CN102003662A - Edge type backlight module capable of strengthening local cooling - Google Patents
Edge type backlight module capable of strengthening local cooling Download PDFInfo
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- CN102003662A CN102003662A CN2010105538510A CN201010553851A CN102003662A CN 102003662 A CN102003662 A CN 102003662A CN 2010105538510 A CN2010105538510 A CN 2010105538510A CN 201010553851 A CN201010553851 A CN 201010553851A CN 102003662 A CN102003662 A CN 102003662A
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- 238000005728 strengthening Methods 0.000 title claims abstract description 73
- 238000001816 cooling Methods 0.000 title abstract 6
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 32
- 230000005855 radiation Effects 0.000 claims description 50
- 230000002787 reinforcement Effects 0.000 claims description 20
- 238000009792 diffusion process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 7
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 7
- 239000003570 air Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 4
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- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses an edge type backlight module capable of strengthening local cooling. The part next to at least one incident side edge, of the backplane of the backlight module is provided with a locally strengthened cooling region; and the surface of the locally strengthened cooling region is provided with a strengthened heat-conducting coating and a three-dimensional cooling configuration, thus the heat can be distributed evenly so as to reduce the temperature and the heat exchange area can be increased. Therefore, by adopting the edge type backlight module capable of strengthening local cooling, the influence of high temperature on the chroma and brightness of the light-emitting device can be avoided, the uniformity of the chroma and brightness of the integral liquid crystal display module can be improved and the light-extraction efficiency can be increased.
Description
[technical field]
The present invention relates to a kind of local side entrance back module of strengthening heat radiation, particularly relate to a kind of side entrance back module that radiating area is strengthened in the part that comprises reinforcement heat conduction coating and three-dimensional heat radiation configuration that has.
[background technology]
LCD (liquid crystal display, LCD) be to utilize the characteristic of liquid crystal material to come a kind of panel display apparatus (flat panel display of display image, FPD), it has more advantages such as frivolous, low driving voltage and low-power consumption compared to other display unit, has become the main product on the whole consumption market.Yet the liquid crystal material of LCD can't be from main light emission, must be by the external light source that provides, so be provided with backlight module in the LCD again in addition so that required light source to be provided.
Generally speaking, backlight module can be divided into side entrance back module and two kinds of forms of direct type backlight module.Known backlight module mainly is as light source with cathode fluorescent tube (CCFL), thermal cathode fluorescent tube (HCFL) or light emitting diode (LED).
Please refer to shown in Figure 1ly, Fig. 1 is a kind of side partial cross-sectional of existing side entrance back module.One side entrance back module 90 comprises a backboard 91, and at least one lateral margin of described backboard 91 is provided with at least one side wall portion 911, and described backboard 91 central authorities carrying one LGP 92.Described LGP 92 is provided with an optical diaphragm group 93, and other has a glue frame 94 to be coated on the outer rim of described backboard 91, and fixing described optical diaphragm group 93 from top to bottom and described LGP 92 are to form described side entrance back module 90.In addition, on described side entrance back module 90, stack a liquid crystal panel 80 (shown in imaginary line) again, and with a shell 70 (shown in imaginary line) coat and fixing as described in liquid crystal panel 80 and as described in side entrance back module 90, promptly form a LCD (indicating).
As shown in Figure 1, on described side wall portion 911 inner surfaces of the described backboard 91 of described side entrance back module 90, be provided with a light source group 95, described light source group 95 has at least one light-emitting device 951, described light-emitting device 951 can be light emitting diode (LED) light-emitting device, and its light source direction is pointed to described LGP 92.Described light-emitting device 951 generally locks by screw or mode such as heat conduction adhesive tape stickup fixes on described side wall portion 911.Owing to can produce heat energy in the process that described light source group 95 operates, these heat energy can be along the direction of arrow in the diagram, by the downward earlier center that inwardly conducts to described backboard 91 again of described side wall portion 911, to dispel the heat.
