CN102075838A - Electret microphone - Google Patents
Electret microphone Download PDFInfo
- Publication number
- CN102075838A CN102075838A CN2011100511234A CN201110051123A CN102075838A CN 102075838 A CN102075838 A CN 102075838A CN 2011100511234 A CN2011100511234 A CN 2011100511234A CN 201110051123 A CN201110051123 A CN 201110051123A CN 102075838 A CN102075838 A CN 102075838A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- base plate
- supporter
- electret microphone
- tone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 27
- 238000009413 insulation Methods 0.000 claims description 15
- 125000006850 spacer group Chemical group 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 14
- 239000012774 insulation material Substances 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 4
- 238000012797 qualification Methods 0.000 abstract description 4
- 239000012528 membrane Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000002788 crimping Methods 0.000 description 6
- 230000003044 adaptive effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention relates to an electret microphone. The electret microphone comprises a shell, a membrane component, an insulating gasket and a back electret component which are arranged in the shell in sequence, wherein the shell comprises a square bottom plate, a square circuit board and a square column-shaped support body arranged between the bottom plate and the circuit board; an inner cavity for accommodating the membrane component, the insulating gasket and the back electret component is arranged in the support body, and both ends of the support body are sealed by the bottom plate and the circuit board; and the back electret component is electrically connected with the circuit board. The top part of the electret microphone is directly sealed by the flat panel-type circuit board, and the smoothness of the top part of the electret microphone is much higher than that of shell edges curled by the traditional method, so that the SMT difficulty of the electret microphone is lowered, and the qualification rate of products is improved.
Description
[technical field]
The present invention relates to the microphone field, relate in particular to a kind of electret microphone.
[background technology]
In the portable communications field, most of circular crimping or the square bead designs of adopting of traditional electret microphone.But the surface smoothness of circular crimping or square crimping electret microphone product is not high, be unfavorable for large-scale SMT (Surface Mounted Technology, surface mounting technology) produces, and the electret microphone cost height of traditional square crimping, the qualification rate of product is low behind the SMT, and performance is relatively poor relatively.
[summary of the invention]
Based on this, be necessary the electret microphone that provides a kind of surface smoothness higher.
A kind of electret microphone, comprise shell and the diaphragm unit, insulation spacer and the backplane assembly that set gradually in the enclosure, shell comprises square base plate and square circuit board, and the supporter of the square column type between base plate and circuit board, supporter inside offers the inner chamber that is used to hold diaphragm unit, insulation spacer and backplane assembly, by base plate and circuit board sealing, backplane assembly and circuit board electrically connect respectively at the supporter two ends.
Preferably, circuit board is provided with impedance transformer and capacitance resistance element near a side of inner chamber, and the opposite side of circuit board is provided with a plurality of conducting boss.
Preferably, base plate offers tone-entering hole.
Preferably, the base plate sealing, circuit board offers tone-entering hole, and tone-entering hole runs through in a plurality of conducting boss, the cavity that tone-entering hole connected component support body and backplane assembly and circuit board form; Be provided with gasket ring between diaphragm unit and the base plate.
Preferably, the base plate sealing, circuit board offers tone-entering hole, tone-entering hole runs through in a plurality of conducting boss, supporter offers at the tone-entering hole place and runs through the axial through hole of supporter, base plate offers groove milling near a side of diaphragm unit, and tone-entering hole and through hole are communicated with the cavity that base plate and supporter and diaphragm unit form by groove milling.
Preferably, electrically connect by electric-conductor between backplane assembly and the circuit board, electric-conductor is electroconductive elastic sheet, conducting ring, power spring or conductive pin.
Preferably, supporter is axially arranged with boring, deposits the electric conducting material of conducting base plate and circuit board in the boring; Be filled with the insulation material layer that the diaphragm unit, backplane assembly and the electric-conductor that prevent in the inner chamber contact with electric conducting material in the supporter.
Preferably, diaphragm unit comprises the conduction zona that closely contacts with base plate and is located at the vibrating diaphragm that conducts electricity between zona and the insulation spacer.
