CN102068207B - Heating and heat-insulating carrier - Google Patents

Abstract

The present invention discloses a heating and heat preservation carrier, which is suitable for directly carrying a food to be kept warm. The heating and heat preservation carrier includes a carrier body and at least one high melting point electrothermal alloy pattern. The carrier body has a first surface and a second surface, and the first surface is opposite to the second surface. The food is suitable for being placed directly on the first surface. The material of the second surface is a ceramic or a glass. The high melting point electrothermal alloy pattern is coated on the second surface. A resistance value of the high melting point electrothermal alloy pattern is substantially 0.5 ohms to 50 ohms, and a melting point of the high melting point electrothermal alloy pattern is higher than or equal to 1100°C.

Description

Heat insulation carrier

technical field

The invention relates to a carrier, and in particular to a carrier used for heating and heat preservation.

Background technique

Thermal insulation conditioning containers are commonly found in kitchen cooking utensils, and their function is to keep food in a warm state. Generally speaking, the best thermal insulation effect of the thermal insulation conditioning container is to keep the ingredients at about 50-80°C. Through the thermal insulation function of the thermal insulation conditioning container, when people take food, the food still maintains a certain temperature, so as not to be icy and cold, affecting health and appetite.

Common heat preservation methods include passive designs, such as thermos cups, or active designs, such as electric cookers. The passive heat preservation design mainly utilizes the container formed of multi-layer insulation material to isolate the outside air, so the inside of the container is not easy to exchange temperature with the outside of the container through conduction or convection. However, the passive type design still causes temperature loss due to heat radiation and a few conduction methods. In other words, the passive type design cannot maintain a warm state for a long time, and in order to achieve the thermal insulation effect, the thickness of the insulation layer must be very thick, which also causes the problem of too large or too small volume.

Most of the active type designs use alternating current to heat elements with electrothermal properties such as nickel-chromium wire to indirectly heat the container. In addition, the active design still requires a set of temperature sensors and temperature control elements. The heating curve is controlled to maintain the desired temperature through the mutual feedback of the temperature sensor and the temperature control element. The disadvantage of this method is that the efficiency of the indirect heating method is low, and the arrangement of the temperature sensor and the temperature control element increases the complexity of the container.

Contents of the invention

The object of the present invention is to provide a heating and heat preservation carrier, which can be directly heated by electrification and has the function of heating and heat preservation.

To achieve the above purpose, the present invention proposes a heating and heat preservation carrier, which is suitable for directly carrying a food material to be kept warm. The heating and heat preservation carrier includes a carrier body and at least one high-melting-point electrothermal alloy pattern. The carrier body has a first surface and a second surface, and the first surface is opposite to the second surface. Foodstuffs are suitable for placing directly on the first side. The material of the second surface is ceramic or glass. The high melting point electrothermal alloy pattern is coated on the second surface. A resistance value of the high melting point electrothermal alloy pattern is substantially 0.5 ohms to 50 ohms, and a melting point of the high melting point electrothermal alloy pattern is higher than or equal to 1100°C.

In an embodiment of the present invention, the material of the above-mentioned high melting point electrothermal alloy pattern includes a metal alloy or a ceramic-metal alloy.

In an embodiment of the present invention, the material of the above-mentioned high melting point electrothermal alloy pattern includes molybdenum alloy, nickel-chromium alloy, cobalt alloy, nickel alloy or tungsten carbide-cobalt alloy.

In an embodiment of the present invention, the material of the above-mentioned high-melting-point electrothermal alloy pattern is substantially lead-free.

In an embodiment of the present invention, the above-mentioned high-melting-point electrothermal alloy pattern is coated on the second surface by a spray method. Specifically, the spraying method includes a plasma thermal spraying method, an arc thermal spraying method, a flame thermal spraying method or a high-velocity flame thermal spraying method.

In an embodiment of the present invention, the above-mentioned high melting point electrothermal alloy pattern is a linear pattern, and the line width of the high melting point electrothermal alloy pattern is greater than 3 mm.