Referring again to shown in Figure 2, Fig. 2 is the side partial cross-sectional of another kind of existing side entrance back module.The side entrance back module 90 of Fig. 2 is similar in appearance to the side entrance back module 90 of Fig. 1, difference is: the side entrance back module 90 of Fig. 2 is provided with a heat-conducting block 96 in addition between described light source group 95 and described backboard 91, and described heat-conducting block 96 is on described backboard 91 of being attached at respectively of L type and the side wall portion 911 thereof approximately, and described heat-conducting block 96 generally is the material that is selected from aluminium (Al) matter, makes with the technology of extrusion molding.Because the heat-conducting block 96 of aluminium matter has better thermal conduction characteristic, and the contact area of the heat-conducting block 96 of described aluminium matter and described backboard 91 more strengthens.Therefore, the heat energy that described light source group 95 is produced can be conducted to the center position of described backboard 91 faster by described side wall portion 911, to dispel the heat.
Yet, still there is a problem in two kinds of above-mentioned existing side entrance back modules 90, be exactly in this heat radiation process by described backboard 91, described backboard 91 is near the zone of described light source group 95, backboard 91 zones (promptly corresponding to 91 zones of the backboard shown in the arrow) that just are adjacent to described side wall portion 911 present the even phenomenon of a kind of temperature distributing disproportionation because having certain length: the temperature near central part is higher relatively in these backboard 91 zones, temperature near the position, both sides is then lower relatively, just in these backboard 91 zones, can produce the phenomenon of hot polymerization collection near central part, also cause simultaneously the radiating effect of described light-emitting device 951 of described light source group 95 of contiguous this central part relatively poor, therefore cause described light-emitting device 951 (LED) to be subjected to temperatures involved and cause its colourity and luminance nonuniformity to spare, thereby cause the briliancy of whole LCD and colourity inhomogeneous, influence the visual effect of client product.
Therefore, be necessary to provide a kind of local side entrance back module of strengthening heat radiation, to solve the existing in prior technology problem.
[summary of the invention]
Main purpose of the present invention provides a kind of local side entrance back module of strengthening heat radiation, is provided with the local radiating area of strengthening by the position that is adjacent to the light inlet lateral margin at backboard, and the local surface of strengthening radiating area has the heat conduction of reinforcement coating.Because it is bigger to strengthen the thermal diffusion coefficient of heat conduction coating, temperature promptly is evenly distributed and reduces, therefore can effectively avoid colourity and briliancy, thereby improve the uniformity of whole LCD MODULE colourity and briliancy and improve light extraction efficiency because of the temperatures involved light-emitting device.
Secondary objective of the present invention provides a kind of local side entrance back module of strengthening heat radiation, strengthen radiating area by the part and have three-dimensional heat radiation configuration, in order to increase heat exchange area, make temperature can be quickly mode by free convection be diffused in the air.
For reaching above-mentioned purpose, the invention provides a kind of local side entrance back module of strengthening heat radiation, described side entrance back module comprises a backboard and at least one light source group, described backboard is provided with at least one light inlet lateral margin, described at least one light source group is adjacent to described at least one light inlet lateral margin, the position that described backboard is adjacent to described at least one light inlet lateral margin is provided with a local radiating area of strengthening, and the described local surface of strengthening radiating area has one and strengthens heat conduction coating.
In one embodiment of this invention, the thermal diffusion coefficient of the material of described reinforcement heat conduction coating is greater than the thermal diffusion coefficient of the base material of described backboard.
In one embodiment of this invention, described reinforcement heat conduction coating is a copper coating; The base material of described backboard is aluminium or its alloy.
In one embodiment of this invention, the described local surface of strengthening radiating area has a three-dimensional heat radiation configuration.
In one embodiment of this invention, described three-dimensional heat radiation configuration is wavy.
In one embodiment of this invention, described backboard is provided with the described local radiating area of strengthening at a middle position that is adjacent to described light inlet lateral margin at least.The described local length of strengthening radiating area is equal to or greater than 1/3rd of described at least one light inlet skirt wall minister degree.
In one embodiment of this invention, described backboard vertically is extended with at least one light inlet side wall portion at described at least one light inlet lateral margin, and the described local radiating area of strengthening extends to form on described at least one light inlet side wall portion.
For reaching above-mentioned another purpose, the invention provides a kind of local side entrance back module of strengthening heat radiation, described side entrance back module comprises a backboard and at least one light source group, described backboard is provided with at least one light inlet lateral margin, described at least one light source group is adjacent to described at least one light inlet lateral margin, the position that described backboard is adjacent to described at least one light inlet lateral margin is provided with a local radiating area of strengthening, and the described local surface of strengthening radiating area has a three-dimensional heat radiation configuration.
