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CN102083583B - 焊剂 - Google Patents

焊剂 Download PDF

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Publication number
CN102083583B
CN102083583B CN2008801062525A CN200880106252A CN102083583B CN 102083583 B CN102083583 B CN 102083583B CN 2008801062525 A CN2008801062525 A CN 2008801062525A CN 200880106252 A CN200880106252 A CN 200880106252A CN 102083583 B CN102083583 B CN 102083583B
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solder flux
flux
component
solder
composition
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CN102083583A (zh
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F·T·劳伦斯
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Henkel Ltd
National Starch and Chemical Investment Holding Corp
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National Starch and Chemical Investment Holding Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种焊剂组合物，其包含：(i)含有溶剂的载体媒介物；(ii)用于活化焊接用金属表面的活化剂组分；(iii)颜色赋予组分，其具有适当的颜色以助于对施加有焊剂的元件上的所述焊剂进行光学检查；和任选地(iv)用于控制焊剂流变学的胶凝组分。利用颜色赋予组分以指示期望量的焊剂的存在。可以排除具有对于可靠焊接而言不充足的焊剂的元件。

Description

焊剂
发明背景
发明领域
本发明涉及焊剂、特别是直接芯片连接(DCA)焊剂领域。在本发明中特别感兴趣的是适用于如下工艺的类型的焊剂：其中将待经焊剂处理的制品在设置和焊接之前浸入焊剂储存器中。这些对于“叠层封装”(PoP)电子组件等是平常的。
相关技术说明
焊接工艺是公知的。这些包括从手工焊接方法到机器焊接方法的范围。将焊剂(flux material)与焊料(soldering material)一起使用是公知的。焊剂满足许多功能。通常，焊剂的主要功能是确保第一元件例如支撑基底如印刷线路板(PCB)的导电材料以穿越焊料互连的良好导电作用与第二元件如电子元件适当地互连。单独使用焊料(solder)将不会形成互连。
为了形成成功的互连，有必要应用焊剂(fluxing material)。已经使用了许多不同的替代物。已知例如在焊料中包括固体焊剂。通常，这类焊料然后将以金属线或其它此类固体形式提供，该形式将引入穿过焊料的焊剂芯。随着加热时焊料熔化，焊剂被活化，并且如果所述焊接工艺符合可接受的标准，则形成由此产生的互连。
还已知使用焊膏。焊膏通常是焊料颗粒在焊剂介质中的均匀稳定的悬浮体。
回流焊接被用于PCB的自动化制造中，其中电子元件被表面安装在已通过如丝网印刷或模版印刷或分配等方法预先施加焊膏的PCB上。然后使得PCB经受足够高的温度，以导致焊料液化并在PCB上就地连接所述元件。热量可以通过例如红外线、加热式输送带或对流装置提供。
