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CN102044532A - Wireless communication module and manufacturing method thereof - Google Patents

Wireless communication module and manufacturing method thereof Download PDF

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Publication number
CN102044532A
CN102044532A CN2010102908963A CN201010290896A CN102044532A CN 102044532 A CN102044532 A CN 102044532A CN 2010102908963 A CN2010102908963 A CN 2010102908963A CN 201010290896 A CN201010290896 A CN 201010290896A CN 102044532 A CN102044532 A CN 102044532A
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CN
China
Prior art keywords
electromagnetic interference
unit
substrate
protection film
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102908963A
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Chinese (zh)
Inventor
廖国宪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Semiconductor Engineering Inc
Original Assignee
Advanced Semiconductor Engineering Inc
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Publication date
Application filed by Advanced Semiconductor Engineering Inc filed Critical Advanced Semiconductor Engineering Inc
Priority to CN2010102908963A priority Critical patent/CN102044532A/en
Publication of CN102044532A publication Critical patent/CN102044532A/en
Priority to CN201110275954.XA priority patent/CN102324416B/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A wireless communication module and a method of manufacturing the same. The wireless communication module comprises a substrate unit, a circuit assembly, a first packaging unit, an electromagnetic interference protective film, a second packaging unit, an antenna and a conductive assembly. The substrate unit has a grounding portion and an electrical contact. The circuit assembly is arranged on the substrate unit and electrically connected to the electrical contact. The first packaging unit wraps the circuit assembly and exposes the electric contact. The electromagnetic interference protection film covers the first packaging unit and is electrically connected to the grounding part. The second packaging unit covers the electromagnetic interference protection film and exposes the electrical contact. The antenna is formed on the second packaging unit. The conductive assembly is electrically connected with the electrical contact and the antenna through the first packaging unit and the second packaging unit.

Description

Wireless communication module and manufacture method thereof
Technical field
The invention relates to a kind of wireless communication module and manufacture method thereof, and particularly relevant for the wireless communication module and the manufacture method thereof of a kind of integral antenna and control module thereof.
Background technology
Traditional wireless communication module comprises antenna and control module thereof.After control module and antenna completed respectively, antenna was located on the part of circuit board, and control module then is located on another part of circuit board and in order to control antenna.
Yet control module of Zhi Zuoing and antenna need two groups of production equipments, many manufacturing costs of deriving respectively.And control module and antenna electrically connect control module and antenna after must being arranged on the circuit board respectively again, quite trouble.
Summary of the invention
The present invention is relevant for a kind of wireless communication module and manufacture method thereof, and antenna and control module thereof are integrated in the wireless communication module, can save manufacturing cost, additionally assemble the cost and the man-hour of antenna and control module thereof.
According to a first aspect of the invention, a kind of wireless communication module is proposed.Wireless communication module comprises a base board unit, a circuit unit, one first encapsulation unit, an electromagnetic interference (electromagnetic interference, EMI) protecting film, one second encapsulation unit, an antenna and a conductive component.Base board unit has a grounding parts (grounding) and an electrical contact.Circuit unit is located on the base board unit.The first package unit covers circuit unit also exposes electrical contact.The electromagnetic interference shielding film covers first encapsulation unit and is electrically connected at grounding parts.Second encapsulation unit covers at least a portion of electromagnetic interference shielding film and exposes electrical contact.Dwi hastasana is formed on second encapsulation unit.Conductive component electrically connects electrical contact and antenna by first encapsulation unit and second encapsulation unit.
A kind of manufacture method of wireless communication module is proposed according to a second aspect of the invention.Manufacture method may further comprise the steps.One substrate is provided, and substrate has a grounding parts and an electrical contact; One circuit unit is provided; Circuit unit is set on substrate; Form one first encapsulating material coating circuit assembly; The position of corresponding grounding parts is cut first encapsulating material and is exposed to form one first encapsulation unit and grounding parts; Form an electromagnetic interference shielding film and cover first encapsulation unit, wherein the electromagnetic interference shielding film is electrically connected at grounding parts; Form at least a portion that one second encapsulating material covers the electromagnetic interference shielding film; Form a perforate and run through first encapsulation unit and second encapsulating material; Form a conductive component in perforate, wherein conductive component is electrically connected at electrical contact; Form an antenna on second encapsulating material, antenna is electrically connected at conductive component; And, the cutting substrate and second encapsulating material.
A kind of manufacture method of wireless communication module is proposed according to a third aspect of the invention we.Manufacture method may further comprise the steps.One substrate is provided, and substrate has a grounding parts and an electrical contact; One circuit unit is provided; Circuit unit is set on substrate; Form one first encapsulating material coating circuit assembly; Form at least a portion that a top electromagnetic interference shielding film covers first encapsulating material; Form one second encapsulating material and cover top electromagnetic interference shielding film; Form a perforate and run through first encapsulating material and second encapsulating material, to expose electrical contact; Form a conductive component in perforate, wherein conductive component is electrically connected at electrical contact; The position of corresponding grounding parts, cutting substrate, first encapsulating material, second encapsulating material and top electromagnetic interference shielding film make substrate be cut into a base board unit, first encapsulating material and are cut into one first encapsulation unit, second encapsulating material and are cut into one second encapsulation unit and make grounding parts and top electromagnetic interference shielding film exposes; Form an antenna on second encapsulation unit, antenna is electrically connected at conductive component; Form a sidepiece electromagnetic interference shielding film on first encapsulation unit, the grounding parts that exposes and the top electromagnetic interference shielding film that exposes.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Figure 1A illustrates the cutaway view according to the wireless communication module of first embodiment of the invention.
