CN101955015A - Surface mount component carrier tape upper cover tape and processing method thereof - Google Patents
Surface mount component carrier tape upper cover tape and processing method thereof Download PDFInfo
- Publication number
- CN101955015A CN101955015A CN2010102817146A CN201010281714A CN101955015A CN 101955015 A CN101955015 A CN 101955015A CN 2010102817146 A CN2010102817146 A CN 2010102817146A CN 201010281714 A CN201010281714 A CN 201010281714A CN 101955015 A CN101955015 A CN 101955015A
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- CN
- China
- Prior art keywords
- cover tape
- hot melt
- melt adhesive
- component carrier
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000003672 processing method Methods 0.000 title abstract 3
- 239000004831 Hot glue Substances 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims abstract description 20
- 229920002799 BoPET Polymers 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
The invention discloses a surface mouth component carrier tape upper cover tape which comprises a PET thin film, wherein a hot melt adhesive layer formed by a hot melt adhesive is coated on the lower surface of the PET thin film, two parallel longitudinal die lines are formed on the hot melt adhesive layer, and die lines which are shaped like an inverted V are formed on the left side and the right side of the two longitudinal die lines. When the surface mouth component carrier tape upper cover tape is used, a client can obtain stable stripping force by only needing to tear apart in the direction of the inverted V along the positions of the die lines after joint, the strength of the stripping force can be determined by the size of a small-diameter cutting knife and different depths formed by cutting, and the upper cover tape of the left and the right die lines still leave on a lower tape, thereby avoiding the problem of leading the stripping strength of the cover tape to change; furthermore, the upper cover tape can save raw materials and save processing cost; and the processing method can be completed once and the processing method is simple.
Description
Technical field
The present invention relates to the paster component carrier band, particularly a kind of last cover tape and job operation thereof that is used for the paster component carrier band.
Background technology
Cover tape on traditional heat-sealing type, be to combine by the high following layer of PET applying price, its structure is PET film+contact bed+following layer, but because of following layer can't satisfy all involution conditional requests of band down, therefore peel strength alters a great deal, cause easily part beat tear or the effect of fitting undesirable, and then cause the inconvenience of SMT plug-in unit factory follow-up work.
Having a kind of again is cover tape on traditional glutinous certainly type, it is this after cover tape on the glutinous type is to be coated with the viscose following layer earlier by one deck PET film, cut into the width of client's appointment again through cutting machine, cutting the back uses the narrower PET that cuts together film adhered, stay left and right sides adhesive tape, become the last cover tape that has from stickiness, this peel strength that goes up cover tape changes the little but this cover tape that goes up because of the making technology complexity, selecting for use of viscose is difficult, causing manufacturing cost is more than two times of cover tape on the heat-sealing type, and client is difficult for accepting.Therefore how producing the low and peel strength of a kind of productive costs, to change little last cover tape be to need a technical matters that will solve at present badly.
Summary of the invention
At above-mentioned the deficiencies in the prior art, the technical problem to be solved in the present invention provides a kind of peel strength and changes last cover tape little and that productive costs is low.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
Cover tape on a kind of paster component carrier band, it comprises the PET film, be coated with hot melt adhesive on the described PET film lower surface and form hot melt adhesive layer, form two parallel longitudinal knife lofts on the described hot melt adhesive layer, the outside forms " eight " font cutting die line about described two longitudinal knife lofts.
Preferably, described hot melt adhesive is PE glue or EVA glue.
The invention also discloses the job operation of cover tape on a kind of above-mentioned paster component carrier band, it comprises the steps: at first coated heat melten gel on the PET film surface, adopt dryer that hot melt adhesive is dried the formation hot melt adhesive layer, can form cover tape like this, adopt the major diameter cutter that the above-mentioned cover tape that goes up is switched to finished width then as requested earlier, adopt small-diameter cutter on cover tape hot melt adhesive layer on the finished width, to cut two parallel longitudinal knife lofts then, adopt continuous die method to form several " eight " font cutting die lines in the outside of two parallel longitudinal knife lofts at last.
