CN101998801A

CN101998801A - Radiating device

Info

Publication number: CN101998801A
Application number: CN2009101629698A
Authority: CN
Inventors: 杨右权; 孔小明; 杨正东
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2009-08-20
Filing date: 2009-08-20
Publication date: 2011-03-30

Abstract

The embodiment of the present invention discloses a heat dissipation device. The heat dissipation device is arranged on a printed circuit board (PCB) on which at least two optical module housings are fixed. The heat dissipation device includes a heat sink and a pressing structure; The upper surface and the lower surface of the module housing are respectively provided with an upper window and a lower window, and the lower window is adapted to the through hole on the PCB; the pressing structure includes a fixing piece and a pressing block connected to the bottom of the PCB through the fixing piece; the pressing piece A part passes through the through hole of the PCB and the lower window of the optical module housing, elastically pushes into the inner space of the optical module housing to contact the lower surface of the optical module; the heat sink includes a heat dissipation substrate that covers the optical module housing and is fixed on the PCB; At the position corresponding to the optical module housing, the heat dissipation substrate has a boss protruding into the inner space of the optical module housing through the upper window to contact the upper surface of the optical module; the distance between the boss and the pressing block is less than the height of the optical module . The embodiment of the present invention can facilitate the insertion and removal of the optical module, so that the optical module can dissipate heat in time.

Description

Heat abstractor

Technical field

The present invention relates to the electronic communication field, particularly a kind of heat abstractor.

Background technology

Because the integrated function of electronic equipment gets more and more, its inner PCB (Printed CircuitBoard, printed circuit board (PCB)) power consumption on is also increasing, and can some Primary Components wherein, the heat-sinking capability of module have determined electronic functionalities further promote.

The XFP that uses in the electronic equipment (10 Gigabit Small Form Factor Pluggable, the 10G small dimension can plug) optical module is a kind of light transceiving integrated module (hereinafter all abbreviating the XFP optical module as optical module), being the optical active devices of realizing light-electricity conversion and electrical-optical conversion, is the critical function module in the communication apparatus such as transmission, access.Along with the continuous lifting of key technical index such as device bandwidth and transmission range, using a plurality of optical modules with transceiver function on same veneer simultaneously is a kind of development trends.

But optical module can produce a large amount of heats in communication, therefore need be to optical module heat radiation in time to guarantee the normal operation of whole electric equipment.Past is that each optical module is equipped with a radiator, this can make cooling fluid absorb the optical module of upstream and the heat of radiator heats up, cause the optical module and the radiator thereof in downstream are not had good thermolysis, so adopting the shared radiator of a plurality of optical modules will be a good solution, as shown in Figure 1.Can there be a problem in shared radiator: because there is machining tolerance in the height of optical module 10 ' itself, so can use the distance difference between flexible cooling pad 30 ' come balance optical modules 10 ' and the radiator base plate 20 ' during a shared radiator, even still can't carrying out good heat radiating by radiator, like this, lower optical module 10 ' cause temperature too high.

Have two kinds of schemes to address the above problem at present:

First kind of solution is that a plurality of optical modules are fixed on the radiator base plate, realizes that thus optical module and the good of radiator base plate contact.This programme is that optical module and radiator are plugged on PCB as an integral device.

Second kind of solution is that optical module is made the wedge structure, and simultaneously, the counterpart of radiator is also done the structure of wedgewise.Each optical module can plug separately in this scheme, and can guarantee contacting between optical module and the radiator base plate by control optical module insertion depth in the horizontal direction.

The inventor is in implementing process of the present invention, and there are the following problems at least to find prior art:

In first kind of solution, if one of them optical module needs to change, entire device all will be extracted, and can have influence on the business that other optical modules are born on this device, can't carry out the plug of single optical module; Second kind of solution need adopt the optical module of special off-standard size, greatly reduces the availability of this scheme.

Summary of the invention

The purpose of the embodiment of the invention provides a kind of heat abstractor, and normal optical module in the prior art can't plug and the problem of weak heat-dissipating to solve.

The embodiment of the invention provides a kind of heat abstractor, is arranged on the printing board PCB, and described PCB sets firmly at least two optical module housings, and described heat abstractor comprises the compressing structure of at least two optical module housings on radiator and the corresponding described PCB;

Have at least two through holes on the described PCB, the upper surface of each optical module housing and lower surface have window and following window, and the following window of described at least two optical module housings adapts with two through holes of described PCB respectively at least;

Described compressing structure comprises briquetting and fixture, and described briquetting is connected the PCB bottom by fixture; The part of described briquetting is passed the through hole of described PCB and the following window of optical module housing, and the inner space of elastic top light inlet module housing is with the lower surface of contact optical module;

Described radiator comprises heat-radiating substrate, and described heat-radiating substrate covers described at least two optical module housings and is fixed on the described PCB; Described heat-radiating substrate has and passes window and protrude into the boss of optical module enclosure interior space with contact optical module upper surface on the position corresponding with the optical module housing; Distance between described boss and the briquetting is less than the height of optical module.

