CN101965101B - Module circuit board assembly, module circuit board and electronic production - Google Patents

Abstract

The invention discloses a module circuit board assembly, a module circuit board and electronic products, relates to the technical field of circuit boards, and is invented for realizing the electrical connection between a module circuit board and a main circuit board. The module circuit board assembly includes a module circuit board, the module circuit board has a substrate, a welding terminal is provided on the upper surface and/or the lower surface of the substrate, and the main circuit board is welded on the welding terminal, and An end connection portion is provided at an end surface of the substrate, and the end connection portion is electrically connected to the main circuit board. The module circuit board includes a base plate, solder terminals are provided on the upper surface and/or lower surface of the base plate, and terminal connection parts are provided on the end face of the base plate. The electronic product includes an electronic product body, and the above-mentioned module circuit board assembly is arranged in the electronic product body. The modular circuit board assembly of the present invention can be used to realize certain functions.

Description

Modular circuit board assemblies, modular circuit boards and electronic products

technical field

The invention relates to the technical field of circuit boards, in particular to a module circuit board assembly, a module circuit board and an electronic product.

Background technique

At present, with the development trend of high density and miniaturization of electronic products, there are more and more applications of modular circuit boards, such as module circuit boards that realize Wi-Fi (Wireless Fidelity, wireless fidelity technology) functions, and realize Module circuit boards with radio frequency functions of wireless terminals, etc. These modular circuit boards are used frequently and can realize some specific functions after being electrically connected with the main circuit board.

Specifically, taking currently commonly used modems as an example, modems can be classified into two types: wired modems and wireless modems according to different ways of accessing the network. The wired modem needs to use a main circuit board to realize the wired Internet access function, and for the wireless modem, it is also necessary to add a module circuit board to realize the Wi-Fi function in the main circuit board to realize the wireless Internet access function.

In the process of using, the inventor found that there are at least the following problems in the prior art:

In order to increase the function of the module circuit board in the main circuit board, it is necessary to electrically connect the main circuit board and the module circuit board.

Contents of the invention

The technical problem to be solved by the embodiments of the present invention is to provide a module circuit board assembly, which can realize the electrical connection between the module circuit board and the main circuit board.

In order to solve the above technical problems, the embodiment of the present invention adopts the following technical solutions:

A module circuit board assembly, comprising a module circuit board, the module circuit board having a base plate, on the upper surface and/or the lower surface of the base plate, welding terminals are arranged, and a main circuit board is welded on the welding terminals, and An end connection portion is provided at an end surface of the substrate, and the end connection portion is electrically connected to the main circuit board.

In the module circuit board assembly provided by the embodiment of the present invention, since the upper surface and/or the lower surface of the module circuit board are provided with welding terminals, the main circuit board and the module circuit board can be connected to each other through the welding terminals. are welded together, and the welding end is used as a conductive electrode, which can realize the electrical connection between the module circuit board and the main circuit board. The boards are electrically connected to the terminal connection, so that the electrical connection between the module circuit board and the main circuit board can also be realized through the terminal connection.

Another technical problem to be solved by the embodiments of the present invention is to provide a module circuit board, which can realize the electrical connection between the module circuit board and the main circuit board.

In order to solve the above technical problems, the embodiment of the present invention adopts the following technical solutions:

A module circuit board includes a base plate, solder terminals are provided on the upper surface and/or lower surface of the base plate, and terminal connection parts are provided on the end face of the base plate.

In the module circuit board provided by the embodiment of the present invention, since the upper surface and/or the lower surface of the module circuit board are provided with welding terminals, the main circuit board and the module circuit board can be welded through the welding terminals. together, and the welding terminal is used as a conductive electrode, which can realize the electrical connection between the module circuit board and the main circuit board. Electrically connected terminal connections, whereby an electrical connection between the module circuit board and the main circuit board can thus also be achieved.

Another technical problem to be solved by the embodiments of the present invention is to provide an electronic product with higher production efficiency.

In order to solve the above technical problems, the embodiment of the present invention adopts the following technical solutions:

An electronic product, comprising an electronic product body, a modular circuit board assembly is arranged in the electronic product body, the modular circuit board assembly includes a modular circuit board, the modular circuit board has a substrate, and the upper surface of the substrate and the /or a welding end is provided on the lower surface, the main circuit board is welded on the welding end, and an end connection part is provided on the end surface of the substrate, and the end connection part is electrically connected to the main circuit board.

