CN101952353B - Production method for an in-mould, semi-cured transfer film - Google Patents
Production method for an in-mould, semi-cured transfer film Download PDFInfo
- Publication number
- CN101952353B CN101952353B CN2009801032219A CN200980103221A CN101952353B CN 101952353 B CN101952353 B CN 101952353B CN 2009801032219 A CN2009801032219 A CN 2009801032219A CN 200980103221 A CN200980103221 A CN 200980103221A CN 101952353 B CN101952353 B CN 101952353B
- Authority
- CN
- China
- Prior art keywords
- protective layer
- transcriptional
- thin film
- semi
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims abstract description 63
- 239000010409 thin film Substances 0.000 claims description 36
- 230000002103 transcriptional effect Effects 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 18
- 230000000873 masking effect Effects 0.000 claims description 18
- 239000003999 initiator Substances 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- QCCDLTOVEPVEJK-UHFFFAOYSA-N phenylacetone Chemical compound CC(=O)CC1=CC=CC=C1 QCCDLTOVEPVEJK-UHFFFAOYSA-N 0.000 claims description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 3
- YFKBXYGUSOXJGS-UHFFFAOYSA-N 1,3-Diphenyl-2-propanone Chemical compound C=1C=CC=CC=1CC(=O)CC1=CC=CC=C1 YFKBXYGUSOXJGS-UHFFFAOYSA-N 0.000 claims description 2
- DLUPHJKQEIIYAM-UHFFFAOYSA-N 1-(2-ethoxyphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCOC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 DLUPHJKQEIIYAM-UHFFFAOYSA-N 0.000 claims description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- VYVRIXWNTVOIRD-LRHBOZQDSA-N ciguatoxin CTX1B Chemical compound C([C@@]12[C@@H](C)[C@@H]([C@@H]3[C@H]([C@H]([C@H](C)[C@H]4O[C@H]5C[C@@H](C)C[C@H]6O[C@@]7(C)[C@H](O)C[C@H]8O[C@H]9C=C[C@H]%10O[C@H]%11C[C@@H]%12[C@H]([C@@H]([C@H]%13O[C@H](C=CC[C@@H]%13O%12)\C=C\[C@H](O)CO)O)O[C@@H]%11C=C[C@@H]%10O[C@@H]9C\C=C/C[C@@H]8O[C@@H]7C[C@@H]6O[C@@H]5C[C@@H]4O3)O)O2)C)[C@H](O)CO1 VYVRIXWNTVOIRD-LRHBOZQDSA-N 0.000 claims description 2
- 125000000400 lauroyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 238000005502 peroxidation Methods 0.000 claims description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 12
- 238000002347 injection Methods 0.000 abstract description 12
- 239000007924 injection Substances 0.000 abstract description 12
- 230000000704 physical effect Effects 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 238000001746 injection moulding Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 208000034189 Sclerosis Diseases 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013518 transcription Methods 0.000 description 4
- 230000035897 transcription Effects 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000002516 radical scavenger Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 231100000167 toxic agent Toxicity 0.000 description 3
- 239000003440 toxic substance Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- GTCAXTIRRLKXRU-UHFFFAOYSA-N methyl carbamate Chemical compound COC(N)=O GTCAXTIRRLKXRU-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000012745 toughening agent Substances 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CABJOLBHWJIZSS-UHFFFAOYSA-N butan-2-one;hydrogen peroxide Chemical compound OO.CCC(C)=O CABJOLBHWJIZSS-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UQTBNUKBTGBSMT-UHFFFAOYSA-N hex-1-ene;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCC=C UQTBNUKBTGBSMT-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- XNXPIAADLKVNFE-UHFFFAOYSA-N methyl 2-hydroxyprop-2-enoate Chemical class COC(=O)C(O)=C XNXPIAADLKVNFE-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/42—Intermediate, backcoat, or covering layers
- B41M5/44—Intermediate, backcoat, or covering layers characterised by the macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
- B29K2105/243—Partially cured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
- B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/002—Coloured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0087—Wear resistance
Landscapes
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Decoration By Transfer Pictures (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a production method for an in-mould, semi-cured transfer film. More specifically, it relates to a production method for an in-mould, semi-cured transfer film which has a laminated structure comprising, in sequence on a base film: a mould-release layer and a protective layer, a print layer, a vapour-deposited layer and an adhesive layer. The said transfer film does not produce harmful substances such as formaldehyde (HCHO) during the production process, and can endow injection moulded articles with highly outstanding physical properties when it is used.
