CN102056472A - Ball grid array (BGA) mounting system with precise vision - Google Patents
Ball grid array (BGA) mounting system with precise vision Download PDFInfo
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- CN102056472A CN102056472A CN2009102187577A CN200910218757A CN102056472A CN 102056472 A CN102056472 A CN 102056472A CN 2009102187577 A CN2009102187577 A CN 2009102187577A CN 200910218757 A CN200910218757 A CN 200910218757A CN 102056472 A CN102056472 A CN 102056472A
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Abstract
The invention discloses a ball grid array (BGA) mounting system with precise vision, comprising an X-Y position adjustment mechanism for horizontally clamping a printed circuit board (PCB) to be processed, two BGA shelving units, a mounting assembly, a beam split imaging device, and a display, wherein the BGA shelving units are arranged respectively at the left side and the right side of the X-Y position adjustment mechanism; the mounting assembly is arranged right above the X-Y position adjustment mechanism and can pick up a BGA device required to be mounted from the BGA shelving units as well as sends the picked BGA device to a pad position corresponding to the PCB; the beam split imaging device is used for carrying out vision alignment on the picked BGA device and the pad position corresponding to the PCB; the display is connected with the beam split imaging device; and the mounting assembly is composed of a pickup mechanism for picking up the BGA devices and an alignment adjustment mechanism for aligning and adjusting the pickup mechanism. The BGA mounting system has the advantages of being simple and reasonable in structure, convenient to install, and simple and easy to operate, and having high working efficiency, and can effectively solve the difficulty of the precise mounting of the BGA devices, chip-scale package (CSP) devices and the like on the PCB; and the serviceability is reliable and the operation precision is high.
Description
Technical field
The present invention relates to a kind of is the system that the devices such as BGA, CSP on the electronic printing plate mount to being welded on PCB, especially relates to a kind of BGA precise vision and mounts system.
Background technology
Miniaturization (as mobile phone), portability (as notebook computer) and multi-functional development trend along with electronic product, the function of integrated circuit is more and more stronger, meanwhile, make the IC chip of BGA (BallGrid Array ball grid array structure), CSP (chip scale package wafer-level package), QFP different packing forms such as (the small-sized square planar package of Quad Flat Package) develop towards the direction that pin number increases, pin-pitch reduces, this brings difficulty just for IC devices such as mounting BGA in sample making or in the small lot batch manufacture by hand.And be applicable to the full-automatic chip mounter of batch process, be uneconomic for sample making and small lot batch manufacture.
Summary of the invention
Technical problem to be solved by this invention is at above-mentioned deficiency of the prior art, provide a kind of BGA precise vision to mount system, it is simple and reasonable, easy for installation and use easy and simple to handle, high efficiency, can effectively solve devices such as BGA, CSP and on pcb board, accurately mount a difficult problem, and reliable working performance, performance accuracy height.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of BGA precise vision mounts system, it is characterized in that: comprise the pending pcb board of horizontal from bottom to up clamping and can locate adjusting mechanism to the X-Y that adjusts clamping pcb board position in length and breadth, be installed in the described X-Y adjusting mechanism left and right sides, location and be used to place the BGA articles holding table that need mount the BGA device, be installed in directly over the adjusting mechanism of described X-Y location and can pick up the required BGA device that mounts and picking up BGA device be delivered to the assembly that mounts of the corresponding pad locations of pcb board from the BGA articles holding table, the corresponding pad locations with pcb board of picking up BGA device is carried out the beam split device for image of vision contraposition and joined with the beam split device for image and be installed in the display on adjusting mechanism right side, described X-Y location, and the beam split device for image is installed on the adjusting mechanism of described X-Y location; The described assembly that mounts is by the mechanism for picking that described BGA device is picked up with described mechanism for picking is carried out the contraposition adjusting mechanism that contraposition adjusts form, and described mechanism for picking is installed on the described contraposition adjusting mechanism.
Described X-Y location adjusting mechanism comprises pedestal, be installed on the pedestal and the position can be carried out in length and breadth to the X-Y coordinates platform of adjusting and is used for the clamping pcb board and hold assembly that the position can be adjusted, and described hold assembly is installed on the X-Y coordinates platform.
