CN101980589B - Method for manufacturing power module circuit board, power module and magnetic core of power module - Google Patents
Method for manufacturing power module circuit board, power module and magnetic core of power module Download PDFInfo
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- CN101980589B CN101980589B CN201010521469A CN201010521469A CN101980589B CN 101980589 B CN101980589 B CN 101980589B CN 201010521469 A CN201010521469 A CN 201010521469A CN 201010521469 A CN201010521469 A CN 201010521469A CN 101980589 B CN101980589 B CN 101980589B
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- magnetic core
- circuit board
- power module
- top layer
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 23
- 238000004804 winding Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 117
- 230000005855 radiation Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a method for manufacturing a power module circuit board, a power module and a magnetic core of the power module, which aim to save layout space of the circuit board and contribute to high-density miniaturization design of the power module and heat dissipation of the magnetic core. The method of the embodiment of the invention comprises the following steps of: embedding a part of the magnetic core of the power module into the circuit board to form a whole body with the circuit board and forming an adhesive surface on the surface of the circuit board; exposing the other part of the magnetic core of the power module outside the circuit board; and electrically connecting the two parts of the magnetic core of the power module with glue. The embodiment of the invention can be used in the power module; and the circuit board and the magnetic core of the power module are unnecessary components for the power module.
Description
Technical field
The present invention relates to power technique fields, particularly a kind of manufacture method of power module circuitry plate, power module and magnetic core thereof.
Background technology
Magnetic core is the requisite material of power module, be mainly used in the transformer and inductance of power module, and the layout area of transformer and the used magnetic core of inductance accounts for 30% of power module area.Be connected the following two types of technology of current existence what realize magnetic core and power module:
The first kind is conventional magnetic core adhesive technology; This technology comprises two kinds: a kind of is that common magnetic core is bonding, the winding of power module is made in circuit board inside, in the zone of layout magnetic core; Circuit board is done the fluting design; Magnetic core is divided into magnetic core and following magnetic core two parts, and two parts all be expression in the circuit board outside, be connected with power module through bonding realization; Another kind is the individual devices welding of band magnetic core, and magnetic core is connected with power module through the mode of welding as the part of individual devices.
Second type is that planar magnetic core integral body is imbedded technology, and whole planar magnetic core is all imbedded circuit board inside, and the winding of power module is made up of circuit board, but the circuit board at magnetic core place top layer other components and parts of layout all up and down, like resistance, electric capacity etc.This technology is different according to the disposing way of imbedding the circuit board inner core, can be divided into horizontal magnetic and the vertical magnetic that buries of burying again.
The inventor finds in realizing process of the present invention, and conventional magnetic core adhesive technology takies the arrangement space of circuit board, is unfavorable for the highly dense miniaturization Design of power module; And planar magnetic core integral body is imbedded technology, because whole magnetic core is imbedded circuit board inside, can not directly dispel the heat through radiator, is unfavorable for the magnetic core heat radiation.
Summary of the invention
The embodiment of the invention provides a kind of manufacture method, power module and magnetic core thereof of circuit board, can save the arrangement space of printed circuit board, helps the highly dense miniaturization Design of power module, helps the magnetic core heat radiation simultaneously.
The embodiment of the invention adopts following technical scheme:
A kind of manufacture method of power module circuitry plate comprises:
It is inner that the part of power module magnetic core is imbedded said circuit board, forms an integral body with said circuit board, and form bonding plane at the upper surface of the part of this power module magnetic core;
Expose at said circuit board another part of power module magnetic core outside;
Two parts of said power module magnetic core are realized being electrically connected through the glue mode.
A kind of power module comprises magnetic core, and it is inner that the part of said magnetic core is imbedded said circuit board, forms an integral body with said circuit board, and forms bonding plane at the upper surface of the part of this magnetic core; Another part of said magnetic core exposes at said circuit board outside; Two parts of said magnetic core realize being electrically connected through the glue mode.
A kind of magnetic core of power module comprises: following magnetic core and last magnetic core; It is inner that said magnetic core is down imbedded said circuit board, forms an integral body with said circuit board, and form bonding plane at the said upper surface of magnetic core down; The said magnetic core of going up exposes at said circuit board outside; Said magnetic core down and the said magnetic core of going up are realized being electrically connected through the glue mode.
