CN102042571B - Conductive cladding structure for lighting devices - Google Patents
Conductive cladding structure for lighting devices Download PDFInfo
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- CN102042571B CN102042571B CN2009102053178A CN200910205317A CN102042571B CN 102042571 B CN102042571 B CN 102042571B CN 2009102053178 A CN2009102053178 A CN 2009102053178A CN 200910205317 A CN200910205317 A CN 200910205317A CN 102042571 B CN102042571 B CN 102042571B
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- light
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- electrical connector
- transmitting body
- conductive circuit
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- 238000005253 cladding Methods 0.000 title 1
- 239000002184 metal Substances 0.000 claims abstract 10
- 229910052751 metal Inorganic materials 0.000 claims abstract 10
- 239000011248 coating agent Substances 0.000 claims abstract 4
- 238000000576 coating method Methods 0.000 claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
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Abstract
Description
技术领域 technical field
本发明有关一种导电包覆结构,尤其是指一种照明装置的导电包覆结构。The present invention relates to a conductive coating structure, in particular to a conductive coating structure of an illuminating device.
背景技术 Background technique
发光组件中的发光二极管(LED)因为具有良好的亮度、较长的寿命及省电等诸多优点,已被大量且广泛地应用在室内或户外的照明装置上,而决定这些照明装置的优胜劣败,总是跳脱不开电气组件受温度、湿度及氧化等影响而损坏的各种因素;因此,本发明人以此作为研究课题,并进行如本申请的创新设计。Light-emitting diodes (LEDs) in light-emitting components have been widely and widely used in indoor or outdoor lighting devices because of their good brightness, long life and power saving, which determines the advantages and disadvantages of these lighting devices Failure, always can not escape the various factors that electrical components are damaged by the influence of temperature, humidity, oxidation, etc.;
公知的照明装置,主要包括灯罩、发光模块及透光镜,其中透光镜固定在灯罩的一侧,并在透光镜与灯罩之间形成有容置空间,发光模块安装在容置空间内,且其是由连接在灯罩上的电路板及布设在电路板上方的两个或两个以上的LED所构成,这些LED对应于透光镜方向作投射;如此,得以组合成照明装置。The known lighting device mainly includes a lampshade, a light-emitting module and a light-transmitting mirror, wherein the light-transmitting mirror is fixed on one side of the lampshade, and an accommodating space is formed between the light-transmitting mirror and the lampshade, and the light-emitting module is installed in the accommodating space , and it is composed of a circuit board connected to the lampshade and two or more LEDs arranged above the circuit board, and these LEDs are projected in the direction corresponding to the light-transmitting mirror; thus, they can be combined into a lighting device.
然而,这种照明装置在实际使用上仍存在有下述问题:由于其发光模块是安装在容置空间内,此容置空间存在有大量的空气,当导电电路暴露在空气中时,极易与空气中的氧分子结合生成氧化物,而容易产生导电效能不佳的现象,严重的甚至影响到整体照明装置的使用寿命。另外,其是借由各组件间的逐一组合安装而成,不仅要耗费大量的人力成本来进行装配,并且在生产过程中的速度也无法有效地获得提升,进而大幅度地降低其实用性及经济效益。前述存在的问题急待加以改善。However, this lighting device still has the following problems in actual use: since its light-emitting module is installed in the accommodation space, there is a large amount of air in the accommodation space, and when the conductive circuit is exposed to the air, it is very easy to Combined with oxygen molecules in the air to form oxides, it is easy to cause poor conductivity, and even seriously affect the service life of the overall lighting device. In addition, it is formed by combining and installing each component one by one, which not only consumes a lot of labor costs for assembly, but also cannot effectively improve the speed of the production process, thereby greatly reducing its practicability and economic benefits. The aforementioned problems urgently need to be improved.
发明内容 Contents of the invention
本发明的主要目的在于提供一种照明装置的导电包覆结构,其是将导电电路及电连接器密封包覆,能够有效地防止湿气、水气对导电电路所造成的影响,进而延长照明装置的使用寿命。The main purpose of the present invention is to provide a conductive coating structure of a lighting device, which seals and covers the conductive circuit and the electrical connector, which can effectively prevent the influence of moisture and water vapor on the conductive circuit, thereby prolonging the lighting time. The service life of the device.