Described contraposition adjusting mechanism is made up of elevating mechanism and rotating mechanism that described mechanism for picking position is adjusted accordingly; Described elevating mechanism is installed on the described mechanism for picking and rotating mechanism is installed on the elevating mechanism, described elevating mechanism is formed by the lifting guiding mechanism and to the manual rotating handle that the lifting guiding mechanism carries out regulating and controlling, and manual rotating handle is installed on the described lifting guiding mechanism.
Video camera, zoom lens and lighting mechanism composition that described beam split device for image is served as reasons and fitted together; Described beam split device for image stretches out when described BGA device and pcb board are carried out the vision contraposition, and the vision contraposition finish after the device for image of withdrawal; Described lighting mechanism is two lighting devices that respectively described BGA device and pcb board thrown light on up and down, and described video camera and display join.
Described X-Y coordinates platform is made up of two horizontal adjusting mechanism and two vertical adjusting mechanisms that are installed in the pedestal left and right sides that are installed in both sides, pedestal front and back, and described horizontal adjusting mechanism and vertical adjusting mechanism join.
Described vertical adjusting mechanism comprises two vertical line slideways being set in parallel in the X-Y coordinates platform left and right sides, is sleeved on the line slideway and activity external member that can move around after line slideway is gone forward and the adjusting leading screw that the activity external member is adjusted, described activity external member is connected by connector with regulating between leading screw, connector be fixedly mounted on the activity external member and connector and adjusting leading screw between be connected with thread connecting mode; Regulating leading screw one end is installed together with horizontal adjusting mechanism.
Described adjusting leading screw is equipped with the spiral direction finder.
On described vertical adjusting mechanism the adjustment swing handle is installed.
Described mechanism for picking by described BGA device is adsorbed pick up suction nozzle, be used to change the suction nozzle replacing device that picks up suction nozzle and with pick up the vacuum pipe that suction nozzle communicates and form.
The present invention compared with prior art has the following advantages:
1, simple and reasonable, each several part is installed compact and is used easy and simple to handle.
2, reliable working performance, performance accuracy height carry out firm clamping by the X-Y location adjusting mechanism that is positioned at the below to pending pcb board; Pick up the BGA device by the assembly that mounts that is positioned at the top simultaneously, and with the BGA device that picked up after contraposition is adjusted, deliver to the corresponding pad locations of pcb board, carry out the Reflow Soldering welding afterwards; In addition, when the BGA device that picked up and pcb board were carried out contraposition, what the present invention adopted was to carry out the vision contraposition at the beam split device for image that mounts between the adjusting mechanism of assembly and X-Y location, thereby aligning accuracy is very high.
3, used mechanism for picking modern design, use are easy and simple to handle and effective, can mount big BGA device and little CSP device to 5mm * 5mm to 50mm * 50mm, can be extensive use of when mounting IC device such as BGA in sample making process and the small batch production process, for example for scientific research institutions' development of new products, because it all adopts form chips such as BGA, CSP, QFP mostly, thereby available the present invention carries out precise vision and mounts, and use value is very high.
In sum, the present invention is simple and reasonable, easy for installation and use easy and simple to handle, high efficiency, and can effectively solve devices such as BGA, CSP and on pcb board, accurately mount a difficult problem, and reliable working performance, performance accuracy height.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is the vertical view of Fig. 1.
Description of reference numerals:
The 1-pedestal; The 2-X-Y coordinates platform; The horizontal adjusting mechanism of 2-1-;
The vertical adjusting mechanism of 2-2-; The 2-21-line slideway; 2-22-activity external member;
2-23-regulates leading screw; The 2-24-connector; The 3-hold assembly;
4-adjusts swing handle; 5-beam split device for image; 6-picks up suction nozzle;
The 7-manual rotating handle; The 8-elevating mechanism; The 9-rotating mechanism;
The 10-left plate; The 11-right plate; The 14-BGA articles holding table;
The 15-display.
