CN102063232A - Structure of capacitive multi-point touch panel and manufacturing method thereof - Google Patents

Abstract

The invention discloses a structure of a capacitive multi-point touch panel and a manufacturing method thereof. The outer layer lens comprises an upper substrate, a first matrix electrode, an ink pattern and a conducting circuit, and the touch sensing piece comprises a lower substrate and a second matrix electrode. The manufacturing method comprises a first matrix electrode forming step, an ink pattern forming step, a conductive circuit forming step, a second matrix electrode forming step, a laminating step, a dividing step and a packaging and testing step which are carried out by a small substrate feeding process, wherein the first matrix electrode forming step, the ink pattern forming step, the conductive circuit forming step, the second matrix electrode forming step, the laminating step and the dividing step are carried out by a large substrate feeding process.

Description

Structure and manufacturing method of capacitive multi-touch panel

technical field

The invention relates to a structure of a capacitive multi-touch panel and a manufacturing method of the capacitive multi-touch panel.

Background technique

Referring to FIG. 1 , it is a schematic cross-sectional view of a capacitive multi-touch panel structure in the prior art. As shown in FIG. 1 , the structure of the prior art multi-touch panel 1 includes two parts, the outer lens 10 and the touch sensing sheet 20 , which are integrated with a transparent optical glue 30 . The outer mirror 10 includes an upper substrate 11 and an ink pattern 15 , and the touch sensing sheet 20 includes a lower substrate 21 , a first matrix electrode 23 , a second matrix electrode 25 , metal lines 27 and a protection layer 29 . The upper substrate 11 and the lower substrate 21 are made of glass or transparent plastic; the ink pattern 15 is formed on the upper substrate 11 and is a design pattern printed by at least one layer of ink, which is used to cover the circuit below and increase the aesthetic feeling of the design; the first matrix The electrodes 23 and the second matrix electrodes 25 are transparent conductive materials, usually indium tin oxide (ITO), which are respectively formed on the two surfaces of the lower substrate 21; the metal layer is formed on the outside of the matrix electrodes and is shielded by the upper ink, and is formed by the metal lines. Formed in a way to reduce the resistance of the second matrix electrode and connect to the external flexible circuit board; the protective layer is usually a transparent protective layer of silicon dioxide to protect the metal layer.

In the capacitive multi-touch panel structure in FIG. 1 , the lower substrate 21 is used as a dielectric material between the first matrix electrodes 23 and the second matrix electrodes 25 to generate a capacitive effect, but the thickness of the glass currently used is usually 0.4 ~0.7 cm. After the touch panel is completed, because the distance between the first and second matrix electrodes is too large, the level difference of the capacitance signals formed by the fingers to the first matrix electrodes and the second matrix electrodes is too large to be easily recognized. Additional compensation is required with a more sophisticated decoding integrated circuit (IC). In addition, plating a layer of indium tin oxide on both sides of the lower substrate is not compatible with the current thin film transistor (thin film transistor, TFT) process equipment or color filter plate (color filter, CF) process equipment, and usually requires a semiconductor process method Depositing a passivation layer 29 to protect the metal lines 27 makes production inefficient and relatively expensive to manufacture.

Referring to FIG. 2 , it is a schematic cross-sectional view of another capacitive multi-touch panel structure in the prior art. As shown in FIG. 2 , in order to improve the above shortcomings, another structure of the touch sensing sheet 40 is formed, including the lower substrate 41 , the first matrix electrodes 43 , the second matrix electrodes 45 , the metal circuit 47 and the dielectric layer 49 , the metal circuit 47 is formed between the dielectric layer 49 and the lower substrate 41, and connected to the second matrix electrode 45, wherein the dielectric layer 49 is a thin film in the TFT process to replace the lower substrate in the first prior art Substrate (glass) dielectric layer. Although this structure can be applied to existing thin-film transistor manufacturing equipment, and narrows the distance between the first matrix electrode 43 and the second matrix electrode 45, the thickness of its dielectric layer is too thin because of the use of TFT manufacturing process, causing the user's The finger capacitance signal is too weak, and it must be solved by reducing the line width of the two electrode matrices 43 and 45. As a side effect, it is necessary to use a precise lithography process to make this thin line width electrode matrix, and too many layers cause The waste of manufacturing process cost, and the use of metal lines leads to poor product reliability.