Technique scheme by the embodiment of the invention can know that through the part of magnetic core is imbedded circuit board inside, another part exposes at circuit board outside, and two parts of magnetic core realize being electrically connected through the glue mode; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand; Can save the arrangement space of circuit board; The highly dense miniaturization Design that helps power module can solve the difficult problem of magnetic core heat radiation through radiator again on the other hand, helps the magnetic core heat radiation.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention, the accompanying drawing of required use is done an introduction simply in will describing embodiment below.
The sectional view of the magnetic core of the power module that Fig. 1 provides for the embodiment of the invention;
The vertical view of the magnetic core of the power module that Fig. 2 provides for the embodiment of the invention;
The flow process chart of the first circuit board daughter board of the band winding that Fig. 3 provides for the embodiment of the invention;
The flow process chart of the second circuit board daughter board of the band winding that Fig. 4 provides for the embodiment of the invention;
The flow process chart of the circuit board panel that Fig. 5 provides for the embodiment of the invention;
The flow chart that Fig. 6 assembles for the circuit board that the embodiment of the invention provides;
The schematic flow sheet of the manufacture method of the power module circuitry plate that Fig. 7 provides for the embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is carried out clear, intactly description.
Referring to Fig. 1 and Fig. 2, the vertical view of the magnetic core of the power module that the sectional view of the magnetic core of the power module that Fig. 1 provides for the embodiment of the invention, Fig. 2 provide for the embodiment of the invention.
The magnetic core of the power module that the embodiment of the invention provides comprises: following magnetic core and last magnetic core; Said magnetic core down at the power module circuitry plate (for example: PCB; Printed Circuit Board) imbeds said circuit board inside in the manufacturing process; Form an integral body with said circuit board, and after said circuit board machines, form bonding plane at the said upper surface of magnetic core down; The said magnetic core of going up exposes at said circuit board outside; Said magnetic core down and the said magnetic core of going up are realized being electrically connected through the glue mode in said circuit board group process of assembling.
Hence one can see that, and the magnetic core of the power module that the embodiment of the invention provides is imbedded circuit board inside through descending magnetic core, and last magnetic core exposes at circuit board outside, realizes magnetic core two-part being electrically connected up and down through the glue mode; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand; As shown in Figure 1, device 1 just is mounted on top layer under the regional circuit board that belongs to of magnetic core with device 2, can save the arrangement space of circuit board; For the highly dense miniaturization of power module provides good solution; The highly dense miniaturization Design that helps power module can solve the difficult problem of magnetic core heat radiation through radiator again on the other hand, helps the magnetic core heat radiation.
Preferably, the bonding plane that the said upper surface of imbedding the inner following magnetic core of circuit board forms is lower than said circuit board top layer or flushes with said circuit board top layer, can avoid like this in circuit board making process or circuit board group process of assembling, damaging magnetic core.
In addition, when the power module circuitry plate was assembled, the bonding plane of following magnetic core was similar to the pad of circuit board; Last magnetic core is similar to the surface mounting component of circuit board, through being employed in seal glue or some glue on the said pad, perhaps on said pad, applies the mode of one deck glue like this; Can two parts up and down of magnetic core be realized being electrically connected; Thereby can realize the automatic Surface Mount of magnetic core, need manual bonding comparing, can reduce assembly cost with the installation of present magnetic core.
Referring to the making flow chart of the power module circuitry plate of Fig. 3 to Fig. 6, wherein, Fig. 3 is the flow process chart of the first circuit board daughter board of band winding; Fig. 4 is the flow process chart of the second circuit board daughter board of band winding; Fig. 5 is the flow process chart of circuit board panel; Fig. 6 is the flow chart of circuit board assembling.
As shown in Figure 3, the work flow of the first circuit board daughter board of band winding comprises:
S11 opens material (first daughter board comprises TOP face, winding etc.) → first daughter board internal layer circuit making → brown → pressing → drilling blind hole → blind hole metallization.
S12, fluting 1: needs are imbedded down the corresponding daughter board fluting in magnetic core zone, and magnetic core is put into slot area under being convenient to.
S13, the first daughter board outer-layer circuit is made: the circuit of only doing the daughter board one side.
S14, filling holes with resin: fill blind hole 1 with resin material, and guarantee that resin face and copper face keep smooth.