Embodiment
As Fig. 1, shown in Figure 2, the present invention includes the pending pcb board of horizontal from bottom to up clamping and can locate adjusting mechanism to the X-Y that adjusts clamping pcb board position in length and breadth, be installed in the described X-Y adjusting mechanism left and right sides, location and be used to place the BGA articles holding table 14 that need mount the BGA device, be installed in directly over the adjusting mechanism of described X-Y location and can pick up the required BGA device that mounts and picking up BGA device be delivered to the assembly that mounts of the corresponding pad locations of pcb board from BGA articles holding table 14, the corresponding pad locations with pcb board of picking up BGA device is carried out the beam split device for image 5 of vision contraposition and joined with beam split device for image 5 and be installed in the display 15 on adjusting mechanism right side, described X-Y location.Described beam split device for image 5 is installed on the adjusting mechanism of described X-Y location.The described assembly that mounts is by the mechanism for picking that described BGA device is picked up with described mechanism for picking is carried out the contraposition adjusting mechanism that contraposition adjusts form, and described mechanism for picking is installed on the described contraposition adjusting mechanism.In the present embodiment, described mechanism for picking by described BGA device is adsorbed pick up suction nozzle 6, be used to change the suction nozzle replacing device that picks up suction nozzle 6 and with pick up the vacuum pipe that suction nozzle 6 communicates and form.
In the present embodiment, described X-Y location adjusting mechanism comprises pedestal 1, be installed on the pedestal 1 and the position can be carried out in length and breadth to the X-Y coordinates platform of adjusting 2 and is used for the clamping pcb board and hold assembly 3 that the position can be adjusted, and described hold assembly 3 is installed on the X-Y coordinates platform 2.Described X-Y coordinates platform 2 is made up of two horizontal adjusting mechanism 2-1 and two vertical adjusting mechanism 2-2 that are installed in pedestal 1 left and right sides that are installed in both sides, pedestal 1 front and back, and described horizontal adjusting mechanism 2-1 and vertical adjusting mechanism 2-2 join.
Described vertical adjusting mechanism 2-2 comprises two vertical line slideway 2-21 being set in parallel in X-Y coordinates platform 2 left and right sides, be sleeved on line slideway 2-21 goes up and activity external member 2-22 that can move around after line slideway 2-21 goes forward and the adjusting leading screw 2-23 that activity external member 2-22 is adjusted, described activity external member 2-22 is connected by connector 2-24 with regulating between leading screw 2-23, connector 2-24 be fixedly mounted on that activity external member 2-22 goes up and connector 2-24 and adjusting leading screw 2-23 between be connected with thread connecting mode.Described adjusting leading screw 2-23 one end is installed together with horizontal adjusting mechanism 2-1.Described adjusting leading screw 2-23 is equipped with the spiral direction finder.Be equipped with on described vertical adjusting mechanism 2-2 and adjust swing handle 4.Both sides, described X-Y coordinates platform 2 front and back are provided with the guide channel of being formed and horizontal adjusting mechanism 2-1 being led by left plate 10 and right plate 11.
Particularly, described pedestal 1 is formed through Precision Machining by metal material.Described X-Y coordinates platform 2 is used for fixing pcb board, and the XY adjustment component of X-Y coordinates platform 2 by being provided with on it (be horizontal adjusting mechanism 2-1 and vertically adjusting mechanism 2-2), respectively from about and the front and back four direction position of pcb board is adjusted; That is to say,, reach the purpose of the two dimensional surface position of pcb board being carried out easy adjustment by adjusting described XY adjustment component.Described hold assembly 3 is used for gripping large-size and heavier pcb board, and the clamping action of the hold assembly 3 by being positioned at pcb board below makes that pcb board can move left and right and bending; If desired, can also adjust the position and the height of hold assembly 3 arbitrarily.
