CN101969754B

CN101969754B - Cooler

Info

Publication number: CN101969754B
Application number: CN2010105081581A
Authority: CN
Inventors: 苏永俊
Original assignee: Qisda Suzhou Co Ltd; Qisda Corp
Current assignee: Qisda Suzhou Co Ltd; Qisda Corp
Priority date: 2010-10-01
Filing date: 2010-10-01
Publication date: 2012-11-21
Anticipated expiration: 2030-10-01
Also published as: CN101969754A

Abstract

The invention provides a cooler which can be used for electronic devices. The cooler comprises a radiating unit, a fan unit, a metal sunshield and a first electronic unit, wherein the fan unit, which is arranged on one side of the radiating unit, comprises a shell and a fan; the fan encloses an open space for containing the fan; the metal sunshield shields part of the open space, so that the metal sunshield and the shell commonly surround the fan; one side of the open space is communicated with the radiating unit, so that the fan can blow air to the radiating unit; the metal sunshield shields the first electronic unit to prevent the first electronic unit from being subjected to electromagnetic interference, and a through hole is formed in the part which shields the open space; the first electronic unit is positioned on one side of the metal sunshield; and the radiating unit and the fan unit are positioned on the other side of the metal sunshield.

Description

Cooling device

[technical field]

The invention relates to a kind of cooling device; Particularly, the invention relates to the employed cooling device of a kind of electronic installation, with the mode cooling electronic device of heat radiation.

[background technology]

Many electronic installations are the phenomenon that it(?) all can appearance temperature when it operates raises such as integrated circuit, transistor for example, and the rising of temperature tends to have influence on the working curve of electronic installation, severe patient even can cause electronic installation to burn or situation such as blast.The electronic installation of high power or high workload frequency particularly, the former is like power transistor, and (Central Processing Unit CPU), often promptly can produce quite high temperature in normal operation for the latter such as central processing unit.

The design of electronic installation now is particular about light, thin, short, little in appearance, portable electronic installations such as mobile computer, mobile phone, digital camera especially for example, small and exquisite, the weight of external form merrily and lightheartedly often its market competitiveness belong to.And under such trend, certainly will need shorten in the electronic installation spacing between the assembly and save the whole purpose that is taken up space of electronic installation to reach.Yet, the inter-module distance dwindle the heat radiation that more is unfavorable for assembly, so heat dissipation problem become electronic installation the design phase one of the key factor that must consider.

In response in the above-mentioned electronic installation that is easy to generate high temperature, release many on the market such as cooling device products such as heat radiator, radiator fans.Electronic installation collocation cooling device uses, and temperature is too high in the time of can avoiding electronic installation work, and then guarantees the operate as normal of electronic installation.Cooling device is owing to differences such as its employed material or its shaped design have different cooling effects, and the cooling device of the different patterns of the also necessary collocation of different electronic installations also can mix sometimes and use different types of cooling device.

Figure 1A is the synoptic diagram of existing cooling device.Shown in Figure 1A, this cooling device comprises fin 1, fan 2 and heat pipe 3 and heat radiator 4.Fan 2 is arranged at a side of fin 1, and is 5 encirclements of housing.Over cap 6 is covered on the fan 2 and is supported by the sidewall of housing 5, waits effect to reach protection.Figure 1B is the synoptic diagram that is provided with of the cooling device shown in Figure 1A.Shown in Figure 1B, the top that is arranged at the circuit board 8 in the housing 7 of electronic installation is coated with the sheet metal 9 that prevents that electromagnetic interference (EMI) from using.The fin 1 of cooling device and fan 2 etc. partly are arranged at the edge of housing 7, and sheet metal 8 is covered in the top of parts such as the fan 2 of radiator cooler.Yet it is redundant and complicated that said structure seems with regard to reaching purposes such as protecting fan, increases unnecessary cost on foot.

[summary of the invention]

The object of the present invention is to provide a kind of cooling device, structurally more succinct compared to prior art, and then can reach and increase structural strength and effect such as reduce cost.

Cooling device of the present invention can be used in electronic installation, wherein comprises: heat-sink unit; Fan unit is arranged at this heat-sink unit one side, comprises a housing and a fan, and wherein this housing surrounds an open space and holds this fan; The metal shield, part is covered this open space and is surrounded this fan jointly with this housing, makes a side of this open space be communicated with this heat-sink unit, and the part that this metal shield covers this open space is formed with at least one through hole; And at least one first electronic unit, this metal shield part at least covers this first electronic unit, and prevents that this first electronic unit from suffering electromagnetic interference (EMI).

As optional technical scheme, described cooling device more comprises second electronic unit, and this second electronic unit is positioned at this opposite side of this metal shield, and this metal shield prevents to produce electromagnetic interference (EMI) between this first electronic unit and this second electronic unit.

As optional technical scheme, this metal shield fits in this housing.

As optional technical scheme, this metal shield covers this fan unit and this heat-sink unit.

As optional technical scheme, this metal shield comprises a lateral margin, and at least a portion of this fan unit is covered in this lateral margin, and this heat-sink unit is positioned at outside this lateral margin.