As shown in Figure 4, the work flow of the second circuit board daughter board of band winding comprises:
S21, open material: second daughter board comprises the PP sheet, core material and BOTTOM (end) face central layer etc.
S22, fluting 2: needs are imbedded down the corresponding core material in magnetic core zone, BOTTOM face central layer, PP sheet fluting, and the fluting size makes that magnetic core can be placed slot area smoothly down.
S23, the second daughter board internal layer circuit is made: make layer pattern in the circuit board except that first daughter board.
As shown in Figure 5, the work flow of circuit board panel comprises:
S31, lamination: first daughter board after the above-mentioned processing and second daughter board are stacked in order, and will descend magnetic core to put into corresponding slot area.
S32, pressing: will descend magnetic core, first daughter board and second daughter board to be pressed into an integral body.
S33 drills through hole → via metalization → making outer graphics.
S34, resistance weldering plug through hole → control deep drilling blind hole 2 → circuit board top layer processing → circuit board panel machines.
As shown in Figure 6, circuit board assembling flow process comprises:
S41, Yin Xi, some glue: print solder paste on board pads, at bonding plane coating one deck glue of following magnetic core.
S42 pastes part, backflow: will go up magnetic core and other device is mounted on the circuit board, and through refluxing, accomplish assembling.
In sum, referring to Fig. 7, the manufacture method of the power module circuitry plate that the embodiment of the invention provides comprises:
S1 imbeds circuit board inside with the part of power module magnetic core, forms an integral body with said circuit board, and forms bonding plane at one one upper surface of this power module magnetic core;
S2 exposes at said circuit board another part of power module magnetic core outside;
S3 realizes two parts of said power module magnetic core to be electrically connected through the glue mode.
Need to prove:
A, because that magnetic core is prone to is broken, therefore imbed bonding plane that the upper surface of the part of the inner power module magnetic core of circuit board forms and must be lower than the circuit board top layer or flush with the circuit board top layer at least.
B, when the power module circuitry plate is assembled; Imbed the pad that bonding plane that the upper surface of the part of the inner power module magnetic core of circuit board forms is similar to circuit board; Expose the surface mounting component that is similar to circuit board at another part of the outside power module magnetic core of said circuit board, the mode through glue between two parts of power module magnetic core realizes being electrically connected.
The circuit board winding of c, power module is positioned at the zone of imbedding the inner power module magnetic core of circuit board, is realized by the circuit board coil, connects through blind hole or through hole between the winding.
D, the circuit board top layer that belongs in power module magnetic core zone do not influence other components and parts of layout, thereby can effectively utilize the arrangement space of circuit board.
Hence one can see that, the manufacture method of the power module circuitry plate that the embodiment of the invention provides, and through the part of magnetic core is imbedded circuit board inside, another part exposes at circuit board outside, and two parts of magnetic core realize being electrically connected through the glue mode; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand; Can save the arrangement space of circuit board; The highly dense miniaturization Design that helps power module can solve the difficult problem of magnetic core heat radiation through radiator again on the other hand, helps the magnetic core heat radiation.
In addition; Owing to imbed the pad that bonding plane that the upper surface of the part of the inner power module magnetic core of circuit board forms is similar to circuit board; Expose the surface mounting component that is similar to circuit board at another part of the outside power module magnetic core of circuit board; Therefore can realize automatic Surface Mount, need manual bonding comparing, can reduce assembly cost with the installation of present magnetic core.
Still referring to Fig. 1 and Fig. 2; The power module that the embodiment of the invention provides; Comprise magnetic core, the part of said magnetic core is imbedded said circuit board in the power module circuitry plate course of processing inner, forms an integral body with said circuit board; And after said circuit board machines, form bonding plane at the upper surface of the part of said magnetic core; Another part of said magnetic core exposes at said circuit board outside; Two parts of said magnetic core realize being electrically connected through the glue mode in said circuit board group process of assembling.
Hence one can see that, the power module that the embodiment of the invention provides, and through the part of magnetic core is imbedded circuit board inside, another part exposes at circuit board outside, and two parts of magnetic core realize being electrically connected through the glue mode; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand; Can save the arrangement space of circuit board; For the highly dense miniaturization of power module provides good solution, can solve the problem of magnetic core heat radiation difficulty on the other hand again through radiator.
