CN101951237B - Laminated sheet type filter and preparation method thereof - Google Patents
Laminated sheet type filter and preparation method thereof Download PDFInfo
- Publication number
- CN101951237B CN101951237B CN2010102368185A CN201010236818A CN101951237B CN 101951237 B CN101951237 B CN 101951237B CN 2010102368185 A CN2010102368185 A CN 2010102368185A CN 201010236818 A CN201010236818 A CN 201010236818A CN 101951237 B CN101951237 B CN 101951237B
- Authority
- CN
- China
- Prior art keywords
- diaphragm
- sheet type
- filter
- lamination sheet
- ferrite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 238000003475 lamination Methods 0.000 claims abstract description 57
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 238000005245 sintering Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 3
- 239000002002 slurry Substances 0.000 claims abstract description 3
- 239000011148 porous material Substances 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 7
- 229910052573 porcelain Inorganic materials 0.000 claims description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000003854 Surface Print Methods 0.000 claims description 4
- 239000012752 auxiliary agent Substances 0.000 claims description 4
- 238000000498 ball milling Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims description 2
- 238000007766 curtain coating Methods 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract 2
- 239000003989 dielectric material Substances 0.000 abstract 2
- 238000010304 firing Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004537 pulping Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000010345 tape casting Methods 0.000 abstract 1
- 238000003491 array Methods 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000019580 granularity Nutrition 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
一种叠层片式滤波器及其制备方法，属于电子元器件技术领域。该滤波器由叠层片式电容和叠层片式磁芯电感复合而成；所述叠层片式磁芯电感由多层表面印刷了导体线的铁氧体膜片层叠烧结而成；所述叠层片式电容包括的端电极与地电极之间是复合介质材料，所述复合介质材料包括铁氧体材料和分布于铁氧体材料中的柱状陶瓷阵列。其制备方法包括配料、流延、制浆、打阵列/互连孔、填陶瓷/导体浆料、导带印刷、叠片、热水均压、切割、排烧、封端等步骤。本发明通过在叠层铁氧体片式滤波器的电容部分增加陶瓷柱状阵列结构，增加了普通铁氧体结构中的等效介电常数，提高了Q值，增大了容值，有效的降低滤波器截止频率，改善了滤波器带外抑制特性。
A laminated chip filter and a preparation method thereof belong to the technical field of electronic components. The filter is composed of a laminated chip capacitor and a laminated chip core inductor; the laminated chip core inductor is formed by laminating and sintering ferrite diaphragms with conductor lines printed on the surface of multiple layers; The laminated chip capacitor includes a composite dielectric material between the terminal electrode and the ground electrode, and the composite dielectric material includes a ferrite material and a columnar ceramic array distributed in the ferrite material. The preparation method includes batching, tape casting, pulping, array/interconnect hole punching, ceramic/conductor slurry filling, conductive tape printing, lamination, hot water pressure equalization, cutting, firing, sealing and other steps. The invention increases the equivalent dielectric constant in the ordinary ferrite structure by adding a ceramic columnar array structure to the capacitor part of the laminated ferrite chip filter, improves the Q value, increases the capacitance value, and effectively Reduce the filter cut-off frequency, improve the filter out-of-band rejection characteristics.
Description
Technical field
The invention belongs to technical field of electronic components, relate to chip-type filter, particularly contain lamination sheet type ferrite filter of dielectric ceramic columnar arrays and preparation method thereof.
Background technology
Along with complete machine and system to the electronic devices and components volume and weight require increasingly high; Filter is as a large amount of passive components that use in system and the complete machine; It is extremely important to reduce its volume and weight; The filter that particularly anti-electromagnetic interference is used, the research anti-emi filter that volume is little, reliability is high becomes the current focus of attention especially.For this reason, both at home and abroad producer develops through the form that adopts monolithic multilayer structure and the anti-emi filter of production miniaturization, low cut-off frequency.
The anti-emi filter of present lamination sheet type structure; Its circuit and version have the C type capacitive form of the parallelly connected direct-to-ground capacitance that adopts single dielectric ceramic material or the pure inductance form of single ferrite multilayered inductance; The anti-emi filter of these versions has the band outside inhibitory can be not high, shortcomings such as rectangle degree difference.For the shortcoming of suppression characteristic difference outside the band that solves filter, the frequency bandwidth characteristics of filter improves through adopting multilayer LC type circuit structure in filter production firm.Common structure has the LC mode filter that adopts single dielectric ceramic material to constitute; The filter of this kind structure has improved the outer suppression characteristic of band; But satisfy the application demand of low cut-off frequency, just need to increase the appearance value and the sense value of filter, because the magnetic permeability of dielectric ceramic is very little; Can only increase the sense value through increasing the inductance number of plies, thereby increase the volume and weight of filter greatly.The LC mode filter that adopts single Ferrite Material to constitute is also arranged; It is same because the dielectric constant of Ferrite Material is very little; Though as to improve the demand that the appearance value satisfies low cut-off frequency, can only realize through increasing the electric capacity number of plies, also can increase the volume and weight of filter greatly; Single Ferrite Material makes the operating frequency range of filter be usually less than 500MHz because its resonance frequency is not high simultaneously.A kind of in addition filter adopts inductive part to have the Ferrite Material lamination to form exactly; Capacitive part is formed by the dielectric ceramic material lamination; Again two parts are combined as a whole and form splitlevel LC filter, though this type of filter has improved the band external characteristic of filter, owing to have interfacial effect between ceramic layer and the ferrite layer; And two kinds of material crystals granularities are different with shrinkage; When the binder removal sintering, can produce a large amount of stress at the interface, the difference of two kinds of material contracts speed and direction has been quickened the accumulation of stress, and the interfacial stress of this generation adds that the contraction mismatch between material layer tends to crackle, layering and the warpage that causes filter inner; Can cause the porcelain body cracking when serious, greatly reduce the reliability of filter.