Description
Technical field
The present invention relates to the manufacture method of semi-harden transcriptional thin film in a kind of mould.
Background technology
Recently, during the liquid-crystal display window of the front panel of the various household appliances such as manufacturing washing machine or air-conditioning or computer, mobile phone etc., be widely used (Inmold) injection moulding in the mould.As everyone knows, the in-mould injection method refers to the method for injection moulding molten resin under the state of the transcriptional thin film that the given pattern of printing is installed between the anchor of injection mold and the movable stand.This in-mould injection method has solved 360 degree that in the past the heat method of transcribing fails to solve around transcribing and jog is transcribed problem, and, injection moulding, vacuum moulding machine, adhesion and 4 step process of pasting the compositions such as aluminium sheet are simplified to injection moulding and transcribe a step process, thereby significantly reduced manufacturing cost and the scrap rate of injection moulding cast product.
In the process of implementing existing mold injection moulding operation, be transcriptional thin film for the material of the topmost impact of mass formation of cast product.Generally, transcriptional thin film is comprised of the bed die that possesses heteromorphism (perhaps substrate) and the protective layer, printed layers, settled layer and the adhesion layer that stack gradually thereon.Under the inner state that transcriptional thin film is installed of injection mold, injection moulding molten resin and casting out after the cast product, the protective layer of transcriptional thin film and printed layers and settled layer are transcribed cast product by adhesion layer, and bed die since heterolayer obtain separating at protective layer.At this moment, only have the part that covers printed layers to adhere on the cast product in the protective layer, and rest part is cut and remove with bed die.Therefore, protective layer not only needs to possess the physical strength that can protect printed layers, also needs to possess outstanding cutting and prevents that burr (Burr) from appearring in cut surface.
In the prior art, thermosetting resin or uv-hardening resin have become the main raw of protective layer., generally, resistance and the wear resistance of the protective layer of use thermosetting resin are low, particularly, use the protective layer of uv-hardening resin to be easy to shattered crack occur at crooked position.
For example; the clear 60-239278 of Japanese patent laid-open publication gazette number (date of declaration: on November 28th, 1985) disclose the gold stamping paper tinsel (Hot stampingfoil) that stacks gradually heterolayer, protective layer, vacuum deposited layer and adhesion layer on the counterdie, the protective layer of this gold stamping paper tinsel just is comprised of uv-hardening resins such as Synolac or vibrin.Therefore, outstanding for the anti-mechanicalness of scratch etc., can be full of cracks appear at bend.
In addition, Korean Patent is announced (date of declaration: on April 15th, 1999) disclose the technology that forms of the protective layer that is comprised of uv-hardening resin and multi-functional isocyanic ester in the transcription material that is comprised of substrate and protective layer, printed layers and adhesion layer 1999-28385 number.At this moment, in making the process of described protective layer, heating once realizes semi-harden, and the transcription material of finishing is transcribed after the cast product, again realizes with uviolizing hardening completely.Although this transcription material has significantly been improved the crack resistance of crooked position, can still do not solve the drawback that burr (Burr) appears in the cut surface of casting protective layer when removing substrate afterwards.Especially severe be that in manufacturing processed, the residue of unreacted isocyanic ester produces harmful toxicant formaldehyde (HCHO).
Summary of the invention
In order to overcome the above problems; the invention provides the manufacture method of semi-harden transcriptional thin film in a kind of mould; the process of the transcriptional thin film that is used for in-mould injection that manufacturing is comprised of the counterdie that possesses heteromorphism and protective layer, printed layers, settled layer and adhesion layer; to cause transcribing glossiness, wear resistance and the resistance of cast product of described transcriptional thin film also outstanding because cutting, crack resistance and the transparency of described protective layer be outstanding; and transcriptional thin film does not produce the toxicants such as formaldehyde, thereby has significantly improved the globality operating environment.