As further optional technical scheme, described cooling device more comprises a covering part, and it protrudes from outside this lateral margin, and this covering part covers this heat-sink unit.

As optional technical scheme, a through hole in this at least one through hole is corresponding to the center section of this fan unit.

As optional technical scheme, this heat-sink unit comprises a relative air intake vent and an air outlet, and this heat-sink unit and this fan unit interconnect, and makes a lateral margin of this this air intake vent of housing encirclement of this fan unit.

As optional technical scheme, this heat-sink unit comprises a relative air intake vent and an air outlet, and this heat-sink unit and this fan unit keep a distance, and an opening that makes this open space one side is towards this air intake vent.

As optional technical scheme, described cooling device more comprises heat-conducting unit, comprises an interconnective heat pipe and a heat radiator, and this heat pipe connects this heat-sink unit, and this heat radiator supplies to connect electronic package and uses.

Benefit of the present invention is, utilizes the metal shield to protect fan, to fan proper protection is provided on the one hand, also makes one-piece construction oversimplify on the other hand.

[description of drawings]

Figure 1A is the synoptic diagram of existing cooling device;

Figure 1B is the synoptic diagram that is provided with of the cooling device shown in Figure 1A;

Fig. 2 A is the synoptic diagram of an embodiment of cooling device of the present invention;

Fig. 2 B is the synoptic diagram of optics behavior of the display of switchable viewing angle shown in Figure 1B; And

Fig. 3 is the synoptic diagram of another embodiment of the display of switchable viewing angle of the present invention.

[embodiment]

The present invention provides a kind of cooling device.In preferred embodiment, cooling device of the present invention is used in combining screen and computing machine is " integral type computing machine " (all in one PC, AIO PC) of one.Yet in other embodiments, cooling device of the present invention can be used in the electronic installation of other type, to reach the effects such as heat radiation of electronic installation.

Fig. 2 A is the synoptic diagram of an embodiment of cooling device of the present invention; Fig. 2 B is the synoptic diagram of the fan unit of cooling device shown in Fig. 2 A.Shown in Fig. 2 A and Fig. 2 B, this cooling device comprises heat-sink unit 10, fan unit 20, metal shield 30, first electronic unit 40, second electronic unit 50 and heat-conducting unit 60.Heat-sink unit 10 comprises air intake vent 11 and the air outlet 12 that is positioned at two opposite ends, and wherein air intake vent 11 is in the face of fan unit 20, and air outlet 12 is towards the top.Fan unit 20 blows into the air of air intake vent 11 and can discharge from air outlet 12, and wherein the visual demand of the direction of air outlet 12 adjusts.In preferred embodiment, heat-sink unit 10 is a metal fins.

Fan unit 20 is arranged at a side of heat-sink unit 10 and near air intake vent 11, wherein comprises housing 21 and fan 22, and housing 21 surrounds open space 100 to hold fan 22.Housing 21 comprises sidewall 211 and base plate 212, and fan 22 is arranged on the base plate 212.In preferred embodiment; Between heat-sink unit 10 and the fan unit 20 with mode fluid-tight engagement such as viscose bondings; In case leak-stopping wind and make the wind that fan unit 20 produced to be received by heat-sink unit 10 effectively, and then make heat-sink unit 10 reach better radiating effect.In the present embodiment, heat-sink unit 10 interconnects with fan unit 20, makes the sidewall 211 of fan unit 20 surround the lateral margin 111 of the air intake vent 11 of heat-sink units 10; Yet in other embodiments; For example when heat-sink unit 10 be not when being arranged on the same plane with fan unit 20; Heat-sink unit 10 can keep a distance with fan unit 20 and divide and be arranged; The opening that must make open space 100 1 sides this moment is towards air intake vent 11, and then makes the fan 22 can be towards air intake vent 11 blowing.

Metal shield 30 is arranged on the end face 2111 of sidewall 211 and is shielded in open space 100 tops; And with the common parts of surrounding around the fans 22 of housing 21; Not exclusively cover fan 22 and keep one and be opened on the corresponding side of open space 100 and air intake vent 11; Make a side of open space 100 be communicated with heat-sink unit 10, and then fan 22 can be dried to heat-sink unit 10.Metal shield 30 part with respect to fan 22 above open space 100 is formed with through hole 31, gets into open space 100 for air, and can functions such as air conducting be provided by the design of through hole 31.In the present embodiment, be formed with a plurality of fan-shaped through holes 31 on the metal shield 30; Yet in other embodiments, can look the design that demand changes through hole 31, for example only form a bigger circular port (see figure 3).In preferred embodiment; Metal shield 30 fits tightly housing 21; And visual demand makes both fluid-tight engagement with modes such as viscose bondings; In case leak-stopping wind and make the wind that fan unit 20 produced to be received by heat-sink unit 10 effectively, in addition and can reach and prevent that fan from producing effects such as noise because wind cuts effect.Being provided with on the one hand of metal shield reaches the purpose that prevents electromagnetic interference (EMI), on the other hand as far as fan, except proper protection is provided, can also satisfies the basic fan that prevents and produce demands such as noise.

