CN102065645B - Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof - Google Patents
Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof Download PDFInfo
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- CN102065645B CN102065645B CN2009101136629A CN200910113662A CN102065645B CN 102065645 B CN102065645 B CN 102065645B CN 2009101136629 A CN2009101136629 A CN 2009101136629A CN 200910113662 A CN200910113662 A CN 200910113662A CN 102065645 B CN102065645 B CN 102065645B
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a double-sided printed circuit board (PCB) with elements and a mutual conductance method thereof, and provides a method for realizing mutual conductance by elements used in a double-sided PCB. The method comprises the following steps: providing the double-sided PCB with holes, wherein, the PCB comprises a top circuit layer, a bottom circuit layer and an insulating film layer bonded between the top circuit layer and the bottom circuit layer, and the holes pass through the top circuit layer and the insulating film layer besides the bottom circuit layer; optionally forming the bottom circuit layer at the holes to be aligned with or approximately aligned with the top circuit layer; and welding one part of the elements on the top circuit layer, and welding the other part of the elements on the bottom circuit layer at the holes so as to realize mutual conductance of the two circuit layers. The mutual conductance method is simple and low in cost; and double-sided circuits are conducted without eletcroless copper plating during the manufacturing process, thus being very environmental-friendly. The invention further discloses the PCB with the elements manufactured by the method.
Description
Technical field
The present invention relates to the field of printed substrate; Be specifically related to the interconnection new method of double-faced flexible wiring board (FPC) for example or rigidity wiring board; For example, directly component pins is made double-sided PCB two sides circuit turn-on through the SMT reflow soldering on the another side circuit.The present invention has also disclosed to need not to adopt boring and need not the heavy copper-plated mode non-chemically of copper and has formed via, and the more convenient making of the method is the double-side lamp belt circuit board of whole volume continuously.
Background technology
In the manufacturing process of traditional double-sided wiring board; Generally all adopt the mode of machine drilling or laser drill in copper-clad plate, to get out the circuit via hole; Make the through-hole wall on the double-sided flexible printed circuit board form conductive layer through chemical-copper-plating process then; In the production technology of tradition blind hole type wiring board, adopt first laser drill to form blind hole, increase the thick through hole conductionization treatment process of copper through re-plating after black holeization or the chemical plating then.The method causes severe contamination owing to need to electroplate and chemical plating to environment.
And traditional carbon oil grout that need not the common employing of the heavy copper-plated printed on both sides circuit of copper two sides conducting or silver slurry grout form conduction mode, and its significant disadvantages is all arranged, and carbon oil grout cost is low, and still big owing to carbon oil resistance, conductive effect is poor; And silver slurry grout conductive effect is good, but the price costliness very of silver slurry is not suitable for a large amount of productions.
Simultaneously, mechanical drilling machine and laser drilling machine involve great expense in traditional manufacture craft, and penetration rate is slow, and production efficiency is low.And because mechanical drilling machine is plane boring; Its table top is about 635 * 762mm, and therefore fertile maximum plate is about 635 * 762mm, can not produce the plate greater than 762mm; And along with the continuous development of LED industry now; LED lamp band more and more presses for the overlength wiring board greater than 762mm, even reaches the length more than 100 meters, and therefore traditional bore mode is made the needs that via more and more can't satisfy development in science and technology.And also can consume a large amount of phenolic aldehyde branch cover plates and wood fibre base plate during machine drilling, laser drilling machine is discharged to the insulation macromolecule resin gasification of printed substrate in the air behind high temperature sintering, is unfavorable for environmental protection.
Therefore, need a kind of can enhancing productivity, speed is fast; Can realize continuous production; And the alternative existing Completion of Drilling Hole mode of cheap technology, and, reduce the chemical mode manufacture craft in order to respond the call of country for energy-saving and emission-reduction; So that can overcome the defective and the deficiency of above-mentioned technology, and can eliminate of the pollution problem of boring material to environment.