In an embodiment of the present invention, a film thickness of the above-mentioned high melting point electrothermal alloy pattern coated on the second surface is 20 μm˜500 μm.

In an embodiment of the present invention, the above-mentioned carrier body includes a first body portion and a second body portion. The second body part and the first body part are in close contact with each other, and the material of the first body part is glass or ceramics, and the high melting point electrothermal alloy pattern is coated on the first body part.

In an embodiment of the present invention, the above-mentioned carrier body is a plate, a bowl, a pot, a cup or a platform.

Based on the above, the present invention forms a high-melting-point electrothermal alloy pattern on one side of the carrier body by spraying. The high-melting-point electrothermal alloy pattern can be heated up after being energized, and the high-melting-point electrothermal alloy pattern has a specific resistance to be heated to a specific temperature after being energized. In this way, the heating and heat preservation carrier of the present invention can be heated by directly electrifying the pattern of the high-melting point electrothermal alloy to achieve the effect of heat preservation. In addition, the high-melting-point electrothermal alloy pattern of the present invention is produced by spraying, so the high-melting-point electrothermal alloy pattern does not need high-temperature sintering to help avoid damage to the carrier body caused by high-temperature sintering.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a heating and heat preservation carrier according to an embodiment of the present invention;

FIG. 2A and FIG. 2B are electron micrographs showing coatings formed on substrates by spraying method and coatings formed on substrates by sintering method, respectively;

FIG. 3A is a top view of a high-melting-point electrothermal alloy pattern according to an embodiment of the present invention;

FIG. 3B is a partial cross-sectional schematic diagram of a heating and heat preservation carrier according to an embodiment of the present invention;

FIG. 4 is a partial cross-sectional schematic diagram of a heating and heat preservation carrier according to another embodiment of the present invention;

Fig. 5 shows the temperature rise curve of the heating and heat preservation carrier according to an embodiment of the present invention after power-on, wherein the horizontal axis is time, and the vertical axis is temperature;

Fig. 6 shows the temperature rise distribution of the water and the bottom of the heating and insulating carrier after the heating and insulating carrier of another embodiment of the present invention is energized in the state of containing water, wherein the horizontal axis is time, and the vertical axis is temperature.

Description of main component symbols

12, 14: Substrate

20, 40: coating

22, 42: particles

100, 200: heating insulation carrier

110, 210: Carrier body

112: First side

114: The Second Side

120: High melting point electrothermal alloy pattern

212: The first body

214: Second Body

500: heating curve

610, 620: heating distribution

T: film thickness

W: line width

Detailed ways

FIG. 1 is a schematic diagram of a heating and heat preservation carrier according to an embodiment of the present invention. Please refer to FIG. 1 , the heating and heat preservation carrier 100 includes a carrier body 110 and at least one high melting point electrothermal alloy pattern 120 . The carrier body 110 has a first surface 112 and a second surface 114 , and the first surface 112 is opposite to the second surface 114 . The material of the second surface 114 is ceramic or glass. The high melting point electrothermal alloy pattern 120 is coated on the second surface 114 . In addition, the carrier body 110 is suitable for directly carrying a food item (not shown) to be kept warm, that is to say, the food item can be directly placed on the first surface 112 . In this embodiment, the carrier body 110 is a platform as an example, but in other embodiments, the carrier body 110 may be a plate, a bowl, a pot, a cup or other containers that can directly carry ingredients.

It is worth mentioning that the high melting point electrothermal alloy pattern 120 can only be coated on the bottom of the carrier body 110 . If the carrier body 110 is made of a transparent material such as glass, the transparent property can be maintained. The user can easily see the food in the heating and heat preservation carrier 100, which increases the convenience of use. Of course, such a design can also prevent the pattern or pattern designed on the carrier body 110 such as plates, bowls, pots, and cups from being covered by the high-melting-point electrothermal alloy pattern 120 , so it is more aesthetically pleasing.