In addition, referring to FIG. 3 , it is a schematic top view of a connection method of matrix electrodes and metal lines in the prior art. As shown in Figure 3, referring also to Figure 1 and Figure 2, the metal lines 27, 47 are formed between the lower substrate 21 or the lower substrate 41 and the dielectric layer 49, and are connected to the second matrix electrode 25 or 45, in order to design Convenient, usually designed in such a way that the width a of the conductive line is equal to the width b of the space. After etching, the width a is smaller than the width b of the space. Because the line is thinner, the yield of the process is poor.

Contents of the invention

Aiming at the disadvantages of the above-mentioned prior art, the present invention provides a structure of a capacitive multi-touch panel and a manufacturing method thereof.

The structure of the capacitive multi-touch panel of the present invention includes:

An outer lens includes an upper substrate, a first matrix electrode, an ink pattern and a conductive circuit, wherein the upper substrate is a transparent material; the first matrix electrode is formed on the upper substrate, and has a first The matrix electrode pattern is a transparent conductive material; the ink pattern is formed on the upper substrate to cover the circuit below, which is an insulating material; the conductive circuit is a conductive colloid material formed on the ink pattern And the non-transparent part, and partly overlapped with the first matrix electrode, to reduce the resistance of the first matrix electrode, and further connect a flexible circuit board, and transmit the signal from a control chip to the first matrix electrode Matrix electrodes;

A touch sensing sheet, including a lower substrate and a second matrix electrode, wherein the lower substrate is a transparent material; the second matrix electrode is a transparent conductive material and has a second matrix electrode pattern, used to communicate with the first matrix electrodes create a capacitive effect; and

An optical adhesive, which is a transparent insulating colloid, is used as a dielectric material and an adhesive material, and is used to bond a surface of the outer lens having the first matrix electrode and a surface of the touch sensing sheet having the second electrode. The surface of the matrix electrode is used to bond the first matrix electrode and the second matrix electrode to form a capacitor and protect the conductive circuit.

The present invention also provides a method for manufacturing a capacitive multi-touch panel, the steps of which include:

A first matrix electrode forming step is to form a first matrix electrode on a large upper substrate;

An ink pattern forming step is to print at least one ink pattern on the large-scale upper substrate after completing the step of forming the first matrix electrodes. overlapping;

A conductive circuit forming step is to form a conductive colloid on the ink pattern after completing the ink pattern forming step, and then cure the conductive colloid to form a conductive circuit;

A second matrix electrode forming step is to form a first matrix electrode on a large lower substrate;

a bonding step, after the conductive circuit forming step and the second matrix electrode forming step are completed, the large-scale upper substrate and the large-scale lower substrate are bonded with a transparent optical adhesive, and then the optical adhesive is cured;

A dividing step is to cut the bonded large-scale upper substrate and the large-scale lower substrate into a plurality of capacitive multi-touch panels after the bonding step is completed; and

A packaging and testing step, the conductive circuit of the divided capacitive multi-touch panel is bonded to a flexible circuit board, and then packaged in an appropriate module, and multiple tests are performed to ensure quality,

Wherein the first matrix electrode forming step, the ink pattern forming step and the conductive circuit forming step are performed simultaneously with the second matrix electrode forming step.

The structure and manufacturing method of the capacitive multi-touch panel according to the present invention, the first matrix electrode and the conductive circuit are formed in the outer lens, and the conductive circuit uses a conductive adhesive material with low chemical activity, which is not easy to be oxidized and chemically corroded , so that the reliability is increased, and it is not necessary to deposit a protective layer by a semiconductor or TFT process method. The number of layers of the structure is reduced by using optical glue as an adhesive and dielectric material at the same time. In addition, the cost of forming the electrode matrix and circuits by printing and etching is much lower than the lithography and etching process using semiconductors or TFTs. In addition, the manufacturing method of the capacitive multi-touch panel of the present invention can be completed by using the existing printed circuit board manufacturing equipment, the technology is mature, and the production efficiency is higher.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a capacitive multi-touch panel structure in the prior art.