In the electronic product provided by the embodiment of the present invention, since soldering terminals are provided on the upper surface and/or the lower surface of the module circuit board, the main circuit board and the module circuit board can be welded together through the soldering terminals. together, and the welding terminal is used as a conductive electrode, which can realize the electrical connection between the module circuit board and the main circuit board. Therefore, the electrical connection between the module circuit board and the main circuit board can also be realized through the terminal connection part, so that the main circuit board with relatively simple logic can be designed first, and then the realization of each The modular circuit board with various functions is electrically connected with the main circuit board to realize relatively complex functions, thus greatly simplifying the difficulty of circuit board design and processing, and making electronic products have higher production efficiency.

Description of drawings

Fig. 1 is a kind of structural representation of module circuit board assembly of the embodiment of the present invention;

Fig. 2 is the bottom view of the module circuit board shown in Fig. 1;

FIG. 3 is another structural schematic diagram of a modular circuit board assembly according to an embodiment of the present invention;

FIG. 4 is another structural schematic diagram of a modular circuit board assembly according to an embodiment of the present invention;

FIG. 5 is another structural schematic diagram of a modular circuit board assembly according to an embodiment of the present invention;

Fig. 6 is a schematic structural diagram when two modular circuit boards are included in the modular circuit board assembly according to the embodiment of the present invention;

FIG. 7 is another structural schematic diagram when two modular circuit boards are included in the modular circuit board assembly according to the embodiment of the present invention;

Fig. 8 is a schematic diagram of an electronic product according to an embodiment of the present invention.

Detailed ways

The embodiment of the present invention aims to provide a module circuit board assembly, a module circuit board and an electronic product, which can realize the electrical connection between the module circuit board and the main circuit board.

The module circuit board assembly in the embodiment of the present invention includes a module circuit board, the module circuit board has a base plate, a welding end is provided on the upper surface and/or the lower surface of the base plate, and the main circuit board is welded on the welding end, In addition, an end connection portion is provided on the end surface of the substrate, and the end connection portion is also electrically connected to the above-mentioned main circuit board.

Since the upper surface and/or the lower surface of the module circuit board are provided with welding terminals, the main circuit board and the module circuit board can be welded together through the welding terminals, and the welding terminals are used as conductive electrodes to realize the connection between the module circuit board and the main circuit board. In addition, the end surface of the module circuit board is also provided with an end connection portion electrically connected to the main circuit board, so the electrical connection between the module circuit board and the main circuit board can also be realized through the end connection portion.

Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

As shown in Figure 1, the modular circuit board assembly of the embodiment of the present invention includes a modular circuit board 1, the modular circuit board 1 has a substrate 12, a first electronic component 16 is arranged on the upper surface of the substrate 12, and a first electronic component 16 is arranged on the lower surface of the substrate 12. A soldering end 14 is provided, and the main circuit board 3 is welded on the soldering end 14 , and an end connection part is provided at the end surface of the substrate 12 , and the end connection part is electrically connected with the main circuit board 3 . In this embodiment, the structural form of the end connection part includes the following three types:

The first type, as shown in FIG. 1 and FIG. 2 , the end connection part is an end face welding terminal 4 provided at the end surface of the substrate 12, and the end face welding end 4 includes a first pad 42 and a second pad 44 arranged oppositely, The first pad 42 is arranged on the upper surface of the substrate 12, the second pad 44 is arranged on the lower surface of the substrate 12, and a metallized groove 46 is connected between the first pad 42 and the second pad 44, the One end of the metallization groove 46 communicates with the first pad 42 , and the other end communicates with the second pad 44 .

Wherein, welding the second pad 44 on the main circuit board 3 can realize the electrical connection between the terminal connection part and the main circuit board 3, so that the module circuit board 1 can pass through the welding terminal 14 located on the lower surface of the substrate 12. , and the end surface welding terminal 4 provided at the end surface of the substrate 12 is electrically connected with the main circuit board 3 .

Moreover, the end face welding end 4 may be in direct contact with the welding end 14, or may be separated by a certain distance. In this embodiment, there is a certain distance between the end surface soldering end 4 and the soldering end 14 , and at this time, the electrical connection between the two can be realized by wiring.

The second type, as shown in Figure 3, the end connection part is the first pin 5 located at the end face of the substrate 12, one end of the first pin 5 is electrically connected with the upper surface of the substrate 12, and the other end is connected with the main circuit board 3 are electrically connected. Wherein, the first pin 5 can be fabricated on the end surface of the substrate 12 by means of welding or packaging. The shape of the first pin 5 can be J shape, airfoil shape and so on. And the size, height and quantity of the first pin 5 can be designed according to actual needs.

For example, as shown in FIG. 4 , the first pin 5 can also be set in a form bent toward the inside of the module circuit board 1 , so that the electrical connection between the module circuit board 1 and the main circuit board 3 can also be realized.

