CN102041546B - Electroplating hanging rack system of semiconductor packing products - Google Patents
Electroplating hanging rack system of semiconductor packing products Download PDFInfo
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- CN102041546B CN102041546B CN2011100296168A CN201110029616A CN102041546B CN 102041546 B CN102041546 B CN 102041546B CN 2011100296168 A CN2011100296168 A CN 2011100296168A CN 201110029616 A CN201110029616 A CN 201110029616A CN 102041546 B CN102041546 B CN 102041546B
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- hanging rack
- hanger
- unit
- semiconductor package
- ultrasonic transducer
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000009713 electroplating Methods 0.000 title claims abstract description 15
- 238000012856 packing Methods 0.000 title abstract 3
- 230000000007 visual effect Effects 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004069 differentiation Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention relates to an electroplating hanging rack system of semiconductor packing products, which comprises a power supply, a controller and a hanging rack, wherein the controller is provided with two digital input ends; and the hanging rack is provided with an ultrasonic transducer and a combined aural and visual alarm which are respectively connected with the two digital input ends of the controller. Compared with the prior art, the electroplating hanging rack system of the semiconductor packing products can inspect the order of the products on the hanging rack in real time, and send out an audible and visual indication, thus ensuring that operating personnel do not take the products by mistake so as to prevent mixing batches, and avoiding economic losses.
Description
Technical field
The present invention relates to semiconductor technology, relate in particular to a kind of semiconductor package product Electroplating Rack system.
Background technology
In semiconductor packages, variant prodn has requirement in batches, even product design is the same, but need do batch treatment because the chip of encapsulation is different; Some are also arranged is that materials such as product design, chip are all identical, but because the difference of production technique also need be done batch treatment.These all require product in the flow line course of processing, to accomplish accurate differentiating and processing, prevent to mix to criticize.
At present; Criticize for prevent that product from mixing in the course of processing; Mainly be the mode that adopts artificial vision, memory to differentiate, but for the product of above-mentioned product design of the same race or even batching of the same race, depend mode that vision and memory differentiate alone and be difficult to accomplish that absolute fool proof handles; And in case product occurs and mix batch, can cause serious erroneous judgement and financial loss to the tracking of subsequent product etc.
Summary of the invention
The technical problem that the present invention solves is: how to avoid encapsulating products in the course of processing, to be mixed and criticize.
For solving the problems of the technologies described above, the present invention provides a kind of semiconductor package product Electroplating Rack system, comprises power supply, unit and hanger.
Alternatively, said unit is provided with two digital input ports.
Alternatively, said hanger is provided with ultrasonic transducer and combined aural and visual alarm.
Alternatively, the ultrasonic transducer on the said hanger and combined aural and visual alarm respectively with said unit on two digital input ports link to each other.
Alternatively, said unit links to each other with power supply.
Alternatively, said ultrasonic transducer links to each other with power supply with combined aural and visual alarm.
Alternatively, said unit is a programmable logic controller, and said programmable logic controller is micro-chip or IPC.
Alternatively, said power supply is the direct supply that is output as 24V.
Alternatively, said hanger has two at least.
Alternatively, said two hangers link to each other with a unit.
Compared with prior art; A kind of semiconductor package product Electroplating Rack system that the present invention asks for protection; Utilize parts such as unit, ultrasonic transducer, combined aural and visual alarm, testing product is placed into the precedence of hanger in real time, and sends the acousto-optic indication; Guarantee operator not take product by mistake and prevent to mix batch, avoid financial loss; Simultaneously, this system is easy for installation, and it is little to take up room, and maintenance cost is low.
Description of drawings
Fig. 1 is the synoptic diagram of a kind of semiconductor package product Electroplating Rack system in the embodiment of the invention.
Embodiment
A lot of details have been set forth in the following description so that make much of the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention does not receive the restriction of following disclosed practical implementation.
Secondly, the present invention utilizes synoptic diagram to be described in detail, and when the embodiment of the invention was detailed, for ease of explanation, said synoptic diagram was an instance, and it should not limit the scope of the present invention's protection at this.
Do detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.
As shown in Figure 1, a kind of semiconductor package product Electroplating Rack provided by the invention system comprises power supply 5, unit 4 and hanger 1.Said hanger 1 is provided with ultrasonic transducer 2 and combined aural and visual alarm 3.
