CN102005391B - Heat dissipation module and assembly method thereof - Google Patents

Abstract

A heat dissipation module comprises a bottom plate, a heat pipe set and a heat dissipation plate. The bottom plate has a top surface, a bottom surface and an opening penetrating the top surface and the bottom surface. The heat pipe set is arranged on the top surface of the bottom plate and is provided with a bending part, wherein the bending part is bent towards the direction of the bottom plate and is arranged in the opening, and a bottom surface of the bending part is aligned with or higher than the bottom surface of the bottom plate. The heat dissipation plate is arranged below the heat pipe set and fills a gap between the bottom plate and the heat pipe set, wherein the heat dissipation plate is provided with a plurality of bearing parts and a plurality of protrusions, one bearing part is arranged between two adjacent protrusions, each bearing part corresponds to one of the heat pipes bearing the heat pipe set, and the protrusions extend into the gap between the two adjacent heat pipes and simultaneously contact the two adjacent heat pipes.

Description

Heat dissipation module and assembly method thereof

technical field

The invention relates to a module and a method, in particular to a heat dissipation module with good heat dissipation effect and an assembly method thereof. the

Background technique

Generally speaking, as long as there is a conductive medium, there will be thermal resistance and affect the heat dissipation effect. Therefore, the best way to fit the heat dissipation module is to directly attach the heat sink to the heat source. Common heat sinks can be fins, heat pipes, or a combination of fins and heat pipes. However, due to the limitation of the shape of the heat pipe and the fins, the contact area between the heat sink and the heat source is very small, which affects the heat dissipation effect. For example, the shape of the heat pipe is mostly circular, so if the heat pipe is directly attached to the heat source, the heat pipe and the heat source will only have point contact or line contact, which will affect the heat dissipation efficiency. In order to increase the heat transfer contact area to improve the heat dissipation effect, the common heat pipe heat dissipation modules in the market are basically composed of a copper base plate, heat pipes and fins. The assembly method of this heat dissipation module is to use solder or glue to fix the above three components together, wherein the copper bottom plate can increase the heat transfer contact area between the heat sink and the heat source. However, it is also because of the shape and processing method of the heat pipe and the copper base plate that the base plate cannot be milled into a shape that can completely cover the edge of the heat pipe. Therefore, solder paste is required between the copper base plate and the heat pipe to assemble it. Together, the contact area between the copper bottom plate and the heat pipe is increased by solder paste as a conductive medium. However, this will return to the nature of the problem that the amount of the conductive medium (copper base plate and solder or glue) between the heat source and the heat sink affects the heat dissipation effect. the

Specifically, before assembling the heat dissipation module on the heat source, fillers must be added to the heat source bonding surface to form a heat dissipation plate (thermal pad) as a medium. Neither can be absolutely flat. From a microscopic point of view, there will still be holes in the heat source bonding surface after processing, and the hardness of the contact material that matches the heat source bonding surface is also high, so a large area of the heat source bonding surface is exposed to the air , while still air is almost a heat transfer insulator except for radiation conduction. At this time, it is a fatal flaw for a heat source that needs to transfer hundreds of watts but has a contact area of only about 370 cm square. Therefore, a medium that is soft and easily deformed by compression is needed to fill the mating gap supported by points, lines and small planes to form a mating surface. In this case, when the surface roughness is the same, the direction and angle of the pressure on the mating surface are the same, because the sharp points, sharp lines or tiny protrusions of the soft material are easy to be depressed, so the softer the material of the mating surface, the more the mating surface will be. The smaller the gap formed by the surface due to processing. the

There is another way in the known technology to directly attach the heat pipe to the heat source, but this requires the use of a heat pipe with a special wall thickness. Specifically, heat pipes with a thicker wall thickness are selected, and the heat pipes are first arranged together and welded with the fins, and then the unevenness caused by the heat pipes arranged together is milled off by machining. surface to create a flat surface for direct contact with heat sources. However, because the wall thickness of the heat pipe increases, the heat group is increased instead, and the heat dissipation effect of the heat pipe is reduced. the

Contents of the invention

The invention provides a method for assembling a heat dissipation module. Compared with the heat dissipation module in the prior art, the assembled heat dissipation module reduces the use of copper heat dissipation plates, thereby reducing thermal resistance and improving heat dissipation effect. the