Technical program of the present invention lies in:
The present invention stacks gradually opposite sex layer at bed die; protective layer; printed layers; settled layer and adhesion layer; and manufacturing is used for the process of the transcriptional thin film of in-mould injection; for being the protective layer masking liquid that a certain or two or more uv-hardening resin that forms 100 parts by weight preparations are comprised of hydrogen peroxide heat embrittlement initiator 1～10 parts by weight and Photoepolymerizationinitiater initiater 3～8 parts by weight in the oligopolymer by acrylic monomer or epoxy system or carbamate; and described masking liquid is coated in after the described opposite sex layer heat embrittlement 10～30 seconds under 80～180 ℃ of temperature environments and form protective layer with 1～20 μ m thickness.
Technique effect of the present invention is:
In-mould injection of the present invention is not multi-functional isocyanic ester with the heat embrittlement initiator of the manufacture method employing of semi-harden transcriptional thin film, but hydrogen peroxide.Therefore, in manufacturing processed, do not produce the toxicants such as formaldehyde (HCHO) and significantly improved the globality Working environment.
And; because under the state of semi-hardening protective layer; namely; coating and printing layer under (Tacky free) the adhering state of removal; the cutting of the outstanding and protective layer of the interlayer clinging force between protective layer and the printed layers and crack resistance and transparency are outstanding, cause the glossiness of the cast product of transcribing described transcriptional thin film and wear resistance and resistance also outstanding.
Embodiment
Semi-harden transcriptional thin film is to stack gradually heterolayer and protective layer, printed layers, settled layer and adhesion layer form at bed die in the mould of the present invention.At this moment, it is identical with usual method with the method for opposite sex layer, printed layers and adhesion layer to form described bed die, and technical characterictic of the present invention is limited in the method that forms described protective layer.In order to help those skilled in the art to understand better the present invention, below describe for example described bed die and heterolayer, printed layers, settled layer and adhesion layer in detail.
Bed die plays the function that keeps the transcriptional thin film form on the whole among the present invention.For example, be that a kind of or two or more hybrid resins form in the resin by polyester system or polypropylene-based, polyamide-based, polyethylene-based or triacetate, its thickness is, preferably, 20～50 μ m.
The heterolayer that is layered on the described bed die plays the function of after injection moulding described bed die being separated from cast product.For example, formed by wax or silica gel, tetrafluoroethylene, trimeric cyanamide, unsaturated urethane etc.The thickness of described heterolayer is, preferably, and about 0.5～1 μ m.
Protective layer is layered on the described heterolayer as technical characterictic of the present invention, plays the afterwards protection of separation bed die and sticks to the printed layers of cast product and the effect of adhesion layer.This protective layer is the protective layer masking liquid that at first preparation is comprised of hydrogen peroxide heat embrittlement initiator 1～10 parts by weight and Photoepolymerizationinitiater initiater 3～8 parts by weight for uv-hardening resin 100 parts by weight; after being coated on the described heterolayer with the thickness of 1～20 μ m this protective layer masking liquid, heat embrittlement formed in 10～30 seconds under 80～180 ℃ of temperature environments.By said process, described protective layer becomes semi-harden and removes adhering state.
At this moment, described uv-hardening resin can adopt common uv-hardening resin, and for example, it is a certain or two or more in the oligopolymer can adopting acrylic monomer or epoxy system or carbamate.
Described heat embrittlement initiator can adopt methyl ethyl ketone hydrogen peroxide, cumene hydroperoxide hydrogen, t-butylperoxyl benzoate, 1,1-ditertiary butyl peroxide-3, a certain or two or more in 3,5-trimethyl-cyclohexane, the two lauroyl of peroxidation, the dibenzoyl peroxide.Described hydrogen peroxide is easy to be thermal decomposited with the acrylic reaction of described uv-hardening resin heat embrittlement occurs.
And, described Photoepolymerizationinitiater initiater can adopt benzophenone, benzyl ketone, CTX, 2, and is a kind of or two or more in 4-diethyl thioxanthone, ethoxybenzoin, diethoxy acetophenone, benzyl methyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, the 1-hydroxy-cyclohexyl phenyl ketone.Described Photoepolymerizationinitiater initiater is excited (Excitation) that the foundation reaction occurs by ultraviolet ray, thereby promotes the chain reaction of uv-hardening resin.