Figure 1B illustrates the top view of Figure 1A.
Fig. 2 illustrates the manufacture method flow chart according to the wireless communication module of first embodiment of the invention.
Fig. 3 A to 3H illustrates the manufacturing schematic diagram of the wireless communication module of Figure 1A.
Fig. 4 illustrates the cutaway view according to the wireless communication module of second embodiment of the invention.
Fig. 5 illustrates the bottom view of Fig. 4.
Fig. 6 illustrates the partial sectional view according to the wireless communication module of another embodiment of the present invention.
Fig. 7 illustrates the manufacture method flow chart according to the wireless communication module of second embodiment of the invention.
Fig. 8 A to 8F illustrates the manufacturing schematic diagram of the wireless communication module of Fig. 4.
The primary clustering symbol description:
100,200: wireless communication module
102a, 102b, 102c: circuit unit
104,204: the first encapsulation units
106,206: the electromagnetic interference shielding film
106a, 206a: top electromagnetic interference shielding film
106b, 206b: sidepiece electromagnetic interference shielding film
108,208: the second encapsulation units
110,210: antenna
112,212: conductive component
114: ground contact
116,216: electrical contact
118,218,318: base board unit
120, sub-perforate in 220: the first
122, sub-perforate in 222: the second
124, perforate in 224: the three
126: protuberance
128,228: the first upper surfaces
130,230: the second upper surfaces
130a, 230a: a part
132,232: the second sides
134,234: the three upper surfaces
136,236: the three sides
138,238,338: the first sides
140,240: substrate
142,242: the first encapsulating materials
144,244: the second encapsulating materials
146,246: perforate
148,248: the first bottom surfaces
214,314: grounding parts
214a: top end face
214b: bottom face
252,352: the grounding parts side
256: support plate
258: the four sides
260: the second bottom surfaces
C: indenture
H: highly
R: unit module district
Embodiment
First embodiment
Please refer to Figure 1A and 1B, Figure 1A illustrates the cutaway view according to the wireless communication module of first embodiment of the invention, and Figure 1B illustrates the top view of Figure 1A.Shown in Figure 1A, wireless communication module 100 comprises base board unit 118, several circuit units 102a, 102b and 102c, first encapsulation unit 104, electromagnetic interference shielding film 106, second encapsulation unit 108, antenna 110 and conductive component 112.
Antenna 110, circuit unit 102a, 102b and 102c all are integrated in the wireless communication module 100, can save many manufacturing costs.Because wireless communication module 100 comprises antenna 110 and control module (being circuit unit 102a, 102b or 102c) thereof, so after wireless communication module 100 is installed in circuit board, expression antenna 110 and control module thereof also installing are simultaneously finished, and can save and install man-hour, installing cost.Moreover antenna 110 and circuit unit 102a are positioned at the position of different vertical height, can save the area of first upper surface 128 of base board unit 118, and the length and width size of whole wireless communication module 100 is dwindled.
But since antenna 110, electromagnetic interference shielding film 106 and conductive component 112 application examples in this way plating mode form the very thin structure of thickness, therefore can reduce the thickness of wireless communication module 100.
Below further specify the detail structure of wireless communication module 100.
Base board unit 118 can be a multilayer structure substrate, and its sandwich construction distinctly has patterned circuit (not illustrating), can electrically connect by those patterned circuit between the sandwich construction.Base board unit 118 has a grounding parts and electrical contact 116, and this grounding parts comprises ground contact 114 and protuberance 126.
Ground contact 114 is positioned on first upper surface 128 of base board unit 118, and it can be the part of the patterned circuit of base board unit 118.The thickness of ground contact 114 between about 12 microns (μ m) between the 18 μ m or between other number range.In addition, ground contact 114 is electrically connected at ground connection (grounding) circuit of base board unit 118.In an enforcement aspect, ground contact 114 can be connection pad (pad).
Protuberance 126 for example is a tin welding spot, and it covers ground contact 114 and is electrically connected at ground contact 114.
Electrical contact 116 for example is connection pad (pad) or the electrical areas that is defined in base board unit 118, and it can be used as the signal load point (feed point) of antenna 110.The electrical contact 116 of present embodiment is the example explanation with the connection pad.
Circuit unit 102a can be semiconductor subassembly (semiconductor element), for example is to cover crystalline substance (flipchip). Circuit unit 102b and 102c for example are passive component or semiconductor subassembly.Circuit unit 102a, 102b and 102c are located on the base board unit 118 and at least one can be electrically connected at electrical contact 116 by the conductive structure (not illustrating) of base board unit 118 among circuit unit 102a, 102b and the 102c.
Antenna 110 is electrically connected at electrical contact 116 by conductive component 112, with transmission signal in circuit unit 102a, 102b and the 102c at least one and be subjected to the control of circuit unit 102a, 102b or 102c.Shown in Figure 1B, the profile curved profile of antenna 110 for example is the S type.So this is non-in order to restriction the present invention, and in other enforcement aspect, antenna 110 can be other profile.
In addition, first encapsulation unit 104 is formed on first upper surface 128 of base board unit 118 and coating circuit assembly 102a, 102b and 102c.Second encapsulation unit 108 covers whole electromagnetic interference shielding film 106.Owing to second encapsulation unit 108 covers whole electromagnetic interference shielding film 106 electromagnetic interference shielding film 106 is protected; so the material of electromagnetic interference shielding film 106 can comprise cheap conductive material, for example is the more weak conductive material of copper, aluminium or corrosion resistance.