The local side entrance back module of strengthening heat radiation of the present invention is provided with the local radiating area of strengthening by the position that is adjacent to the light inlet lateral margin at backboard, and its surface has the heat conduction coating of reinforcement and/or three-dimensional heat radiation configuration.Because it is bigger to strengthen the thermal diffusion coefficient of heat conduction coating, temperature promptly is evenly distributed and to external diffusion, and three-dimensional heat radiation configuration can increase the heat exchange area with ambient air, make temperature can be quickly mode by free convection be diffused in the air.Therefore, the present invention can effectively avoid colourity and the briliancy because of the temperatures involved light-emitting device, thereby improves the uniformity of whole LCD MODULE colourity and briliancy and improve light extraction efficiency.
[description of drawings]
Fig. 1: a kind of side partial cross-sectional of existing side entrance back module.
Fig. 2: the side partial cross-sectional of another kind of existing side entrance back module.
Fig. 3: a kind of local three-dimensional exploded view of strengthening the side entrance back module of heat radiation of first embodiment of the invention.
Fig. 4: a kind of local backboard stereogram of strengthening the side entrance back module of heat radiation of first embodiment of the invention.
Fig. 5: the local partial enlarged view of strengthening radiating area of first embodiment of the invention Fig. 4 dorsulum.
Fig. 6: a kind of local backboard stereogram of strengthening the side entrance back module of heat radiation of second embodiment of the invention.
[specific embodiment]
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and conjunction with figs. are described in detail below:
Please refer to shown in Figure 3ly, Fig. 3 discloses a kind of local three-dimensional exploded view of strengthening the side entrance back module of heat radiation of first embodiment of the invention.Side entrance back module 10 of the present invention mainly comprises a backboard 11, described backboard 11 central carrying one LGPs 12, can comprise a reflector plate (not indicating) between described backboard 11 and the described LGP 12, described LGP 12 is provided with an optical diaphragm group 13, other has a glue frame 14, and fixing described optical diaphragm group 13 from top to bottom and described LGP 12 are in described backboard 11.In addition, on described side entrance back module 10, stack a liquid crystal panel module again, promptly form a LCD (not illustrating).
As shown in Figure 3, side entrance back module 10 of the present invention mainly also comprises at least one light source group 15.On at least one light inlet lateral margin 110 of described backboard 11, vertically be provided with at least one light inlet side wall portion 111 (showing two corresponding light inlet lateral margin 110 and light inlet side wall portions 111 that are provided with among the figure), the inner surface that is adjacent to the described light inlet wall portion 111 of described light inlet lateral margin 110 is provided with described light source group 15, described light source group 15 has at least one light-emitting device 151, described light-emitting device 151 can be the LED light-emitting device, and its light source direction is pointed to described LGP 12.Described light-emitting device 151 generally locks by screw or mode such as heat conduction adhesive tape stickup fixes at least one section and is on the heat-conducting block 16 of L type, is fixed on the described backboard 11 again.Perhaps described light-emitting device 151 also can be selected to be directly fixed on the described side wall portion 111.Therefore, the heat energy that is produced in the process of described light source group 15 runnings can conduct to described backboard 11 by the described side wall portion 111 or the described heat-conducting block 16 of described backboard 11, to dispel the heat.
Please refer to shown in Figure 4ly, Fig. 4 discloses a kind of local backboard stereogram of strengthening the side entrance back module of heat radiation of first embodiment of the invention.In order to eliminate the hot concentration phenomenon of mentioning in the prior art, prevent that just described backboard 11 from presenting the even phenomenon of temperature distributing disproportionation near the zone of described light source group 15, the middle position that described backboard 11 of the present invention is adjacent to described at least one light inlet lateral margin 110 is provided with a local radiating area 112 of strengthening, and the described local surface of strengthening radiating area 112 has one and strengthens heat conduction coating 112a; And the described local surface of strengthening radiating area 112 has a three-dimensional heat radiation configuration 112b.Details are as follows:
At first explanation comprises two kinds of heat energy circulation ways in that the heat radiation process of described side entrance back module 10 is actual:
(1) heat conduction: the heat energy that comes out from described light-emitting device 151 (LED), circuit board (not indicating) and/or described heat-conducting block 16 by described light source group 15 conduct on the back inner surface of described backboard 11, are transmitted to the outer surface of described backboard 11 then.