First electronic unit 40 and second electronic unit 50 are arranged at metal shield 30 both sides, and metal shield 30 is covered on second

electronic unit

50, and 40 of first electronic units are positioned at metal shield 30 tops.Heat-conducting unit 60 comprises interconnective heat radiator 61 and heat pipe 62.Heat radiator 61 is preferably metal material, can be connected with electronic package; 62 of heat pipes connect heat-sink unit 10, use the heat that electronic package produced that heat radiator 61 is absorbed and are passed to heat-sink unit 10.

In the present embodiment, second electronic unit 50 and heat-sink unit 10 and fan unit 20 are positioned at the first area of

metal shield

30, and 40 of first electronic units are positioned at another zone of metal shield 30.30 pairs first electronic units 40 of metal shield and second electronic unit 50 produce the effect of covering; To prevent that assembly and the assembly on second electronic unit 50 on first electronic unit 40 from producing electromagnetic interference (EMI) each other; Also prevent simultaneously that first electronic unit 40 and second electronic unit, 50 outer electromagnetic waves from causing electromagnetic interference (EMI) to the assembly on it, or prevent that the assembly on first electronic unit 40 and second electronic unit 50 from causing electromagnetic interference (EMI) to other assemblies.In the present embodiment, first electronic unit 40 is a display module, and second electronic unit 50 is a computer main frame panel; Yet in other embodiments, first electronic unit 40 can be the electronic packages such as printed circuit board (PCB) of other type, and second electronic unit 50 can be electronic packages such as the printed circuit board (PCB) of other type or power supply.

Metal shield 30 has lateral margin 32, and in the present embodiment, some is covered in the lateral margin 32 10 whole being positioned at outside the lateral margin 32 of heat-sink unit fan unit 20; Yet in other embodiments, can cover heat-sink unit 10 simultaneously protects with fan unit 20.Fig. 3 is the synoptic diagram of another embodiment of cooling device of the present invention.As shown in Figure 3, metal shield 30 comprises covering part 321, and covering part 321 is covered on the heat-sink unit 10 from lateral margin 32 protrusions, makes heat-sink unit 10 and fan unit 20 all by 30 coverings of metal shield.The corresponding position of center section of metal shield 30 and fan 22 is formed with the through hole 31 of a circle.At this moment, the direction of air outlet 12 can be adjusted into non-direction towards metal shield 30, and air outlet 12 can not hidden by metal shield 30.In the present embodiment, covering part 321 is the part of metal shield 30; Yet in other embodiments, covering part 321 can be the extra assembly that installs additional, and can adopt the material different with metal shield 30.

Compared to prior art, the present invention also makes the one-piece construction of cooling device seem more succinct, and then the increase of structural strength and the aspects such as reduction of cost is contributed to some extent except fan being provided basic protection etc. the function.

The present invention is described by above-mentioned related embodiment, but is not to limit the invention to the foregoing description, and the interest field of this patent is as the criterion with claims.

Claims

1. cooling device is characterized in that comprising:

Heat-sink unit;

Fan unit is arranged at this heat-sink unit one side, comprises housing and fan, and wherein this housing surrounds an open space and holds this fan;

The metal shield, part is covered this open space and is surrounded this fan jointly with this housing, makes a side of this open space be communicated with this heat-sink unit, and the part that this metal shield covers this open space is formed with at least one through hole; And

At least one first electronic unit, this metal shield part at least cover this first electronic unit, and prevent that this first electronic unit from suffering electromagnetic interference (EMI);

Second electronic unit, this second electronic unit is positioned at the opposite side of this metal shield, and this metal shield prevents to produce electromagnetic interference (EMI) between this first electronic unit and this second electronic unit.

2. cooling device according to claim 1 is characterized in that this metal shield fits in this housing.

3. cooling device according to claim 1 is characterized in that this metal shield covers this fan unit and this heat-sink unit.

4. cooling device according to claim 1 is characterized in that this metal shield comprises lateral margin, and at least a portion of this fan unit is covered in this lateral margin, and this heat-sink unit is positioned at outside this lateral margin.

5. cooling device according to claim 4 is characterized in that this metal shield more comprises the covering part that protrudes from outside this lateral margin, and this covering part covers this heat-sink unit.

6. cooling device according to claim 1 is characterized in that a through hole in this at least one through hole is corresponding to the center section of this fan unit.

7. cooling device according to claim 1 is characterized in that this heat-sink unit comprises relative air intake vent and air outlet, and this heat-sink unit and this fan unit interconnect, and makes a lateral margin of this this air intake vent of housing encirclement of this fan unit.

8. cooling device according to claim 1 is characterized in that this heat-sink unit comprises relative air intake vent and air outlet, and this heat-sink unit and this fan unit keep a distance, and an opening that makes this open space one side is towards this air intake vent.

9. cooling device according to claim 1 is characterized in that more comprising heat-conducting unit, and this heat-conducting unit comprises interconnective heat pipe and heat radiator, and this heat pipe connects this heat-sink unit, and this heat radiator supplies to connect electronic package and uses.