Preferably, the bonding plane that the said upper surface of imbedding the part of the inner magnetic core of circuit board forms is lower than said circuit board top layer or flushes with said circuit board top layer, can avoid like this in circuit board making process or circuit board group process of assembling, damaging magnetic core.
It is understandable that in addition; When the power module circuitry plate is assembled; Imbed the pad that bonding plane that the upper surface of the part of the inner magnetic core of circuit board forms is similar to circuit board, expose the surface mounting component that then is similar to circuit board at another part of the outside magnetic core of circuit board, like this through being employed in seal glue or some glue on the said pad; Perhaps on said pad, apply the mode of one deck glue, can two parts up and down of magnetic core be realized being electrically connected.Therefore can realize the automatic Surface Mount of magnetic core, need manual bonding comparing, can reduce assembly cost with the installation of present magnetic core.
Above-mentioned specific embodiment is not in order to restriction the present invention; For those skilled in the art; All under the prerequisite that does not break away from the principle of the invention, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the manufacture method of a power module circuitry plate is characterized in that, comprising:
The part of power module magnetic core is imbedded circuit board inside, form an integral body, and form bonding plane at the upper surface of the part of this power module magnetic core with said circuit board;
Expose at said circuit board another part of power module magnetic core outside;
Two parts of said power module magnetic core are realized being electrically connected through the glue mode.
2. method according to claim 1 is characterized in that, it is inner that the part of power module magnetic core is imbedded said circuit board, forms an integral body with said circuit board and comprises:
The first circuit board daughter board of difference processing belt winding and the second circuit board daughter board of band winding;
According to the shape of the part of the said power module magnetic core that is embedded into, slot respectively at said first circuit board daughter board and the corresponding position of said second circuit board daughter board;
Said first circuit board daughter board and said second circuit board daughter board behind the fluting are stacked in order, and the part of said power module magnetic core is put into corresponding slot area;
A part and said two circuit board daughter boards that are stacked together of said power module magnetic core are pressed into an integral body.
3. method according to claim 1 is characterized in that, the bonding plane that the said upper surface of imbedding the part of the inner power module magnetic core of circuit board forms is lower than said circuit board top layer or flushes with said circuit board top layer.
4. according to the arbitrary described method of claim 1-3, it is characterized in that said method also comprises:
The layout components and parts on the circuit board top layer of power module magnetic core region.
5. a power module is characterized in that, comprises magnetic core, and the part of said magnetic core is imbedded said power module circuitry intralamellar part, forms an integral body with said circuit board, and forms bonding plane at the upper surface of the part of this magnetic core; Another part of said magnetic core exposes at said circuit board outside; Two parts of said magnetic core realize being electrically connected through the glue mode.
6. power module according to claim 5 is characterized in that, the bonding plane that the said upper surface of imbedding the part of the inner magnetic core of circuit board forms is lower than said circuit board top layer or flushes with said circuit board top layer.
7. according to claim 5 or 6 described power modules, it is characterized in that the winding of said power module is positioned at the said part zone on every side of imbedding the inner magnetic core of circuit board.
8. power module according to claim 7 is characterized in that, layout has components and parts on the circuit board top layer of said magnetic core region.
9. the magnetic core of a power module is characterized in that, comprising: following magnetic core and last magnetic core; Said magnetic core is down imbedded circuit board inside, forms an integral body with said circuit board, and forms bonding plane at the said upper surface of magnetic core down; The said magnetic core of going up exposes at said circuit board outside; Said magnetic core down and the said magnetic core of going up are realized being electrically connected through the glue mode.