FIG. 2 is a schematic cross-sectional view of another capacitive multi-touch panel structure in the prior art.

FIG. 3 is a schematic top view of the connection method of matrix electrodes and metal lines in the prior art.

FIG. 4 is a schematic cross-sectional view of the structure of the capacitive multi-touch panel of the present invention.

5 is a schematic cross-sectional view of another structure of the touch sensing sheet of the capacitive multi-touch panel of the present invention.

Fig. 6 is a schematic top view of the connection method of the first matrix electrodes and conductive lines in the present invention.

FIG. 7 is a schematic flowchart of a manufacturing method of a capacitive multi-touch panel according to the present invention.

Detailed ways

The implementation of the present invention will be described in more detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it after studying this specification.

Referring to FIG. 4, it is a schematic cross-sectional view of the structure of the capacitive multi-touch panel of the present invention. As shown in FIG. part, and combined with a transparent optical glue 80 into one body. The outer lens 60 includes an upper substrate 61 , a first matrix electrode 63 , an ink pattern 65 and a conductive circuit 67 , and the touch sensor sheet 70 includes a lower substrate 71 and a second matrix electrode 75 from bottom to top.

The upper substrate 61 and the lower substrate 71 are made of transparent materials, such as transparent glass, transparent strengthened glass, transparent plastic or flexible transparent materials; A matrix electrode 63 is formed on the upper substrate 61, which has a matrix electrode pattern forming a capacitor, and is a transparent conductive material, such as indium tin oxide (ITO), aluminum zinc oxide (AZO), indium zinc oxide (IZO), or Any one of nanoscale metal layers; the ink pattern 65 is formed on the upper substrate 61, which is a design pattern printed by at least one layer of ink to cover the circuit below and increase the aesthetic feeling of the design. The position of the ink pattern 65 can be It is separated from the first matrix electrode 63 at a distance, or partially overlapped on the first matrix electrode 63; the conductive circuit 67 is a conductive colloid material, which is used to reduce the resistance of the first matrix electrode 63, and further connects the external A flexible circuit board (not shown), which transmits the signal from the control chip (IC) to the first matrix electrode 63, is formed on the non-transparent part, on the ink pattern 65, and is partially superimposed on the first matrix electrode 63 , if the ink pattern is separated from the first matrix electrode with an interval, it will be partially formed on the upper substrate 61, wherein the material of the conductive colloid is any one of silver colloid, gold colloid, carbon colloid or graphite colloid, which is not easily oxidized And chemical corrosion, so that the conductive line has a high degree of reliability.

The second matrix electrode 75 has a second matrix electrode pattern and is formed on the lower substrate 71 to generate a capacitive effect with the first matrix electrode 63. It is a transparent conductive material such as indium tin oxide (ITO) or zinc oxide. Any one of aluminum (AZO), indium zinc oxide (IZO), or nano-scale metal layers; optical glue 80, with high transparency, to connect the surface of the outer lens 60 with the first matrix electrode 63 and the touch sensing sheet 70 has the surface of the second matrix electrode 75, the first matrix electrode 63 and the second matrix electrode 75 are bonded to form a capacitor, as a dielectric and bonding material.

Referring to FIG. 5 , it is a schematic cross-sectional view of another structure of the touch sensing sheet of the capacitive multi-touch panel of the present invention. As shown in FIG. 5 , the touch sensor sheet 70 of the present invention may further include a back adhesive 77 and a back adhesive protection film under the lower substrate 71 , especially when the material of the lower substrate 71 is a flexible transparent material.