为了达到上述目的,本发明提供一种照明装置的导电包覆结构,所述照明装置包含金属承座及两个或两个以上的发光组件,该导电包覆结构包括导电电路、电连接器、透光体及灯罩,该导电电路布设于所述金属承座的内表面并供所述发光组件电性连接;该电连接器固定于所述金属承座且电性导接该导电电路;该透光体披覆于该导电电路及该电连接器外部而固化成型;该灯罩披覆于该电连接器及该透光体外部而固化成型。In order to achieve the above object, the present invention provides a conductive coating structure of a lighting device, the lighting device includes a metal socket and two or more light-emitting components, the conductive coating structure includes a conductive circuit, an electrical connector, The light-transmitting body and the lampshade, the conductive circuit is arranged on the inner surface of the metal socket and electrically connected to the light-emitting component; the electrical connector is fixed on the metal socket and electrically connected to the conductive circuit; the The light-transmitting body is coated on the conductive circuit and the electric connector and cured; the lampshade is covered on the electric connector and the light-transmitting body and cured.
本发明的照明装置的导电包覆结构还具有以下功效,其是以射出披覆方式进行透光体及灯罩成型,不仅可减少公知装配时,因为人体手部的重复接触所产生的静电效应(ESD),而能提升产品的成品率与稳定度。还可以因为工序的简化而大幅度地降低人力装配成本。而且,借由在透光体成型有导光柱,发光组件所发出的投射角度得以被精确地控制在一定范围内。The conductive coating structure of the lighting device of the present invention also has the following effects, which is to mold the light-transmitting body and the lampshade in the way of injection coating, which can not only reduce the electrostatic effect ( ESD), which can improve the yield and stability of the product. It can also greatly reduce the cost of manpower assembly due to the simplification of the process. Moreover, by forming the light guide column on the light-transmitting body, the projection angle emitted by the light-emitting component can be precisely controlled within a certain range.
附图说明 Description of drawings
图1为本发明的金属承座与导电电路的分解图;Fig. 1 is an exploded view of a metal socket and a conductive circuit of the present invention;
图2为本发明的金属承座、导电电路与电连接器的分解图;2 is an exploded view of the metal socket, conductive circuit and electrical connector of the present invention;
图3为本发明的结构与各发光组件的组合图;Fig. 3 is a combination diagram of the structure of the present invention and each light-emitting component;
图4为图3的剖视示意图;Figure 4 is a schematic cross-sectional view of Figure 3;
图5为本发明的结构披覆透光体后的组合剖视示意图;Fig. 5 is a combined cross-sectional schematic view of the structure of the present invention coated with a light-transmitting body;
图6为本发明的结构披覆灯罩后的组合剖视示意图;Fig. 6 is a combined cross-sectional schematic view of the structure of the present invention covered with a lampshade;
图7为照明装置与对接连接器的分解图;Fig. 7 is an exploded view of the lighting device and the docking connector;
图8为照明装置与对接连接器的组合图;8 is a combination diagram of the lighting device and the docking connector;
图9为本发明的另一实施例的组合剖视示意图。FIG. 9 is a combined cross-sectional schematic view of another embodiment of the present invention.
附图标记说明Explanation of reference signs
导电电路10
绝缘层11 铜箔电路层12
接点121Contact 121
电连接器20
导电杆21
透光体30
导光柱31
灯罩40Shade 40
照明装置8
金属承座81、81′ 穿孔811
凹沟812 发光组件82Groove 812 Light-
对接连接器9Butt connector 9
具体实施方式 Detailed ways
有关本发明的详细说明及技术内容,配合附图说明如下,然而所附附图仅用于提供参考与说明,并非用来对本发明加以限制。The detailed description and technical content of the present invention are described below with accompanying drawings, but the attached drawings are only for reference and description, and are not intended to limit the present invention.
