CN102074512B - Ultrathin tube shell - Google Patents
Ultrathin tube shell Download PDFInfo
- Publication number
- CN102074512B CN102074512B CN 201010588932 CN201010588932A CN102074512B CN 102074512 B CN102074512 B CN 102074512B CN 201010588932 CN201010588932 CN 201010588932 CN 201010588932 A CN201010588932 A CN 201010588932A CN 102074512 B CN102074512 B CN 102074512B
- Authority
- CN
- China
- Prior art keywords
- shell
- edge
- sole piece
- oxygen
- free copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005367 electrostatic precipitation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- Oxygen, Ozone, And Oxides In General (AREA)
Abstract
The invention discloses an ultrathin tube shell, comprising an upper cover, a location member, a base and a circular thick sliver sheet, wherein the upper cover comprises an external ring sheet and a disc-shaped non-oxygenic copper plate; the external ring sheet is connected to the edge of the non-oxygenic copper plate; the base comprises an annular metal sheet, a cylindrical shell, an annular edge and a bottom block; the edge is fixed at the top end of the shell; the upper surface of one end of the annular metal sheet is welded with the shell, and the other end of the annular metal sheet is sleeved and fixed at the lower part of the side wall of the bottom block; the thick sliver sheet is disposed on the bulge of the bottom block; the location member is an annular location ring; the bottom of the location ring is provided with an eave layer shaped ring projected inwardly; the outer wall of the location ring is fitted with the inner wall of the shell in an embedding manner; the inner side of the eave layer shaped ring is contacted with the upper part of the side wall of the bottom block; the outer ring sheet is welded with the edge in a sealing manner. In the invention, the part structure and assembling manner are improved on the original basis; the tube shell is compared with the traditional tube shell for packaging tube cores of the same type, the thickness is reduced about 66%, and the weight is reduced about 73%.
Description
Technical field
The invention belongs to the high power semi-conductor technical field, be specifically related to a kind of ultrathin tube shell for high-power both-end device package.
Background technology
At present, make the field at high power semi-conductor, the encapsulation technology of semiconductor device more and more comes into one's own.A kind of novel ultra-high power semiconductor switching device RSD(Reversely Switch-on Dynistor) is the Russian scientist invention 1980s, the maximum characteristics of this device be can be in high di/dt situation switch super large pulse power (peak power can reach hundreds of megawatts), can be widely used in the aspects such as manual simulation's nuclear fusion, ELECTROMAGNETIC WEAPON, the super high power pulse power, electrostatic precipitation, desalt.After the RSD switch occurs, its encapsulating package adopts the ZT80dt shell always, this shell mainly is comprised of loam cake, upper molybdenum sheet, upper silver strip, locating ring and base, the loam cake of shell and base bottom are made by the oxygen-free copper of high conductivity, the sidewall of base is the ceramic material of high insulation, this shell dielectric strength is high, heat radiation is good, can satisfy device works long hours under high power state, and the connection in series-parallel that is easy to the RSD switch is used, and can satisfy the demand fully for the RSD switch that still is in the experimental applications stage.Yet increasingly mature and extensive along with the RSD switch application, this shell exposes many inconvenience gradually, adopt the RSD switch of this shell encapsulation, single the about 30mm of thickness, about weight 1.5kg, such thickness and weight have caused the height of stack layer and weight very huge when the use in parallel of RSD switch series, have limited the application of RSD switch in many engineering systems.For example, need tens of RSD switches of connection in series-parallel in some super high power system, if use calculating by 30 switch series connection, the height of switch series stack layer will reach 0.9m, weight 45kg, and such height and weight are that system is unacceptable.