The heat abstractor of the embodiment of the invention has increased boss on heat-radiating substrate, use flexible compressing structure that the optical module that inserts the optical module housing is fixed, by being used of boss and compressing structure, realized that the plug that makes things convenient for of optical module contacts with the tight of radiator with optical module.

Description of drawings

Fig. 1 is the structural representation of known heat abstractor;

Fig. 2 is the front view of the heat abstractor of the embodiment of the invention;

Fig. 3 a is the end view one of the compressing structure of the embodiment of the invention;

Fig. 3 b is the end view two of the compressing structure of the embodiment of the invention;

Fig. 4 a is the end view three of the compressing structure of the embodiment of the invention;

Fig. 4 b is the end view four of the compressing structure of the embodiment of the invention.

Embodiment

For above-mentioned purpose, the feature and advantage that make the embodiment of the invention can become apparent more, the embodiment of the invention is described in further detail below in conjunction with the drawings and specific embodiments.

The embodiment of the invention provides a kind of heat abstractor, as shown in Figure 2, described heat abstractor is arranged on the printing board PCB 10, PCB10 sets firmly at least two optical module housings 30, and described heat abstractor comprises the compressing structure 40 of at least two optical module housings 30 on radiator 20 and the corresponding described PCB10.

Described PCB10 has at least two through holes 101, and for the ease of user's use, a plurality of through holes 101 on the PCB10 are preferably in turn and are arranged in parallel.

The upper surface of each optical module housing 30 and lower surface have window 301 and following window 302, and be different with the optical module housing that only has window that prior art is used.

Described at least two optical module housings 30 are fixed on the PCB10, and the following window 302 of described at least two optical module housings 30 adapts with two through holes 101 of described PCB10 respectively at least.Through hole 101 and following window 302 can be all shapes such as rectangle or ellipse.

Described compressing structure 40 comprises briquetting 401 and fixture 402, and described briquetting 401 is connected the PCB10 bottom by fixture 402; The part of briquetting 401 is passed the through hole 101 of PCB10 and the following window 302 of optical module housing 30, and the inner space of elastic top light inlet module housing 30 is with the lower surface of contact optical module 50.

Described radiator 20 comprises heat-radiating substrate 201, and described heat-radiating substrate 201 covers above-mentioned at least two optical module housings 30 and is fixed on the PCB10; Described heat-radiating substrate 201 has and passes window 301 and protrude into the boss 2011 of optical module housing 30 inner spaces with contact optical module 50 upper surfaces on the position corresponding with optical module housing 30; Distance between boss 2011 and the briquetting 401 is less than the height of optical module 50.Described boss 2011 and last window 301 can be all shapes such as polygon or ellipse.The material of described boss 2011 is copper or aluminium.

Because optical module 50 upper surfaces of the embodiment of the invention directly contact the boss 2011 on the heat-radiating substrate 201, the elastic heat dissipating pad that the thermal-conduction resistance of the boss 2011 of copper or aluminium is used far below prior art, therefore, the heat bulk storage that optical module 50 is produced that heat abstractor of the present invention can be very fast is given radiator 20.

The fixed form of described radiator 20 and PCB10 is specifically as follows and is spirally connected or welding etc.Described being spirally connected can be for screw directly be screwed onto heat-radiating substrate 201 on the PCB10, also can fix for respectively screw is screwed to the double-screw bolt that two ends have internal thread from heat-radiating substrate 201 sides and PCB10 side.

Described compressing structure 40 can have following two kinds of implementations:

1) briquetting 401 is the rigidity piece, comprises flexible member 4021 in the fixture 402.

Described flexible member 4021 with described briquetting 401 elastic compressions on PCB10, so that the part of described briquetting 401 is passed the through hole 101 of PCB10 and the following window 302 of optical module housing 30, the inner space of elastic top light inlet module housing 30 is with the lower surface of contact optical module 50.Described flexible member 4021 is specifically as follows spring or rubber washer etc.

The briquetting 401 of described rigidity can be wedge shape, shown in Fig. 3 a.Briquetting height in the optical module porch of optical module housing 30 is lower than the briquetting height of optical module housing 30 inside.

The briquetting 401 of described rigidity can also be arch, shown in Fig. 3 b.The position of arching upward of briquetting 401 heads into the inner space of optical module housing 30.

2) fixture 402 is fixed in an end of briquetting 401 on the PCB10, and the position that described briquetting 401 links to each other with fixture 402 is a shell fragment.

The part of described briquetting 402 is passed the through hole 101 of described PCB10 and the following window 302 of optical module housing 30, and the inner space of elastic top light inlet module housing 30 is with the lower surface of contact optical module 50.Described shell fragment is specifically as follows metal clips or plastics shell fragment, and described affixed mode can be for being spirally connected etc.Described briquetting 401 can be wedge shape, and the briquetting height in the optical module porch of optical module housing 30 is lower than the briquetting height of optical module housing 30 inside, shown in 4a.

Described briquetting 401 can also be arch, shown in Fig. 4 b.The position of arching upward of briquetting 401 heads into the inner space of optical module housing 30.