考虑到现代电子器件例如移动电话日益要求的电路小型化和复杂性，已涌现了例如能通过拾取-浸渍工艺(pick-and-dip process)应用的焊接工艺。例如采用粘性液体形式的焊剂。关于此点，粘性液体是可以通过拾取-浸渍工艺施加的、但其足够粘从而于适当位置保留在被浸渍的元件上用于后续焊接的粘性液体。
拾取-浸渍工艺典型地用于已预先施加有焊料的元件。许多电子元件用在板上(on-board)的充足焊料制造，以使得元件随后被焊接至基底。基底可以是线路板或甚至其它电子元件。
希望将粘性焊剂直接施加至已被制造具有在适当位置上的焊料的元件。粘性焊剂可以例如被施加至焊球阵列(ball grid array，BGA)或凸点专用集成电路(ASIC)。
典型地，粘性焊剂的这种施加通过浸入储存器中来实现。储存器典型地将是非常浅的，并且浸渍将只浸没预先施加的焊料至期望的深度。
一旦粘性焊剂被施加，元件可以在回流之前被设置在基底如PCB上。通常，粘性焊剂提供原始强度(green strength)(焊接前将元件保持在适当位置)。此类粘性焊剂一般是基本上无色的，或可以具有由组合物的组分赋予的轻微颜色。例如如果使用松香，当观察相对大量的组合物时，它可以赋予淡黄色至橙色。在施加至焊料上的小量的情况下，焊剂是基本上无色的，并且一般不被看见。
过去，所用的大部分焊料组合物为锡-铅型的，其被证实在大多数常见应用中是有用的。本发明的焊剂可以与此类焊料组合物一起使用。
铅在焊料组合物中的使用已经受到监督，并且由于环境和健康原因变得不令人满意。因此，已经尝试从焊料组合物中消除对铅的需要。此类无铅焊料组合物典型地包含锡、铜和银(典型地95.5重量％的锡、4重量％的银和0.5重量％的铜)。铋也可以在大约1.0重量％至4.5重量％的范围内与锡、锑和银一起使用。涉及无铅合金的专利包括美国专利1,437,641、3,607,253、4,042,725、4,170,472、4,667,871、4,670,217、4,695,428、4,758,407、4,778,733、4,806,309、4,879,096、4,929,423、5,094,813、5,102,748、5,147,471、5,242,658、5,256,370、5,316,205、5,320,272、5,328,660、5,344,607、5,352,407、5,390,080、5,393,489、5,405,577、5,411,703、5,414,303、5,429,689、5,435,968、5,439,639、5,452,842、5,455,004、5,527,628、5,538,686、5,569,433、5,580,520、5,658,528、5,698,160、5,718,868、5,730,932、5,733,501、5,755,896、5,762,866、5,817,194、5,837,191、5,843,371、5,851,482、5,863,493、5,874,043、5,918,795和6,231,691；欧洲专利文献EP-A-0251 611、EP-A-0 336 575、EP-A-0 629 463、EP-A-0 629 464、EP-A-0629 465、EP-A-0 629 466和EP-A-0 629 467；英国专利文献GB-A-2158,459；日本专利文献JP-A-5050286和JP-A-8230598；和国际专利公开WO-A-94/2563，它们各自公开的内容由此明确通过引入并入本文。
对于在拾取-放置工艺(pick-and-place process)中实现元件的可靠连接有特定的要求。在这方面，焊剂的正确施加是一个关键考虑因素。如果未施加充足的焊剂(例如用量不足或焊剂的覆盖率不足)，在每一焊料点可能不能实现有效的焊接。这最终可能导致产生不正确的互连/电路。
在本领域中一般认为，提供实现许多功能的焊剂是所期望的。特别期望的是焊剂提供良好的表面活化。在这方面，已知在焊剂内包含活化剂组分，其将起到从金属表面除去被氧化的物质的作用，由此允许更好的焊接成金属互连和最终的金属(PCB)至金属(电子元件)互连。