(2) thermal convection current: generally the mode with free convection is dispersed into the outer surface of heat energy from described backboard 11 extraneous air.
Then, please describe respectively again and light described side entrance back module 10 (described light-emitting device 151) original state and stable state simultaneously with reference to every data of following form:
The specific heat capacity of copper and aluminium, the coefficient of heat conduction, thermal diffusion coefficient and density contrast as following table:
In the thermal convection current process, three parameters estimating the thermal convection current speed are as follows:
(1) light the original state of backlight module 10:
Described backboard 11 generally is an aluminium matter, preferably copper facing of heat conduction coating 112a (adopting vacuum splashing and plating or additive method) is strengthened on the described local surface of strengthening radiating area 112 of the backboard 11 of described aluminium matter, because the thickness of copper layer (35 μ m) is much smaller with respect to the thickness (adopting 0.8mm or 1mm usually) of described backboard 11, can ignore so strengthen the thermal resistance of heat conduction coating 112a (copper coating) generation.But it is, bigger than the diffusion coefficient 70x10-6m2/s of aluminium because the diffusion coefficient of copper is 117x10-6m2/s.Therefore, according to formula α=k/ (ρ * C), if traditional backboard in the same time is compared with the heat radiation of copper facing backboard, temperature can reach homogenising quickly at the copper-plated described local radiating area 112 of strengthening.Thermal diffusion coefficient is big more, and expression heat is fast more in the transfer rate of material internal, and just temperature rises fast more.Also can so understand, the more traditional backboard of the temperature difference of the copper-plated described local equidirectional of strengthening radiating area 112, same distance come little.
In addition, please more simultaneously with reference to Fig. 4 and shown in Figure 5, the partial enlarged view of radiating area is strengthened in the part that Fig. 5 discloses the backboard 11 of Fig. 4.Because influence the factor of surface coefficient h surface area that temperature contrast, solid contact with fluid etc. is arranged.In the first embodiment of the present invention, because the described local copper plate (strengthening heat conduction coating 112a) of strengthening radiating area 112 makes the faster surface that is diffused into more equably of heat energy, the described local temperature height of strengthening the temperature of radiating area 112 than traditional backboard co-located region under original state is so surface coefficient h is bigger.As Fig. 4 and shown in Figure 5, radiating area 112 is strengthened except the surface has the heat conduction of reinforcement coating 112a in the part of the backboard 11 of first embodiment of the invention, also has a three-dimensional heat radiation configuration 112b.Described three-dimensional heat radiation configuration 112b preferably is wavy, and this wavy design can increase the described local heat exchange area of strengthening radiating area 112, make temperature can be quickly mode by free convection be diffused in the air.Because surface area significantly increases, so surface coefficient h also increases, so that evaluation coefficient Nu becomes is big.According to the definition of Nu, convection current will strengthen.
Equally, under the original state, because the copper-plated described local radiating area 112 of strengthening wants big with the temperature contrast of surrounding air and the difference of traditional backboard, so Δ t increases, Gr is big more, that is fluid buoyancy is big more with the ratio of viscous force, illustrates that the described local buoyancy of strengthening radiating area 112 hot-air on every side increases, and more helps producing free convection, hot-air is risen, cold air descends, and carries out heat exchange, and heat energy is distributed quickly.
(2) light the stable state of backlight module after 10 a period of times:
Because the described local radiating area 112 of strengthening can be accelerated heat loss through convection, so the temperature of described backboard 11 can reduce, the evaluation coefficient Nu and the Gr that are caused by the temperature difference will diminish, free convection will die down so, reach stable state (being that the heat energy that LED produces equates with the heat energy that convection current is taken away) up to described backlight module 10 and surrounding air, this moment, the temperature of described backboard 11 not only distributed more evenly, and what mean temperature also can more traditional backboard is low.It is even to help the LED bright dipping, and colourity is even, and improves light extraction efficiency.