Preferably, described two longitudinal knife lofts are 0.5 to 1MM apart from the distance of the cooresponding loam cake belt edge of row.
Preferably, the distance between adjacent two " eight " font cutting die lines is 3-5MM.
Technique scheme has following beneficial effect: cover tape in use on this paster component carrier band, the client only needs along the position of cutting die line to tear to fall the direction of the Eight characters after applying, can obtain stable peeling force, the peeling force size, can be by the size of minor diameter cutting knife, being cut into the different degree of depth determines, and the last cover tape of left and right sides cutting die line is still stayed down and is with, therefore can not cause the problem of cover tape peel strength variation, and this cover tape that goes up is economized raw material, economize tooling cost, method for processing is disposable to be finished, and job operation is simple.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification sheets, below with preferred embodiment of the present invention and conjunction with figs. describe in detail as after.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Description of drawings
Fig. 1 is the cutaway view of the embodiment of the invention.
Fig. 2 is the structural representation of embodiment of the invention hot melt adhesive layer.
The specific embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1, 2, cover tape comprises PET film 1 on this chip module carrier band, is coated with hot melt adhesive on PET film 1 lower surface and forms hot melt adhesive layer 2, and the hot melt adhesive of coating can be PE glue or EVA glue.Form on the hot melt adhesive layer 2 two parallel 3, two longitudinal knife lofts 3 of longitudinal knife loft about the outside form " eight " font cutting die line 4.Article two, longitudinal knife loft 3 is 0.5 to 1MM apart from the distance of the cooresponding loam cake belt edge of row, and the distance between adjacent two " eight " font cutting die lines 4 is 3-5MM.
The job operation of cover tape comprises the steps: at first coated heat melten gel on PET film 1 surface on the above-mentioned paster component carrier band, adopt dryer that hot melt adhesive is dried and form hot melt adhesive layer 2, can form cover tape like this, adopt the major diameter cutter that the above-mentioned cover tape that goes up is switched to finished width then as requested earlier, adopt small-diameter cutter to cut two parallel longitudinal knife lofts 3 then on cover tape hot melt adhesive layer on the finished width, the degree of depth of cutting die line should be just to cut off hot melt adhesive layer and the PET film is not cut and worn.At last adopt continuous die method to form several " eight " font cutting die lines 4 in the outside of two parallel longitudinal knife lofts.Article two, the longitudinal knife loft is 0.5 to 1MM apart from the distance of finished width loam cake belt edge, and the distance between adjacent two " eight " font cutting die lines is 3-5MM.
Cover tape in use on this paster component carrier band, the client only needs along the position of cutting die line to tear to fall the direction of the Eight characters after applying, can obtain stable peeling force, the peeling force size, can be by the size of minor diameter cutting knife, be cut into the different degree of depth and determine, and the last cover tape of left and right sides cutting die line is still stayed down and is with, therefore the problem that can not cause the cover tape peel strength to change, and this cover tape that goes up is economized raw material, economize tooling cost, method for processing is disposable to be finished, and job operation is simple.
More than cover tape and job operation on a kind of paster component carrier band that the embodiment of the invention provided are described in detail; for one of ordinary skill in the art; thought according to the embodiment of the invention; part in specific embodiments and applications all can change; in sum; this description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (5)
1. cover tape on the paster component carrier band, it is characterized in that: it comprises the PET film, be coated with hot melt adhesive on the described PET film lower surface and form hot melt adhesive layer, form two parallel longitudinal knife lofts on the described hot melt adhesive layer, the outside forms " eight " font cutting die line about described two longitudinal knife lofts.
2. cover tape on the paster component carrier band according to claim 1 is characterized in that: described hot melt adhesive is PE glue or EVA glue.