First encapsulation unit 104 and second encapsulation unit 108 define the first sub-perforate 120 and the second sub-perforate 122 respectively.The position of the first sub-perforate 120 and the second sub-perforate 122 overlaps exposing electrical contact 116, and conductive component 112 is formed in the first sub-perforate 120 and in the second sub-perforate 122 and be contacted with electrical contact 116, to be electrically connected at electrical contact 116.
Electromagnetic interference shielding film 106 covers the outer surface of first encapsulation unit 104 and comprises top electromagnetic interference shielding film 106a and sidepiece electromagnetic interference shielding film 106b.Top electromagnetic interference shielding film 106a covers second upper surface 130 of second encapsulation unit 108.Sidepiece electromagnetic interference shielding film 106b covers second side 132 of second encapsulation unit 108 and is contacted with protuberance 126 to be electrically connected at ground contact 114.Electromagnetic interference shielding film 106 can be discharged to earth terminal with the electromagnetic interference that is subjected to, and avoids electromagnetic interference infringement circuit unit 102a, 102b and 102c.
Antenna 110 is formed on the 3rd upper surface 134 of second encapsulation unit 108, and the bearing of trend of antenna 110 is parallel to the bearing of trend of top electromagnetic interference shielding film 106a haply.When antenna 110 plate aerials (patch antenna), top electromagnetic interference shielding film 106a can be used as the ground structure of plate aerial.
In addition, second encapsulation unit 108 has the 3rd side 136, and base board unit 118 has first side 138.First side 138 and the 3rd side 136 trim haply, i.e. first side 138 and the 3rd side 136 copline haply.
Below with the manufacture method of the wireless communication module 100 of Fig. 2 and Fig. 3 A to 3H explanation Figure 1A.Fig. 2 illustrates the manufacture method flow chart according to the wireless communication module of first embodiment of the invention, and Fig. 3 A to 3H illustrates the manufacturing schematic diagram of the wireless communication module of Figure 1A.
In step S102, substrate 140 as shown in Figure 3A is provided, for example be the strip substrate.Substrate 140 has several ground contact 114 (being illustrated in Figure 1A) and several grounding parts.Grounding parts comprises electrical contact 116 and protuberance 126.Substrate 140 definition several unit module districts R, those ground contacts 114, those electrical contacts 116 and those protuberances 126 are positioned at the scope of those unit module districts R accordingly, and the formed structure of subsequent step is formed in the scope of corresponding unit module district R.Thus, in follow-up cutting step, carry out cutting action, can cut out several wireless communication modules 100 along the scope of unit module district R.Say that further the manufacture method of the wireless communication module of present embodiment can once be made several wireless communication modules, significantly promotes output.
Then, in step S104, provide as shown in Figure 3A several circuit units 102a, 102b and 102c.
Then, in step S106, as shown in Figure 3A, for example being that (Surface Mounting Technology SMT) is provided with circuit unit 102a, 102b and 102c on first upper surface 128 of substrate 140 to surface mount technology.
Then, in step S108, shown in Fig. 3 B, form first encapsulating material 142 and coat those circuit units 102a, 102b, 102c and protuberance 126.
First encapsulating material, 142 sealing materials (molding compound), it can comprise phenolic group resin (Novolac-based resin), epoxy (epoxy-based resin), silicone (silicone-based resin) or other suitable covering.First encapsulating material 142 also can comprise suitable filler, for example is the silicon dioxide of powdery.Any that can utilize several encapsulation technologies forms first encapsulating material 142.Above-mentioned encapsulation technology for example is compression forming (compression molding), injection moulding (injection molding) or metaideophone moulding (transfer molding).
In other embodiment, first encapsulating material 142 can be dielectric material, for example is photoresist.Can use coating technique, form first encapsulating material 142 and coat those circuit units 102a, 102b, 102c and protuberance 126.Above-mentioned coating technique for example is printing (printing), spin coating (spinning) or spraying (spraying).
Behind step S108, can make 142 sclerosis of first encapsulating material to 142 heating of first encapsulating material.
Then, in step S110, shown in Fig. 3 C, the position of corresponding ground contact 114, application examples is the cutter cutting mode in this way, from second upper surface, 130 cuttings, first encapsulating material 142 of first encapsulating material 142, to form several first encapsulation units 104.After the cutting, second side 132 of first encapsulation unit 104 and at least a portion of protuberance 126 are exposed.3C to 3H figure only shows single first encapsulation unit 104.The cutting mode of present embodiment is partly worn (half-cut) mode of cutting.
Because the design of the height H (being illustrated in Figure 1A) of protuberance 126 avoids cutting tool to cut off ground contact 114, that is, the formation of protuberance 126 can avoid ground contact 114 to be separated into two parts.Cutting tool is through protuberance 126 and cut out indenture C on protuberance 126.The profile of indenture C is V-shape, and so this is non-in order to limit the present invention, and the profile of indenture C is decided on cutting tool or cutting mode.
Then, in step S112, shown in Fig. 3 D, form electromagnetic interference shielding film 106 and cover first encapsulation unit 104.Wherein, the mode of formation electromagnetic interference shielding film for example has plating, coating, sputter (sputter) technology.
Electromagnetic interference shielding film 106 comprises top electromagnetic interference shielding film 106a and sidepiece electromagnetic interference shielding film 106b.Top electromagnetic interference shielding film 106a covers second upper surface 130 of first encapsulation unit 104 and has the 3rd perforate 124, a part of 130a of second upper surface 130 of first encapsulation unit 104 is exposed in the 3rd perforate 124, and the position of this part 130a is corresponding to electrical contact 116.Sidepiece electromagnetic interference shielding film 106b covers second side 132 of first encapsulation unit 104 and contacts protuberance 126, to be electrically connected at protuberance 126.
Because indenture C increases the area that protuberance 126 exposes, and makes sidepiece electromagnetic interference shielding film 106b and protuberance 126 contacts area bigger, can promote associativity and electrical quality between sidepiece electromagnetic interference shielding film 106b and the protuberance 126.
Though the 3rd perforate 124 forms in step S112, so this is non-in order to restriction the present invention.In an enforcement aspect, electromagnetic interference shielding film 106 can cover first encapsulation unit 104 fully and not form the 3rd perforate 124 among the step S112; In subsequent step S116, perforate 146 more runs through electromagnetic interference shielding film 106 except running through second encapsulating material 144 and first encapsulation unit 104, can expose electrical contact 116 so equally then.
Then, in step S114, shown in 3E figure, form second encapsulating material 144 with above-mentioned coating technique and cover whole electromagnetic interference shielding film 106, can protect whole electromagnetic interference shielding film 106, so this is non-in order to restriction the present invention.In an enforcement aspect, second encapsulating material 144 also can only cover the part of electromagnetic interference shielding film 106.Wherein, the material of second encapsulating material 144 and formation method do not repeat them here similar in appearance to first encapsulating material 142.
Then, in step S116, shown in 3F figure, the position of this part 130a (part 130a is illustrated in Fig. 3 D) of corresponding second upper surface 130 is used laser processing technology and is formed several (3F figure only shows single) perforates 146.
Perforate 146 runs through first encapsulation unit 104 and second encapsulating material 144, to expose electrical contact 116.Specifically, perforate 146 comprises that the first sub-perforate 120 and second sub-perforate 122, the first sub-perforates 120 run through first encapsulation unit 104, and the second sub-perforate 122 runs through second encapsulating material 144.The first sub-perforate 120 overlaps and communicates with the second sub-perforate 122, and electrical contact 116 exposes from the first sub-perforate 120 and the second sub-perforate 122.
Then, in step S118, shown in 3G figure, form conductive component 112 in the perforate 146 of correspondence with plating, coating or encapsulating technology.Wherein, conductive component 112 cylinders, its material metal material for example is the metal material that comprises copper.
Then, in step S120, shown in 3H figure, for example being that plating, coating or sputter technology form antenna 110 on the 3rd upper surface 134 of second encapsulating material 144 of correspondence.Antenna 110 contact conductive components 112 are to be electrically connected at electrical contact 116.
Then, in step S122, along the scope of unit module district R (as shown in Figure 3A), the direction cutting substrate 140 and second encapsulating material 144 of first bottom surface 148 of past substrate 140 (first bottom surface 148 is illustrated in 3H figure) are to form several wireless communication modules 100 shown in Figure 1A.Wherein, second encapsulating material 144 is cut into several second encapsulation units 108, and substrate 140 is cut into several base board units 118.
In addition, in an enforcement aspect, also can cut second encapsulating material 144 and substrate 140, can form the wireless communication module 100 shown in Figure 1A equally toward the direction of the 3rd upper surface 134 of second encapsulating material 144.
Because the cutting path of step S122 the substrate 140 and second encapsulating material 144 through overlapping, thus the 3rd side 136 of first side 138 of base board unit 118 and second encapsulation unit 108 trim haply, shown in Figure 1A.
Second embodiment
Please refer to Fig. 4, it illustrates the cutaway view according to the wireless communication module of second embodiment of the invention.Continue to use same numeral with the first embodiment something in common among second embodiment, do not repeat them here.Wireless communication module 100 differences of the wireless communication module 200 of second embodiment and first embodiment are that the grounding parts 214 of wireless communication module 200 is located at base board unit 218 inside.
Wireless communication module 200 comprises base board unit 218, several circuit units 102a, 102b and 102c, first encapsulation unit 204, electromagnetic interference shielding film 206, second encapsulation unit 208, antenna 210 and conductive component 212.
Base board unit 218 for example is a multilayer structure substrate.Base board unit 218 has grounding parts 214 and electrical contact 216.Grounding parts 214 is located at base board unit 218 inside, and electrical contact 216 can be used as the signal load point of antenna 210.
Grounding parts 214 is located at the inside of base board unit 218.First upper surface 228 that the top end face 214a of grounding parts 214 is not subjected to base board unit 218 covers and exposes.Please be simultaneously with reference to Fig. 5, it illustrates the bottom view of Fig. 4.First bottom surface 248 that the bottom face 214b of grounding parts 214 is not subjected to base board unit 218 is covered and is exposed, and does not cover and exposes and the grounding parts side 252 of grounding parts 214 is subjected to first side 238 of base board unit 218.In the present embodiment, grounding parts 214 conducting perforations (conductive via), its first upper surface 228 from base board unit 218 is through to first bottom surface 248, and so this is non-in order to restriction the present invention.In an enforcement aspect, please refer to Fig. 6, it illustrates the partial sectional view according to the wireless communication module of another embodiment of the present invention.Grounding parts 314 is embedded in the base board unit 318, and it does not run through base board unit 318 and only exposes grounding parts side 352 from first side 338 of base board unit 318.
Please get back to Fig. 4, sidepiece electromagnetic interference shielding film 206b has second bottom surface 260, and wherein first bottom surface 248 of base board unit 218 and second bottom surface 260 trim haply.
Below with the manufacture method of the wireless communication module of Fig. 7 and Fig. 8 A to 8F key diagram 4.Fig. 7 illustrates the manufacture method flow chart according to the wireless communication module of second embodiment of the invention, and Fig. 8 A to 8F illustrates the manufacturing schematic diagram of the wireless communication module of Fig. 4.Step S202 to S208 no longer repeats to give unnecessary details at this similar in appearance to step S102 to S108.Begin explanation from step S210 down.
Then, in step S210, shown in Fig. 8 A, form second upper surface 230 that top electromagnetic interference shielding film 254 covers first encapsulating material 242 with plating, coating or sputter technology.242 several (Fig. 8 A only shows single) the 3rd perforates 224 of definition of first encapsulating material, it exposes a part of 230a of second upper surface 230 of first encapsulating material 242, and the position of this part 230a is corresponding to electrical contact 216.
Then, in step S212, shown in Fig. 8 B, form second encapsulating material 244 with coating technique and cover on the electromagnetic interference shielding film 206a of top.
Then, in step S214, shown in Fig. 8 C,, form perforate 246 and run through corresponding first encapsulating material 242 and the second corresponding encapsulating material 244, to expose corresponding electrical contact 216 accordingly corresponding to the position of this part 230a of second upper surface 230.
After perforate 246 runs through first encapsulating material 242 and second encapsulating material 244, the first sub-perforate 220 of perforate 246 is formed at first encapsulating material 242 and the second sub-perforate 222 of perforate 246 is formed at 244, the first sub-perforates 220 of second encapsulating material and electrical contact 216 is all exposed in the second sub-perforate 222.
Then, in step S216, shown in Fig. 8 D, form conductive component 212 in the perforate 246 of correspondence.Conductive component 212 is electrically connected at corresponding electrical contact 216.
Then, in step S218, shown in Fig. 8 E, the position of corresponding grounding parts 214, cutting substrate 240, first encapsulating material 242, second encapsulating material 244 and top electromagnetic interference shielding film 206a are to form several base board units 218, several first encapsulation units 204 and several second encapsulation units 208.The cutting mode of present embodiment is worn (full-cut) mode of cutting entirely.
Among the cutting step S218, because the position of the corresponding grounding parts 214 of cutting path P, so expose grounding parts side 252 after grounding parts 214 is cut.In addition, substrate 240, first encapsulating material 242, second encapsulating material 244 and the top electromagnetic interference shielding film 206a of cutting path P through overlapping, therefore behind cutting step, first side 238 (first side 238 is illustrated in Fig. 5), first encapsulation unit 204 that base board unit 218 exposes it exposes the 4th side 258 that its second side 232, the 3rd side 236 that second encapsulation unit 208 exposes it and top electromagnetic interference shielding film 206a expose it.Grounding parts side 252, first side 238, second side 232, the 4th side 258 and the 3rd side 236 trim haply, i.e. first side 238, grounding parts side 252, second side 232, the 4th side 258 and the 3rd side 236 copline haply.
Among the cutting step S218, substrate 240 can be fixedly arranged on pasting on the film (not illustrating) of support plate 256, and cutting tool can cut to the film of pasting on support plate 256 tops, wears substrate 240, first encapsulating material 242 and second encapsulating material 244 thoroughly to cut.Because support plate 256 has stickiness, so the base board unit 218 after the cutting still firmly sticks on the support plate 256.In addition, substrate 240 can attach on the support plate 256 in step S202.
Then, in step S220, shown in Fig. 8 F, form antenna 210 on the 3rd upper surface 234 of second encapsulation unit 208, and form sidepiece electromagnetic interference shielding film 206b on the 4th side 258 of second side 232 of the grounding parts side 252 of first side 238 of base board unit 218 (first side 238 is illustrated in Fig. 5), grounding parts 214, first encapsulation unit 204 and top electromagnetic interference shielding film 206a.Wherein, antenna 210 is electrically connected at electrical contact 216 by conductive component 212, and EMI sidepiece protecting film 206b is connected in top electromagnetic interference shielding film 206a.
In an enforcement aspect, antenna 210 can form in identical or different mode respectively at different step with sidepiece electromagnetic interference shielding film 206b.
In an enforcement aspect, sidepiece electromagnetic interference shielding film 206b can more be formed on the 3rd side 236 of second encapsulation unit 208.
Then, in step S222, remove support plate 256.So far, formation wireless communication module 200 as shown in Figure 4.
Above-mentioned enforcement wireless communication module of the present invention and manufacture method thereof have multinomial feature, and it is as follows to enumerate the part feature description:
(1). with semiconductor technology method, antenna, circuit unit are integrated in the wireless communication module, can save many manufacturing costs.
(2). wireless communication module comprises antenna and control module thereof.After wireless communication module was installed in circuit board, antenna and control module thereof also installing were simultaneously finished, and can save and install man-hour, installing cost.
(3). antenna and circuit unit are positioned at the position of different vertical height, can save the area of base board unit, dwindle the length and width size of wireless communication module.
(4). form the very thin structure of thickness because antenna, electromagnetic interference shielding film and conductive component can be used plating mode, therefore can dwindle the thickness of wireless communication module.
(5). second encapsulating material can cover whole electromagnetic interference shielding film, to protect whole electromagnetic interference shielding film.So the material of electromagnetic interference shielding film can comprise cheap metal, for example is the more weak metal of copper, aluminium or corrosion resistance.
In sum, though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.