Summary of the invention
Before describing the present invention in detail; Those skilled in the art are to be understood that; " element " should be done the understanding on the most wide in range connotation in this application; The elements that promptly comprise all types of electronic devices and components that are used for circuit, electric component or other type, the element of surface mount (SMT) type for example, the element of tape welding pin or pin such as various each color component of SMT type, support (promptly with pin) each color component of type, various high power devices or the like.Therefore, term " component pins " has included various terms and/or any structure or part that can be used for realizing conductive communication such as leg, pin, leg of element.
In addition, term " wiring board " and " circuit board " can use in the application with exchanging.
Invention has been described although the present invention combines SMT Reflow Soldering technology; But those skilled in the art are to be understood that; The present invention obviously can be not limited to the welding of other type of Reflow Soldering and implement, and therefore the scope of the invention is only defined by the appended claims.
According to the present invention, relate to the circuit board that directly component pins is made double-sided PCB two sides circuit turn-on through the SMT reflow soldering on the another side circuit.This type of circuit board manufacturing method reduces chemical treatment technologies such as heavy copper copper facing, reduces discharge of wastewater.Compare with the printed substrate structure with traditional technology, technology of the present invention has not only reduced production cost, has improved the reliability and the quality of technical process and final products; Improved production efficiency greatly, and importantly, this technology can realize the continuous uninterrupted production of wiring board; Thereby cause the revolution that printed substrate is made length restriction; And this technology has reduced the consumption of the macromolecule pollutant that boring brings and has reduced heavy copper copper facing operation and make, and has reduced the chemical wastewater discharging in the wiring board manufacture craft; Be environmental protection, can avoid and eliminate the problem of environmental pollution that existing hole, sink copper, copper-plating technique are brought basically.And starch the method ratio that the grout mode is made the conducting circuit with traditional carbon oil, silver, and it conducts electricity very well, and production cost is low.
Of the present invention another be also advantageous in that, owing to when connecting (for example welding) element, realized the interconnection of two-layer line layer, so processing step reduces, and process cycle shortens, and cost also correspondingly reduces, and the wiring board quality is more reliable.
According to the present invention; A kind of method that element is realized interconnection of passing through that is used for double-sided wiring board is provided; Comprise: provide to form porose double-sided wiring board; Wherein, said wiring board comprises top line layer, wiring underlayer layer and is combined in the insulating film layer between said top line layer and the wiring underlayer layer, and top line layer and insulating film layer are passed but not break-through wiring underlayer layer in said hole; The part of element is welded on the top line layer, and another part of element is welded on the wiring underlayer layer at place, said hole site, thus the interconnection of realization top line layer and wiring underlayer layer.
Certainly, according to a preferred embodiment of the invention, can be earlier that the wiring underlayer layer top of said hole site is extremely neat mutually with the top line layer or approaching concordant, and then carry out the element welding, so more can guarantee the reliability of welding quality and conducting.
Said method also comprises, before welding, on the wiring underlayer layer at place, on the pad of said top line layer and said hole site, applies tin cream; Afterwards; Directly the component pins of said element is welded on the wiring underlayer layer at pad and place, said hole site of said top line layer accordingly, thereby when having welded element, realizes the interconnection of top line layer and wiring underlayer layer through component pins.
According to another preferred embodiment of the invention, said double-sided wiring board is the double face copper that top line layer and wiring underlayer layer are copper wire layer, and the described tin cream that applies applies through screen printing mode, and said welding is the SMT Reflow Soldering.
According to another preferred embodiment of the invention, the position in said hole removes said top line layer and insulating film layer through said top line layer is opened the hollow out window, thereby forms the groove shaped structure in hole.
According to another preferred embodiment of the invention, the wiring underlayer layer at place, said hole site passes through the mould roof pressure and is pushed up to neat mutually with the top line layer or approaching concordant.
According to another preferred embodiment of the invention, said double-sided wiring board is double-faced flexible wiring board or rigidity wiring board.