Preferably, the backplane assembly comprises the back pole plate that offers at least one backplane tone-entering hole and is located on the back pole plate electret film near a side of diaphragm unit.
The sealing of plate circuit board is directly adopted at the top of above-mentioned electret microphone, and the shell edge of the evenness at its top after far above traditional crimping, thereby the difficulty when having reduced electret microphone SMT improve the production qualification rate of product; In addition, adopt base plate, circuit board to cooperate supporting body structure, on performance, corresponding area reduces between the electric-conductor that electrically connects backplane assembly and circuit board in the supporter and the shell, make parasitic capacitance reduce, noise reduces, in addition, component number is few, the reliability height, and the cost of material is low.
This electret microphone during fabrication, and is easy to process, and the efficient height can carry out large-scale production; Production technology is regulated easy, management and control easily; The circuit board downforce at top is adjustable, can not damage inner structure; Equipment is simple, can reduce the input of production equipment.
[description of drawings]
Fig. 1 is the electret microphone schematic perspective view of embodiment 1;
Fig. 2 be among Fig. 1 electret microphone along the cutaway view of I-I line;
Fig. 3 is the sectional view of supporter among Fig. 1;
Fig. 4 is the schematic perspective view of the electret microphone of embodiment 2;
Fig. 5 be among Fig. 4 electret microphone along the cutaway view of II-II line;
Fig. 6 is the sectional view of supporter among Fig. 4;
Fig. 7 is the cutaway view of the electret microphone of embodiment 3.
[embodiment]
Mainly reaching specific embodiment below in conjunction with the accompanying drawings is described in further detail electret microphone.
Embodiment 1
As depicted in figs. 1 and 2, the electret microphone 100 of present embodiment comprises shell 110 and the diaphragm unit 120, insulation spacer 130 and the backplane assembly 140 that set gradually in shell 110.Shell 110 comprises square base plate 111 and square circuit board 112, and the supporter 113 of the square column type between base plate 111 and circuit board 112.Backplane assembly 140 electrically connects with circuit board 112.
Preferably, can pass through hot melt adhesive film, prepreg or glue between base plate 111, circuit board 112 and the supporter 113 connects.The size of base plate 111, circuit board 112 and supporter 113 is adaptive, thereby the three can pressing forms the shell 110 of electret microphone 100.
As shown in Figures 2 and 3, for strengthening the performance of microphone 100 opposing external interference, being axially arranged with of the supporter 113 of present embodiment holes 114.Deposit the electric conducting material of conducting base plate 111 and circuit board 112 in the boring 114, as being metallic conduction material, alloy conductive material etc.Electric conducting material can pass through tin cream or elargol and base plate 111 and circuit board 112 conductings.Further preferred, between base plate 111 and the supporter 113, can be connected by the hot melt adhesive film or the prepreg of conductivity between circuit board 112 and the supporter 113, thereby no longer need by tin cream or elargol conducting between electric conducting material and the base plate 111 and between electric conducting material and the circuit board 112.
In addition, further be filled with the insulation material layer 115 that prevents conductive element device contacts in electric conducting material and the inner chamber in the supporter 113 of present embodiment.Insulation material layer 115 is filled in the wall of supporter 113 near inner chamber.Insulation material layer 115 can be organic materials such as epoxy resin.
Offer tone-entering hole 116 on the base plate 111 of present embodiment.Preferably, base plate 111 also is provided with in the position of tone-entering hole 116 and is used to prevent that dust from entering structure (not shown) such as the dustcloth of electret microphone 100 or Air Filter.
The diaphragm unit 120 of present embodiment comprises the conduction zona 122 that closely contacts with base plate 111, and is located at the vibrating diaphragm 124 between conduction zona 122 and the insulation spacer 130.
The circuit board 112 of present embodiment is provided with impedance transformer 162 and capacitance resistance element 164 in the side near resonant cavity 150, and opposite side is provided with a plurality of conducting boss 166.Conducting boss 166 is as the output of electret microphone 100.The circuit board 112 of present embodiment is provided with 4 conducting boss 166, and in other embodiments, according to the be connected situation of microphone with external equipment, the quantity of conducting boss 166 can also be 2,3 or 5 etc.