Described contraposition adjusting mechanism is made up of elevating mechanism 8 that described mechanism for picking position is adjusted accordingly and rotating mechanism 9.Described elevating mechanism 8 is installed on the described mechanism for picking and rotating mechanism 9 is installed on the elevating mechanism 8, described elevating mechanism 8 is formed by the lifting guiding mechanism and to the manual rotating handle 7 that the lifting guiding mechanism carries out regulating and controlling, and manual rotating handle 7 is installed on the described lifting guiding mechanism.In the actual use, can realize described the moving up and down and rotatablely moving of assembly that mount by operation elevating mechanism 8 and rotating mechanism 9.During use, can regulate the described upper-lower position that mounts assembly by rotation manual rotating handle 7.Described rotating mechanism 9 is used for adjusting the BGA device that picks up on the suction nozzle 6 and the mutual alignment of pcb board, by the lever that is provided with on the rotating mechanism 9, the described assembly that mounts can be rotated in ± 15 ° of scopes, that is to say, adjust the relative angle of BGA device and pcb board by rotating mechanism 9.
Usually in the use, rotating mechanism 9 will be used with X-Y coordinates platform 2.Particularly, in the position alignment process of pcb board and BGA device, adjust the two dimensional surface position of pcb board by adjusting X-Y coordinates platform 2, to reach the position concentric with the BGA device, simultaneously, adjust by adjusting the described rotational angle that mounts 9 pairs of BGA devices that pick up of rotating mechanism of assembly, make that corresponding pad locations overlaps up and down on BGA device and the pcb board.Be noted that: the position alignment process of pcb board and BGA device is to carry out on beam split device for image 5 carries out the basis of accurate vision contraposition.
Video camera, zoom lens and lighting mechanism composition that described beam split device for image 5 is served as reasons and fitted together.Described beam split device for image 5 stretches out when described BGA device and pcb board are carried out the vision contraposition, and the vision contraposition finish after the device for image of withdrawal.Described lighting mechanism is two lighting devices that respectively described BGA device and pcb board thrown light on up and down, and described video camera and display 15 join.
In the present embodiment, described video camera is a ccd video camera.Described lighting mechanism is the LED lighting mechanism.To sum up, described beam split device for image 5 is to pcb board with pick up and stretch out when BGA device on the suction nozzle 6 carries out the vision contraposition, puts in reposition when carrying out the mounting of BGA device.In addition, because beam split device for image 5 joins with display 15, then in vision contraposition process, can show pcb board surface on the display 15 simultaneously and pick up BGA device on the suction nozzle 6, and the two image respectively accounts for 50%, in the actual mechanical process, also can be according to concrete needs, the displaying ratio on display 15 also can adjust accordingly with pcb board and BGA device image.
The course of work of the present invention is: at first, pcb board is placed on the X-Y coordinates platform 2, and it is fixedly clamped with the hold assembly on being installed on the X-Y coordinates platform 23, simultaneously the required BGA device that mounts is placed on the BGA articles holding table 14, move afterwards and pick up suction nozzle 6 and on BGA articles holding table 14, pick up the BGA device, pick up suction nozzle 6 and pick up to move once more behind the BGA device and pick up suction nozzle 6 and make that to pick up the pad locations that will mount the BGA device on suction nozzle 6 and the pcb board corresponding; Afterwards, stretch out 5 pairs of pcb boards of beam split device for image and BGA device again and carry out accurate vision contraposition, in the vision contraposition process, pcb board and BGA device are imaged on the external display 15 simultaneously by beam split device for image 5; Then, unite adjustment by adjusting X-Y coordinates platform 2 and the described rotating mechanism 9 that mounts assembly again, in the associating adjustment process, image corresponding relation with reference to shown pcb board on the remote data indicator 15 and BGA device is adjusted, very directly perceived and the contraposition effect is very good, aligning accuracy is than higher, in a word, by adjusting X-Y coordinates platform 2 and rotating mechanism 9, make on BGA device and the pcb board that the pad picture position coincides accordingly; Then, withdrawal beam split device for image 5 is adjusted the described elevating mechanism 8 that mounts assembly, makes to drop under the BGA device on the corresponding pad of pcb board, puts down the BGA device and rises and pick up suction nozzle 6, just finishes the process that mounts of a BGA device.
The above; it only is preferred embodiment of the present invention; be not that the present invention is imposed any restrictions, everyly any simple modification that above embodiment did, change and equivalent structure changed, all still belong in the protection range of technical solution of the present invention according to the technology of the present invention essence.
Claims (9)
1. a BGA precise vision mounts system, it is characterized in that: comprise the pending pcb board of horizontal from bottom to up clamping and can locate adjusting mechanism to the X-Y that adjusts clamping pcb board position in length and breadth, be installed in the described X-Y adjusting mechanism left and right sides, location and be used to place the BGA articles holding table (14) that need mount the BGA device, be installed in directly over the adjusting mechanism of described X-Y location and can pick up the required BGA device that mounts and picking up BGA device be sent the assembly that mounts of the corresponding pad locations of pcb board from BGA articles holding table (14), the corresponding pad locations with pcb board of picking up BGA device is carried out the beam split device for image (5) of vision contraposition and joined with beam split device for image (5) and be installed in the display (15) on adjusting mechanism right side, described X-Y location, and beam split device for image (5) is installed on the adjusting mechanism of described X-Y location; The described assembly that mounts is by the mechanism for picking that described BGA device is picked up with described mechanism for picking is carried out the contraposition adjusting mechanism that contraposition adjusts form, and described mechanism for picking is installed on the described contraposition adjusting mechanism.
2. mount system according to the described a kind of BGA precise vision of claim 1, it is characterized in that: described X-Y location adjusting mechanism comprises pedestal (1), be installed in that pedestal (1) is gone up and the position can be carried out in length and breadth to the X-Y coordinates platform of adjusting (2) and is used for the clamping pcb board and hold assembly (3) that the position can be adjusted, and described hold assembly (3) is installed on the X-Y coordinates platform (2).
3. mount system according to claim 1 or 2 described a kind of BGA precise visions, it is characterized in that: described contraposition adjusting mechanism is made up of elevating mechanism (8) that described mechanism for picking position is adjusted accordingly and rotating mechanism (9); Described elevating mechanism (8) is installed on the described mechanism for picking and rotating mechanism (9) is installed on the elevating mechanism (8), described elevating mechanism (8) is formed by the lifting guiding mechanism and to the manual rotating handle (7) that the lifting guiding mechanism carries out regulating and controlling, and manual rotating handle (7) is installed on the described lifting guiding mechanism.
4. mount system according to claim 1 or 2 described a kind of BGA precise visions, it is characterized in that: video camera, zoom lens and lighting mechanism composition that described beam split device for image (5) is served as reasons and fitted together; Described beam split device for image (5) stretches out when described BGA device and pcb board are carried out the vision contraposition, and the vision contraposition finish after the device for image of withdrawal; Described lighting mechanism is two lighting devices that respectively described BGA device and pcb board thrown light on up and down, and described video camera and display (15) join.
5. mount system according to claim 1 or 2 described a kind of BGA precise visions, it is characterized in that: described X-Y coordinates platform (2) is made up of two horizontal adjusting mechanism (2-1) and two vertical adjusting mechanisms (2-2) that are installed in pedestal (1) left and right sides that are installed in both sides, pedestal (1) front and back, and described horizontal adjusting mechanism (2-1) and vertical adjusting mechanism (2-2) join.
6. mount system according to the described a kind of BGA precise vision of claim 5, it is characterized in that: described vertical adjusting mechanism (2-2) comprises the two vertical line slideways (2-21) that are set in parallel in X-Y coordinates platform (2) left and right sides, being sleeved on line slideway (2-21) goes up and activity external member (2-22) that can move around after line slideway (2-21) goes forward and the adjusting leading screw (2-23) that activity external member (2-22) is adjusted, described activity external member (2-22) is connected by connector (2-24) with regulating between leading screw (2-23), connector (2-24) be fixedly mounted on that activity external member (2-22) goes up and connector (2-24) and adjusting leading screw (2-23) between be connected with thread connecting mode; Regulating leading screw (2-23) end is installed together with horizontal adjusting mechanism (2-1).
7. mount system according to the described a kind of BGA precise vision of claim 6, it is characterized in that: described adjusting leading screw (2-23) is equipped with the spiral direction finder.
8. mount system according to the described a kind of BGA precise vision of claim 5, it is characterized in that: be equipped with on described vertical adjusting mechanism (2-2) and adjust swing handle (4).