The third type, as shown in FIG. 5 , the end connection part includes a connection hole 82 arranged at the end of the upper surface of the substrate 12, and a second pin 84 is inserted in the connection hole 82, and the second pin 84 bypasses the substrate 12. The end portion is electrically connected with the main circuit board 3 . Wherein, the hole 82 can be designed as a through hole or a non-through hole, and one end of the second pin 84 can be soldered in the hole 82 by reflow soldering or other methods. And for the non-through hole, the depth of the hole 82 is not limited. In the limit state, the depth of the hole 82 can also be designed to be 0, that is to say, the hole 82 has become a welding pad at this time.

In this way, for the second pin 84 , one end thereof can be welded in the hole 82 by plugging, or surface-attached on the pad by contact when the hole 82 becomes a pad. Similarly, the other end can also be welded on the main circuit board 3 by plug-in or surface mount.

In this embodiment, the first type of end connection part is selected.

It should be further noted that, in this embodiment, the solder end 14 can be formed by etching the copper skin on the substrate 12, or by electroplating, so its thickness is generally small, only a few ounces, of which 1 An ounce is only equivalent to 35 microns, which makes the overall thickness of the module circuit board assembly thinner, so it can be widely used in ultra-thin mobile phones, digital cameras and other electronic products.

The shape of welding end 14 is not limited in the present embodiment, according to the needs of actual manufacturing situation and use situation, welding end 14 can be designed as circle, semicircle, rectangle, rhombus, pentagram, or other rules or Irregular shape.

Not only that, the shape of the module circuit board 1 in this embodiment is not limited, and any shape such as a circle or a square can also be used.

It can also be seen from FIGS. 1 to 5 that a second electronic component 18 is provided on the lower surface of the substrate 12 at a position away from the solder end 14. After the second electronic component 18 is set, generally, the second The height of the electronic components 18 will be greater than the height of the welding end 14, so in order to avoid the second electronic components 18 from hindering the welding of the module circuit board 1 and the main circuit board 3, the main circuit board 3 can be provided with an accommodating part, so that the second electronic component 18 is accommodated in the accommodating part. Specifically, in this embodiment, grooves are provided on the main circuit board 3 , and the second electronic components 18 are accommodated in the corresponding grooves. In this way, electronic components are arranged on both sides of the substrate 12, on the one hand, the integration of the modular circuit board 1 can be improved, and on the other hand, the layout space of the modular circuit board 1 can be increased, and the layout design of the electronic components therein can be optimized.

However, the structure of the accommodating portion is not limited thereto. In other embodiments of the present invention, structures such as skylights may also be provided on the main circuit board as the accommodating portion.

Wherein, the number of module circuit boards 1 welded on the main circuit board 3 is not limited to one, and may also be two or more. In this embodiment, when two module circuit boards 1 are welded on the main circuit board 3, as shown in FIG. 6, the two module circuit boards 1 can be stacked up and down; or as shown in FIG. The module circuit boards 1 can also be horizontally arranged in parallel.

To sum up, in the modular circuit board assembly of the embodiment of the present invention, since soldering terminals are provided on the upper surface and/or lower surface of the modular circuit board, the main circuit board and the The module circuit boards are welded together, and the welding terminal is used as a conductive electrode, which can realize the electrical connection between the module circuit board and the main circuit board. The terminal connection portion electrically connected to the main circuit board, so the electrical connection between the module circuit board and the main circuit board can also be realized through the terminal connection portion.

The embodiment of the present invention also provides a module circuit board, the module circuit board includes a base plate, solder terminals are provided on the upper surface and/or the lower surface of the base plate, and terminal connection parts are provided on the end face of the base plate.

In the embodiment of the present invention, since there are welding terminals on the upper surface and/or the lower surface of the module circuit board, the main circuit board and the module circuit board can be welded together through the welding terminals, and the welding terminals are used as conductive electrodes, which can realize The electrical connection between the module circuit board and the main circuit board, in addition, an end connection part electrically connected to the main circuit board is provided on the end face of the module circuit board, so the module circuit board and the main circuit board can also be realized through the end connection part. electrical connection between.

It should be noted that after the module circuit board 1 is manufactured, it is not necessary to immediately weld the module circuit board 1 and the main circuit board 3 together through the welding terminal 14 and the terminal connection part. If it is oxidized or corroded during storage, it is necessary to perform surface treatment on the module circuit board 1 . The surface treatment method can choose HASL (Hot Air Solder Leveling, hot air leveling), ENIG (Electroless NickelImmersion Cold, electroless nickel plating/immersion gold), OSP (Oraganic Solderablility Preservation, organic solderability protective film), chemical silver, chemical tin any of the.