The present invention also provides a kind of double-sided wiring board with element, comprising: the top line layer; First adhesive layer; Insulating film layer; Second adhesive layer; The bottom line layer; With the hole that is arranged in the said double-sided wiring board; Wherein, said top line layer is combined on the one side of insulating film layer via first adhesive layer, and said bottom line layer is combined on the opposite another side of insulating film layer via second adhesive layer; Top line layer, first adhesive layer, insulating film layer and second adhesive layer are passed in said hole; And the part of said element is fixed by welding on the top line layer, and another part of said element is fixed by welding on the wiring underlayer layer at place, said hole site, thereby realizes the interconnection of top line layer and wiring underlayer layer.
Certainly, according to a preferred embodiment of the invention, the wiring underlayer layer of said hole site can be configured as neat mutually with the top line layer or approaching concordant, and then carries out the element welding, so more can guarantee the reliability of welding quality and conducting.
According to another preferred embodiment of the invention, said double-sided wiring board is double-faced flexible wiring board or rigidity wiring board; On the wiring underlayer layer at place, on the pad of said top line layer and said hole site, be applied with tin cream; And the component pins of said element is welded on through Reflow Soldering on the wiring underlayer layer at pad and said hole site place of said top line layer accordingly.
According to another preferred embodiment of the invention, said element is surface mount (SMT) type element, and said element is installed through the mode of SMT and is welded on the said double-sided wiring board through the SMT Reflow Soldering.
The present invention has also disclosed a kind of LED lamp band, comprises the double-sided wiring board of aforesaid band element and the element that is mounted thereon.
More specifically; According to the present invention; Through adopting the circuit board that directly component pins is made double-sided PCB two sides circuit turn-on through the SMT reflow soldering on the another side circuit; Not only step through SMT being pasted element and welding step integrate and have saved processing step, and this technology can make the reliable welding quality of element, and the conducting of two-sided circuit also has very high reliability.
The adhesive layer that uses among the present invention can be the hot setting adhesive layer, and hot setting adhesive is an acrylic acid adhesive, the glass prepreg (PP) that perhaps epoxy adhesive, or gummosis amount is little.
According to an aspect of the present invention, disclosed a kind of elder generation with single-side coated copper plate, no copper insulating surfaces be covered with the hot setting adhesive layer with die punching after, hot pressing is laminated with other layer of copper and promptly forms the groove shaped pore structure, bottom portion of groove is the exposed copper face of bottom; And then the mode of employing mould roof pressure, copper top at the bottom of the groove is extremely neat mutually with the top copper face or approaching concordant; Circuit turn-on is to make component pins directly and the end brazing formation circuit turn-on that is connected together through the SMT Reflow Soldering.
Single-side coated copper plate can be flexible circuit copper-clad plate (FCCL), also can be rigid circuit copper-clad plate (CCL).
The groove shaped pore structure can be square hole or rectangle hole.
After the present invention has also disclosed and has accomplished circuit board making with the copper-clad plate of this groove shaped structure through conventional line plate production method, make the position, hole with die stamping at the bottom of the copper roof pressure to neat mutually with last aspect copper or approaching concordant.
According to an important characteristic of the present invention, the welding that has disclosed at the SMT component pins is that component pins directly is welded on the circuit of another layer, thereby realizes the conducting of two-layer circuit up and down.
According to a preferred embodiment of the invention, above-mentioned groove shaped hole is to use die punching after covering hot-setting adhesive with single-side coated copper plate, is composited with another layer Copper Foil then.
According to a preferred embodiment of the present invention, above-mentioned hot-setting adhesive is hot-setting adhesive esters of acrylic acid or the epoxy type.
According to a preferred embodiment of the present invention, above-mentioned Copper Foil is pure copper foil or the alloyed copper that is ductile, and thickness is that 0.012-0.5mm is thick.