In the previous designs, the heating of the food materials mostly used an additional heating device to indirectly heat the food materials contained in pots, bowls, plates, and cups. However, the high-melting-point electrothermal alloy pattern 120 can convert electrical energy into thermal energy after being energized, and is used to heat food placed in the carrier body 110 or the carrier body 110 . That is to say, the design of this embodiment can directly use the electrothermal effect generated by the high-melting-point electrothermal alloy pattern 120 on the pot, bowl, plate, and cup to heat the food. Therefore, the design of this embodiment can provide a heating and heat preservation carrier 100 that directly contains and heats foodstuffs and has high convenience in use.

In addition, the design of conventional heating devices needs to form materials with electrothermal properties on the device body by sintering. In order to avoid damage to the device body due to excessive sintering temperature, the material with electrothermal properties must also have a low melting point. For example, such electrothermal materials with low melting point characteristics include aluminum, silver, copper and other materials. In fact, in order to reduce the manufacturing process temperature required for sintering, it is necessary to add low melting point materials such as lead to these materials with electrothermal properties. Therefore, when the conventional heating device is used to directly heat the food, it is easy to cause pollution to the food, and of course it will also cause pollution to the environment.

In this embodiment, the high melting point electrothermal alloy pattern 120 is coated on the second surface 114 by a spray method. Common spraying methods include a plasma thermal spraying method, an arc thermal spraying method, a flame thermal spraying method or a high-velocity flame thermal spraying method. In the spraying method, molten metal powder or metal rods are directly sprayed on the second surface 114 to form the desired high-melting-point electrothermal alloy pattern 120 .

FIG. 2A and FIG. 2B are electron micrographs of the coating formed on the substrate by spraying method and the coating formed on the substrate by sintering method, respectively. As can be seen from FIG. 2A , the coating 20 formed on the substrate 12 by spraying is structurally formed by stacking a plurality of flat particles 22 . In addition, the substrate 12 is not affected by the manufacturing process. As can be seen from FIG. 2B , in the coating 40 formed on the substrate 14 by the sintering method, the particle boundaries of the particles 42 are in a concave shape towards the center of the particles. In fact, because of the high temperature during sintering, there is a phenomenon of diffusion (such as bulk diffusion, grain boundary diffusion, surface diffusion, etc.) at the edges of the particles 42 . That is to say, such a high temperature may also cause similar diffusion phenomena to occur in the substrate 14 during the sintering process and change its original state.

Please continue to refer to FIG. 1 , during the manufacturing process of the spray method, the carrier body 110 does not need to be heated or baked, and there will be no damage caused by the thermal manufacturing process. In addition, the spraying method does not need to add low-melting-point materials such as lead to avoid damage to the carrier body 110 by the thermal manufacturing process. Therefore, the material of the high-melting-point electric heating alloy pattern 120 is substantially lead-free, and will not cause pollution to the environment or food. Moreover, the carrier body 110 is not easily damaged by the temperature of the spraying method, so a melting point of the high melting point electrothermal alloy pattern 120 may be higher than or equal to 1100° C.

In addition, besides heating, the heat preservation and heating carrier 100 also needs to keep the foods loaded on the carrier body 110 at a certain temperature so that they can be eaten at any time. Generally speaking, the temperature of the ingredients used at the right time is preferably 50°C-80°C. Therefore, a resistance value of the high-melting-point electrothermal alloy pattern 120 is substantially 0.5 ohm to 50 ohm to have a specific heating limit.

For example, the material of the high melting point electrothermal alloy pattern 120 can be a metal alloy or a ceramic-metal alloy. In addition, materials that meet the aforementioned properties include, for example, molybdenum alloy, nickel-chromium alloy, cobalt alloy, nickel alloy, tungsten carbide-cobalt alloy, or alloy materials based on the above alloys. These materials are not easy to react with other substances and are not easy to deteriorate, so the use of these materials is helpful to improve the service life of the thermal insulation and heating carrier 100 .

