image, obtain the position of the 3rd picture point by the location map algorithm, described the 3rd picture point is by the described first picture point rectangular projection gained, and the displacement of measuring described second picture point and the 3rd picture point.
7. one kind as being used for the positioning apparatus of osculating element on the electronic component (2,3) as described in the claim 6, it is characterized in that described treating apparatus obtains described displacement by the product of the coordinate difference of the z axis scale factor and described second picture point and the 3rd picture point.
8. one kind is used for osculating element (2 on the electronic component as described in claim 6,3) positioning apparatus, it is characterized in that, also comprise a calibration mask (9), the image of this mask is taken by first and second cameras (4,5) and is obtained, and described treating apparatus is from the image of calibration with mask, derive and be used to calculate between described No. one and No. two cameras (4,5) the accurately location map algorithm of relative position.
9. one kind is used for osculating element (2 on the electronic component as described in claim 8,3) positioning apparatus, it is characterized in that, described calibration comprises basic unit which is provided with treated signature and the multilayer which is provided with signature with mask (9), the thickness of described multilayer is accurately known, and is pinpoint with respect to the signature in the described basic unit.
10. one kind as being used for the positioning apparatus of osculating element on the electronic component (2,3) as described in the claim 8, it is characterized in that described treating apparatus is derived the z axis scale factor that is used to measure displacement between described second picture point and the 3rd picture point.
11. one kind as being used for the positioning apparatus of osculating element on the electronic component (2,3) as described in the claim 7, it is characterized in that described treating apparatus is determined at the displacement between any 2 in the described aligned spaces.
12. one kind is used for osculating element (2 on the electronic component as described in claim 6,3) positioning apparatus, it is characterized in that, described positioning apparatus also comprises No. three cameras (6) that link to each other with described treating apparatus, this camera is used to take the 3rd image of described osculating element, described the 3rd image has the 4th picture point and the 5th picture point, wherein said the 5th picture point is the point of the described first picture point rectangular projection gained and is not arranged in described second image, simultaneously, described treating apparatus is measured the displacement between described the 4th picture point and described the 5th picture point.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20082704 | 2008-07-21 | ||
| MYPI20082704A MY148204A (en) | 2008-07-21 | 2008-07-21 | A method and means for measuring positions of contact elements of an electronic components |
| PCT/MY2009/000082 WO2010011124A1 (en) | 2008-07-21 | 2009-06-26 | A method and means for measuring positions of contact elements of an electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102099653A true CN102099653A (en) | 2011-06-15 |
| CN102099653B CN102099653B (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009801278488A Active CN102099653B (en) | 2008-07-21 | 2009-06-26 | Method and means for measuring positions of contact elements of an electronic components |
Country Status (5)
| Country | Link |
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| JP (1) | JP5787258B2 (en) |
| KR (1) | KR101633139B1 (en) |
| CN (1) | CN102099653B (en) |
| MY (1) | MY148204A (en) |
| WO (1) | WO2010011124A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106465580A (en) * | 2014-05-30 | 2017-02-22 | 雅马哈发动机株式会社 | Component-data-generating device, surface-mounting machine, and method for generating component data |
| CN107576274A (en) * | 2016-07-04 | 2018-01-12 | 先进装配系统有限责任两合公司 | Method and device for the three-dimensional determination of height position information on the front side of a terminal |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213581B (en) * | 2010-04-08 | 2016-06-08 | 财团法人工业技术研究院 | object measuring method and system |
| US8691916B2 (en) | 2012-05-07 | 2014-04-08 | Dow Global Technologies Llc | Retortable easy opening seals for film extrusion |
| JP6457295B2 (en) * | 2015-02-19 | 2019-01-23 | 株式会社Ｆｕｊｉ | Parts judgment device |
| KR20230144924A (en) * | 2022-04-08 | 2023-10-17 | 비트록스 테크놀로지스 에스디엔. 비에이치디. | System and method for determining contact height of a packaged chip |
| KR102746624B1 (en) * | 2024-08-09 | 2024-12-27 | (주)인스케이프 | Popo-pin alignment method |
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| JP3266429B2 (en) * | 1994-11-08 | 2002-03-18 | 松下電器産業株式会社 | Pattern detection method |
| US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
| US6538750B1 (en) * | 1998-05-22 | 2003-03-25 | Cyberoptics Corporation | Rotary sensor system with a single detector |
| DE60015966T2 (en) * | 1999-04-13 | 2005-12-01 | Icos Vision Systems N.V. | MEASURING THE LAYERS OR COPLANARITY OF CONTACT ELEMENTS OF AN ELECTRONIC COMPONENT WITH FLAT LIGHTING AND TWO CAMERAS |
| EP1220596A1 (en) * | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | A method and an apparatus for measuring positions of contact elements of an electronic component |
| JP3915033B2 (en) * | 2003-05-15 | 2007-05-16 | 株式会社テクノホロン | Measuring method and measuring apparatus using stereo optical system |
| JP4623657B2 (en) * | 2003-05-28 | 2011-02-02 | 富士機械製造株式会社 | Captured image processing apparatus and captured image processing method for electronic component mounter |
| EP1877726B1 (en) * | 2005-03-11 | 2011-07-27 | Creaform Inc. | Auto-referenced system and apparatus for three-dimensional scanning |
| US7400417B2 (en) * | 2005-05-23 | 2008-07-15 | Federal Mogul World Wide, Inc. | Diffraction method for measuring thickness of a workpart |
| KR20070099398A (en) * | 2006-04-03 | 2007-10-09 | 삼성전자주식회사 | Board inspection apparatus and board inspection method using the same |
| JP2009139285A (en) * | 2007-12-07 | 2009-06-25 | Univ Nihon | Solder ball inspection device, inspection method thereof, and shape inspection device |
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2008
- 2008-07-21 MY MYPI20082704A patent/MY148204A/en unknown
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2009
- 2009-06-26 CN CN2009801278488A patent/CN102099653B/en active Active
- 2009-06-26 WO PCT/MY2009/000082 patent/WO2010011124A1/en active Application Filing
- 2009-06-26 JP JP2011520004A patent/JP5787258B2/en active Active
- 2009-06-26 KR KR1020117000873A patent/KR101633139B1/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106465580A (en) * | 2014-05-30 | 2017-02-22 | 雅马哈发动机株式会社 | Component-data-generating device, surface-mounting machine, and method for generating component data |
| CN106465580B (en) * | 2014-05-30 | 2019-06-18 | 雅马哈发动机株式会社 | Component data generating means, surface mounting apparatus and component data generation method |
| CN107576274A (en) * | 2016-07-04 | 2018-01-12 | 先进装配系统有限责任两合公司 | Method and device for the three-dimensional determination of height position information on the front side of a terminal |
| CN107576274B (en) * | 2016-07-04 | 2019-10-29 | 先进装配系统有限责任两合公司 | Method and device for the three-dimensional determination of height position information on the front side of a terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110043593A (en) | 2011-04-27 |
| KR101633139B1 (en) | 2016-06-23 |
| MY148204A (en) | 2013-03-15 |
| JP5787258B2 (en) | 2015-09-30 |
| CN102099653B (en) | 2012-11-14 |
| WO2010011124A1 (en) | 2010-01-28 |
| JP2011528800A (en) | 2011-11-24 |
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