The invention provides a heat dissipation module, which reduces the use of copper heat dissipation plates compared with the heat dissipation module of the prior art, thereby reducing thermal resistance and having a better heat dissipation effect than the heat dissipation module of the prior art. the

The present invention proposes a method for assembling a heat dissipation module, which includes at least the following steps: providing a heat pipe group, a bottom plate and a jig, wherein the bottom plate has an opening, and the heat pipe group has a bending portion, and the bending portion is arranged in the opening inside, and the jig has a solder paste holding area; fill a solder paste in the solder paste accommodating area of the jig; clamp the jig, heat pipe group and bottom plate, make the bottom plate contact with the jig, and the opening of the bottom plate Correspondingly coincide with the solder paste holding area of the jig, and the bending part of the heat pipe group is in the solder paste holding area; the solder paste is melted to cover the opening of the bottom plate and the bending part of the heat pipe group, and the melted tin The paste is filled into the gaps between the heat pipes of the heat pipe group and formed into a heat dissipation plate; and the jig is removed, wherein the heat dissipation plate, the heat pipe group and the bottom plate are assembled into a heat dissipation module. the

In an embodiment of the method for assembling the heat dissipation module of the present invention, the above-mentioned method of arranging the bent portion in the opening includes making a bottom surface of the bent portion higher than or equal to a bottom surface of the bottom plate. the

In one embodiment of the method for assembling the heat dissipation module of the present invention, the method for forming the heat dissipation plate from the above-mentioned melted solder paste is to stand still the clamped heat pipe group, bottom plate and jig, and make the melted solder paste solidify. the

In one embodiment of the method for assembling the heat dissipation module of the present invention, it further includes forming a plastic frame on a surface of the jig, so that when the jig, the heat pipe group, and the bottom plate are clamped, the plastic frame is tightly attached to the bottom plate, wherein The area surrounded by the plastic frame is the solder paste holding area. the

In one embodiment of the method for assembling the heat dissipation module of the present invention, it further includes coating solder paste on the heat pipe group, so that the solder paste coated on the heat pipe group will flow down and fill the gap between the heat pipes after melting . the

In an embodiment of the method for assembling the heat dissipation module of the present invention, after the heat dissipation module is assembled, it further includes post-processing a contact surface of the heat dissipation plate relatively away from the heat pipe group and the bottom plate, so that the contact surface forms a flat surface. the

In one embodiment of the method for assembling the heat dissipation module of the present invention, before melting the solder paste, it further includes coating solder paste on a top surface of the base plate that is relatively far away from the jig, and disposing a fin group on the top of the base plate noodle. the

The present invention further provides a heat dissipation module suitable for disposing on a chip, and the heat dissipation module includes a bottom plate, a heat pipe group and a heat dissipation plate. The bottom plate has a top surface, a bottom surface and an opening passing through the top surface and the bottom surface. The heat pipe group is arranged on the top surface of the bottom plate, and the heat pipe group has a bent portion, wherein the bent portion is bent toward the bottom plate and arranged in the opening, and a bottom surface of the bent portion is aligned with the bottom surface of the bottom plate or higher than the bottom surface of the base plate. The cooling plate is arranged under the heat pipe group, and fills the gap between the bottom plate and the heat pipe group, wherein the cooling plate has a plurality of bearing parts and a plurality of protrusions, and one bearing part is located between two adjacent protrusions, and Each bearing part corresponds to one of the heat pipes of the heat pipe group, and the protruding part extends into the gap between two adjacent heat pipes and contacts the two adjacent heat pipes at the same time. the

In an embodiment of the heat dissipation module of the present invention, the shape of the above-mentioned bearing part and the shape of the heat pipe cooperate with each other. the

In an embodiment of the heat dissipation module of the present invention, the bottom surface of the bent portion is a plane with a plurality of gaps formed by assembling the heat pipes. the

In an embodiment of the heat dissipation module of the present invention, the heat dissipation plate is made of tin. the

In an embodiment of the heat dissipation module of the present invention, the above further includes a fin set having a bottom surface, and the bottom surface of the fin set is disposed on the top surface of the bottom plate. In addition, the bottom surface of the fin group has a groove, and the heat pipe group is accommodated in the groove. the