According to a preferred embodiment of the present invention, the copper top is to neat mutually with the top copper face or approaching concordant at the bottom of the above-mentioned groove shaped hole, and component pins directly connects with back side circuit with the tin cream Reflow Soldering when reaching the SMT welding.
According to a preferred embodiment of the present invention, the printed on both sides wiring board of above-mentioned groove shaped pore structure is characterized in that, said through hole is realized the line layer conducting without Completion of Drilling Hole and heavy copper, copper facing.
According to a preferred embodiment of the present invention, above-mentioned through hole is to adopt mould that through hole is gone out.
According to a kind of execution mode; Top layer at double-sided circuit needs with the bond pad locations hollow out removal top layer copper and the insulating barrier of bottom connection leg directly to be contacted with bottom circuit copper; Through the SMT print solder paste, the reflow soldering conducting realizes the interconnection of bottom circuit through component pins and top layer circuit.
According to a preferred embodiment of the present invention, above-mentioned groove shaped hole need adopt the salient point mould with the mode of punching press protruding the top to aperture, groove shaped hole of copper at the bottom of with hole, groove shaped hole, and is neat mutually with top layer copper or near concordant.
According to a preferred embodiment of the present invention, above-mentioned shrinkage pool type printed on both sides wiring board is characterized in that, said through hole can be made length at the printed substrate more than 1 meter by continuous cutting.
According to a preferred embodiment of the present invention, above-mentioned shrinkage pool type printed on both sides wiring board is a double-sided flexible printed circuit board.
According to another preferred embodiment of the invention, above-mentioned line layer is a Copper Foil.
According to a kind of preferred embodiment of the present invention, pressing is to adopt adhesive to carry out bonding.
According to another preferred embodiment of the invention, the conducting of line layer directly is welded on component pins on another layer line road Copper Foil when soldered elements, and tin cream solidifies and realizes conductive communication after Reflow Soldering.
According to another preferred embodiment of the invention, this kind printed on both sides wiring board is used to make LED lamp band.
According to another preferred embodiment of the invention, this kind printed on both sides wiring board is continuously the long transmission line plate of whole volume.
According to another preferred embodiment of the invention, be to carry out with die punching and protruding top through continuous punching mode or continuous mode of pressing.
According to another preferred embodiment of the invention, describedly directly component pins is made double-sided PCB two sides circuit turn-on through the SMT reflow soldering on the another side circuit, it is characterized in that described method does not re-use chemical treatment and makes the hole conducting.
According to another preferred embodiment of the invention, the FPC made from the new method of interconnection of the present invention (FPC) is applicable to that the element in the LED lamp band comes the double-sided circuit of conducting FPC.
The method is particularly useful for LED lamp band flexible PCB.The method is simple, and cost is low, and manufacturing process need not to adopt the heavy copper facing of chemistry to realize conducting two sides circuit, so very environmental protection.
In following description, with the details of setting forth one or more embodiment of the present invention to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Fig. 1 is the partial section of the printed on both sides wiring board of correlation technique, has shown the through hole of the traditional circuit plate making of accomplishing the processing of conductionization electroless copper;
Fig. 2 has shown the structure of single-side coated copper plate;
Fig. 3 has shown the thermosetting adhesive glue has been attached to the structure behind the single-side coated copper plate insulating barrier;
Fig. 4 has shown the mode through die punching, with the die-cut structure that comes out of via;
Fig. 5 has shown pure copper foil has been pressed together the structure that forms double face copper through pressing and tack coat;
Fig. 6 has shown the structure of the double-sided wiring board of producing line pattern;
Fig. 7 shown pure copper foil at the bottom of utilizing for example protruding backform tool with the groove shaped hole through the impact style top to neat mutually with the groove shaped aperture of top line layer or near concordant structure; And
Fig. 8 has shown through after the SMT print solder paste, element is welded on the structure of realization double-sided circuit conducting on the corresponding pad through Reflow Soldering.