Claims (19)

1.一种无线通信模块，包括：1. A wireless communication module, comprising: 一基板单元，具有一接地部及一电性接点；A substrate unit having a grounding portion and an electrical contact; 一电路组件，设于该基板单元上；a circuit component disposed on the substrate unit; 一第一封装单元，包覆该电路组件并露出该电性接点；a first packaging unit, covering the circuit assembly and exposing the electrical contact; 一电磁干扰防护膜，覆盖该第一封装单元并电性连接于该接地部；an electromagnetic interference protection film covering the first packaging unit and electrically connected to the grounding portion; 一第二封装单元，覆盖该电磁干扰防护膜的至少一部分且露出该电性接点；A second packaging unit, covering at least a part of the electromagnetic interference protection film and exposing the electrical contact; 一天线，形成于该第二封装单元上；以及an antenna formed on the second package unit; and 一导电组件，通过该第一封装单元及该第二封装单元电性连接该电性接点与该天线。A conductive component is electrically connected to the electrical contact and the antenna through the first packaging unit and the second packaging unit. 2.如权利要求1所述的无线通信模块，其中该基板单元具有一第一上表面，该接地部位于该第一上表面，该第一封装单元具有一第二侧面及一第二上表面，该电磁干扰防护膜包括一上部电磁干扰防护膜及一侧部电磁干扰防护膜，该上部电磁干扰防护膜覆盖该第二上表面，而该侧部电磁干扰防护膜覆盖该第二侧面并电性连接于该接地部。2. The wireless communication module according to claim 1, wherein the substrate unit has a first upper surface, the ground portion is located on the first upper surface, and the first packaging unit has a second side surface and a second upper surface The electromagnetic interference protection film includes an upper electromagnetic interference protection film and a side electromagnetic interference protection film, the upper electromagnetic interference protection film covers the second upper surface, and the side electromagnetic interference protection film covers the second side and electrically connected to this ground. 3.如权利要求1所述的无线通信模块，其中该第二封装单元具有一第三上表面，该天线形成于该第三上表面上。3. The wireless communication module as claimed in claim 1, wherein the second packaging unit has a third upper surface, and the antenna is formed on the third upper surface. 4.如权利要求2所述的无线通信模块，其中该基板单元具有一第一侧面，该第二封装单元覆盖该上部电磁干扰防护膜及该侧部电磁干扰防护膜并具有一第三侧面，该基板单元的该第一侧面与该第三侧面切齐。4. The wireless communication module as claimed in claim 2, wherein the substrate unit has a first side, the second packaging unit covers the upper EMI protection film and the side EMI protection film and has a third side, The first side of the substrate unit is flush with the third side. 5.如权利要求2所述的无线通信模块，其中该接地部包括：5. The wireless communication module as claimed in claim 2, wherein the grounding part comprises: 一接地接点；以及a ground contact; and 一突出部，形成于该接地接点上并具有一凹痕；a protruding part is formed on the ground contact and has a notch; 其中，该侧部电磁干扰防护膜电性连接于该突出部。Wherein, the side electromagnetic interference protection film is electrically connected to the protrusion. 6.如权利要求1所述的无线通信模块，其中该第一封装单元定义一第一子开孔，该第二封装单元定义一第二子开孔，该电性接点从该第一子开孔及该第二子开孔露出，该导电组件形成于该第一子开孔及该第二子开孔内。6. The wireless communication module according to claim 1, wherein the first packaging unit defines a first sub-opening, the second packaging unit defines a second sub-opening, and the electrical contact is connected from the first sub-opening The hole and the second sub-opening are exposed, and the conductive component is formed in the first sub-opening and the second sub-opening. 7.如权利要求1所述的无线通信模块，其中该基板单元具有一第一侧面，该第一封装单元更具有一第二侧面及一第二上表面，该接地部形成于该基板单元的内部；7. The wireless communication module as claimed in claim 1, wherein the substrate unit has a first side, the first packaging unit further has a second side and a second upper surface, and the grounding portion is formed on the substrate unit internal; 其中，该电磁干扰防护膜包括一上部电磁干扰防护膜及一侧部电磁干扰防护膜，该上部电磁干扰防护膜覆盖该第二上表面，该侧部电磁干扰防护膜覆盖该接地部、该第一侧面及该第二侧面。Wherein, the electromagnetic interference protective film includes an upper electromagnetic interference protective film and a side electromagnetic interference protective film, the upper electromagnetic interference protective film covers the second upper surface, and the side electromagnetic interference protective film covers the grounding part, the second a side and the second side. 8.如权利要求7所述的无线通信模块，其中该接地部具有一接地部侧面，该侧部电磁干扰防护膜覆盖该接地部侧面，该接地部侧面与该第一侧面切齐。8 . The wireless communication module as claimed in claim 7 , wherein the ground portion has a side surface of the ground portion, the side electromagnetic interference protection film covers the side surface of the ground portion, and the side surface of the ground portion is aligned with the first side surface. 9.如权利要求7所述的无线通信模块，其中该第二封装单元具有一第三侧面，该侧部电磁干扰防护膜具有一第四侧面，该第四侧面与该第三侧面切齐。9. The wireless communication module as claimed in claim 7, wherein the second packaging unit has a third side, the side electromagnetic interference protection film has a fourth side, and the fourth side is aligned with the third side. 10.如权利要求7所述的无线通信模块，其中该基板单元更具有一第一底面，该侧部电磁干扰防护膜更具有一第二底面，该第一底面与该第二底面切齐。10. The wireless communication module as claimed in claim 7, wherein the substrate unit further has a first bottom surface, the side electromagnetic interference protection film further has a second bottom surface, and the first bottom surface is aligned with the second bottom surface. 11.