In sum, described local reinforcement radiating area 112 is because the thermal diffusion coefficient of copper plate (strengthening heat conduction coating 112a) is bigger than aluminium, so temperature can be evenly distributed in the copper facing zone apace.Because copper plate can strengthen free convection, so the described local reinforcement radiating area 112 and the near zone temperature of backboard 11 will reduce.The junction temperature of the described light-emitting device 151 (LED) of diverse location will reduce and reach more even on described light source group 15 like this, so the briliancy of the described light-emitting device 151 of diverse location will become more even on the described light source group 15, colourity also can become evenly, so the briliancy of whole LCD and uniformity of chromaticity will improve.And because the junction temperature of described light-emitting device 151 reduces, light extraction efficiency will improve.
Moreover the present invention does not limit the material of described reinforcement heat conduction coating 112a, and except copper facing, the material of described reinforcement heat conduction coating 112a can be other coating, and its thermal diffusion coefficient is greater than the thermal diffusion coefficient of described backboard 11.
In addition, the present invention does not limit the shape of described three-dimensional heat radiation configuration 112b, described three-dimensional heat radiation configuration 112b except can be wavy, also can be that other have the profile that can increase surface area and auxiliary heat dissipation, fin shape for example.
And, be that the described local surface of strengthening radiating area 112 has described reinforcement heat conduction coating 112a and described three-dimensional heat radiation configuration 112b simultaneously though first embodiment of the invention discloses,, the present invention is not limited to this.In the present invention, the user can select for use a kind of technical characterictic wherein to implement according to the demand of reality, the radiating effect to a certain degree that also can reach.For example: the described local surface of strengthening radiating area 112 has described reinforcement heat conduction coating 112a but does not have described three-dimensional heat radiation configuration 112b; The perhaps described local surface of strengthening radiating area 112 has described three-dimensional heat radiation configuration 112b but does not have described reinforcement heat conduction coating 112a.
Moreover the present invention does not limit the described local proportionate relationship that radiating area 121 is occupied of strengthening in described backboard 11, and the user can set according to actual demand.For example, according to the central notion of object and the basic effect desiring to reach, the described local length of strengthening radiating area 112 can be designed to be equal to or greater than 1/3rd of described at least one light inlet lateral margin 110 length.In addition, the described local width (with respect to the other direction of length) of strengthening radiating area 112 approximates or greater than 1/4th of described backboard 11 width.
In addition, described backboard 11 vertically extends (one-body molded or non-one-body molded) at described at least one light inlet lateral margin 110 described at least one light inlet side wall portion 111, describedly local strengthens that radiating area 112 is also extensible to be formed into 111 (not illustrating) on described at least one light inlet side wall portion.
Please refer to shown in Figure 6ly, Fig. 6 discloses a kind of local backboard stereogram of strengthening the side entrance back module of heat radiation of second embodiment of the invention.Described local the strengthen radiating area 112 of radiating area 112 similar in appearance to first embodiment of the invention strengthened in the part of the backboard 11 of second embodiment of the invention, therefore continue to use identical element numbers and title, but its difference is: the described local length of strengthening radiating area 112 equals the length of described at least one light inlet lateral margin 110, and the just described local radiating area 112 of strengthening takes the whole sides of described backboard 11 in abutting connection with described at least one light source group 15.In such design, because 112 pairs of heat conduction of the described local reinforcement radiating area of diverse location are identical with the positive role of thermal convection current, so though the Temperature Distribution of described backboard 11 is still uneven, but because the described local radiating area 112 of strengthening has described reinforcement heat conduction coating 112a can strengthen thermal convection current, so the bulk temperature of described backboard 11 can reduce, help reducing described light-emitting device 151 junction temperatures like this, strengthen described light-emitting device 151 light extraction efficiencies.