9. mount system according to claim 1 or 2 described a kind of BGA precise visions, it is characterized in that: described mechanism for picking by described BGA device is adsorbed pick up suction nozzle (6), be used for changing the suction nozzle replacing device pick up suction nozzle (6) and with pick up the vacuum pipe that suction nozzle (6) communicates and form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102187577A CN102056472A (en) | 2009-11-02 | 2009-11-02 | Ball grid array (BGA) mounting system with precise vision |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102187577A CN102056472A (en) | 2009-11-02 | 2009-11-02 | Ball grid array (BGA) mounting system with precise vision |
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| CN102056472A true CN102056472A (en) | 2011-05-11 |
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| CN2009102187577A Pending CN102056472A (en) | 2009-11-02 | 2009-11-02 | Ball grid array (BGA) mounting system with precise vision |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281750A (en) * | 2011-05-23 | 2011-12-14 | 江西万申机械有限责任公司 | Chip mounter |
| CN104302117A (en) * | 2014-10-21 | 2015-01-21 | 东莞市新泽谷机械制造股份有限公司 | An improved vertical plug-in machine |
| CN104302116A (en) * | 2014-10-21 | 2015-01-21 | 东莞市新泽谷机械制造股份有限公司 | A workbench for a plug-in machine |
| CN105710631A (en) * | 2016-04-20 | 2016-06-29 | 湖州国信物资有限公司 | BGA sticking system |
| CN108656532A (en) * | 2018-03-16 | 2018-10-16 | 嘉兴领科材料技术有限公司 | A kind of preparation facilities of fiber reinforcement High Performance Thermoplastic Composites |
| CN112802788A (en) * | 2020-12-28 | 2021-05-14 | 西南技术物理研究所 | High-precision chip positioning device |
| CN113207274A (en) * | 2021-04-29 | 2021-08-03 | 歌尔科技有限公司 | Automatic battery mounting equipment and automatic battery mounting method |
| CN114828445A (en) * | 2022-05-24 | 2022-07-29 | 苏州创阈星智能科技有限公司 | Mounting equipment |
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2009
- 2009-11-02 CN CN2009102187577A patent/CN102056472A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281750B (en) * | 2011-05-23 | 2014-05-14 | 江西万申机械有限责任公司 | Chip mounter |
| CN102281750A (en) * | 2011-05-23 | 2011-12-14 | 江西万申机械有限责任公司 | Chip mounter |
| CN104302116B (en) * | 2014-10-21 | 2017-11-03 | 东莞市新泽谷机械制造股份有限公司 | Workbench for plug-in machine |
| CN104302117A (en) * | 2014-10-21 | 2015-01-21 | 东莞市新泽谷机械制造股份有限公司 | An improved vertical plug-in machine |
| CN104302116A (en) * | 2014-10-21 | 2015-01-21 | 东莞市新泽谷机械制造股份有限公司 | A workbench for a plug-in machine |
| CN105710631B (en) * | 2016-04-20 | 2017-12-01 | 嵊州北航投星空众创科技有限公司 | A kind of BGA mounting systems |
| CN105710631A (en) * | 2016-04-20 | 2016-06-29 | 湖州国信物资有限公司 | BGA sticking system |
| CN108656532A (en) * | 2018-03-16 | 2018-10-16 | 嘉兴领科材料技术有限公司 | A kind of preparation facilities of fiber reinforcement High Performance Thermoplastic Composites |
| CN112802788A (en) * | 2020-12-28 | 2021-05-14 | 西南技术物理研究所 | High-precision chip positioning device |
| CN113207274A (en) * | 2021-04-29 | 2021-08-03 | 歌尔科技有限公司 | Automatic battery mounting equipment and automatic battery mounting method |
| CN113207274B (en) * | 2021-04-29 | 2023-01-20 | 歌尔科技有限公司 | Automatic battery mounting equipment and automatic battery mounting method |
| CN114828445A (en) * | 2022-05-24 | 2022-07-29 | 苏州创阈星智能科技有限公司 | Mounting equipment |
| CN114828445B (en) * | 2022-05-24 | 2023-09-15 | 苏州创阈星智能科技有限公司 | Mounting equipment |
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Application publication date: 20110511 |