Fig. 9 has shown on the basis of the double-sided wiring board with line pattern shown in Figure 6; The Copper Foil of omission at the bottom of with the hole be the processing step on top upwards, and directly in this hole, through Reflow Soldering for example the two ends of element is welded on the structure of realizing the double-sided circuit conducting on the corresponding wiring board respectively after the print solder paste.
Embodiment
To be that specific embodiment comes the present invention is described in more detail below with the double-sided flexible printed circuit board.It will be appreciated by those skilled in the art that these execution modes have only enumerated some specific embodiments of the present invention, the present invention and protection range thereof are not had any restriction.For example, although described embodiment below in conjunction with Copper Foil,, the material of line layer not only comprises fine copper, but also can be other copper alloy or other metal or alloy.
One, the making of substrate
Perhaps, can adopt to apply the oven dry production equipment, the heat curing-type glue of liquid state is coated in single-side coated copper plate not to be had on the copper face insulating barrier yet.
Two, the making in groove shaped hole
With the copper-clad plate material of structure shown in Figure 3, on 25 tons of punch presses of Ningbo Ou Tai CH1-25 type, the through hole mould with being made according to the customer line design data by engineering department in advance upwards carries out punching with copper face.Obtain as shown in Figure 4 pass top layer Copper Foil 5, adhesive glue 4, dielectric film 3 and thermosetting glued membrane 2 and forming the structure of through hole.Then through BURKLEN LAMV multi-layer vacuum pressing machine with 120-160 ℃, pressure is 15-20kg/cm
2, pressing time is 80-120min, presses together with pure copper foil 1 and forms structure shown in Figure 5.
Three, other making of circuit
Then with conventional wiring board manufacture method, through pressing dry film, figure transfer is made public, and develops, and etching pastes epiphragma 8,9, pressing, and literal, OSP, moulding has promptly obtained the not finished product wiring board of conducting, structure as shown in Figure 6.As shown in Figure 6, although concrete the sign shown some pads of top copper wire layer 5 among Fig. 6, for example, like 2-3 pad of the superiors that construct among Fig. 6.In addition, Fig. 6 has also shown the groove shaped hole of the not conducting of a shaping, but this groove shaped hole obviously can be provided with a plurality of arbitrarily as required.
Because above step is the traditional handicraft of printed substrate, belong to those skilled in the art and know, just carefully do not stating at this.
Four, stamping die apical pore
Through the wiring board of accomplishing; Through 25 tons of punch presses of Ningbo Ou Tai CH1-25 type, adopt the apical pore mould of making according to the customer line design data by engineering department in advance, adopt the for example mode of location, pipe position; With the end copper wire layer in groove shaped hole 1 top to neat mutually with top copper face 5 or near concordant position; Obtain structure as shown in Figure 7, so that during follow-up SMT soldered elements, the tin cream reflow soldering connects.In Fig. 7, the end copper 1 that has shown the groove shaped hole site to neat mutually with top copper face 5 or near concordant position, will with element for example through welding be come the pad of the end copper wire layer 1 of conducting thereby formed by the top.
Five, SMT directly is welded on component pins on another layer line road
When the SMT soldered elements, adopt traditional SMT welding procedure, (promptly in the pad locations of wiring board shown in Figure 7; Comprise the some pads of top copper wire layer 5 and the pad of end copper wire layer 1), stamp tin cream 6 with silk screen printing (for example steel mesh printing), through automatic placement machine element 7 is attached on the above-mentioned wiring board then; Through Reflow Soldering, after 5 section 275 degree solidified, the tin cream of pad locations solidified; Obtain structure as shown in Figure 8; With this, the both sides element leg of element is welded together with this two-layer line layer respectively, realize the circuit communication of two sides line layer simultaneously.
Certainly, the suitable part of other of SMT element also can be used for realizing the welding conducting, and is not limited only to the leg part of element.
Because above-mentioned SMT technology belongs to traditional components and parts attachment process, belong to those skilled in the art and know, just no longer carefully state at this.