In sum, in the heat radiation process of existing side entrance back module, the zone that backboard is adjacent to the light inlet lateral margin can present the even phenomenon of the temperature distributing disproportionation that temperature is higher and position, both sides temperature is lower of central part, cause the colourity of light-emitting device and luminance nonuniformity even, thereby cause the briliancy of whole LCD and colourity inhomogeneous.The present invention is provided with the described local radiating area 112 of strengthening by the middle position that is adjacent to described at least one light inlet lateral margin 110 at described backboard 11, the described local surface of strengthening radiating area 112 has the heat conduction coating 112a of reinforcement and three-dimensional heat radiation configuration 112b, because the thermal diffusion coefficient of described reinforcement heat conduction coating 112a is bigger, temperature promptly is evenly distributed, and described three-dimensional heat radiation configuration 112b can increase heat exchange area, make temperature can be quickly mode by free convection be diffused in the air.Therefore, the local side entrance back module of strengthening heat radiation of the present invention can guarantee that the colourity of light-emitting device and briliancy are even, thereby improves the uniformity of whole LCD MODULE colourity and briliancy and improve light extraction efficiency.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (10)
1. local side entrance back module of strengthening heat radiation, described side entrance back module comprises a backboard and at least one light source group, described backboard is provided with at least one light inlet lateral margin, described at least one light source group is adjacent to described at least one light inlet lateral margin, it is characterized in that: the position that described backboard is adjacent to described at least one light inlet lateral margin is provided with a local radiating area of strengthening, and the described local surface of strengthening radiating area has one and strengthens heat conduction coating.
2. the local side entrance back module of strengthening heat radiation as claimed in claim 1, it is characterized in that: the thermal diffusion coefficient of the material of described reinforcement heat conduction coating is greater than the thermal diffusion coefficient of the base material of described backboard.
3. the local side entrance back module of strengthening heat radiation as claimed in claim 2, it is characterized in that: described reinforcement heat conduction coating is a copper coating; The base material of described backboard is aluminium or its alloy.
4. the local side entrance back module of strengthening heat radiation as claimed in claim 1 is characterized in that: the described local surface of strengthening radiating area has a three-dimensional heat radiation configuration.
5. the local side entrance back module of strengthening heat radiation as claimed in claim 4 is characterized in that: described three-dimensional heat radiation configuration is wavy or the fin shape.
6. the local side entrance back module of strengthening heat radiation as claimed in claim 1 is characterized in that: described backboard is provided with the described local radiating area of strengthening at a middle position that is adjacent to described light inlet lateral margin at least.
7. as claim 1 or the 6 described local side entrance back modules of strengthening heat radiation, it is characterized in that: the described local length of strengthening radiating area is equal to or greater than 1/3rd of described at least one light inlet lateral margin length.
8. local side entrance back module of strengthening heat radiation, described side entrance back module comprises a backboard and at least one light source group, described backboard is provided with at least one light inlet lateral margin, described at least one light source group is adjacent to described at least one light inlet lateral margin, it is characterized in that: the position that described backboard is adjacent to described at least one light inlet lateral margin is provided with a local radiating area of strengthening, and the described local surface of strengthening radiating area has a three-dimensional heat radiation configuration.
9. the local side entrance back module of strengthening heat radiation as claimed in claim 8 is characterized in that: described three-dimensional heat radiation configuration is wavy or the fin shape.
10. the local side entrance back module of strengthening heat radiation as claimed in claim 8, it is characterized in that: the described local surface of strengthening radiating area has one and strengthens heat conduction coating, and the thermal diffusion coefficient of the material of described reinforcement heat conduction coating is greater than the thermal diffusion coefficient of the base material of described backboard.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105538510A CN102003662A (en) | 2010-11-18 | 2010-11-18 | Edge type backlight module capable of strengthening local cooling |
| US13/000,912 US20120127749A1 (en) | 2010-11-18 | 2010-11-26 | Side-light type backlight module with local heat-dissipation enhancement |
| PCT/CN2010/079166 WO2012065315A1 (en) | 2010-11-18 | 2010-11-26 | Edge type backlight module having function of locally strengthened heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105538510A CN102003662A (en) | 2010-11-18 | 2010-11-18 | Edge type backlight module capable of strengthening local cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102003662A true CN102003662A (en) | 2011-04-06 |
Family
ID=43811246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105538510A Pending CN102003662A (en) | 2010-11-18 | 2010-11-18 | Edge type backlight module capable of strengthening local cooling |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102003662A (en) |
| WO (1) | WO2012065315A1 (en) |
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| Publication number | Publication date |
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| WO2012065315A1 (en) | 2012-05-24 |
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