一种无线通信模块的制造方法，包括：11. A method of manufacturing a wireless communication module, comprising: 提供一基板，该基板具有一接地部及一电性接点；providing a substrate, the substrate has a ground portion and an electrical contact; 提供一电路组件；providing a circuit assembly; 设置该电路组件于该基板上；disposing the circuit component on the substrate; 形成一第一封装材料包覆该电路组件；forming a first packaging material to cover the circuit assembly; 对应该接地部的位置，切割该第一封装材料，使该第一封装材料形成一第一封装单元并使该接地部露出；corresponding to the position of the grounding portion, cutting the first packaging material so that the first packaging material forms a first packaging unit and exposing the grounding portion; 形成一电磁干扰防护膜覆盖该第一封装单元，其中该电磁干扰防护膜电性连接于该接地部；forming an electromagnetic interference protection film to cover the first packaging unit, wherein the electromagnetic interference protection film is electrically connected to the ground portion; 形成一第二封装材料覆盖该电磁干扰防护膜的至少一部分；forming a second packaging material covering at least a portion of the electromagnetic interference protection film; 形成一开孔贯穿该第一封装单元及该第二封装材料；forming an opening through the first packaging unit and the second packaging material; 形成一导电组件于该开孔内，其中该导电组件电性连接于该电性接点；forming a conductive component in the opening, wherein the conductive component is electrically connected to the electrical contact; 形成一天线于该第二封装材料上，该天线电性连接于该导电组件；以及forming an antenna on the second packaging material, the antenna is electrically connected to the conductive component; and 切割该基板及该第二封装材料。cutting the substrate and the second packaging material. 12.如权利要求11所述的制造方法，其中该基板具有一第一上表面，该接地部位于该第一上表面，该第一封装材料具有一第二上表面，于切割该第一封装材料的该步骤中更包括：12. The manufacturing method according to claim 11, wherein the substrate has a first upper surface, the ground portion is located on the first upper surface, the first packaging material has a second upper surface, and the first package is cut Materials included in this step include: 从该第二上表面切割该第一封装材料，以露出该第一封装单元的一第二侧面；cutting the first packaging material from the second upper surface to expose a second side surface of the first packaging unit; 其中，于形成该电磁干扰防护膜的该步骤中，该电磁干扰防护膜包括一上部电磁干扰防护膜及一侧部电磁干扰防护膜，该上部电磁干扰防护膜覆盖该第二上表面，而该侧部电磁干扰防护膜覆盖该第一封装单元的该第二侧面并电性连接于该接地部。Wherein, in the step of forming the electromagnetic interference protective film, the electromagnetic interference protective film includes an upper electromagnetic interference protective film and a side electromagnetic interference protective film, the upper electromagnetic interference protective film covers the second upper surface, and the The side electromagnetic interference protection film covers the second side surface of the first packaging unit and is electrically connected to the ground portion. 13.如权利要求11所述的制造方法，其中于切割该基板及该第二封装材料的该步骤中，该第二封装材料被切割成一第二封装单元，该第二封装单元具有一第三上表面，于形成该天线的该步骤中，该天线形成于该第二封装单元的该第三上表面上。13. The manufacturing method according to claim 11, wherein in the step of cutting the substrate and the second packaging material, the second packaging material is cut into a second packaging unit, the second packaging unit has a third On the upper surface, in the step of forming the antenna, the antenna is formed on the third upper surface of the second packaging unit. 14.如权利要求12所述的制造方法，其中于形成该第二封装材料的该步骤中，该第二封装材料覆盖该上部电磁干扰防护膜及该侧部电磁干扰防护膜，于切割该基板及该第二封装材料的该步骤中，该第二封装材料被切割成一第二封装单元且该基板被切割成一基板单元，该第二封装单元具有一第三侧面，该基板单元具有一第一侧面，该基板单元的该第一侧面与该第二封装单元的该第三侧面切齐。14. The manufacturing method according to claim 12, wherein in the step of forming the second encapsulation material, the second encapsulation material covers the upper EMI protection film and the side EMI protection film, and when cutting the substrate and the step of the second packaging material, the second packaging material is cut into a second packaging unit and the substrate is cut into a substrate unit, the second packaging unit has a third side, the substrate unit has a first side, the first side of the substrate unit is aligned with the third side of the second packaging unit. 15.如权利要求11所述的制造方法，其中于形成该电磁干扰防护膜的该步骤中，该电磁干扰防护膜露出该电性接点；15. The manufacturing method according to claim 11, wherein in the step of forming the EMI protection film, the EMI protection film exposes the electrical contact; 于形成该开孔的该步骤更包括：The step of forming the opening further includes: 形成一第一子开孔于该第一封装单元上；forming a first sub-opening on the first packaging unit; 形成一第二子开孔于该第二封装材料上，该电性接点从该第一子开孔及该第二子开孔露出；以及forming a second sub-opening on the second packaging material, the electrical contacts are exposed from the first sub-opening and the second sub-opening; and 于形成该导电组件的该步骤中，该导电组件形成于该第一子开孔及该第二子开孔内。In the step of forming the conductive element, the conductive element is formed in the first sub-opening and the second sub-opening. 16.