Based on the above, using the assembling method of the heat dissipation module of the present invention, it is possible to assemble a heat dissipation module that reduces the use of copper heat dissipation plates between the chip and the bottom plate compared with the known technology, so that the thermal resistance can be reduced, and the heat dissipation of the heat dissipation module for the chip can be increased. Effect. In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings. the

Description of drawings

FIG. 1 is a flow chart of a method for assembling a heat dissipation module according to an embodiment of the present invention. the

FIG. 2 is an exploded schematic view of the heat pipe group, the bottom plate and the jig of FIG. 1 . the

Fig. 3 is a schematic diagram of the assembly of the heat pipe group and the bottom plate. the

FIG. 4 is a schematic diagram of the jig, the heat pipe group and the bottom plate. the

FIG. 5 is a schematic diagram of a heat dissipation module. the

FIG. 6 is a schematic diagram of the cooling plate of FIG. 5 . the

FIG. 7 is a schematic cross-sectional view of A-A of the heat dissipation module in FIG. 5 . the

FIG. 8 is a schematic diagram of a fin set. the

Detailed ways

FIG. 1 is a flowchart of an assembly method of a heat dissipation module according to an embodiment of the present invention; FIG. 2 is an exploded schematic view of the heat pipe group, base plate and jig of FIG. 1 ; and FIG. 3 is an assembly schematic diagram of the heat pipe group and base plate. Please refer to Fig. 1, Fig. 2 and Fig. 3 at the same time, as step S110, provide a heat pipe group 110, a bottom plate 120 and a jig 200, wherein the bottom plate 120 has a top surface 122, a bottom surface 124 and penetrates the top surface 122 and the bottom surface 124 has an opening 126, and the heat pipe assembly 110 has a bent portion 112, and the jig 200 has a solder paste receiving area 200a. the

Next, please continue to refer to FIG. 1 , FIG. 2 and FIG. 3 , as in step S120 , a solder paste is filled in the solder paste receiving area 200 a of the jig 200 and on the top surface 122 of the base plate 120 . In this embodiment, the method for forming the solder paste accommodating area 200a is as in step S108, which may be to form a plastic frame 204 on the surface 202 of the jig 200, and the area surrounded by the plastic frame 204 is the solder paste accommodating area. 200a. In other embodiments, a groove recessed into the surface 202 may also be formed on the surface 202 of the jig 200 as the solder paste receiving area 200a. the

FIG. 4 is a schematic diagram of the jig, the heat pipe group and the bottom plate. Please refer to Fig. 1, Fig. 2 and Fig. 4 at the same time, such as step S130, clamping jig 200, heat pipe group 110 and base plate 120, wherein base plate 120 is configured on jig 200 and the bottom surface 124 of base plate 120 and jig 200 The surface 202 of the bottom plate 120 is in contact with the surface 202 of the bottom plate 120, and the opening 126 of the bottom plate 120 coincides with the solder paste receiving area 200a of the jig 200, and the heat pipe set 110 is arranged on the top surface 122 of the bottom plate 120, and the bent portion 112 of the heat pipe set 110 is facing The direction of the bottom plate 120 is bent and disposed in the opening 126 to be located in the solder paste receiving area 200a. It is worth noting that when clamping the jig 200 , the heat pipe assembly 110 and the bottom plate 120 , the plastic frame 204 disposed on the surface 202 of the jig 200 has slight elasticity, so the plastic frame 204 can be tightly attached to the bottom plate 120 . the

Then, as in step S140 , the solder paste is melted to cover the opening 126 of the bottom plate 120 and the bent portion 112 of the heat pipe assembly 110 , wherein the method of melting the solder paste is heating. It should be noted that the heat pipe group 110 is arranged with a plurality of axially parallel heat pipes, so two adjacent heat pipes are in contact with each other. However, due to the shape of the heat pipes, the two adjacent heat pipes cannot be completely in contact with each other, which means that there is still a gap between the two adjacent heat pipes. In step S140 , the melted solder paste flows and fills the gaps between the heat pipes of the heat pipe assembly 110 to form a heat sink 130 . In particular, before the solder paste is melted, the solder paste can be coated on the heat pipe assembly 110 as in step S132 . The solder paste coated on the heat pipe assembly 110 is also melted in step S140 , and is influenced by gravity to flow downward along the shape of the heat pipes toward the bottom plate 120 , and surely fills the gaps between the heat pipes. In addition, the method of forming the melted solder paste into the heat sink 130 is to stand still the clamped heat pipe set 110 , base plate 120 and jig 200 , so that the melted solder paste solidifies according to the shape of the heat pipe set 110 , base plate 120 and jig 200 . FIG. 5 is a schematic diagram of a heat dissipation module. Please refer to FIG. 1 , FIG. 2 and FIG. 5 at the same time, and then as in step S150, remove the jig 200 , wherein the heat dissipation plate 130 , the heat pipe group 110 and the bottom plate 120 are assembled into a heat dissipation module 100 . the