3. the job operation of cover tape on the paster component carrier band, it is characterized in that, it comprises the steps: at first coated heat melten gel on the PET film surface, adopt dryer that hot melt adhesive is dried the formation hot melt adhesive layer, can form cover tape like this, adopt the major diameter cutter that the above-mentioned cover tape that goes up is switched to finished width then as requested earlier, adopt small-diameter cutter on cover tape hot melt adhesive layer on the finished width, to cut two parallel longitudinal knife lofts then, adopt continuous die method to form several " eight " font cutting die lines in the outside of two parallel longitudinal knife lofts at last.
4. the job operation of cover tape is characterized in that on the paster component carrier band according to claim 3, and described two longitudinal knife lofts are 0.5 to 1MM apart from the distance of corresponding loam cake belt edge.
5. the job operation of cover tape is characterized in that on the paster component carrier band according to claim 3, and the distance between adjacent two " eight " font cutting die lines is 3-5MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102817146A CN101955015A (en) | 2010-09-15 | 2010-09-15 | Surface mount component carrier tape upper cover tape and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102817146A CN101955015A (en) | 2010-09-15 | 2010-09-15 | Surface mount component carrier tape upper cover tape and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101955015A true CN101955015A (en) | 2011-01-26 |
Family
ID=43482665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102817146A Pending CN101955015A (en) | 2010-09-15 | 2010-09-15 | Surface mount component carrier tape upper cover tape and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101955015A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538088A (en) * | 2013-07-09 | 2014-01-29 | 靖江瑞泰胶带有限公司 | Cover tape slitting cutter |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0257575A (en) * | 1988-08-10 | 1990-02-27 | Nec Corp | Tape for mounting electronic part |
| JPH04201871A (en) * | 1990-11-29 | 1992-07-22 | Mitsubishi Electric Corp | Cover tape for emboss taping |
| JPH05213364A (en) * | 1992-01-27 | 1993-08-24 | Matsushita Electric Ind Co Ltd | Component storage tape |
| JPH05330571A (en) * | 1992-05-29 | 1993-12-14 | Nec Corp | Carrier tape for semiconductor device |
| JPH07101462A (en) * | 1993-10-05 | 1995-04-18 | Matsushita Electric Ind Co Ltd | Electronic part string |
| JPH1086992A (en) * | 1996-09-11 | 1998-04-07 | Sony Corp | Ic container |
| CN1224687A (en) * | 1998-01-26 | 1999-08-04 | 四维企业股份有限公司 | Composite film for packaging |
| CN101273677A (en) * | 2005-09-16 | 2008-09-24 | 3M创新有限公司 | Cover tape and method for manufacture |
| CN101544294A (en) * | 2008-03-27 | 2009-09-30 | 3M创新有限公司 | Electronic-device packaging device, electronic-device packaging method and packaging equipment thereof |
-
2010
- 2010-09-15 CN CN2010102817146A patent/CN101955015A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0257575A (en) * | 1988-08-10 | 1990-02-27 | Nec Corp | Tape for mounting electronic part |
| JPH04201871A (en) * | 1990-11-29 | 1992-07-22 | Mitsubishi Electric Corp | Cover tape for emboss taping |
| JPH05213364A (en) * | 1992-01-27 | 1993-08-24 | Matsushita Electric Ind Co Ltd | Component storage tape |
| JPH05330571A (en) * | 1992-05-29 | 1993-12-14 | Nec Corp | Carrier tape for semiconductor device |
| JPH07101462A (en) * | 1993-10-05 | 1995-04-18 | Matsushita Electric Ind Co Ltd | Electronic part string |
| JPH1086992A (en) * | 1996-09-11 | 1998-04-07 | Sony Corp | Ic container |
| CN1224687A (en) * | 1998-01-26 | 1999-08-04 | 四维企业股份有限公司 | Composite film for packaging |
| CN101273677A (en) * | 2005-09-16 | 2008-09-24 | 3M创新有限公司 | Cover tape and method for manufacture |
| CN101544294A (en) * | 2008-03-27 | 2009-09-30 | 3M创新有限公司 | Electronic-device packaging device, electronic-device packaging method and packaging equipment thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538088A (en) * | 2013-07-09 | 2014-01-29 | 靖江瑞泰胶带有限公司 | Cover tape slitting cutter |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110126 |