Certainly; As another embodiment; Also can be on the basis of the double-sided wiring board with line pattern shown in Figure 6, omit end copper 1 top with the groove shaped hole site shown in Figure 7 to neat mutually with top copper face 5 or near concordant step, and directly in this groove shaped hole after the print solder paste through after the technological process such as Reflow Soldering, curing for example; The two ends of element are welded on realization double-sided circuit conducting on the corresponding wiring board respectively, as shown in Figure 9.Further shortened process so just.
Those skilled in the art are appreciated that obviously double-sided circuit conducting method of the present invention and structure are equally applicable to rigid circuit board (or being called hardboard), just repeat no more at this.
More than combining accompanying drawing will be that specific embodiment has carried out detailed description to the present invention with the double-sided flexible printed circuit board.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present invention, especially the scope of claim does not have any restriction.Scope of the present invention is limited accompanying claims.
Claims (8)
1. method that element is realized interconnection of passing through that is used for double-sided wiring board comprises:
Provide and form porose double-sided wiring board; Wherein, Said wiring board comprises top line layer, wiring underlayer layer and is combined in the insulating film layer between said top line layer and the wiring underlayer layer, and top line layer and insulating film layer are passed but not break-through wiring underlayer layer in said hole;
The part of element is welded on the top line layer, and another part of element is welded on the wiring underlayer layer of said hole site, thus the interconnection of realization top line layer and wiring underlayer layer;
Said method is further comprising the steps of:
Said the step that forms porose double-sided wiring board is provided after, with the wiring underlayer layer top of said hole site to neat mutually with item layer line layer or near concordant.
2. method according to claim 1 is characterized in that, said method also comprises:
Before welding, on the wiring underlayer layer at place, on the pad of said top line layer and said hole site, apply tin cream;
Afterwards; Directly the component pins of said element is welded on the wiring underlayer layer at pad and place, said hole site of said top line layer accordingly, thereby when having welded element, realizes the interconnection of top line layer and wiring underlayer layer through component pins.
3. method according to claim 1 and 2; It is characterized in that; Said double-sided wiring board is the double face copper that top line layer and wiring underlayer layer are copper wire layer, and the described tin cream that applies applies through screen printing mode, and said welding is the SMT Reflow Soldering.
4. method according to claim 1 and 2 is characterized in that, the position forming said hole removes said top line layer and insulating film layer through said top line layer is opened the hollow out window, thereby forms the groove shaped structure in hole.
5. method according to claim 1 and 2 is characterized in that, said double-sided wiring board is double-faced flexible wiring board or rigidity wiring board.
6. double-sided wiring board with element comprises:
The top line layer;
First adhesive layer;
Insulating film layer;
Second adhesive layer;
The bottom line layer; With
Be arranged on the hole in the said double-sided wiring board;
Wherein, said top line layer is combined on the one side of insulating film layer via first adhesive layer, and said bottom line layer is combined on the opposite another side of insulating film layer via second adhesive layer; And
Top line layer, first adhesive layer, insulating film layer and second adhesive layer are passed in said hole;
The part of said element is fixed by welding on the top line layer, and another part of said element is fixed by welding on the wiring underlayer layer of said hole site, thereby realizes the interconnection of top line layer and wiring underlayer layer;
Wherein, said double-sided wiring board is the double-faced flexible wiring board;
The wiring underlayer layer of said hole site is configured as neat mutually with the top line layer or approaching concordant;
Be applied with tin cream together or near on the concordant wiring underlayer layer mutually being configured as of place, on the pad of said top line layer and said hole site with the top line layer;
The component pins of said element is welded on through Reflow Soldering on the wiring underlayer layer at pad and said hole site place of said top line layer accordingly.
7. the double-sided wiring board of band element according to claim 6 is characterized in that, said element is surface mount (SMT) type element, and said element is installed through the mode of SMT and is welded on the said double-sided wiring board through the SMT Reflow Soldering.