Referring to FIG. 6 , it is a schematic top view of the connection method of the first matrix electrode 63 and the conductive circuit 67 according to the present invention. As shown in FIG. 6 , the conductive circuit 67 is formed on the ink pattern 65 , is slightly longer than the length of the ink pattern 65 , and partially overlaps with the pattern of the first matrix electrode 63 . In the present invention, the conductive circuit 67 is directly combined with the ink pattern 65, which can reduce the impact of the conductive circuit 67 on the vision, and can have a wider width to improve the yield of the process. The width c of the conductive circuit in the best embodiment of the present invention is The ratio to the space width d is 7:3, but not limited thereto.

Referring to FIG. 7 , it is a schematic flow chart of the manufacturing method of the capacitive multi-touch panel of the present invention. As shown in FIG. 7 , the manufacturing method of the capacitive multi-touch panel of the present invention includes a first matrix electrode forming step S12, an ink pattern forming step S14, a conductive circuit forming step S16, a second matrix electrode forming step S20, and a bonding step S30 , Segmentation step S40 and packaging and testing step S50, wherein steps S12-16 are performed simultaneously with step S20.

The first matrix electrode forming step S12 is to form transparent and conductive electrode patterns on the transparent large upper substrate. The formation method can be to deposit transparent conductive materials on the large upper substrate by methods such as sputtering, evaporation, electroplating or electroless plating. Then, the electrode pattern is directly separated by laser processing; or the electrode pattern is printed by photoresist coating and then developed by the photoresist method, and then the electrode pattern is formed by etching; or the electrode pattern is formed by printing The method directly prints the etching paste on the transparent conductive layer, and then forms electrode patterns by etching. The etching method can be wet etching or dry etching. The ink pattern forming step S14 is to print at least one ink pattern on the large upper substrate by printing after the first matrix electrodes are formed on the large upper substrate. The ink pattern can be separated from the first matrix electrodes by an interval or partially overlapped. Conductive circuit forming step S16 is to form a conductive colloid on the ink pattern by spray printing, transfer printing, letterpress printing, gravure printing or screen printing, and connect to the matrix electrodes, and then the conductive colloid Curing to form conductive lines, wherein the conductive colloid can be silver colloid, gold colloid, carbon colloid or graphite colloid, etc.

The second matrix electrode forming step S20 is to form a transparent conductive electrode pattern on the transparent large lower substrate to form a capacitive effect with the first matrix electrode. The formation method can be through sputtering, evaporation, electroplating or The electrode material is deposited on the large lower substrate by means of electroless plating, and then the electrode pattern is separated by direct laser processing; or the electrode pattern is printed by using the photolithography method, after coating the photoresist, exposing the mask and developing it , and then form an electrode pattern by etching; or use a printing method to directly print an etching paste on the transparent conductive layer, and then form an electrode pattern by etching. The etching method can be wet etching or dry etching. The bonding step S30 is to align the large upper substrate and the large lower substrate respectively having patterns with a transparent optical glue, and then bond them together, and then cure the optical glue. The dividing step S30 is to cut the laminated large upper and lower substrates into a plurality of capacitive multi-touch panels. In the packaging and testing step S50 , the conductive circuit is bonded to the flexible circuit board, and an adhesive and an adhesive protective film can be further pasted on the bottom (outside) of the lower substrate. Then go through various tests to ensure the quality of the capacitive multi-touch panel.

The above descriptions are only preferred embodiments for explaining the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change of the present invention made under the same creative spirit will be accepted. Still should be included in the category that the present invention intends to protect.

Claims (12)

