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CN102003647B - 全方位led球泡灯 - Google Patents

全方位led球泡灯 Download PDF

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Publication number
CN102003647B
CN102003647B CN2010105830960A CN201010583096A CN102003647B CN 102003647 B CN102003647 B CN 102003647B CN 2010105830960 A CN2010105830960 A CN 2010105830960A CN 201010583096 A CN201010583096 A CN 201010583096A CN 102003647 B CN102003647 B CN 102003647B
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led
heat dissipation
light source
bulb lamp
led bulb
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CN102003647A (zh
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刘树高
安建春
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Shandong Kaiyuan Electronic Co Ltd
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Shandong Kaiyuan Electronic Co Ltd
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Priority to CN2010105830960A priority Critical patent/CN102003647B/zh
Publication of CN102003647A publication Critical patent/CN102003647A/zh
Priority to PCT/CN2011/082941 priority patent/WO2012075891A1/zh
Priority to US13/884,876 priority patent/US8979310B2/en
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Publication of CN102003647B publication Critical patent/CN102003647B/zh
Priority to ZA2013/02399A priority patent/ZA201302399B/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明公开了一种全方位LED球泡灯，包括灯头、散热壳体、线路板、LED光源和灯罩，散热壳体设有外凸平台，平台上设有柱状LED光源，光源架体为多棱柱状，发光点与灯头距离远，其后端的散热器挡光范围小，柱头侧、顶面的LED芯片采用透镜集成封装，柱头后端设有反光面。本发明具有灯体后端光通量大，全方位发光，光照强度均匀，LED芯片封装容易，加工方便，热阻小，散热效果好，使用寿命长等优点。

Description

全方位LED球泡灯
技术领域
本发明属于LED照明技术领域，具体是涉及一种LED球泡灯。 
背景技术
随着LED技术的高速发展，LED以其节能、环保等优点，逐渐成为新型绿色照明的首选。由于白炽灯及电子节能灯在日常使用中仍占据着非常高的比例，为了减少浪费，利用现有接口，不需要更换原传统灯具基座和线路的LED球泡灯就应运而生。对于室内照明用LED球泡灯，对其光强分布和亮度的基本要求是：灯泡发光不仅要具备全方向性，而且光强分布要尽量均匀，球泡上部和侧部光通量要达到一定值，避免明暗不均，否则，使用者就会感到心情压抑。其建议的光照强度值是：作业区为100-300cd/㎡，顶棚为100-300 cd/㎡，墙面为50-150 cd/㎡。为规范LED球泡灯生产，美国能源之星于2009年底发布了LED照明的新标准，在标准中规定了全方向LED灯（也称做无方向灯）的光强分布。在此规定中，灯泡正下方规定是0度的情况下，在其两侧各135°的范围内，任何角度的发光强度都不得低于平均发光强度的20％，在135度-180度范围内，其光通量至少要达到灯总光通量的5%。也就是在灯泡侧下区270度范围内发光强度大而且要分布均匀，顶部90度范围内光通量不能太小。 
众所周知， LED光源由于封装的原因，其发光面最大为180度，半强度角一般最大为140度左右。现有使用的LED 球泡灯，大多是将板式LED集成模块光源植入球泡内，发光面窄，无法实现全方位发光。专利号为200920206369.2的中国专利公开了“一种球泡灯”，虽能实现较大角度发光，但结构复杂，接触面多，不但制作困难，而且散热效果差，使用寿命短，也不适合贴装大功率芯片。申请号为201010146167.0的中国发明专利申请公开了“可提高光通性的LED球泡灯”，LED模组固定在斜面上，虽出光角度变大，但球泡尾端光通量少，达不到全方位发光要求，同时也存在着结构复杂，制作困难，散热效果差，使用寿命短的缺点。还有的LED 球泡灯采用特殊透镜配光，即在现LED灯的基础上，通过在周围的LED灯珠上安装向上散光的透镜，虽能在光强分布上满足标准要求，但由于不同颜色的光折射率存在着差异，极易产生光色温不一致性的现象，造成视觉疲劳。 
发明内容
本发明要解决的技术问题是提供一种结构简单、便于安装、散热效果好的全方位LED球泡灯。 
为解决上述技术问题，本发明包括灯头、散热壳体、LED光源和灯罩，所述散热壳体腔体内设有线路板，其结构特点是散热壳体沿轴向设有外凸的平台，平台顶面设有LED光源；所述LED光源为柱头集成发光光源，其封装架体设有多棱状柱头，在柱头的顶面和侧面均设有LED芯片，架体柱头后端设有环状反光面，所述散热壳体呈梭形，灯罩与散热壳体平台顶端相接。 
优选的是所述反光面与架体轴向夹角α为15度至35度。 
更为优选的是所述反光面与柱状架体轴向夹角α为20度至30度。 
所述平台上设有安装孔，架体尾端设在安装孔内，并与凸台螺纹连接。 
所述LED光源架体的柱头为六棱状，各个侧面上均设有LED芯片，顶部和侧部的LED芯片由透镜一体式封装。 
所述反光面与架体为一体式。 
所述LED光源与散热壳体间设有绝缘材料，LED光源后端设有紧固螺母，紧固螺母上设有电极接头。 
由于本发明的散热壳体设有向外凸起的平台，平台顶面上设有LED光源，LED光源架体为多棱柱状，其柱头为光源点，发光点与灯尾距离远，其后端的散热器挡光范围小，柱头侧、顶面均设有LED芯片，并采用透镜集成封装，柱头后端设有反光面，不仅灯体后端光通量大，实现了全方位发光，而且灯体侧、下部光照强度均匀，光线柔和。LED光源架体顶面和侧面均为平面，LED芯片封装容易，加工方便，LED光源架体与平台紧密结合，热阻小，散热效果好，使用寿命长。 
附图说明
图1是本发明的结构示意图； 
图2是本发明LED光源侧视图；
图3是本发明LED光源顶面示意图；
图4是本发明另一实施例结构示意图。
具体实施方式
由图1至图3所示，本实施例包括灯头1、散热壳体2、LED光源3和灯罩4，所述散热壳体2腔体内设有线路板5。灯头1为E27灯头，其下部紧固接有铝质散热壳体2，散热壳体2外设有散热鳍片，散热壳体2沿轴向设有外凸的平台6，平台6中心设有安装孔7，LED光源3设在平台6上。LED光源3为柱头集成发光光源，其封装架体8设有多棱状柱头，图中所示多棱状柱头为六棱状，当然根据需要也可以采用八棱甚至更多棱柱体，在柱头的顶面和各个侧面均设有LED芯片9。散热壳体平台6的台壁最好在10至30毫米，以确保散热效果。柱头顶部和侧部的LED芯片9由硅胶透镜12一体式封装，架体8的尾端设在平台6的安装孔7内，并与凸台6螺纹连接，架体8底座与平台6紧密连接，架体8尾端的引线电极11与线路板5电连接。架体8柱头后端设有环状反光面10，该反光面10与架体8为一体式；反光面10与架体8轴向夹角α为15度至35度，所述夹角α比较优选的角度在20至30度。 
图4所示实施例，散热壳体2呈梭形，灯罩4与散热壳体平台6顶端相接，散热壳体2外凸的平台6只有少部分位于灯罩4内，散热鳍片延伸至平台6顶端，增加了散热面积。LED光源3与散热壳体2间设有绝缘材料13，LED光源3后端设有紧固螺母14，该紧固螺母14将LED光源3固定在散热壳体2上，紧固螺母14上设有电极接头15。 