It is worth mentioning that the resistivity of these materials is greater than that of silver, aluminum, copper and other metal materials, so they can have greater flexibility in the adjustment of resistance. For example, if a good conductor material, such as silver, needs to achieve a resistance value of 50 ohms, the line width must be reduced and the line length increased during pattern layout. Such a layout will increase the difficulty of the manufacturing process. Therefore, it is easier to achieve the resistance value required by this embodiment by using an alloy with a higher resistivity.

Since the spraying method can form patterns of different shapes according to different requirements, in this embodiment, the desired resistance value can be achieved through the shape layout of the high-melting point electrothermal alloy pattern 120 . For example, FIG. 3A and FIG. 3B are respectively a top view of a high-melting-point electrothermal alloy pattern and a partial cross-sectional schematic diagram of a heating and heat preservation carrier according to an embodiment of the present invention. Please refer to FIG. 3A and FIG. 3B at the same time. The high melting point electrothermal alloy pattern 120 is, for example, a linear pattern, and the line width W of the high melting point electrothermal alloy pattern 120 is greater than 3 mm.

In addition, in this embodiment, the high melting point electrothermal alloy pattern 120 is formed by spraying, so the film thickness T of the high melting point electrothermal alloy pattern 120 can be increased to an appropriate film thickness according to the requirements of the manufacturing process. For example, a film thickness T of the high melting point electrothermal alloy pattern 120 coated on the second surface 114 is 20 μm˜500 μm. With such a pattern layout, the resistance value of the high melting point electrothermal alloy pattern 120 can fall within the range of 0.5 ohms to 50 ohms. Of course, the pattern layout above is just an example. In fact, the layout of the high-melting-point electrothermal alloy pattern 120 can be adjusted and changed according to the selection of materials and the manufacturing process conditions of the spraying process.

In addition, the carrier body 110 may not only be composed of a single material. FIG. 4 is a schematic partial cross-sectional view of a heating and heat preservation carrier according to another embodiment of the present invention. Referring to FIG. 4 , the carrier body 210 of the heating and heat preservation carrier 200 includes a first body part 212 and a second body part 214 . The second body part 214 and the first body part 212 are in close contact with each other, and the material of the first body part 212 is glass or ceramics, and the high melting point electrothermal alloy pattern 120 is coated on the first body part 212 .

That is to say, the carrier body 210 may be a composite structure composed of different materials, and the high melting point electrothermal alloy pattern 120 is disposed on the first body part 212 of glass or metal. In fact, in the present embodiment and the above-mentioned embodiments, the glass material may be strengthened glass, quartz glass, microceramic glass, or crystallized glass. Ceramics can be various ceramic materials that can be used to hold food.

FIG. 5 shows the temperature rise curve of the heating and heat preservation carrier according to an embodiment of the present invention after being energized, wherein the horizontal axis is time, and the vertical axis is temperature. Please refer to FIG. 5 , the heating and heat preservation carrier used in this embodiment uses molybdenum as the material of the high melting point electrothermal alloy pattern. At the same time, when making high-melting-point electrothermal alloy patterns, the production process conditions of the spraying method include spraying by arc spraying at a current of 170A-200A, a voltage of 25V-30V, and an air pressure of 60psi. The high-melting-point electrothermal alloy pattern of this embodiment is supplied with a direct current of 120W, such as a voltage of 12V and a current of 10A, and its temperature rise is shown in the temperature rise curve 500 .

It can be seen from the heating curve 500 that the heating limit of the high-melting-point electrothermal alloy pattern is about 60°C, so using the heating and heat preservation carrier of this embodiment can maintain the food at about 60°C, which is convenient for taking at any time. In addition, the heating and heat preservation carrier of this embodiment can be heated by using low-power direct current, and it is not easy to use electricity for danger.