As shown in Figure 8, the embodiment of the present invention also provides an electronic product, the electronic product includes an electronic product body 9, and a module circuit board assembly is arranged in the electronic product body 9, and the module circuit board assembly includes a module circuit board 1 and main circuit board 3 . As shown in FIG. 1 , the module circuit board 1 has a base plate 12, a welding end 14 is provided on the lower surface of the base plate 12, the main circuit board 3 is welded on the welding end 14, and an end connecting portion is provided at the end face of the base plate 12, The terminal connection portion is electrically connected to the main circuit board 3 .

Since the welding terminal is provided on the upper surface and/or the lower surface of the module circuit board, the main circuit board and the module circuit board can be welded together through the welding terminal, and the welding terminal is used as a conductive electrode, which can realize the connection between the module circuit board and the module circuit board. The electrical connection between the main circuit boards, in addition, an end connection part electrically connected to the main circuit board is also provided on the end face of the module circuit board, so the electrical connection between the module circuit board and the main circuit board can also be realized through the end connection part. In this way, the main circuit board with relatively simple logic can be designed first, and then the module circuit board that realizes various functions is electrically connected with the main circuit board to realize more complex functions, thus greatly simplifying the design and processing of the circuit board Difficulty, so that electronic products have higher production efficiency.

The electronic product can be a communication device, such as a mobile phone, a computer, a modem, a network switch, etc., or a home appliance, such as a refrigerator, a microwave oven, etc.

It should be noted that the structure and function of the module circuit board in the embodiment of the module circuit board are the same as those of the module circuit board in the embodiment of the module circuit board assembly, and the structure and function of the module circuit board assembly in the embodiment of the electronic product The structure and function of the module circuit board assembly described in the embodiment of the function and the module circuit board assembly are the same, and will not be repeated here.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope described in the claims.

Claims (8)

1. modular circuit board component; It is characterized in that, comprise module board, said module board has substrate; On the upper surface of said substrate and/or lower surface, be provided with the weldering end; Be welded with main circuit board on the said weldering end, and be provided with the end connecting portion at said base board end surface place, said end connecting portion and said main circuit board are electrically connected;

The upper surface of said substrate is provided with first electronic devices and components; The lower surface of said substrate is provided with said weldering end; Said end connecting portion is the end face weldering end that is located at said substrate end-face place, and said end face weldering end comprises first pad and second pad that is oppositely arranged, and said first pad is located at the upper surface of said substrate; Said second pad is located at the lower surface of said substrate, and between said first pad and said second pad, is connected with the metallization groove.

2. circuit board assemblies according to claim 1; It is characterized in that; The position of on the lower surface of said substrate, departing from said weldering end is provided with second electronic devices and components, and on said main circuit board, is provided with the accommodation section, and said second electronic devices and components are installed with in corresponding accommodation section.

3. circuit board assemblies according to claim 2 is characterized in that, on said main circuit board, is provided with at least two said module boards, and stacked on top is arranged or horizontal parallel arranged between said at least two module boards.

4. a module board is characterized in that, comprises substrate, on the upper surface of said substrate and/or lower surface, is provided with the weldering end, and is provided with the end connecting portion at said base board end surface place;

The upper surface of said substrate is provided with first electronic devices and components; The lower surface of said substrate is provided with said weldering end; Said end connecting portion is the end face weldering end that is located at said substrate end-face place, and said end face weldering end comprises first pad and second pad that is oppositely arranged, and said first pad is located at the upper surface of said substrate; Said second pad is located at the lower surface of said substrate, and between said first pad and said second pad, is connected with the metallization groove.

5. module board according to claim 4 is characterized in that, the position of on the lower surface of said substrate, departing from said weldering end is provided with second electronic devices and components.

6. an electronic product is characterized in that, comprises the electronic product body; Be provided with the modular circuit board component in the said electronic product body, said modular circuit board component comprises module board, and said module board has substrate; On the upper surface of said substrate and/or lower surface, be provided with the weldering end; Be welded with main circuit board on the said weldering end, and be provided with the end connecting portion at said base board end surface place, said end connecting portion and said main circuit board are electrically connected;

The upper surface of said substrate is provided with first electronic devices and components, and the lower surface of said substrate is provided with said weldering end, and said end connecting portion is:

Be located at the end face weldering end at said substrate end-face place; Said end face weldering end comprises first pad and second pad that is oppositely arranged; Said first pad is located at the upper surface of said substrate; Said second pad is located at the lower surface of said substrate, and between said first pad and said second pad, is connected with the metallization groove.

7. electronic product according to claim 6; It is characterized in that; The position of on the lower surface of said substrate, departing from said weldering end is provided with second electronic devices and components, and on said main circuit board, is provided with the accommodation section, and said second electronic devices and components are installed with in corresponding accommodation section.

8. electronic product according to claim 7 is characterized in that, on said main circuit board, is provided with at least two said module boards, and stacked on top is arranged or horizontal parallel arranged between said at least two module boards.

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