Electrically connect by electric-conductor 170 between backplane assembly 140 and the circuit board 112.The electric-conductor 170 of present embodiment is an electroconductive elastic sheet.The size of electroconductive elastic sheet is slightly larger than the size of resonant cavity 150, and after sealing was finished, electroconductive elastic sheet was subjected to circuit board 112 and deforms with the pressure of supporter 113, thereby can give the certain pressure of components and parts in the inner chamber, made all components and parts fix in position.In other preferred embodiments, electric-conductor 170 can also be structures such as conductive pin, power spring or conducting ring, the metal or alloy making that conductivity such as further preferably copper are good, less with the parasitic capacitance of shell 110 generations.
The external sound signal enters electret microphone 100 by the tone-entering hole of offering on the shell 110 116, cause the vibration of diaphragm unit 120, further cause the variation of capacity plate antenna between diaphragm unit 120 and the backplane assembly 140, produce the alternating voltage signal, finish the conversion of acoustoelectric signal; By electric-conductor 170 signal of telecommunication is passed to circuit board 112 again,, transmit signals to conducting boss 166 through impedance variation.
Embodiment 2
As shown in Figure 4 and Figure 5, the electret microphone 200 of present embodiment comprises shell 210 and the diaphragm unit 220, insulation spacer 230 and the backplane assembly 240 that set gradually in shell 210.Shell 210 comprises square base plate 211 and square circuit board 212, and the supporter 213 of the square column type between base plate 211 and circuit board 212.Electrically connect between backplane assembly 240 and the circuit board 212.
As shown in Figure 5 and Figure 6, for strengthening the performance of microphone 200 opposing external interference, being axially arranged with of the supporter 213 of present embodiment holes 214.Deposit the electric conducting material of conducting base plate 211 and circuit board 212 in the boring 214.Electric conducting material can pass through tin cream or elargol and base plate 211 and circuit board 212 conductings.In addition, further be filled with the insulation material layer 215 that prevents conductive element device contacts in electric conducting material and the inner chamber in the supporter 213 of present embodiment.Insulation material layer 215 is filled in the wall of supporter 213 away from inner chamber.
The circuit board 212 of present embodiment is provided with impedance transformer 262 and capacitance resistance element 264 in the side near diaphragm unit 220, and opposite side is provided with a plurality of conducting boss 266.Conducting boss 266 is as the output of electret microphone 200.
Accordingly, electret microphone 200 is provided with gasket ring 217 between diaphragm unit 220 and base plate 211, thereby base plate 211 cooperates gasket ring 217 and diaphragm unit 220 and supporter 213 to constitute resonant cavity 250.Gasket ring 217 shapes of present embodiment are adaptive with conduction zona 222, and the thickness of gasket ring 217 cooperates the thickness of conduction zona 222 to reach the dimensional requirement of resonant cavity 250.In addition, in a preferred embodiment, gasket ring 217 can also be one-body molded with base plate 211, also promptly offers on base plate 211 and conduct electricity structures such as adaptive groove of zona 222 or opening.
Embodiment 3
As shown in Figure 7, the electret microphone 300 of present embodiment comprises shell 310 and the diaphragm unit 320, insulation spacer 330 and the backplane assembly 340 that set gradually in shell 310.Shell 310 comprises square base plate 311 and square circuit board 312, and the supporter 313 of the square column type between base plate 311 and circuit board 312.Electrically connect between backplane assembly 340 and the circuit board 312.
For strengthening the performance of microphone 300 opposing external interference, being axially arranged with of the supporter 313 of present embodiment holes 314.Deposit the electric conducting material of conducting base plate 311 and circuit board 312 in the boring 314.Electric conducting material can pass through tin cream or elargol and base plate 311 and circuit board 312 conductings.
Diaphragm unit 320 comprises the conduction zona 322 that closely contacts with base plate 311, and is located at the vibrating diaphragm 324 between conduction zona 322 and the insulation spacer 330.
The circuit board 312 of present embodiment is provided with impedance transformer 362 and capacitance resistance element 364 in the side near diaphragm unit 320, and opposite side is provided with a plurality of conducting boss (not shown).Conducting boss is as the output of electret microphone 300.
The supporter 313 of present embodiment cooperates circuit board 312 and backplane assembly 340 to form resonant cavity 350.
Accordingly, base plate 311 offers groove milling 318 in the side near diaphragm unit 320.Tone-entering hole 316 and through hole 317 further are communicated with the cavity that base plate 311 and supporter 313 and diaphragm unit 320 form by groove milling 318.
The tone-entering hole that is appreciated that electret microphone is not limited to above-mentioned set-up mode, also can be located at a side of the drain pan of shell.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (9)
1. electret microphone, comprise shell and the diaphragm unit, insulation spacer and the backplane assembly that in described shell, set gradually, it is characterized in that, described shell comprises square base plate and square circuit board, and the supporter of the square column type between described base plate and described circuit board, described supporter inside offers the inner chamber that is used to hold described diaphragm unit, insulation spacer and backplane assembly, by described base plate and the sealing of described circuit board, described backplane assembly and described circuit board electrically connect respectively at described supporter two ends.
2. electret microphone as claimed in claim 1 is characterized in that, described circuit board is provided with impedance transformer and capacitance resistance element near a side of described inner chamber, and the opposite side of described circuit board is provided with a plurality of conducting boss.
3. electret microphone as claimed in claim 1 or 2 is characterized in that described base plate offers tone-entering hole.
4. electret microphone as claimed in claim 2, it is characterized in that, described base plate sealing, described circuit board offers tone-entering hole, described tone-entering hole runs through in described a plurality of conducting boss, and described tone-entering hole is communicated with the cavity that described supporter and described backplane assembly and described circuit board form; Be provided with gasket ring between described diaphragm unit and the described base plate.
5. electret microphone as claimed in claim 2, it is characterized in that, described base plate sealing, described circuit board offers tone-entering hole, described tone-entering hole runs through in described a plurality of conducting boss, described supporter offers at described tone-entering hole place and runs through the axial through hole of described supporter, and described base plate offers groove milling near a side of described diaphragm unit, and described tone-entering hole and described through hole are communicated with the cavity that described base plate and described supporter and described diaphragm unit form by described groove milling.
6. electret microphone as claimed in claim 1 is characterized in that, electrically connects by electric-conductor between described backplane assembly and the described circuit board, and described electric-conductor is electroconductive elastic sheet, conducting ring, power spring or conductive pin.
7. electret microphone as claimed in claim 1 is characterized in that described supporter is axially arranged with boring, deposits the electric conducting material of described base plate of conducting and described circuit board in the described boring; Be filled with the insulation material layer that the diaphragm unit, backplane assembly and the electric-conductor that prevent in the described inner chamber contact with described electric conducting material in the described supporter.
8. electret microphone as claimed in claim 1 is characterized in that, described diaphragm unit comprises the conduction zona that closely contacts with described base plate and is located at vibrating diaphragm between described conduction zona and the described insulation spacer.