Said unit 1 is provided with two digital input ports, respectively with hanger 1 on ultrasonic transducer 2 link to each other with combined aural and visual alarm 3.Unit 4, ultrasonic transducer 2 and combined aural and visual alarm 3 all link to each other with power supply 5, and said power supply 5 can adopt the direct supply that is output as 24V that regulated supply is provided.
Said unit 4 is a programmable logic controller, like micro-chip or IPC, so that set instruction flexibly according to the actual production demand.
Said hanger 1 has two at least, and a unit 4 can link to each other with two hangers 1.
When product is hung over 1 last time of hanger; Ultrasonic transducer 2 detects product and exists; Combined aural and visual alarm 3 can correspondingly glimmer and pipe; Alert will with batch product hang on the same hanger 1, and the product of different batches is placed on another hanger 1, product combined aural and visual alarm 3 can not send the warning acousto-optic in order to avoid disturb though the ultrasonic transducer 2 on this moment second hanger 1 has also detected.The subsequent operations personnel according to acousto-optic indication will with batch product got after, 1 combined aural and visual alarm 3 just can send sound and light alarm on another hanger, to carry out a batch differentiation, prevents mixed getting.
Though the present invention discloses as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art are not breaking away from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.
Claims (6)
1. semiconductor package product Electroplating Rack system; It is characterized in that: said hanger system comprises power supply, unit and hanger; Said hanger is provided with ultrasonic transducer and combined aural and visual alarm; Said unit, ultrasonic transducer and combined aural and visual alarm link to each other with said power supply, and said unit links to each other with said ultrasonic transducer and said combined aural and visual alarm.
2. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: said unit is provided with two digital input ports.
3. a kind of semiconductor package product Electroplating Rack as claimed in claim 2 system is characterized in that: the ultrasonic transducer on the said hanger and combined aural and visual alarm respectively with said unit on two digital input ports link to each other.
4. a kind of semiconductor package product Electroplating Rack as claimed in claim 2 system, it is characterized in that: said unit is a programmable logic controller, said programmable logic controller is micro-chip or IPC.
5. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: said power supply is the direct supply that is output as 24V.
6. a kind of semiconductor package product Electroplating Rack as claimed in claim 1 system, it is characterized in that: said hanger has two at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100296168A CN102041546B (en) | 2011-01-27 | 2011-01-27 | Electroplating hanging rack system of semiconductor packing products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100296168A CN102041546B (en) | 2011-01-27 | 2011-01-27 | Electroplating hanging rack system of semiconductor packing products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102041546A CN102041546A (en) | 2011-05-04 |
| CN102041546B true CN102041546B (en) | 2012-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100296168A Active CN102041546B (en) | 2011-01-27 | 2011-01-27 | Electroplating hanging rack system of semiconductor packing products |
Country Status (1)
| Country | Link |
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| CN (1) | CN102041546B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755521B (en) * | 2016-04-06 | 2018-05-01 | 天津中环半导体股份有限公司 | A kind of electrophoretic apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5503730A (en) * | 1991-07-16 | 1996-04-02 | Canon Kabushiki Kaisha | Method for anodic oxidation |
| EP1678352A2 (en) * | 2003-10-22 | 2006-07-12 | Nexx Systems, Inc. | Method and apparatus for fluid processing a workpiece |
| CN101323967A (en) * | 2007-06-11 | 2008-12-17 | Umgabs株式会社 | Electropolating hangers |
| CN201245723Y (en) * | 2008-05-01 | 2009-05-27 | 泰州市苏中电镀器材有限公司 | Electroplating fixture for printed circuit board |
-
2011
- 2011-01-27 CN CN2011100296168A patent/CN102041546B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5503730A (en) * | 1991-07-16 | 1996-04-02 | Canon Kabushiki Kaisha | Method for anodic oxidation |
| EP1678352A2 (en) * | 2003-10-22 | 2006-07-12 | Nexx Systems, Inc. | Method and apparatus for fluid processing a workpiece |
| CN101323967A (en) * | 2007-06-11 | 2008-12-17 | Umgabs株式会社 | Electropolating hangers |
| CN201245723Y (en) * | 2008-05-01 | 2009-05-27 | 泰州市苏中电镀器材有限公司 | Electroplating fixture for printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN102041546A (en) | 2011-05-04 |
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Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |