CN101976716A - Method of conducting electricity through substrate holes - Google Patents

Abstract

The invention relates to a conducting method of a substrate through hole, belonging to the electric field, which mainly comprises the following steps: a release film is distributed on the two sides of the substrate; forming through holes respectively penetrating through the release films on the substrate; filling conductive adhesive in each through hole; peeling off each of the releasable films; depositing a metal conductive layer on the surface of the substrate from which the release films are separated; forming a specific molding pattern on the substrate deposited with the metal conductive layer by using a photolithography technique; in addition, the metal conducting layer is directly attached to the substrate by using a deposition technology, and meanwhile, the layout density of the LED component can be improved by using a micro-lithography process to form a small-line-width metal line.

Description

Method of conducting electricity through substrate holes

technical field

The present invention relates to electrical products, in order to provide a conductive method for substrate through-holes, especially a substrate that uses a detachable film to prevent the conductive glue from contaminating the ceramic substrate, and can form a metal conductive layer on the ceramic substrate through deposition. Method of conduction through holes.

Background technique

At present, we can already see the application of various light-emitting LED diode products in daily life, such as traffic lights, motorcycle tail lights, car headlights, street lights, computer indicator lights, flashlights, LED backlights, etc. In addition to the necessary LED chip manufacturing process, these products must go through a very important process - packaging. The function of LED packaging is to provide the necessary support for LED chip electricity, light and heat. For example, semiconductor components exposed to the atmosphere for a long time will age due to the influence of water vapor or other chemical substances in the environment, resulting in degradation of characteristics. It is an effective way to isolate the atmosphere by using high-transparency epoxy resin to coat the light-emitting diodes. In addition, selecting a suitable base material can provide sufficient heat dissipation function of the LED component, so that the reliability of the LED is greatly improved, and at the same time, the luminous efficiency of the LED grain is promoted and the service life is increased.

As shown in Figure 1, it is a schematic cross-sectional view of filling the conductive glue in the through hole of the existing substrate. In order to shorten the transmission distance of electronic signals, a through hole 10 is first formed on the substrate 1, and a metal shield 12 is arranged on the substrate 1, and Align the through hole 120 on the metal shield 12 with the through hole 10 on the substrate 1, and then pour the glue. Because of the use of this metal shield 12, there will be alignment problems. Due to the size effect of a large area, the cumulative error at the edge is large , and cannot be aligned to fill holes.

Another method of filling conductive adhesive is to use electroplating to fill holes (not shown in the figure). The overall process is complicated, which increases man-hours and costs. If there are air bubbles, there will be a pass rate problem. In addition, the cost of the power supply is high. The number of power supplies used in production and the configuration of machine lines and space will become a big burden.

Contents of the invention

The main purpose of the present invention is to provide a conductive method using a release film to prevent the conductive adhesive from contaminating the ceramic substrate, and to form through-holes of the metal conductive layer on the ceramic substrate through deposition. Solve the problem that the existing method of filling conductive adhesive has complicated overall process, increased man-hours, high cost, difficulty in completely filling through holes, and limited effect improvement by using pulse electroplating.

For reaching above-mentioned purpose, main method of the present invention comprises:

a. Distributing a release film on two sides of the substrate; b. Forming on the substrate through holes through each release film; c. Filling each of the through holes with conductive glue; d. e. Deposit a conductive metal layer on the surface of the substrate that has been separated from the detachable films; f. Form a specific molding pattern on the substrate on which the conductive metal layer has been deposited; g. Another metal circuit layer is formed on the material; h, removing the specific molding pattern and the metal conductive layer.

Wherein the substrate is a ceramic substrate;

Wherein, after the metal circuit layer is formed, the specific molding pattern and the metal conductive layer are respectively removed, so that the conductive circuits of the metal circuit layer have an insulating effect;

wherein the specific molding pattern is formed using lithography;

Wherein the metal circuit layer is formed by electrochemical technology.

The advantage of the present invention is that: the through-hole formed by the detachable film and the substrate has a self-alignment function, and the conductive glue can fully enter the through-hole and fill it without generating bubbles when filling the hole, and will not contaminate the surface of the substrate Therefore, there is no need to clean the surface of the substrate, which reduces the cost of equipment and man-hours. In addition, the metal conductive layer is directly attached to the substrate by using deposition technology. At the same time, the metal circuit with small line width is formed by the lithography process to improve the layout of LED components. Density; the metal conductive layer will be directly attached to the substrate instead of being attached, so it can strengthen its coating strength.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional substrate through-hole filled with conductive adhesive.

2 to 9 are cross-sectional views of the manufacturing steps of the substrate of the present invention.

Detailed ways

As shown in accompanying drawing 2 to accompanying drawing 9, it is the sectional view of the step of making the substrate of the present invention, it can be clearly seen from the figure that the present invention includes: a) distributing a detachable film on the two sides of the substrate; c) filling the through holes with conductive glue; d) peeling off each of the aforementioned release films; A conductive metal layer is deposited on the surface; f) a specific modeling pattern is formed on the base material on which the conductive metal layer has been deposited; g) a metal circuit layer is formed on the base material by electrochemical technology; h ) to remove specific molding patterns and metal conductive layers.

First, step a) uses ceramics as the substrate 2. Because the ceramic substrate has good thermal conductivity, it can quickly export the heat energy generated by high-power LEDs to the outside world, so that the LED grains will not increase the temperature due to the accumulation of heat energy and affect the luminous efficiency. At the same time, the ceramic substrate has the characteristics of high temperature resistance and high humidity. The important characteristic is an insulator, so it can be used as a circuit carrier. Before making a through hole on the substrate 2, a breakaway Sexual film20.

Then proceed to step b), performing laser processing on the predetermined surface of the substrate 2 bonded with the release film 20, so that the substrate 2 and the release film 20 on both sides of the substrate 2 are formed with through holes 22 at the same position. , Laser light such as fiber laser, carbon dioxide laser, YAG laser, excimer laser, etc. can be used.

Then proceed to step c), placing the substrate 2 with the through-hole 22 formed on the machine (not shown in the figure), and then filling the through-hole 22 with the conductive glue 3, and at the same time, the conductive glue 3 will overflow to the release film 20 surfaces. When filling the conductive adhesive 3, one side of the substrate 2 can be used for filling; it can also be filled simultaneously on both sides of the substrate 2, so that the conductive adhesive 3 can be stably and reliably filled in the through hole 22. In this way, not only can the For the purpose of preventing contamination, there is no need to use a shield as an alignment step.

Then proceed to step d), after the above-mentioned filling of the conductive adhesive 3 is completed, the release film 20 on both sides of the substrate 2 can be peeled off respectively. It is in a complete and pollution-free state, so there is no need to clean the surface of the substrate 2.

Then proceed to step e), depositing the surface of the substrate 2 that has been detached from the release film 20 (take sputtering as an example) to form a metal conductive layer 24, so as to facilitate the electroplating of copper lines on the substrate 2, since the sputtering uses argon The ions bombard the target, knock out the target atoms into gas phase and deposit on the substrate 2, so it has the advantages of no pollution and good adhesion.

Then proceed to step f), after completing the sputtering of the metal conductive layer 24 on the surface of the above-mentioned substrate 2, a specific molded pattern 26 is formed by using lithography technology. Taking negative photoresist as an example, when the lithography process is performed, the energy of light is used The properties of the photoresist (photoresist) that are exposed to light are changed to produce bonds, so the photoresist in the unirradiated part will be dissolved during development, and the photoresist part will form a pattern. This technology can achieve conductive metal in metal. Layer 24 forms a specific molded pattern 26 .

Then proceed to step g), forming a metal circuit layer 28 on the specific molding pattern 26 formed on the aforementioned base material 2 by using electrochemical technology. Since the aforementioned metal circuit layer 28 is formed by electroplating, the circuit layer 28 will have a suitable Therefore, the basic circuit prototype is formed. Since the metal circuit layer 28 is directly formed by electroplating in step g), it has ideal electrical conduction characteristics and heat dissipation effects.

The through hole 22 formed by the detachable film 20 and the substrate 2 has a self-alignment function, and the surface of the substrate will not be stained when the conductive glue is filled, so there is no need to clean the surface of the substrate 2 additionally.

Using ceramics as the base material 2 and matching the metal circuit layer 28 can not only improve the heat dissipation effect, but also use the lithography process to form the metal circuit with small line width, which can increase the layout density of the LED components.

Then proceed to step h), as shown in Fig. 7 and Fig. 8 , the conduction method of the through hole 22 of the substrate 2 may further include removing the specific molding pattern 26 after forming the metal circuit layer 28 to expose The metal conductive layer 24 is then subjected to an etching process to remove the exposed metal conductive layer 24 , so that the conductive circuits of the metal circuit layer 28 have an insulating effect.

Claims (5)

1. A conductive method for through-holes in a substrate, characterized in that: a) a release film is distributed on two sides of the substrate; b) through-holes respectively penetrating the release films are formed on the substrate; c) Each through-hole is filled with conductive glue; d) Peeling off each of the aforementioned release films; e) Depositing a metal conductive layer on the surface of the substrate that has been separated from each of the release films; f) Depositing the metal conductive layer on the surface A specific molding pattern is formed on the substrate; g) A metal circuit layer is additionally formed on the substrate; h) The specific molding pattern and the metal conductive layer are removed. 2. The conductive method for through-holes in a substrate according to claim 1, wherein the substrate is a ceramic substrate. 3. The conduction method of substrate through holes according to claim 1, characterized in that: after the metal circuit layer is formed, the specific molded pattern and the metal conductive layer are removed respectively, so that the conductive circuit of the metal circuit layer have an insulating effect on each other. 4 . The conductive method for through-holes in a substrate according to claim 1 , wherein the specific molding pattern is formed by photolithography. 5 . 5 . The conductive method for through-holes in a substrate according to claim 1 , wherein the metal circuit layer is formed by electrochemical technology. 6 .

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