FIG. 6 is a schematic diagram of the heat dissipation plate of FIG. 5 , and FIG. 7 is a schematic cross-sectional view of A-A of the heat dissipation module of FIG. 5 . Please refer to FIG. 5, FIG. 6 and FIG. 7 at the same time. The heat dissipation plate 130 formed by solidification has a plurality of bearing parts 132 and a plurality of protrusions 134, wherein each bearing part 132 corresponds to one of the heat pipes of the heat pipe group 110, and the bearing part 132 and the protruding portion 134 are formed according to the shape of the heat pipes between two adjacent heat pipes, the shape of the opening 126 of the bottom plate 120, and the shape of the solder paste melting area 200a of the jig 200, so the shape of the bearing portion 132 is consistent with that of the heat pipes. The shapes match each other, and the protruding portion 134 further extends into the gap between two adjacent heat pipes and contacts the two adjacent heat pipes at the same time. It can be seen from the above that the carrying portion 132 and the protruding portion 134 can at least completely cover the bottom of the heat pipe group 110, improving the known technology because of the gap between the heat pipes and the need to additionally use a copper cooling plate to increase the contact area, but the copper The thermal resistance of the heat sink made will affect the heat dissipation instead. In other words, the heat dissipation module of this embodiment can improve the heat dissipation effect. the

Please continue to refer to FIG. 1 and FIG. 5, after step S130 and before step S140, it is possible to apply solder paste on the top surface 122 of the base plate 120 as in step S134, and arrange a fin group 140 on the top of the base plate 120. Surface 122. FIG. 8 is a schematic diagram of a fin set. Please refer to FIG. 7 and FIG. 8 at the same time, the fin group 140 has a bottom surface 142, and the bottom surface 142 has a groove 142a, and the heat pipe group 110 is accommodated in this groove 142a, so as to increase the heat pipe group 110 and the fins. The contact area of the sheet group 140 improves the heat dissipation effect. the

Please continue to refer to FIG. 5 and FIG. 6. After the heat dissipation module 100 is assembled, it further includes post-processing a contact surface 136 of the heat dissipation plate 130 that is relatively far away from the heat pipe group 110, so that the contact surface 136 forms a flat surface, which can be further combined with Chip has good contacts. It is worth noting that the relationship between the bottom surface 112a of the bent portion 112 and the bottom surface 124 of the bottom plate 120 will affect the result of post-processing. The bottom surface 112 a of the bending portion 112 is a plane formed by assembling a plurality of heat pipes with the plurality of gaps described above. In addition, the bottom surface 112 a of the bent portion 112 can be equal to the bottom surface 124 of the bottom plate 120 , that is, the bottom surface 112 a can be aligned with the bottom surface 124 . Alternatively, the bottom surface of the bent portion 112 may also be higher than the bottom surface 124 of the bottom plate 120 . In detail, the thickness of the supporting portion 132 of the cooling plate 130 can be determined according to the height of the plastic frame 204 (marked in FIG. 2 ) and the distance between the bottom surface 112a of the bent portion 112 of the heat pipe group 110 and the bottom surface 124 of the bottom plate 120. Decide. For example, when the bottom surface 112 a of the bent portion 112 is aligned with the bottom surface 124 of the base plate 120 , the height of the sealant 204 is equal to the thickness of the bearing portion 132 . Alternatively, when the bottom surface of the bent portion 112 is higher than the bottom surface 124 of the bottom plate 120 , the sum of the height of the sealant 204 and the distance between the bottom surface 112 a of the bent portion 112 and the bottom surface 124 of the bottom plate 120 is the thickness of the bearing portion 132 . Furthermore, the jig 200 may also have a groove recessed on its surface 202 to determine the thickness of the bearing portion 132 . In this way, when post-processing the contact surface 136 of the heat sink 130 , the processing thickness can be determined according to the thickness of the supporting portion 132 , so as to avoid excessive processing that affects the thickness of the heat pipes of the heat pipe assembly 110 or damages the heat pipes. the