添加活化剂以分解并除去存在于待进行焊接的部分中的任何氧化物膜，并且该活化剂通常为有机化合物，包括卤化物、典型地胺氢卤化物、如二乙胺盐酸盐，或不含卤化物的弱有机酸。
特别地，期望使用在75至250℃范围内的温度下熔融的羧酸，如欧洲专利公开0 620 077 A中所述。
特别重要的是更可靠地施加焊剂至元件，特别是其上具有预先施加的焊料的那些元件。这也将意味着降低的组装电子器件的废品率(rejection rate)。
发明概述
本发明提供了焊剂组合物，其包含：
(i)含有溶剂的载体媒介物(carrier vehicle)；
(ii)用于活化焊接用金属表面的活化剂组分；
(iii)用于控制焊剂流变学的胶凝组分；和
(iv)颜色赋予组分，其具有适当的颜色以助于对施加有焊剂的元件上的所述焊剂进行光学检查。
颜色赋予组分可为任何适当的类型，包括染料或着色剂。颜色可由物质的荧光性质所致。一个标准在于所提供的颜色赋予剂显示适度的在所述焊剂中的溶解度。适当的颜色赋予组分如染料可以选自单偶氮、偶氮、三芳基甲烷、呫吨、磺酞、吖啶、喹啉、吖嗪、噁嗪、蒽醌和靛蓝(indigold)染料，如美国专利6,241,385中所述。
期望地，在利用红光源的检测工艺中，颜色赋予剂将包含蓝色、绿色或紫色染料，更期望地蓝色染料。此类物质可以选自Orasol NavyBlueTM、Janus GreenTM、甲基紫、专利蓝、Victoria blue RTM、结晶紫、Irgalith Blue TNCTM、Irgalith Magenta TCBTM、Erythrosinextra bluishTM、氯酚蓝、溴酚蓝、Savinyl blue BTM、Orasol blueBLNTM、Rhoduline violet、氯化频哪氰醇、溴化频哪氰醇、碘化频哪氰醇、Solophenyl Brilliant Blue BLTM、Nile blue ATM、GallocyaninTM、Gallamine BlueTM、天青石蓝、亚甲基蓝、ThinoninToluidine Blue O、亚甲基绿和Azure A/B/CTM、Savinyl Green BTM、Savinyl Blue RS、D+C Green 6TM、Blue VIF OrganolTM、Celliton BlueExtraTM、Alizarin Blue STM、Nitro Fast Green GSB、茜素红(Chinalizarin)、Oil Blue N、Solvay PurpleTM和其组合，如美国专利6,241,385中所述。
期望地，在利用红光源的检测工艺中，颜色赋予剂将包含蓝色、绿色或紫色染料，其可以选自一种或多种基于蒽醌的化合物，例如具有下式的那些：
Figure GPA00001046750400051
期望地，在利用红光源的检测工艺中，R将为3-N-环己基-2，4，6-三甲基苯磺酰胺(CAS 23552-74-1)。作为选择，R另外可以相同或不同，并且可以选自C1-C20烷基、C3-C20环烷基、C5-C20芳基、C6-C20烷基芳基、C6-C20芳基烷基及其组合。
重要地，该组分的适当选择有助于通过光学手段的焊剂检验。这通过与自动拾取-放置设备(pick and place equipment)中的照明光源的协同相互作用而实现，以使得焊剂呈现黑色。例如，如果照明光源是红色的，那么蓝色的颜色赋予组分是有利的。具有对于可靠焊接而言不充足的焊剂的元件可以被排除(reject)。
作为选择，如果照明光源本质上是紫外线(UV)，可以以类似方式使用为荧光组分(fluorescing component)的适当荧光颜色赋予组分。
如果荧光颜色赋予剂显示出适度的在焊剂介质中的溶解度，可以选择适当的荧光染料，例如从双苯并噁唑、苝类、蒽类、靛蓝类和硫准靛类(thioindigoid)、咪唑类、萘二甲酰亚胺类(naphtalimide)、呫吨类、噻吨类、香豆素类和若丹明类中选择。
期望地，荧光赋予剂将选自一种或多种双苯并噁唑基化合物如具有双苯并噁唑结构的那些：
Figure GPA00001046750400052
其中R为氢、甲基、丁基或叔丁基之一，z为噻吩环。进一步期望地，双苯并噁唑(bisbenzozazolyl)化合物为2，5-双(5′-叔丁基-2-苯并噁唑)噻吩，其中R为叔丁基和z为噻吩环。作为选择，R另外可以相同或不同，并且可以选自氢、C1-C20烷基、C3-C20环烷基和其组合。
本发明的焊接用焊剂还提供焊接前的良好的原始强度，因而提供牢固的焊接接头。在这种情况下，其赋予各种可归因于良好焊剂的性质，例如从PCB或其它基底上的金属表面除去氧化物层和保护清洁的接头表面免受氧化直至进行焊接。这导致改进的金属间接触。
焊剂组合物的载体媒介物可以包括至少一种高沸点溶剂如聚乙二醇醚。这将不在一般室温下蒸发，并且通常将与焊剂的其它组分于适当位置保留在施加有所述焊剂的基底上。
当焊剂暴露于回流焊接机的加热位置所特有的较高温度下时，高沸点溶剂提供将承载活性材料的介质。例如在典型的机器中，将基底如用焊剂处理的元件和PCB逐步加热至约230℃的温度。期望地，高沸点溶剂为聚乙二醇醚，例如具有下式的物质：CH3CH2O(CH2CH2O)2CH2CH3。
焊剂组合物的活化剂组分为羧酸、松香中的至少一种，和任选进一步包括在加热时释放卤化氢的卤化化合物。适当的卤化化合物可以选自反式-2，3-二溴-2-丁烯-1，4-二醇、内消旋-2，3-二溴琥珀酸、三-(2，3-二溴丙基)-异氰脲酸酯和其组合。通常添加活化剂，以分解并除去存在于待进行焊接的基底部分中的任何氧化物膜。对于铜基底如常规用于PCB的那些，除去被氧化的铜是期望的。松香可以由于其性质用作弱酸性活化剂，但是其也被添加用于保护金属免受氧化例如作为保护涂层。
本发明焊接的整体效果在于更明确的、改进的和更牢固的电子元件与基底上的金属例如线路板上的铜之间的互连。
松香组分是至少一种选自歧化松香；氢化松香、脱氢松香或未改性松香中的物质。松香的高沸点确保其将保留在适当位置直至发生焊接。
松香是从天然来源如松树树液获得的天然物质，并包括松香酸的异构体。也可以使用合成树脂。这些物质一般可以称为树脂，此处使用的术语“树脂”包括天然树脂如松香、化学改性的松香、和合成树脂。为了形成本发明的组合物，树脂可以与另外的活化剂和胶凝剂一起分散于溶剂中。
焊剂组合物将优选包含至少一种颜色赋予组分如基于上述结构式的化合物，其以所述组合物总量的0.1重量％至10重量％的量存在。更优选地，至少一种化合物将以所述组合物总量的0.5重量％至2重量％的量存在。
焊剂组合物一般将包含以所述组合物总量的30重量％至70重量％的量存在的活化剂组分。更期望地，焊剂组合物将包含以组合物总量的40重量％至60重量％的量存在的活化剂组分。
焊剂组合物一般将包含以所述组合物总量的0.1重量％至10重量％的量存在的胶凝剂。更期望地，焊剂组合物将包含以所述组合物总量的0.4重量％至1重量％的量存在的胶凝剂。
焊剂的流变学依赖于存在于所述焊剂中的胶凝剂水平。低含量的胶凝剂导致牛顿流变学(Newtonian rheology)。期望地，焊剂组合物将具有牛顿流变学。具有牛顿流变学的焊剂组合物对浸渍速度(dipspeed)不敏感，由此对于所述组合物的浸渍应用而言是期望的。
对于某些应用，可能期望本发明的焊剂组合物不包含胶凝剂。该组合物将具有牛顿流变学。
在用本发明的焊剂组合物处理所述电子元件后，焊料可以被用于将电子元件例如BGA附着至基底。
本发明还提供了将元件焊接至金属基底的方法，该方法包括以下步骤：
(i)用如上所述的本发明的焊剂组合物处理所述元件；和
(ii)随后将所述元件焊接至金属化基底。
焊接步骤可以通过回流工艺实现。
本发明涉及具有基于蒽醌的结构式的化合物(例如下式那些，其中R如上述定义)作为生产焊接工艺用液体焊剂中的组分的用途：
Figure GPA00001046750400081
特别地，焊剂组合物的使用有助于在自动拾取-浸渍工艺期间对所施加的焊剂进行光学检查。
现在将如下所述更详细地描述本发明。
附图简述
图1下面示出用于在PCB上的器件的应用检测和组装的典型方法的示意图。
图2示出说明没有施加的焊剂和施加有本发明的焊剂组合物的在BGA红光下对比的两个图像。
附图详述
为了易于参考，如图1中说明性所示的，浸渍焊剂工艺被分为通过示意图中各个图像所示的三个步骤。在第一步骤(步骤1)中，将元件(在这种情况下，带有附图标记1的BGA)浸入包含蓝色染料的粘性焊剂3的储存器或池2中。用刮刀4将焊剂3找平。获得均一高度的焊剂允许待焊接的元件均匀浸入。在这种情况下，BGA的焊料5球浸入该池中。将粘性涂层附着至焊料。
第二步骤(步骤2)显示出拾取喷嘴6(其也可以用于浸渍)。经焊剂处理的BGA器件1、特别是具有粘性焊剂的焊球暴露于来自具有通过检测器9检测的反射光的适当波长的光源8的光线7。监测器9适于相对于标准比较经焊剂处理的元件的反射光图案以确定元件是否被充分地用焊剂处理。
在第三步骤(步骤3)中，将经恰当地焊剂处理的元件设置在已经在所述PCB上排列有连接垫板(connective pad)12的PCB基底10上。如果用焊剂对BGA的处理就可靠焊接而言是不足的，则监测器9将从反射光图案挑选它，并且该BGA由于不适于设置在PCB上被排除。可以将所述被排除的BGA从加工环境中取出，或者可能被再循环用于进一步的焊剂处理。
第二步骤通过图2来说明，其中焊剂在被浸渍的BGA上的存在显示为比其中未施加焊剂的图像更黑的图像。以该方式检测焊剂可以将鉴别未经恰当地焊剂处理的元件作为一种可能性。排除未经恰当地焊剂处理的元件可能发生。
实施例
将BGA浸入根据本发明的焊剂中。该焊剂包括使用MY9E拾取-放置机(pick and place machine，MyData制造)的具有蓝色染料(可从Clariant获得的Savinyl Blue RS)的DCA焊剂(可从HenkelLoctite Adhesives UK获得的产品No.E/U/2290)。使用该机器的集成检验设备得到图2中所示的图像。
图2中的第一(顶部)图像(照片)示出无焊剂的电子元件的焊球阵列；第二图像显示出施加有焊剂的相同元件。变暗的图像由焊剂的蓝色所致。在经焊剂处理的焊料和未经焊剂处理的焊料之间实现的颜色对比使得能够识别(和排除)具有不充足的焊剂施加的元件(例如所示的BGA)。
当用于参考说明本发明时，此处所用的术语“包括/包含”和术语“具有”用于说明所述特征、整数、步骤或组分的存在，但并不排除一种或多种其它特征、整数、步骤、组分或其组合的存在或附加。
应理解，为了清楚起见而在单独的实施方案的上下文中描述的本发明某些特征也可以在单一实施方案中以组合方式提供。相反，为了简短起见而在单一的实施方案中描述的本发明的各种特征也可以分别地或以任何适当的子组合方式提供。

Claims (4)

1.一种检查元件在组件运转中存在充足焊剂的方法，该方法包括以下步骤：
(a)用发射红光的光源照射其上具有施加的焊剂组合物的元件，其中所述焊剂组合物包含：
(i)含有聚乙二醇醚溶剂的载体媒介物；
(ii)用于活化焊接用金属表面的活化剂组分；
(iii)用于控制焊剂流变学的胶凝组分；和
(iv)蓝色赋予组分，其有助于对施加有焊剂的元件上的所述焊剂进行光学检查，该蓝色赋予组分可溶于所述焊剂组合物；
(b)光学检查焊剂的存在；和
(c)排除不存在充足焊剂的元件。
2.根据权利要求1所述的方法，其中该方法还包括确定是否存在充足焊剂的步骤。
3.根据权利要求1所述的方法，其中照射的红光的波长在613-653nm之间。
4.根据权利要求3所述的方法，其中照射的红光的主波长为633nm。
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TW200922730A (en) 2009-06-01
US8348135B2 (en) 2013-01-08
EP2183076A1 (en) 2010-05-12
US20100143658A1 (en) 2010-06-10
IE20070530A1 (en) 2009-03-18
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CN102083583A (zh) 2011-06-01
WO2009013210A1 (en) 2009-01-29
TWI468248B (zh) 2015-01-11

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