Find according to retrieval, be in a kind of Ultrathin packaged semiconductor rectifying device that relates in 200920086846.6 at number of patent application, its structure comprises plate shell, the semiconductor rectifier chip, negative electrode and anode metal electrode briquetting, it is on the basis of the semiconductor rectifier device of existing flat encapsulation, the thickness of negative electrode and anode metal electrode briquetting is designed to respectively be not more than 3mm, shell thickness is not more than 9mm, shell is pottery or epoxy sealing shell, this ultrathin packing forms has the packaged semiconductor rectifying device of utmost point low thermal resistance with respect to the encapsulation of routine.This structure is compared with conventional package ZT80dt type shell, very large reducing arranged on the size, weight saving is many, but the semiconductor rectifier chip directly contacts with anode metal electrode briquetting with negative electrode, produce easily and do not produce shearing force because the chip expanded by heating does not mate, make it unbalance stress, reduce useful life.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of encapsulation for the ultra-high power semiconductor switching device, and thin, the lightweight ultrathin tube shell of design thickness.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of ultrathin tube shell, comprise loam cake, keeper, base, it is characterized in that: also comprise circular thick silver strip, described loam cake comprises outer ring plate and discoidal oxygen-free copper dish, and described outer ring plate is connected with the edge of oxygen-free copper dish; Described base comprises annular sheet metal, columnar shell, the edge of annular and sole piece, described sole piece is that the middle part is with the circular configuration of projection, described edge is fixed in the top of shell, one end upper surface of described annular sheet metal and shell welding, its other end is nested and be fixed in the lower sidewall of sole piece, described thick silver strip places on the projection of sole piece, described keeper is the locating ring of annular, described locating ring bottom is with inwardly protruded eaves stratiform annulus, the outer wall of locating ring cooperates with described outer casing inner wall is nested, the inboard of described eaves stratiform annulus contacts with the side wall upper part of sole piece, described outer ring plate and edge seal welding.
The material at described outer ring plate, annular sheet metal and edge is for can cut down metal, and described outer ring plate and oxygen-free copper plate edge seal welding are fixed, and surface both has nickel coating.Can cut down metal and also claim teleoseal, because this alloy has good low temperature structure stability and plasticity, therefore easily welding can make better tightness of the present invention.
Described sole piece material is oxygen-free copper, and its surface is provided with nickel coating, and the bottom surface of described sole piece is provided with the location notch for the switch series connection.
Described shell is the ceramic ring of high insulation.
Described nickel coating thickness is 5-7 μ m.
In above-mentioned feature structure, the oxygen-free copper dish is set to disc-shaped structure, the downward groove that caves in and be used for the switch located in series in its middle part, compare with the conventional package shell, required immense pressure of bearing was distributed on whole tube core heat sink when this large-area detent can use switch series connection, had avoided that the shrinkage pool positioning mode causes the tube core unbalance stress in the conventional package shell because pilot pin is long.At the set inwardly protruded eaves stratiform annulus in locating ring bottom, its thickness is 1mm, compare with the shell locating ring of conventional package tube core, this locating ring that eaves layer structure arranged no longer is confined to locate the function of tube core, and it can also more effectively eliminate the electrion between the heat sink and shell base of tube core.The present invention and traditional shell difference also have, and during use, with the downward upside down of the positive terminal of tube core, the loam cake bottom surface that makes shell directly contacts with heat sink of tube core negative pole, so design thickness of the present invention is very little, and weight saving.In addition, after tube core inversion encapsulation, the anodal surface of tube core contacts with the oxygen-free copper of tube shell bottom, in order to eliminate the shell base die surfaces is not mated the shearing force of generation because of thermal expansion, has installed one deck ductility and high conductive thick silver strip between tube core and base additional.
The beneficial effect that adopts technique scheme to produce is: 1. the present invention has carried out design improvement to the structure of loam cake, keeper and base, changed original fit system, in the situation that does not change its performance, make the overall structure volume reduce weight saving; The anodal inversion downwards of tube core encapsulated, and the anodal surface of tube core contacts thick silver strip with the oxygen-free copper of tube shell bottom, has eliminated the shearing force that produces because of thermal expansion, prolongs its useful life.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of loam cake;
Fig. 3 is the structural representation of locating ring;
Fig. 4 is the structural representation of base;
Wherein, 1, annular sheet metal, 2, shell, 3, the edge, 4, outer ring plate, 5, the oxygen-free copper dish, 6, thick silver strip, 7, sole piece, 8, tube core, 9, locating ring.