10. the magnetic core of power module according to claim 9 is characterized in that, the bonding plane that the upper surface of said magnetic core down forms is lower than said circuit board top layer or flushes with said circuit board top layer.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010521469A CN101980589B (en) | 2010-10-27 | 2010-10-27 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
| BRPI1106079A BRPI1106079B8 (en) | 2010-10-27 | 2011-05-30 | method of making a power module, power module, and magnetic core circuit board |
| MX2011013414A MX2011013414A (en) | 2010-10-27 | 2011-05-30 | Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof. |
| PCT/CN2011/074905 WO2011137845A1 (en) | 2010-10-27 | 2011-05-30 | Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof |
| HU1200280A HU230993B1 (en) | 2010-10-27 | 2011-05-30 | Manufacturing method for power supply module circuit board, power supply module and megnetic core thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010521469A CN101980589B (en) | 2010-10-27 | 2010-10-27 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101980589A CN101980589A (en) | 2011-02-23 |
| CN101980589B true CN101980589B (en) | 2012-10-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010521469A Active CN101980589B (en) | 2010-10-27 | 2010-10-27 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN101980589B (en) |
| BR (1) | BRPI1106079B8 (en) |
| HU (1) | HU230993B1 (en) |
| MX (1) | MX2011013414A (en) |
| WO (1) | WO2011137845A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980589B (en) * | 2010-10-27 | 2012-10-17 | 华为技术有限公司 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
| CN102325429B (en) * | 2011-08-15 | 2016-09-14 | 深圳市核达中远通电源技术有限公司 | A kind of upper and lower magnetic core method of the modular power source that bonds |
| CN102686025B (en) * | 2012-05-07 | 2016-03-30 | 华为技术有限公司 | The printed circuit board (PCB) of power module, power module and manufacture method thereof |
| CN104183358B (en) * | 2014-08-09 | 2017-12-12 | 乐清市华信电子有限公司 | Filter module |
| US10308480B2 (en) | 2016-07-08 | 2019-06-04 | Otis Elevator Company | Embedded power module |
| GB2567227A (en) | 2017-10-06 | 2019-04-10 | Heyday Integrated Circuits | Galvanically isolated gate drive circuit with power transfer |
| CN108471670B (en) * | 2018-05-09 | 2024-07-12 | 天芯互联科技有限公司 | Buried power supply module structure and manufacturing method thereof |
| CN113194630B (en) * | 2021-04-21 | 2023-10-27 | 深圳市汇川技术股份有限公司 | Planar magnetic part and manufacturing method thereof |
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| US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
| US6189203B1 (en) * | 1999-04-08 | 2001-02-20 | Lucent Technologies Inc. | Method of manufacturing a surface mountable power supply module |
| CN1926646A (en) * | 2004-03-10 | 2007-03-07 | Det国际控股有限公司 | Magnetic part |
| CN101312615A (en) * | 2007-05-25 | 2008-11-26 | 日本梅克特隆株式会社 | Printed circuit board and manufacturing method thereof |
| CN101778539A (en) * | 2009-12-23 | 2010-07-14 | 深南电路有限公司 | A kind of PCB processing technology method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5781091A (en) * | 1995-07-24 | 1998-07-14 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
| CN100584144C (en) * | 2007-02-09 | 2010-01-20 | 西安交通大学 | A passive base board for the switch power module and its making method |
| US8094458B2 (en) * | 2008-03-24 | 2012-01-10 | Microsemi Corporation | Semiconductor package with embedded magnetic component and method of manufacture |
| CN101980589B (en) * | 2010-10-27 | 2012-10-17 | 华为技术有限公司 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
-
2010
- 2010-10-27 CN CN201010521469A patent/CN101980589B/en active Active
-
2011
- 2011-05-30 MX MX2011013414A patent/MX2011013414A/en active IP Right Grant
- 2011-05-30 HU HU1200280A patent/HU230993B1/en unknown
- 2011-05-30 WO PCT/CN2011/074905 patent/WO2011137845A1/en active Application Filing
- 2011-05-30 BR BRPI1106079A patent/BRPI1106079B8/en active IP Right Grant
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
| US6189203B1 (en) * | 1999-04-08 | 2001-02-20 | Lucent Technologies Inc. | Method of manufacturing a surface mountable power supply module |
| CN1926646A (en) * | 2004-03-10 | 2007-03-07 | Det国际控股有限公司 | Magnetic part |
| CN101312615A (en) * | 2007-05-25 | 2008-11-26 | 日本梅克特隆株式会社 | Printed circuit board and manufacturing method thereof |
| CN101778539A (en) * | 2009-12-23 | 2010-07-14 | 深南电路有限公司 | A kind of PCB processing technology method |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2011013414A (en) | 2012-02-21 |
| WO2011137845A1 (en) | 2011-11-10 |
| HU230993B1 (en) | 2019-08-28 |
| BRPI1106079A2 (en) | 2016-05-10 |
| BRPI1106079B1 (en) | 2020-10-20 |
| BRPI1106079B8 (en) | 2021-02-02 |
| CN101980589A (en) | 2011-02-23 |
| HUP1200280A2 (en) | 2013-01-28 |
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