请参照图1至图4所示,本发明提供一种照明装置的导电包覆结构,所述照明装置8包含金属承座81及多数个发光组件82,本实施例的金属承座81为具有开口端的盒体,此发光组件82可为LED裸晶或已封装有透镜的LED的形态,该导电包覆结构包括导电电路10、电连接器20、透光体30及灯罩40。Please refer to Fig. 1 to Fig. 4, the present invention provides a conductive coating structure of a lighting device. The box body at the open end, the light-
导电电路10由绝缘层11及布设于绝缘层11上方的铜箔电路层12所构成,此绝缘层11对应于金属承座81的内侧表面粘贴结合;前述各发光组件82固定在绝缘层11上,而其端子(图中未示出)则与铜箔电路层12电性连接。另外在金属承座81的侧板上开设有一对穿孔811,而导电电路10的铜箔电路层12则成型有对应于前述各穿孔811配设的一对接点121。The
本实施例的电连接器20为插座,其具有一对导电杆21,导电杆21对应于接点121电性导接,此对导电杆21对应前述金属承座81的各穿孔811插接,并与导电电路10的接点121电性导接。The
请参照图5所示,为将图4所制作完成的半成品置入预制的模具(图中未示出)中,再将环氧树脂、聚碳酸酯(PC)等材质进行加温热熔后,并以射出披覆方式注入模具中,此熔融液体将流动披覆在导电电路10、各发光组件82及局部披覆金属承座81、电连接器20外部,待固化后而成型为透光体30,再从模具中取出;另外在对应于各发光组件82的位置处分别成型有导光柱31。Please refer to Figure 5, in order to put the semi-finished product made in Figure 4 into a prefabricated mold (not shown in the figure), and then heat and melt materials such as epoxy resin and polycarbonate (PC) , and injected into the mold by injection coating, the molten liquid will flow and coat the
请参照图6所示,将图5所制作完成的半成品置入预制的模具(图中未示出)中,再将工程塑料等材质进行加温热熔后,以射出披覆方式注入模具中,其将披覆在透光体30、金属承座81及电连接器20外部,待固化后而成型为灯罩40,再从模具中取出。Please refer to Figure 6, put the semi-finished product made in Figure 5 into a prefabricated mold (not shown in the figure), and then heat and melt engineering plastics and other materials, and inject it into the mold by injection coating , which will cover the outside of the light-transmitting
请参照图7及图8所示,此照明装置8利用被灯罩40所射出且局部包覆的电连接器20,提供与此电连接器20相互应合的对接连接器9进行插接或拔除,而更增加了使用的便利性。Please refer to FIG. 7 and FIG. 8, the
请参照图9所示,其中该金属承座81除了可为上述实施例外,也可如本实施例的厚板金属承座81′形态,在其侧边面开设有环形凹沟812,前述透光体30在披覆于导电电路10及电连接器20时,同时嵌入凹沟812内部而固接;如此,以增加透光体30与金属承座81′结合牢固度;另外,透光体30的上表面为平整面;而灯罩40则是再披覆于透光体30、电连接器20及局部金属承座81′上;如此,也具有前述实施例的等同效果。Please refer to FIG. 9 , where the
以上所述,仅为本发明的较佳实施例而已,并非用于限定本发明的保护范围。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1443567A2 (en) * | 2003-01-24 | 2004-08-04 | Adriana Disaro' | Modular emitter device and manufacturing method thereof |
EP1821030A1 (en) * | 2006-02-15 | 2007-08-22 | IDEALED S.r.l. Unipersonale | LED light unit |
CN101442015A (en) * | 2007-11-19 | 2009-05-27 | 日进半导体株式会社 | Light emitting diode device and manufacturing method thereof |
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EP1443567A2 (en) * | 2003-01-24 | 2004-08-04 | Adriana Disaro' | Modular emitter device and manufacturing method thereof |
EP1821030A1 (en) * | 2006-02-15 | 2007-08-22 | IDEALED S.r.l. Unipersonale | LED light unit |
CN101442015A (en) * | 2007-11-19 | 2009-05-27 | 日进半导体株式会社 | Light emitting diode device and manufacturing method thereof |
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