一种无线通信模块的制造方法，包括：16. A method of manufacturing a wireless communication module, comprising: 提供一基板，该基板具有一接地部及一电性接点；providing a substrate, the substrate has a ground portion and an electrical contact; 提供一电路组件；providing a circuit assembly; 设置该电路组件于该基板上；disposing the circuit component on the substrate; 形成一第一封装材料包覆该电路组件；forming a first packaging material to cover the circuit assembly; 形成一上部电磁干扰防护膜覆盖该第一封装材料的至少一部分；forming an upper EMI shielding film covering at least a portion of the first packaging material; 形成一第二封装材料覆盖该上部电磁干扰防护膜；forming a second encapsulation material to cover the upper electromagnetic interference protection film; 形成一开孔贯穿该第一封装材料及该第二封装材料，以露出该电性接点；forming an opening through the first packaging material and the second packaging material to expose the electrical contact; 形成一导电组件于该开孔内，其中该导电组件电性连接于该电性接点；forming a conductive component in the opening, wherein the conductive component is electrically connected to the electrical contact; 对应该接地部的位置，切割该基板、该第一封装材料、该第二封装材料及该上部电磁干扰防护膜，使该基板被切割成一基板单元、该第一封装材料被切割成一第一封装单元、该第二封装材料被切割成一第二封装单元并使该接地部及该上部电磁干扰防护膜露出；Corresponding to the position of the grounding part, cutting the substrate, the first packaging material, the second packaging material and the upper electromagnetic interference protection film, so that the substrate is cut into a substrate unit, and the first packaging material is cut into a first package The unit and the second packaging material are cut into a second packaging unit and the grounding part and the upper electromagnetic interference protection film are exposed; 形成一天线于该第二封装单元上，该天线电性连接于该导电组件；forming an antenna on the second packaging unit, the antenna is electrically connected to the conductive component; 形成一侧部电磁干扰防护膜于该第一封装单元、该基板单元、露出的该接地部及露出的该上部电磁干扰防护膜上。A side electromagnetic interference protection film is formed on the first packaging unit, the substrate unit, the exposed ground portion and the exposed upper electromagnetic interference protection film. 17.如权利要求16所述的制造方法，其中于提供该基板的该步骤中，该接地部形成于该基板的内部；17. The manufacturing method according to claim 16, wherein in the step of providing the substrate, the ground portion is formed inside the substrate; 于切割该基板、该第一封装材料、该第二封装材料及该上部电磁干扰防护膜的该步骤中，该基板单元具有一第一侧面及该第一封装单元具有一第二侧面，该第一侧面及该第二侧面露出；In the step of cutting the substrate, the first encapsulation material, the second encapsulation material and the upper EMI protection film, the substrate unit has a first side and the first encapsulation unit has a second side, the first one side and the second side are exposed; 于形成该侧部防护膜防护膜的该步骤中，该侧部防护膜防护膜覆盖该接地部、该第一侧面及该第二侧面。In the step of forming the side pellicle film, the side pellicle film covers the ground portion, the first side surface, and the second side surface. 18.如权利要求16所述的制造方法，其中于切割该基板、该第一封装材料、该第二封装材料及该上部防护膜防护膜的该步骤中，该基板单元具有一第一侧面、该第一封装单元具有一第二侧面、该第二封装单元具有一第三侧面及该上部电磁干扰防护膜具有一第四侧面，该第一侧面、该第二侧面、该第三侧面及该第四侧面露出；18. The manufacturing method according to claim 16, wherein in the step of cutting the substrate, the first packaging material, the second packaging material, and the upper pellicle pellicle, the substrate unit has a first side, The first packaging unit has a second side, the second packaging unit has a third side and the upper electromagnetic interference protection film has a fourth side, the first side, the second side, the third side and the The fourth side is exposed; 其中，该接地部具有一接地部侧面，该接地部侧面、该第一侧面、该第二侧面、该第三侧面及该第四侧面切齐。Wherein, the grounding part has a side of the grounding part, and the side of the grounding part, the first side, the second side, the third side and the fourth side are aligned. 19.如权利要求16所述的制造方法，其中于切割该基板、该第一封装材料及该第二封装材料及该上部电磁干扰防护膜的该步骤中，该基板单元具有一第一底面，于形成该侧部电磁干扰防护膜的该步骤之后，该侧部电磁干扰防护膜具有一第二底面，其中该第一底面与该第二底面切齐。19. The manufacturing method according to claim 16, wherein in the step of cutting the substrate, the first packaging material, the second packaging material and the upper electromagnetic interference protection film, the substrate unit has a first bottom surface, After the step of forming the side EMI protection film, the side EMI protection film has a second bottom surface, wherein the first bottom surface is aligned with the second bottom surface.
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Cited By (6)

* Cited by examiner, † Cited by third party
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CN102769005A (en) * 2012-06-28 2012-11-07 日月光半导体制造股份有限公司 Semiconductor package structure and manufacturing method thereof
CN103000617A (en) * 2011-09-09 2013-03-27 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof
CN103022014A (en) * 2012-11-06 2013-04-03 日月光半导体制造股份有限公司 Packaging module structure with antenna and manufacturing method thereof
CN103152068A (en) * 2013-02-04 2013-06-12 日月光半导体制造股份有限公司 Communication device with wireless module packaging structure and manufacturing method thereof
CN109755225A (en) * 2017-11-03 2019-05-14 三星电机株式会社 Anneta module
US11664580B2 (en) 2013-03-04 2023-05-30 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna substrate and manufacturing method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000617A (en) * 2011-09-09 2013-03-27 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof
CN103000617B (en) * 2011-09-09 2015-12-09 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof
CN102769005A (en) * 2012-06-28 2012-11-07 日月光半导体制造股份有限公司 Semiconductor package structure and manufacturing method thereof
CN103022014A (en) * 2012-11-06 2013-04-03 日月光半导体制造股份有限公司 Packaging module structure with antenna and manufacturing method thereof
CN103152068A (en) * 2013-02-04 2013-06-12 日月光半导体制造股份有限公司 Communication device with wireless module packaging structure and manufacturing method thereof
US11664580B2 (en) 2013-03-04 2023-05-30 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna substrate and manufacturing method thereof
CN109755225A (en) * 2017-11-03 2019-05-14 三星电机株式会社 Anneta module
CN109755225B (en) * 2017-11-03 2023-08-11 三星电子株式会社 Antenna module

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