CN102083269A - Ceramic circuit substrate and manufacturing method thereof - Google Patents

Abstract

The invention relates to a ceramic circuit substrate and a manufacturing method thereof. The ceramic circuit substrate comprises a substrate and a blank. The surface of the substrate is provided with a plurality of bonding pads; and the blank is stacked on the surface of the substrate and provided with a plurality of through holes, wherein the positions of the through holes correspond to the bonding pads, and the diameters of the through holes are greater than those of the bonding pads. The ceramic circuit substrate is provided with a solder mask layer which can be used for preventing a solder bridge and preventing the substrate from warping.

Description

Ceramic circuit substrate and manufacturing method thereof

technical field

The present invention relates to a ceramic circuit substrate and a manufacturing method thereof, in particular to a ceramic circuit substrate with a solder-proof function and a manufacturing method of the ceramic circuit substrate.

Background technique

With the rapid development of electronic technology, electronic products are also designed towards the trend of light, thin, short and small. For the circuit wiring design of such electronic products, the circuit board (wired board) is a frequently used structural component, such as a printed circuit board (printing circuit board), a chip carrier (chip carrier) or a low-temperature co-fired ceramic substrate ( LTCC) and other circuit boards.

Traditionally, due to the limitation that the printing opening is only below 200 microns (um), and there are problems such as poor resolution and printing size deviation, it can only be used for partial solder mask and cannot print solder mask around the bonding pad (pad). (solder mask), and then cause the solder balls to contact each other to form a solder bridge, and produce a short circuit. In addition, due to the large diameter of the printing line, when using ceramic plaster printing, the shrinkage rate of the ceramic paste is different from that of the substrate material due to the large printing area, resulting in warping of the product during the co-firing process.

In view of the fact that traditional methods cannot effectively solve the problems of solder bridges and substrate warpage, it is urgent to propose a novel ceramic circuit substrate that can be used to prevent solder bridges and substrate warpage.

Contents of the invention

One of the objectives of the present invention is to provide a ceramic circuit substrate with a solder resist layer to prevent solder balls from contacting each other during soldering to form solder bridges and short circuits.

Another object of the present invention is to provide a ceramic circuit substrate for preventing the substrate from warping during the co-firing process.

The invention relates to a ceramic circuit substrate, including a substrate and a green body. There are a plurality of bonding pads on the surface of the substrate. The green body is stacked on the surface of the substrate. The green body has a plurality of through holes, wherein the positions of the through holes correspond to the bonding pads, and the diameter of the through holes is larger than that of the bonding pads.

According to the ceramic circuit substrate of the present invention, the shrinkage ratio of the substrate and the green body is the same. Or the material of the green body is the same as that of the substrate.

According to the ceramic circuit substrate of the present invention, the substrate is a low temperature co-fired ceramic substrate.

According to the ceramic circuit substrate of the present invention, the plurality of through holes are formed by laser or mechanical through hole means.

According to the ceramic circuit substrate of the present invention, the thickness of the green body is between 10 and 50 microns.

The present invention relates to a manufacturing method of a ceramic circuit substrate, comprising the following steps. A substrate having a plurality of bonding pads on its surface is provided. A green body stacked on the surface of the substrate is provided, the green body has a plurality of through holes, wherein the positions of the through holes correspond to the bonding pads, and the diameter of the through holes is larger than the diameter of the bonding pads.

According to the manufacturing method of the ceramic circuit substrate of the present invention, the shrinkage ratio of the substrate and the green body is the same. Or the material of the green body is the same as that of the substrate. The substrate is a low temperature co-fired ceramic substrate. The plurality of vias are formed by laser or mechanical via means. The thickness of the green embryos is between 10 and 50 microns.

According to the present invention, the ceramic circuit substrate has a solder resist layer, which can be used to prevent tin bridges and substrate warping.

Description of drawings

FIG. 1 is a cross-sectional view showing a ceramic circuit substrate according to an embodiment of the present invention.

2A to 2B are schematic diagrams showing a manufacturing method of an airtight ceramic layer according to an embodiment of the present invention.

Detailed ways

In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.