Claims (7)

1.一种全方位LED球泡灯，包括灯头（1）、散热壳体（2）、LED光源（3）和灯罩（4），所述散热壳体（2）腔体内设有线路板（5），其特征是所述散热壳体（2）沿轴向设有外凸的平台（6），平台（6）顶面设有LED光源（3），所述LED光源（3）为柱头集成发光光源，其封装架体（8）设有多棱状柱头，在柱头的顶面和侧面均设有LED芯片（9），架体（8）柱头后端设有环状反光面（10），所述散热壳体（2）呈梭形，灯罩（4）与散热壳体平台（6）顶端相接。
2.按照权利要求1所述的全方位LED球泡灯，其特征是所述反光面（10）与架体（8）轴向夹角α为15度至35度。
3.按照权利要求2所述的全方位LED球泡灯，其特征是所述反光面（10）与柱状架体（8）轴向夹角α为20度至30度。
4.按照权利要求1所述的全方位LED球泡灯，其特征是所述平台（6）上设有安装孔（7），架体（8）尾端设在安装孔（7）内，并与凸台（6）螺纹连接。
5.按照权利要求4所述的全方位LED球泡灯，其特征是所述架体（8）的柱头为六棱状，其各个侧面上均设有LED芯片（9），顶部和侧部的LED芯片（9）由透镜（12）一体式封装。
6.按照权利要求1所述的全方位LED球泡灯，其特征是所述反光面（10）与架体（8）为一体式。
7.按照权利要求1所述的全方位LED球泡灯，其特征是所述LED光源（3）与散热壳体（2）间设有绝缘材料（13），LED光源（3）后端设有紧固螺母（14），紧固螺母（14）上设有电极接头（15）。
CN2010105830960A 2010-12-11 2010-12-11 全方位led球泡灯 Active CN102003647B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2010105830960A CN102003647B (zh) 2010-12-11 2010-12-11 全方位led球泡灯
PCT/CN2011/082941 WO2012075891A1 (zh) 2010-12-11 2011-11-25 全方位led球泡灯
US13/884,876 US8979310B2 (en) 2010-12-11 2011-11-25 Omnidirectional LED light bulb
ZA2013/02399A ZA201302399B (en) 2010-12-11 2013-04-03 Omnidirectional led light bulb

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CN2010105830960A CN102003647B (zh) 2010-12-11 2010-12-11 全方位led球泡灯

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KR101326518B1 (ko) 2011-09-02 2013-11-07 엘지이노텍 주식회사 조명 장치
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CN102003647A (zh) 2011-04-06
US20140043823A1 (en) 2014-02-13
WO2012075891A1 (zh) 2012-06-14
ZA201302399B (en) 2014-08-27
WO2012075891A8 (zh) 2013-03-21
US8979310B2 (en) 2015-03-17

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