Illustrated among Fig. 4 a and Fig. 4 b briquetting 401 at an end of optical module inlet by affixed situation, the other end that in fact can also be briquetting 401 is by affixed.

Certainly, described briquetting 401 also can be the shell fragment of an integral body, and those skilled in the art can be easy to make multiple modification and retouching according to the thought of the embodiment of the invention.

After optical module 50 is inserted into optical module housing 30, because the distance between briquetting 401 and the boss 2011 is less than the height of optical module 50, therefore, optical module 50 can press down briquetting 401, briquetting 401 is subjected to pressing down of optical module 50 can make generation back stretch upwards in the whole compressing structure 40, makes briquetting 401 upwards push optical module 50 from the bottom; Simultaneously, the boss 2011 on the heat-radiating substrate 201 can protrude into optical module housing 30 inside, has solved the problem that optical module 50 that the thickness reason owing to optical module housing 30 upper surfaces causes does not reach heat-radiating substrate 201.By being used of boss 2011 and compressing structure 40, solved the problem that part optical module that the machining tolerance by optical module causes can't closely contact with radiator.

In addition, the embodiment of the invention is all to be fixed on optical module housing 30 and radiator 20 on the PCB10, use the optical module 50 of 40 pairs of insertions of flexible compressing structure to fix, realized to plug optical module 50 easily, improved the operating efficiency of changing optical module 50.

Because what the heat abstractor of the embodiment of the invention was changed in use only is optical module, it is less that therefore operation plugs required space, can make electronic equipment better utilization space.

To sum up, the heat abstractor of the embodiment of the invention has increased boss on heat-radiating substrate, use flexible compressing structure that the optical module that inserts the optical module housing is fixed, by being used of boss and compressing structure, realized that the plug that makes things convenient for of optical module contacts with the tight of radiator with optical module.

Need to prove, in this article, relational terms such as first and second grades only is used for an entity or operation are made a distinction with another entity or operation, and not necessarily requires or hint and have the relation of any this reality or in proper order between these entities or the operation.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby make and comprise that process, method, article or the equipment of a series of key elements not only comprise those key elements, but also comprise other key elements of clearly not listing, or also be included as this process, method, article or equipment intrinsic key element.Do not having under the situation of more restrictions, the key element that limits by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises described key element and also have other identical element.

The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.All any modifications of being done within the spirit and principles in the present invention, be equal to replacement, improvement etc., all be included in protection scope of the present invention.

Claims

1. A heat dissipation device is arranged on a printed circuit board PCB, and the PCB is fixed with at least two optical module housings, wherein the heat dissipation device includes a heat sink and at least two optical modules corresponding to the PCB The compression structure of the shell;

The PCB has at least two through holes, and the upper surface and the lower surface of each optical module housing are respectively provided with an upper window and a lower window, and the lower windows of the at least two optical module housings are respectively connected to the PCB. At least two through holes are compatible;

The pressing structure includes a pressing block and a fixing part, and the pressing block is connected to the bottom of the PCB through the fixing part; a part of the pressing block passes through the through hole of the PCB and the lower window of the optical module housing, and the elastic top enters the light the inner space of the module housing to contact the lower surface of the optical module;

The heat sink includes a heat dissipation substrate, the heat dissipation substrate covers the at least two optical module housings and is fixed on the PCB; the heat dissipation substrate is at a position corresponding to the optical module housing, and has a The boss protrudes into the inner space of the optical module housing to contact the upper surface of the optical module; the distance between the boss and the pressing block is smaller than the height of the optical module.

2. The heat dissipation device according to claim 1, wherein the fixing member includes an elastic element, and the elastic element elastically presses the pressing block on the PCB, so that a part of the pressing block passes through Through the through hole of the PCB and the lower window of the optical module housing, elastically push into the inner space of the optical module housing to contact the lower surface of the optical module.

3. The heat dissipation device according to claim 2, wherein the elastic element is a spring or a rubber washer.

4. The heat dissipating device according to claim 1, wherein the fixing member fixes one end of the pressing block on the PCB, the part where the pressing block is connected to the fixing member is a shrapnel, and a part of the pressing block Pass through the through hole of the PCB and the lower window of the optical module housing, elastically push into the inner space of the optical module housing to contact the lower surface of the optical module.

5. The heat dissipation device according to claim 4, wherein the elastic sheet is a metal elastic sheet or a plastic elastic sheet.

6. The heat dissipation device according to any one of claims 1-5, wherein the pressing block is wedge-shaped, and the height of the pressing block at the optical module entrance of the optical module housing is lower than the height of the optical module housing inside. Briquetting height.

7. The heat dissipation device according to any one of claims 1-5, wherein the pressing block is arched, and the arched part of the pressing block pushes into the inner space of the optical module housing.

8. The heat dissipation device according to any one of claims 1-5, wherein the heat sink and the PCB are fixed by screwing or welding.

9. The heat dissipation device according to any one of claims 1-5, wherein the through hole and the lower window are rectangular.

10. The heat dissipation device according to any one of claims 1-5, wherein the boss is made of copper or aluminum.