Embodiment
1 as can be known with reference to the accompanying drawings, the present invention is specifically related to a kind of ultrathin tube shell, comprises loam cake, keeper, base, it is characterized in that: also comprise circular thick silver strip 6, described loam cake comprises outer ring plate 4 and discoidal oxygen-free copper dish 5, and described outer ring plate 4 is connected with the edge of oxygen-free copper dish 5; Described base comprises annular sheet metal 1, columnar shell 2, the edge 3 of annular and sole piece 7, described sole piece 7 is that the middle part is with the circular configuration of projection, described edge 3 is fixed in the top of shell 2, one end upper surface of described annular sheet metal 1 and shell 2 welding, its other end is nested and be fixed in the lower sidewall of sole piece 7, described thick silver strip 6 places on the projection of sole piece 7, described keeper is the locating ring 9 of annular, described locating ring 9 bottoms are with inwardly protruded eaves stratiform annulus, the outer wall of locating ring 9 and described nested cooperation of shell 2 inwalls, the inboard of described eaves stratiform annulus contacts with the side wall upper part of sole piece 7, described outer ring plate 4 and edge 3 seal weldings.
With reference to the accompanying drawings 2, accompanying drawing 3 and accompanying drawing 4 are as can be known, loam cake of the present invention is comprised of oxygen-free copper dish 5 and outer ring plate 4, both closely weld together, and surface electrical is coated with nickel metal layer, and electroplating thickness is generally 5-7 μ m, the integral thickness of loam cake is 0.5mm, the detent of upper surface is arranged on the oxygen-free copper dish 5 groove depth 1.5mm, diameter phi 78mm, its center is concentric with the oxygen-free copper dish; Locating ring 9 is generally made by polytetrafluoroethylene, its external diameter 79mm, internal diameter 75mm, height 5mm, end at locating ring 9 has designed an inwardly protruded eaves stratiform annulus, and height and the width of eaves stratiform annulus are 1mm, and this eaves layer can be eliminated electrion between the heat sink and shell base of tube core 8.Base is comprised of annular sheet metal 1, shell 2, edge 3 and sole piece 7, and the material at edge 3 is for can cut down metal, and annular sheet metal 1 and sole piece 7 are oxygen-free copper, the thickness 5mm of sole piece 7, diameter phi 73mm, its outer surface nickel plating is provided with the location notch of connecting for switch at the bottom center place of sole piece 7.The material of shell 2 is the ceramic cup of high insulation, ceramic ring height 6.5mm, external diameter φ 90mm, internal diameter φ 80mm.
The present invention is at first tiled thick silver strip 6 to the sole piece 7 of base when package die 8, then puts into successively locating ring 9 and tube core 8, and both are close to, and with welding manner loam cake and base seal is welded together at last, can finish the encapsulation of tube core 3.
According to the size of the above each parts of the present invention and packaged type as can be known, structural thickness proposed by the invention is about 9-10mm, weight is 0.4kg, compare with the conventional package shell of encapsulation model tube core 8 of the same race, thickness has dwindled about 66%, weight saving about 73% (the about 30mm of thickness of traditional Z T80dt type encapsulating package is about weight 1.3kg).
Claims (4)
1. ultrathin tube shell, comprise loam cake, keeper, base, it is characterized in that: also comprise circular thick silver strip (6), described loam cake comprises outer ring plate (4) and discoidal oxygen-free copper dish (5), and described outer ring plate (4) is connected with the edge of oxygen-free copper dish (5); Described base comprises annular sheet metal (1), columnar ceramic package (2), the edge of annular (3) and oxygen-free copper sole piece (7), described sole piece (7) is that the middle part is with the circular configuration of projection, described edge (3) is fixed in the top of shell (2), one end upper surface of described annular sheet metal (1) and shell (2) welding, its other end is nested and be fixed in the lower sidewall of sole piece (7), described thick silver strip (6) places on the projection of sole piece (7), described keeper is the locating ring (9) of annular, described locating ring (9) bottom is with inwardly protruded eaves stratiform annulus, the outer wall of locating ring (9) and described shell (2) the nested cooperation of inwall, the inboard of described eaves stratiform annulus contacts with the side wall upper part of sole piece (7), described outer ring plate (4) and edge (3) seal welding, the structural thickness of described shell is 9 ~ 10mm.