9. electret microphone as claimed in claim 1 is characterized in that, described backplane assembly comprises the back pole plate that offers at least one backplane tone-entering hole and is located at the electret film of a side of close described diaphragm unit on the described back pole plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110051123 CN102075838B (en) | 2011-03-03 | 2011-03-03 | Electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110051123 CN102075838B (en) | 2011-03-03 | 2011-03-03 | Electret microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102075838A true CN102075838A (en) | 2011-05-25 |
| CN102075838B CN102075838B (en) | 2013-12-18 |
Family
ID=44034154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110051123 Expired - Fee Related CN102075838B (en) | 2011-03-03 | 2011-03-03 | Electret microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102075838B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102611770A (en) * | 2012-02-23 | 2012-07-25 | 广东步步高电子工业有限公司 | A Method for Reducing the Failure of Mobile Phone Receivers |
| CN102957992A (en) * | 2011-08-15 | 2013-03-06 | 哈曼国际工业有限公司 | Dual backplate microphone |
| CN103067831A (en) * | 2013-01-24 | 2013-04-24 | 山东共达电声股份有限公司 | Diaphragm and microphone |
| CN103298238A (en) * | 2012-02-22 | 2013-09-11 | 深南电路有限公司 | Integrated sound damper PCB board and manufacturing method thereof |
| CN108645502A (en) * | 2018-04-28 | 2018-10-12 | 北京遥测技术研究所 | A kind of aerospace craft noise testing Electret sound sensor |
| CN108989959A (en) * | 2018-08-09 | 2018-12-11 | 京东方科技集团股份有限公司 | Electret microphone and its manufacturing method, display device |
| CN109547907A (en) * | 2019-01-23 | 2019-03-29 | 东莞泉声电子有限公司 | Lesser electret capacitor microphone of noise coefficient and preparation method thereof |
| CN112243190A (en) * | 2020-12-04 | 2021-01-19 | 山东新港电子科技有限公司 | Ultrathin double-directional electret microphone |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146375A (en) * | 2006-09-14 | 2008-03-19 | 东莞泉声电子有限公司 | Miniature condenser microphone |
| EP2112840A2 (en) * | 2008-04-25 | 2009-10-28 | Hosiden Corporation | Electret condenser microphone |
| CN201616904U (en) * | 2010-01-27 | 2010-10-27 | 潍坊新港电子有限公司 | Electret microphone |
-
2011
- 2011-03-03 CN CN 201110051123 patent/CN102075838B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146375A (en) * | 2006-09-14 | 2008-03-19 | 东莞泉声电子有限公司 | Miniature condenser microphone |
| EP2112840A2 (en) * | 2008-04-25 | 2009-10-28 | Hosiden Corporation | Electret condenser microphone |
| CN201616904U (en) * | 2010-01-27 | 2010-10-27 | 潍坊新港电子有限公司 | Electret microphone |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102957992A (en) * | 2011-08-15 | 2013-03-06 | 哈曼国际工业有限公司 | Dual backplate microphone |
| CN103298238A (en) * | 2012-02-22 | 2013-09-11 | 深南电路有限公司 | Integrated sound damper PCB board and manufacturing method thereof |
| CN103298238B (en) * | 2012-02-22 | 2016-03-30 | 深南电路有限公司 | The pcb board of integrated acoustic damper and manufacture method thereof |
| CN102611770A (en) * | 2012-02-23 | 2012-07-25 | 广东步步高电子工业有限公司 | A Method for Reducing the Failure of Mobile Phone Receivers |
| CN103067831A (en) * | 2013-01-24 | 2013-04-24 | 山东共达电声股份有限公司 | Diaphragm and microphone |
| CN103067831B (en) * | 2013-01-24 | 2015-07-08 | 山东共达电声股份有限公司 | Diaphragm and microphone |
| CN108645502A (en) * | 2018-04-28 | 2018-10-12 | 北京遥测技术研究所 | A kind of aerospace craft noise testing Electret sound sensor |
| CN108645502B (en) * | 2018-04-28 | 2020-08-14 | 北京遥测技术研究所 | Electret noise sensor for measuring noise of aerospace vehicle |
| CN108989959A (en) * | 2018-08-09 | 2018-12-11 | 京东方科技集团股份有限公司 | Electret microphone and its manufacturing method, display device |
| CN108989959B (en) * | 2018-08-09 | 2020-11-10 | 京东方科技集团股份有限公司 | Electret microphone, manufacturing method thereof and display device |
| CN109547907A (en) * | 2019-01-23 | 2019-03-29 | 东莞泉声电子有限公司 | Lesser electret capacitor microphone of noise coefficient and preparation method thereof |
| CN109547907B (en) * | 2019-01-23 | 2024-01-05 | 东莞泉声电子有限公司 | Electret capacitor microphone and manufacturing method thereof |
| CN112243190A (en) * | 2020-12-04 | 2021-01-19 | 山东新港电子科技有限公司 | Ultrathin double-directional electret microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102075838B (en) | 2013-12-18 |
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