Among the present invention, the content of described hydrogen peroxide is 1 parts by weight when following, because the heat embrittlement degree is inadequate, protective layer can keep some adhesivityes, and this can reduce product performance.In contrast, the content of described hydrogen peroxide reaches 10 parts by weight when above, because the heat embrittlement degree is too high, be full of cracks can appear in protective layer.And the heat embrittlement degree was not inadequate when the temperature that heats described coating reached 80 ℃.In contrast, when the temperature that heats described coating reached more than 180 ℃, bed die was perhaps because of temperature distortion.
Among the present invention, described protective layer masking liquid can also comprise amine or Urea Series compound as the light toughener except uv-hardening resin and heat embrittlement initiator and Photoepolymerizationinitiater initiater.Described smooth toughener can promote the foundation reaction of Photoepolymerizationinitiater initiater.
The method that is coated with the masking liquid of described protective layer can adopt intaglio plate coating machine, nick version coating machine, T mould fluting coating machine, spraying coating machine, lack castor coating machine etc.When being applied to the protective layer masking liquid on the heterolayer by aforesaid method, this coating is hardened in anaerobism, that is, under the anoxic condition, process of setting is more smooth.That is, the inner setting rate of the coating of anoxic is fast, and the coatingsurface setting rate that contacts oxygen is slow.Therefore, protective layer coating operation of the present invention preferably, is carried out under nitrogen environment.So, become nitrogen oxide after nitrogen and the combination with oxygen and play the effect of scavenging agent (Scavenger), thereby also carry out rapidly anaerobism sclerosis at coatingsurface.
And, can adopt the monomer that includes aryl at the adhering additive of the surface removal of protective layer, preferably, adopt hydroxyl acrylic methyl esters and analogue thereof.At this moment, play equally the scavenging agent effect after hydroxyl and the combination with oxygen and help to implement the anaerobism sclerosis.
In addition, the printed layers that is layered on the described protective layer is identical with existing transcriptional thin film, is comprised of acrylic resin or polyurethane resin, melamine resin and polyamide resin, and comprises versicolor pigment or dyestuff.Described printed layers, preferably, it is 1～2 μ m that part forms given pattern and color and thickness.Among the present invention, described printed layers is coated on the protective layer of semi-harden state, possesses powerful interlayer clinging force.The settled layer that is layered on the described printed layers is identical with existing transcriptional thin film, is comprised of aluminium or chromium, nickel, silver etc., and plays the effect that metallicity gloss is provided.The thickness of settled layer is about 0.02 μ m.
At last, adhesion layer is that adhesive agent forms by acrylic acid series or ethene, and plays the effect of transcription film applying of the present invention to the injection moulding cast product.The thickness of adhesion layer is, preferably, and 1～2 μ m.
As mentioned above; among the present invention; consist of and do not add in the uv-hardening resin of described protective layer as the multi-functional isocyanic ester of heat embrittlement initiator and add hydrogen peroxide; thereby when forming the protective layer masking liquid; heat after described protective layer masking liquid is coated on the heterolayer implement first semi-harden after, form printed layers and settled layer and adhesion layer and produce transcriptional thin film at the protective layer of semi-harden state.And, utilize after the described transcriptional thin film injection moulding cast product, to the protective layer of transcribing cast product again irradiation ultraviolet radiation and the protective layer that hardens fully.
Describe the present invention in detail below with reference to embodiment and Comparative Examples.
Embodiment 1
With vibrin mould (TORAY company product: XM80) be used for bed die, and on its bed die, be heterolayer with 0.5 μ m thickness intaglio plate coating unsaturated urethane.
Then; with propenoic methyl carbamate resin (SARTOMER company product: CN953) 48 parts by weight; butylethylene acrylate 25 parts by weight; methacrylic acid octadecane alcohol ester (the product SR324 of SARTOMER company) 22 parts by weight and allyl methacrylate(AMA) (the product SR201 of SARTOMER company) 5 parts by weight are used for uv-hardening resin; cumene hydroperoxide 4 parts by weight are used for the heat embrittlement initiator; (Ciba company product: Darocur-1173) 4 parts by weight are used for Photoepolymerizationinitiater initiater, and (BYK company product: ANTI-TERA-YOU) 2 parts by weight prepare the protective layer masking liquid to use other dispersion agent with 2-hydroxy-2-methyl-1-phenyl-1-acetone.Under nitrogen environment, utilize after the intaglio plate coating machine is coated on the described heterolayer with 5 μ m thickness described protective layer masking liquid heat embrittlement 20 seconds under 160 ℃ of temperature environments and form protective layer.
On described protective layer, implement coloured coating and form printed layers with usual method; and at the coating depositing treatment agent of this printed layers and vacuum deposited aluminum and after forming settled layer; on its settled layer, form adhesion layer with the thickness acrylic resins of painting solvent B82 solution of 1 μ m, thereby produce the transcriptional thin film (A) for in-mould injection.
Embodiment 2
Among the described embodiment 1, the heat embrittlement initiator does not use cumene hydroperoxide and uses dibenzoyl peroxide 4 parts by weight, thus preparation protective layer masking liquid.In addition, adopt the method identical with described embodiment 1 to produce transcriptional thin film (B) for in-mould injection.
Comparative Examples 1
Among the described embodiment 1, the protective layer masking liquid of cumene hydroperoxide is removed in preparation, and with the method identical with described embodiment 1 this masking liquid is coated in and forms protective layer on the heterolayer.Then; to described protective layer direct irradiation UV-lamp (high voltage mercury lamp: 120W/cm) realize after the sclerosis with ultraviolet ray, form printed layers and settled layer and adhesion layer and produce transcriptional thin film (C) for in-mould injection with the method identical with described embodiment 1.
Comparative Examples 2
Among the described embodiment 2, the protective layer masking liquid of dibenzoyl peroxide is removed in preparation, and with the method identical with described embodiment 2 this masking liquid is coated in and forms protective layer on the heterolayer.Then; to described protective layer direct irradiation UV-lamp (high voltage mercury lamp: 120W/cm) realize after the sclerosis with ultraviolet ray, form printed layers and settled layer and adhesion layer and produce transcriptional thin film (D) for in-mould injection with the method identical with described embodiment 2.
The test physical property
Detection reaches physical propertys such as whether there being burr by each interlayer clinging force and surface strength, the be full of cracks degree of transcriptional thin film A～D that described embodiment and Comparative Examples obtain, and its result can be with reference to following table 1.At this moment; detect by an unaided eye the 3M transparent adhesive tape is pasted whether protective layer separates to detect clinging force with printed layers when opening behind the surface of protective layer at once; detect surface hardness with pencil hardometer; the state of crooked position of detecting by an unaided eye is observed the be full of cracks degree, and observes the burr (Burr) that are formed at the protective layer cut surface after the injection moulding with magnascope and observe whether there are burr.
＜table 1 〉
| Classification | The interlayer clinging force | Surface hardness | The be full of cracks degree | Whether there are burr |
| Transcriptional thin film A (embodiment 1) | Be close to fully | 4H | Nothing | Nothing |
| Transcriptional thin film B (embodiment 2) | Be close to fully | 4H | Nothing | Nothing |
| Transcriptional thin film C (Comparative Examples 1) | Part is peeled off | 3H | The part be full of cracks | Part produces |
| Transcriptional thin film D (Comparative Examples 2) | Part is peeled off | 3H | The part be full of cracks | Part produces |
As above shown in the table 1; transcriptional thin film (C, D) protective layer and the interlayer clinging force between the printed layers that the transcriptional thin film that the embodiment of the invention produces (A, B) produces compared with Comparative Examples are outstanding; the surface hardness of protective layer of transcribing cast product is outstanding; the be full of cracks degree of crooked position is improved, and the cut surface of protective layer does not produce burr.
Claims (4)
1. the manufacture method of the interior semi-harden transcriptional thin film of mould is characterized in that, stacks gradually heterolayer, protective layer, printed layers, settled layer and adhesion layer at bed die,
And the process of transcriptional thin film comprises in the manufacturing mould; preparation is the protective layer masking liquid that a certain or two or more uv-hardening resin that forms 100 parts by weight and hydrogen peroxide heat embrittlement initiator 1 ~ 10 parts by weight and Photoepolymerizationinitiater initiater 3 ~ 8 parts by weight form in the oligopolymer by acrylic monomer or epoxy system or carbamate; and after being coated on the described heterolayer with 1 ~ 20 thickness the protective layer masking liquid, heat embrittlement 10 ~ 30 seconds under 80 ~ 180 ℃ of temperature environments and the step of protective layer of forming.
2. the manufacture method of semi-harden transcriptional thin film in the mould according to claim 1, it is characterized in that, described hydrogen peroxide heat embrittlement initiator adopts cumene hydroperoxide, peroxidized t-butyl perbenzoate, 1,1-ditertiary butyl peroxide-3, a certain or two or more in 3,5-trimethyl-cyclohexane, the two lauroyl of peroxidation, the dibenzoyl peroxide.
3. the manufacture method of semi-harden transcriptional thin film according to claim 1 or in the 2 described moulds, it is characterized in that, described Photoepolymerizationinitiater initiater adopts benzophenone, benzyl ketone, CTX, 2, and is a certain or two or more in 4-diethyl thioxanthone, ethoxybenzoin, diethoxy acetophenone, benzyl methyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, the 1-hydroxy-cyclohexyl phenyl ketone.
4. the manufacture method of semi-harden transcriptional thin film according to claim 1 or in the 2 described moulds is characterized in that, implements to form the step of described protective layer under nitrogen environment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080008685A KR100823834B1 (en) | 2008-01-28 | 2008-01-28 | Method of manufacturing semi-cured transfer film for in-mold |
| KR10-2008-0008685 | 2008-01-28 | ||
| PCT/KR2009/000326 WO2009096680A2 (en) | 2008-01-28 | 2009-01-22 | Production method for an in-mould, semi-cured transfer film |
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| CN101952353A CN101952353A (en) | 2011-01-19 |
| CN101952353B true CN101952353B (en) | 2013-01-02 |
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| CN2009801032219A Expired - Fee Related CN101952353B (en) | 2008-01-28 | 2009-01-22 | Production method for an in-mould, semi-cured transfer film |
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| Country | Link |
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| KR (1) | KR100823834B1 (en) |
| CN (1) | CN101952353B (en) |
| WO (1) | WO2009096680A2 (en) |
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| KR101420079B1 (en) * | 2012-05-08 | 2014-07-15 | 에스케이씨 주식회사 | In-mold film for injection molding and method for forming undercoating layer used in the preparation thereof |
| KR102086794B1 (en) * | 2013-05-31 | 2020-04-14 | 삼성전자주식회사 | Method for manufacturing case frame |
| KR102723379B1 (en) * | 2021-10-08 | 2024-10-29 | 도우성 | Coating compositon for imd film and coating film using same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6773465B1 (en) * | 2000-05-18 | 2004-08-10 | Itoh Optical Industrial Co., Ltd. | Optical element |
| CN1646608A (en) * | 2002-02-14 | 2005-07-27 | 阿什兰公司 | Free radically cured cold-box binders containing an alkyl silicate |
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| JP2908467B2 (en) * | 1989-04-07 | 1999-06-21 | 大日本印刷株式会社 | In-mold transfer sheet and method for manufacturing the same |
| MY121667A (en) * | 1996-04-26 | 2006-02-28 | Nissha Printing | Thermo and active energy ray curable resin composition used for protecting layer of transfer material transfer material surface protecting material and process for producing molded article excellent in abrasion resistance and chemical resistance. |
| JP4086131B2 (en) * | 2001-01-30 | 2008-05-14 | 日本化薬株式会社 | Resin composition, solder resist resin composition, and cured products thereof |
| US20060051549A1 (en) * | 2002-10-31 | 2006-03-09 | Kyoeisha Chemical Co., Ltd | Resin composition, transfer material and process for producing shaped item |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6773465B1 (en) * | 2000-05-18 | 2004-08-10 | Itoh Optical Industrial Co., Ltd. | Optical element |
| CN1646608A (en) * | 2002-02-14 | 2005-07-27 | 阿什兰公司 | Free radically cured cold-box binders containing an alkyl silicate |
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| Title |
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| JP平2-266975A 1990.10.31 |
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| WO2009096680A2 (en) | 2009-08-06 |
| CN101952353A (en) | 2011-01-19 |
| KR100823834B1 (en) | 2008-04-21 |
| WO2009096680A3 (en) | 2009-10-22 |
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