Fig. 6 shows the temperature rise distribution of the water and the bottom of the heating and insulating carrier after the heating and insulating carrier of another embodiment of the present invention is energized in the state of containing water, wherein the horizontal axis is time, and the vertical axis is temperature. Please refer to FIG. 6 , the heating and heat preservation carrier used in this embodiment uses nickel-chromium alloy as the material of the high melting point electric heating alloy pattern. At the same time, the heating and heat preservation carrier of this embodiment is filled with water. The high-melting-point electrothermal alloy pattern of this embodiment is fed with 120W direct current, for example, 12V voltage and 10A current, and the heating and heat-retaining carrier bottom and the temperature rise of the water are shown in the temperature rise distribution 610 and 620 respectively.

It can be seen from the temperature rise distribution 610 that, in the state filled with water, the temperature rise limit of the high melting point electrothermal alloy pattern made of nickel-chromium alloy is about 50°C. The water inside the heat preservation carrier can also be heated to about 50°C. In addition, the temperature rise distribution 610 has a high correlation with the temperature rise distribution 620 , indicating that the direct heating design of this embodiment provides a relatively good heating efficiency.

To sum up, the present invention uses high-melting-point materials to directly form electrothermal alloy patterns on the surface of utensils carrying food by spraying, so the present invention provides a container design that can be directly heated. Furthermore, in the present invention, through the planning of the resistance value, the high-melting-point electrothermal alloy pattern has a certain temperature rise limit. Therefore, the heating and heat preservation carrier of the present invention can keep the contained food materials at a certain temperature and be ready to be eaten at any time. Therefore, the heating and heat preservation carrier has quite good convenience in use. In addition, in terms of material selection, the high-melting-point electrothermal alloy pattern is substantially lead-free and has the advantage of being environmentally friendly. Furthermore, the high-melting-point electrothermal alloy pattern of the present invention is made by spraying, so the high-melting-point electrothermal alloy pattern does not need to be produced by high-temperature sintering, which helps to avoid the damage caused by high-temperature sintering to the carrier body. harm.

Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims (9)

1. a heating and thermal insulation carrier, be suitable for the directly food materials of carrying for being incubated, this heating and thermal insulation carrier comprises:

Carrier bodies, there is first surface and second, this first surface is relative with this second, these food materials are suitable for directly being positioned on this first surface and this material of second is glass, wherein this carrier bodies comprises first body and second body of different materials, and this second body and this first body are close to each other; And

At least one high-melting-point electrothermal alloy pattern, coat on this second, one resistance value of this high-melting-point electrothermal alloy pattern is essentially 0.5 ohm to 50 ohm, and a fusing point of this high-melting-point electrothermal alloy pattern is greater than or equal to 1100 DEG C, this high-melting-point electrothermal alloy pattern is coated on this second by plasma spraying by stacking wherein this high-melting-point electrothermal alloy pattern that forms of the particle of multiple flat.

2. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this high-melting-point electrothermal alloy pattern comprises metal alloy or ceramic-metal alloy.

3. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this high-melting-point electrothermal alloy pattern comprises molybdenum alloy, nickel-chromium alloy, cobalt alloy, nickel alloy or tungsten-cobalt carbide alloy.

4. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this high-melting-point electrothermal alloy pattern is not leaded in fact.

5. heating and thermal insulation carrier as claimed in claim 1, wherein this plasma spraying comprises plasma heat plasma spraying, arc heat plasma spraying, flame hot-melting penetrate method or the hot plasma spraying of high-speed flame.

6. heating and thermal insulation carrier as claimed in claim 1, wherein this high-melting-point electrothermal alloy pattern is linear pattern, and the live width of this high-melting-point electrothermal alloy pattern is greater than 3mm.

7. heating and thermal insulation carrier as claimed in claim 1, wherein the thickness of this high-melting-point electrothermal alloy pattern application on this second is 20 μm ~ 500 μm.

8. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this first body be this glass or this pottery and this high-melting-point electrothermal alloy pattern application on this first body.

9. heating and thermal insulation carrier as claimed in claim 1, wherein this carrier bodies is dish, bowl, pot, cup or platform.