8. a LED lamp band comprises according to the double-sided wiring board of each described band element among the claim 6-7 and the element that is mounted thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101136629A CN102065645B (en) | 2009-11-17 | 2009-12-30 | Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910224495.5 | 2009-11-17 | ||
| CN200920273552.4 | 2009-11-17 | ||
| CN200910224495 | 2009-11-17 | ||
| CN200920273552 | 2009-11-17 | ||
| CN2009101136629A CN102065645B (en) | 2009-11-17 | 2009-12-30 | Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102065645A CN102065645A (en) | 2011-05-18 |
| CN102065645B true CN102065645B (en) | 2012-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202159835U Expired - Lifetime CN201639856U (en) | 2009-11-17 | 2009-12-30 | Double-sided circuit board with element |
| CN2009101136629A Active CN102065645B (en) | 2009-11-17 | 2009-12-30 | Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202159835U Expired - Lifetime CN201639856U (en) | 2009-11-17 | 2009-12-30 | Double-sided circuit board with element |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN201639856U (en) |
| WO (1) | WO2011060600A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201639856U (en) * | 2009-11-17 | 2010-11-17 | 王定锋 | Double-sided circuit board with element |
| CN103022333B (en) * | 2012-12-14 | 2016-04-27 | 厦门市三安光电科技有限公司 | A kind of die-bonding method of LED core particle |
| FR3006551B1 (en) * | 2013-05-30 | 2016-12-09 | Linxens Holding | METHOD FOR MANUFACTURING A PRINTED CIRCUIT, PRINTED CIRCUIT OBTAINED BY THIS METHOD AND ELECTRONIC MODULE COMPRISING SUCH A CIRCUIT PRINTED |
| CN104064848A (en) * | 2014-05-26 | 2014-09-24 | 普尔思（苏州）无线通讯产品有限公司 | Laser antenna and manufacturing method thereof |
| CN104582270B (en) * | 2014-12-05 | 2018-04-27 | 广东明路电力电子有限公司 | Metal laminate connects the preparation method of circuit |
| EP3119168B1 (en) * | 2015-07-17 | 2021-12-01 | Goodrich Lighting Systems GmbH | Aircraft led light unit |
| CN107219678B (en) * | 2016-03-22 | 2020-01-24 | 群创光电股份有限公司 | Display module |
| MX2018013731A (en) * | 2016-05-11 | 2019-08-01 | Flex Automotive Gmbh | Electrical circuitry assembly and method for manufacturing the same. |
| US20180020547A1 (en) * | 2016-07-13 | 2018-01-18 | Alcatel-Lucent Canada Inc. | Underlying recessed component placement |
| CN107072044B (en) * | 2017-06-05 | 2024-04-12 | 广东顺德施瑞科技有限公司 | Double-sided flexible circuit board |
| CN112055463A (en) * | 2019-06-07 | 2020-12-08 | 铜陵国展电子有限公司 | A new bowl hole and manufacturing method of a bowl hole double-sided circuit board |
| CN112055462A (en) * | 2019-06-07 | 2020-12-08 | 铜陵国展电子有限公司 | Bonding pad formed by extending front solder mask layer to back metal and manufacturing method |
| CN113950204B (en) * | 2020-07-16 | 2024-04-12 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
| CN220254758U (en) * | 2023-07-13 | 2023-12-26 | 铜陵国展电子有限公司 | A circuit board, a conjoined circuit board and an LED light strip |
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- 2009-12-30 CN CN2009202159835U patent/CN201639856U/en not_active Expired - Lifetime
- 2009-12-30 CN CN2009101136629A patent/CN102065645B/en active Active
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- 2010-01-18 WO PCT/CN2010/000073 patent/WO2011060600A1/en active Application Filing
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| CN1202794A (en) * | 1997-06-03 | 1998-12-23 | 国际商业机器公司 | Circuit board with primary and secondary through holes |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102065645A (en) | 2011-05-18 |
| CN201639856U (en) | 2010-11-17 |
| WO2011060600A1 (en) | 2011-05-26 |
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