1. A structure of capacitive multi-touch panel, characterized in that, comprising: An outer lens includes an upper substrate, a first matrix electrode, an ink pattern and a conductive circuit, wherein the upper substrate is a transparent material; the first matrix electrode is formed on the upper substrate, and has a first The matrix electrode pattern is a transparent conductive material; the ink pattern is formed on the upper substrate to cover the circuit below, which is an insulating material; the conductive circuit is a conductive colloid material formed on the ink pattern And the non-transparent part, and partly overlapped with the first matrix electrode, to reduce the resistance of the first matrix electrode, and further connect a flexible circuit board, and transmit the signal from a control chip to the first matrix electrode Matrix electrodes; A touch sensing sheet, including a lower substrate and a second matrix electrode, wherein the lower substrate is a transparent material; the second matrix electrode is a transparent conductive material and has a second matrix electrode pattern, used to communicate with the first matrix electrodes create a capacitive effect; and An optical adhesive, which is a transparent insulating colloid, is used as a dielectric material and an adhesive material, and is used to bond a surface of the outer lens having the first matrix electrode and a surface of the touch sensing sheet having the second electrode. The surface of the matrix electrode is used to bond the first matrix electrode and the second matrix electrode to form a capacitor and protect the conductive circuit. 2 . The structure according to claim 1 , wherein the touch sensing sheet further comprises a back adhesive and a back adhesive protective film on a surface of the lower substrate where the second matrix electrodes are not formed. 3 . 3. The structure according to claim 1, wherein the transparent material forming the upper substrate and the lower substrate is at least one of a transparent glass, a transparent strengthened glass, a transparent plastic or a flexible transparent material one. 4. The structure according to claim 1, wherein the transparent conductive material forming the first matrix electrode and the second matrix electrode is indium tin oxide, zinc aluminum oxide, indium zinc oxide, or nanoscale metal one of the layers. 5. The structure of claim 1, wherein the conductive colloid material forming the conductive circuit is one of silver colloid, gold colloid, carbon colloid or graphite colloid. 6. The structure of claim 1, wherein the conductive trace has a conductive circuit width to space width ratio of 7:3. 7. A method for manufacturing a capacitive multi-touch panel, characterized in that the steps include: A first matrix electrode forming step is to form a first matrix electrode on a large upper substrate; An ink pattern forming step is to print at least one ink pattern on the large-scale upper substrate after completing the step of forming the first matrix electrodes. overlapping; A conductive circuit forming step is to form a conductive colloid on the ink pattern after completing the ink pattern forming step, and then cure the conductive colloid to form a conductive circuit; A second matrix electrode forming step is to form a first matrix electrode on a large lower substrate; a bonding step, after the conductive circuit forming step and the second matrix electrode forming step are completed, the large-scale upper substrate and the large-scale lower substrate are bonded with a transparent optical adhesive, and then the optical adhesive is cured; A dividing step is to cut the bonded large-scale upper substrate and the large-scale lower substrate into a plurality of capacitive multi-touch panels after the bonding step is completed; and A packaging and testing step, the conductive circuit of the divided capacitive multi-touch panel is bonded to a flexible circuit board, and then packaged in an appropriate module, and multiple tests are performed to ensure quality, Wherein the first matrix electrode forming step, the ink pattern forming step and the conductive circuit forming step are performed simultaneously with the second matrix electrode forming step. 8. The manufacturing method according to claim 7, wherein the first matrix electrode forming step is to form a transparent conductive material through a sputtering process, an evaporation process, an electroplating process or an electroless plating process. Deposit on the large upper substrate, and then use a laser processing method or a lithography method and an etching method or use a printing method to directly print an etching paste on the transparent conductive material, and then use the etching method to separate a first A matrix electrode pattern, wherein the etching method is a wet etching method or a dry etching method. 9. The manufacturing method according to claim 7, wherein the packaging and testing steps further comprise coating a back adhesive on the divided capacitive multi-touch panel and affixing a back adhesive protection film on the capacitive multi-touch panel. Large lower base plate. 10. The manufacturing method according to claim 7, wherein the second matrix electrode forming step is to form a transparent conductive material through a sputtering process, an evaporation process, an electroplating process or an electroless plating process. Deposit on the large lower substrate, and then use a laser processing method or a lithography method and an etching method to directly print an etching paste on the transparent conductive material by a printing method, and then use the etching method to separate a first Two matrix electrode patterns, wherein the etching method is a wet etching method or a dry etching method. 11. The manufacturing method according to claim 7, wherein the conductive circuit is formed by a spray printing method, a transfer printing method, a letterpress printing method, a gravure printing method or a screen printing method. 12. The manufacturing method according to claim 7, wherein the conductive colloid material forming the conductive circuit is one of silver colloid, gold colloid, carbon colloid or graphite colloid.

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