2. ultrathin tube shell according to claim 1, it is characterized in that the material of described outer ring plate (4), annular sheet metal (1) and edge (3) is for can cut down metal, described outer ring plate (4) is welded and fixed with oxygen-free copper dish (5) edge seal, and surface both has nickel coating.
3. ultrathin tube shell according to claim 2 is characterized in that described sole piece (7) material is oxygen-free copper, and its surface is provided with nickel coating, and the bottom surface of described sole piece (7) is provided with the location notch for the switch series connection.
4. ultrathin tube shell according to claim 3 is characterized in that the nickel coating on described outer ring plate (4), oxygen-free copper dish (5) and sole piece (7) surface is 5～7 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010588932 CN102074512B (en) | 2010-12-15 | 2010-12-15 | Ultrathin tube shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010588932 CN102074512B (en) | 2010-12-15 | 2010-12-15 | Ultrathin tube shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102074512A CN102074512A (en) | 2011-05-25 |
| CN102074512B true CN102074512B (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010588932 Expired - Fee Related CN102074512B (en) | 2010-12-15 | 2010-12-15 | Ultrathin tube shell |
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| Country | Link |
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| CN (1) | CN102074512B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108716425B (en) * | 2018-04-09 | 2021-05-18 | 中国科学院理化技术研究所 | heat insulation support |
| CN111933577B (en) * | 2020-07-15 | 2022-05-31 | 中国电子科技集团公司第二十九研究所 | A method for integrating local large-area welding board-level interconnection of hermetic packaging units |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2201727Y (en) * | 1994-04-07 | 1995-06-21 | 东南大学 | Ceramic package semi-conductor anti-electrophoresis device |
| CN201466015U (en) * | 2009-06-24 | 2010-05-12 | 湖北台基半导体股份有限公司 | Ultrathin packaged semiconductor rectifying device |
| CN101877332A (en) * | 2010-06-13 | 2010-11-03 | 江阴市赛英电子有限公司 | Novel plate pressure welding type multichip packaging ceramic package |
| CN202003974U (en) * | 2010-12-15 | 2011-10-05 | 中国电子科技集团公司第十三研究所 | Ultrathin tube shell |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8159072B2 (en) * | 2007-12-12 | 2012-04-17 | Wen-Huo Huang | Rectification chip terminal structure |
-
2010
- 2010-12-15 CN CN 201010588932 patent/CN102074512B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2201727Y (en) * | 1994-04-07 | 1995-06-21 | 东南大学 | Ceramic package semi-conductor anti-electrophoresis device |
| CN201466015U (en) * | 2009-06-24 | 2010-05-12 | 湖北台基半导体股份有限公司 | Ultrathin packaged semiconductor rectifying device |
| CN101877332A (en) * | 2010-06-13 | 2010-11-03 | 江阴市赛英电子有限公司 | Novel plate pressure welding type multichip packaging ceramic package |
| CN202003974U (en) * | 2010-12-15 | 2011-10-05 | 中国电子科技集团公司第十三研究所 | Ultrathin tube shell |
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| Publication number | Publication date |
|---|---|
| CN102074512A (en) | 2011-05-25 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110525 Assignee: BOWEI INTEGRATED CIRCUITS Co.,Ltd. Assignor: THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY Group Corp. Contract record no.: 2014130000056 Denomination of invention: Ultrathin tube shell Granted publication date: 20130327 License type: Exclusive License Record date: 20140429 |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: BOWEI INTEGRATED CIRCUITS Co.,Ltd. Assignor: THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY Group Corp. Contract record no.: 2014130000056 Date of cancellation: 20170704 |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 |