To sum up, the heat dissipation module produced by the heat dissipation module assembly method of the present invention can completely cover the bottom part of the heat pipe group and provide a uniform contact surface with the chip, so it can be compared The known technology reduces the use of copper heat sinks, thereby reducing thermal resistance and improving heat dissipation. the

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims. the

Claims (13)

1. A method for assembling a cooling module, characterized in that it comprises: Provide a heat pipe group, a base plate and a jig, wherein the base plate has an opening, and the heat pipe set has a bent portion, and the bent portion is disposed in the opening, and the jig has a solder paste holding area; filling a solder paste in the solder paste containing area of the jig and a top surface of the bottom plate; Clamping the jig, the heat pipe group and the bottom plate so that the bottom plate is in contact with the jig, and the opening of the bottom plate coincides with the solder paste receiving area of the jig , and the bending part of the heat pipe group is in the solder paste containing area; melting the solder paste to cover the opening of the bottom plate and the bent portion of the heat pipe group, wherein the melted solder paste fills the gaps between the plurality of heat pipes of the heat pipe group and formed as a heat sink; and The jig is removed, wherein the heat dissipation plate, the heat pipe group and the bottom plate are assembled into a heat dissipation module. 2. The method for assembling the heat dissipation module according to claim 1, wherein the method of disposing the bent portion in the opening comprises making a bottom surface of the bent portion higher than or equal to that of the bottom plate a base. the 3. According to the assembly method of the heat dissipation module according to claim 1, the method of forming the heat dissipation plate from the melted solder paste is to clamp the heat pipe group, the bottom plate and the jig in a standing position, so that The melted solder paste is solidified. 4. The method for assembling a heat dissipation module according to claim 1, further comprising forming a plastic frame on a surface of the jig, so that when the jig, the heat pipe group, and the bottom plate are clamped, The plastic frame is in close contact with the bottom plate, and the area surrounded by the plastic frame is the solder paste accommodating area. 5. The method for assembling the heat dissipation module according to claim 1, further comprising coating the solder paste on the heat pipe group, so that the solder paste coated on the heat pipe group will go downward after melting. Flow fills the gaps between the heat pipes. 6. The method for assembling a heat dissipation module according to claim 1, after the heat dissipation module is assembled, further comprising post-processing a contact surface of the heat dissipation plate that is relatively far away from the heat pipe group, so that the contact surface form a flat surface. 7. According to the assembling method of the heat dissipation module according to claim 1, before melting the solder paste and after clamping the heat pipe group, the bottom plate and the jig, further comprising The solder paste is coated on a top surface away from the jig, and a fin group is arranged on the top surface of the base plate. 8. A heat dissipation module, suitable for being configured on a chip, said heat dissipation module is characterized in that it comprises: a bottom plate having a top surface, a bottom surface and an opening passing through the top surface and the bottom surface; a heat pipe group disposed on the top surface of the bottom plate, the heat pipe group has a bent portion, wherein the bent portion is bent toward the bottom plate and disposed in the opening, and a bottom surface of the bent portion is flush with or higher than the bottom surface of the bottom plate; and A heat dissipation plate is disposed under the heat pipe group and fills the gap between the bottom plate and the heat pipe group, wherein the heat dissipation plate has a plurality of bearing parts and a plurality of protrusions, and one of the bearing parts between two adjacent protrusions, and each carrying portion corresponds to one of the heat pipes of the heat pipe group, and the protrusions extend into the gap between two adjacent heat pipes, and Simultaneously contact two adjacent heat pipes. 9. The heat dissipating module according to claim 8, wherein the shape of the bearing part matches the shape of the heat pipe. 10 . The heat dissipation module according to claim 8 , wherein the bottom surface of the bent portion is a plane formed by assembling the heat pipes with a plurality of gaps. 11 . 11. The heat dissipation module according to claim 8, wherein the heat dissipation plate is made of tin. 12. The heat dissipation module according to claim 8, further comprising a fin set having a bottom surface, and the bottom surface of the fin set is disposed on the top surface of the bottom plate. the 13. The heat dissipation module according to claim 12, wherein the bottom surface of the fin set has a groove, and the heat pipe set is accommodated in the groove. the

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