The sectional view of Fig. 1 shows a ceramic circuit substrate 1 according to an embodiment of the present invention, which includes: a substrate 11 with a plurality of bonding pads 12 on its surface, and the substrate 11 can be a low-temperature co-fired ceramic substrate, wherein the above-mentioned low-temperature co-fired ceramic substrate The fired ceramic substrate can be composed of a plurality of ceramic layers 15; and a green body 13, stacked on the surface of the substrate 11, the green body 13 has a plurality of through holes 14, wherein the positions of the plurality of through holes 14 correspond to the plurality of The bonding pad 12 , and the diameter of the through hole 14 is larger than the diameter of the bonding pad 12 . In addition, the thickness of the green body 13 is between 10-50 micrometers, and the through-holes 14 can be formed by a laser or a mechanical through-hole device (not shown). It should be noted that the substrate 11 and the green body 13 have the same shrinkage rate, and the materials constituting both are also the same. As shown in FIG. 1 , when the solder balls 17 of the IC chip 16 are soldered to the bonding pads 12 of the substrate 11 , the green body 13 can be used as a solder resist layer to avoid solder bridges between the solder balls, thereby causing short circuits. In addition, the thickness of the green body 13 can be designed to be the same as the thickness of the substrate 11 according to the actual situation.

2A to 2B are schematic diagrams showing a manufacturing method of the airtight ceramic layer 1 according to an embodiment of the present invention. As shown in FIG. 2A , the present invention provides a substrate 11 with a plurality of bonding pads on its surface, and the substrate 11 can be a low temperature co-fired ceramic substrate, wherein the above-mentioned low temperature co-fired ceramic substrate can be composed of a plurality of ceramic layers. In addition, an electronic circuit 18 is provided at the center of the substrate 11 . As shown in FIG. 2B , the present invention provides a green body 13 stacked on the surface of the substrate, the green body 13 has a plurality of through holes 14, wherein the positions of the plurality of through holes 14 correspond to the plurality of bonding pads 12, and The diameter of the through hole 14 is larger than the diameter 12 of the bonding pad. In addition, the thickness of the green body 13 is between 10-50 micrometers, and the through-holes 14 can be formed by a laser or a mechanical through-hole device (not shown). It should be noted that the substrate 11 and the green body 13 have the same shrinkage rate, and the materials constituting both are also the same. Next, the green body 13 and the substrate 11 are stacked by sintering, and only the required bonding pads 12 are exposed (as shown in FIG. 1 ).

The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention.

Claims (10)

1. A ceramic circuit substrate, characterized in that comprising: a substrate having a plurality of bonding pads on its surface; and The green body is stacked on the surface of the substrate. The green body has a plurality of through holes, wherein the positions of the plurality of through holes correspond to the plurality of bonding pads, and the diameter of the through holes is larger than the diameter of the bonding pads. 2. The ceramic circuit substrate as claimed in claim 1, wherein the shrinkage rate of the substrate and the green body is the same; or the material of the green body is the same as that of the substrate. 3. The ceramic circuit substrate as claimed in claim 1, wherein the substrate is a low temperature co-fired ceramic substrate. 4. The ceramic circuit substrate as claimed in claim 1, wherein the plurality of through holes are formed by laser or mechanical through hole devices. 5. The ceramic circuit substrate as claimed in claim 1, wherein the thickness of the green body is between 10 and 50 microns. 6. A method for manufacturing a ceramic circuit substrate, characterized in that it comprises: providing a substrate having a plurality of bonding pads on its surface; and A green body stacked on the surface of the substrate is provided, the green body has a plurality of through holes, wherein the positions of the plurality of through holes correspond to the plurality of bonding pads, and the diameter of the through holes is larger than the diameter of the bonding pads. 7 . The method for manufacturing a ceramic circuit substrate as claimed in claim 6 , wherein the shrinkage ratio of the substrate and the green body is the same; or the material of the green body is the same as that of the substrate. 8. The method for manufacturing a ceramic circuit substrate as claimed in claim 6, wherein the substrate is a low temperature co-fired ceramic substrate. 9. The method for manufacturing a ceramic circuit board as claimed in claim 6, wherein the plurality of through holes are formed by a laser or a mechanical through hole device. 10. The method for manufacturing a ceramic circuit board as claimed in claim 6, wherein the thickness of the green body is between 10 and 50 microns.

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