Summary of the invention
To above problem, task of the present invention provides a kind of novel laminated chip-type filter and preparation method thereof, and this filter has advantages such as cut-off frequency is low, the outer inhibition of band is high, squareness factor is good, operating frequency range is wide; When preparation chip-type filter provided by the invention, need not existing equipment is transformed, its preparation technology is compatible mutually with conventional chip components and parts technology and LTCC technology.
The present invention introduces ceramic columnar arrays in existing LC type ferrite chip-type filter; Effectively improve the appearance value of filter; Because columnar arrays evenly distributes, can effectively control the contraction of each independent cylinder in the columnar arrays as the Ferrite Material of agent structure, reduce the porcelain body internal stress; Alleviate the dissimilar materials interfacial effect, thus the whole reliability that improves porcelain body.
The technical scheme that the present invention takes is following:
A kind of lamination sheet type wave filter, as shown in Figure 1, be composited by lamination sheet type electric capacity and lamination sheet type magnetic core inductance, have the lamination sheet type structure.Said lamination sheet type magnetic core inductance is formed by the range upon range of sintering of ferrite membrane sheet that multiple-level surface has printed conductor lines; The conductor lines on multilayer ferrite diaphragm surface is interconnected and forms an inductance coil; An exit of this inductance coil links to each other with a termination electrode of whole filter, and another exit links to each other with another termination electrode of whole filter.Said lamination sheet type electric capacity comprises two termination electrode plates and a ground electrode plate; One of them termination electrode plate links to each other with a termination electrode of whole filter; Another termination electrode plate links to each other with another termination electrode of whole filter, and the ground electrode plate links to each other with the ground electrode of whole filter; Be the complex media material between termination electrode and ground electrode, said complex media material comprises Ferrite Material and is distributed in the column Ceramic Array in the Ferrite Material.
Lamination sheet type wave filter provided by the invention can also be expanded into periodic structure.The lamination sheet type wave filter of periodically expanding structure that has provided by the invention as shown in Figure 2, this filter is stacked together spaced reciprocally by a plurality of said lamination sheet type electric capacity and a plurality of said lamination sheet type magnetic core inductance.
Compare (Insertion Loss-frequency curve of various forms filter is as shown in Figure 4) with existing C type, capacitance-resistance type, pure sense matrix formula filter, filter provided by the invention has the following advantages:
(1) inductive part in the filter has advantages such as the sense value is big, equivalent series resistance is little, parasitic parameter is little, has improved the transmission performance in the filter passband;
(2) through in the capacitive part diaphragm, inserting low Jie's high-frequency ceramic material; Form columnar arrays through multilayer stack back; Effectively increase the appearance value and the Q value of capacitive part in the filter, dwindled the volume and weight of filter, strengthened the outer suppression characteristic of band and the high frequency characteristics of filter simultaneously; Weaken the outer inhibition of filter band along with frequency increases and " sticking up tail " phenomenon of variation, expanded the operating frequency range of application of filter.
(3) the present invention fills dielectric ceramic material through through hole in the preparation process of reality, and the columnar arrays that multilayer stack back forms is evenly distributed; The independent cylinder ceramic material of in the array each, the Ferrite Material that all is used as agent structure be tightly around control, thereby effectively decompose the porcelain body internal stress; Alleviate the interfacial effect between the dissimilar materials; Reduce the contraction mismatch when burning altogether greatly, solve the delamination splitting phenomenon that possibly occur when porcelain body burns altogether, the whole reliability that improves filter; The method is simply efficient, in batches high conformity.
Description of drawings
Fig. 1 is the longitudinal profile structural representation of lamination sheet type wave filter provided by the invention.
Fig. 2 is the longitudinal profile structural representation of periodically expanding the lamination sheet type wave filter of structure that has provided by the invention.
Fig. 3 is a column Ceramic Array provided by the invention structural plan sketch map.
Fig. 4 is the insertion loss-frequency curve comparison diagram of lamination sheet type wave filter provided by the invention and correlation filter.
Embodiment
A kind of lamination sheet type wave filter, as shown in Figure 1, be composited by lamination sheet type electric capacity and lamination sheet type magnetic core inductance, have the lamination sheet type structure.Said lamination sheet type magnetic core inductance is formed by the range upon range of sintering of ferrite membrane sheet that multiple-level surface has printed conductor lines; The conductor lines on multilayer ferrite diaphragm surface is interconnected and forms an inductance coil; An exit of this inductance coil links to each other with a termination electrode of whole filter, and another exit links to each other with another termination electrode of whole filter.Said lamination sheet type electric capacity comprises two termination electrode plates and a ground electrode plate; One of them termination electrode plate links to each other with a termination electrode of whole filter; Another termination electrode plate links to each other with another termination electrode of whole filter, and the ground electrode plate links to each other with the ground electrode of whole filter; Be the complex media material between termination electrode and ground electrode, said complex media material comprises Ferrite Material and is distributed in the column Ceramic Array in the Ferrite Material.
Lamination sheet type wave filter provided by the invention can also be expanded into periodic structure.The lamination sheet type wave filter of periodically expanding structure that has provided by the invention as shown in Figure 2; This filter is stacked together spaced reciprocally by a plurality of said lamination sheet type electric capacity and a plurality of said lamination sheet type magnetic core inductance; Thereby realize the version of inductance and electric capacity parallel connection, satisfy the demand of various applications.
A kind of preparation method of lamination sheet type wave filter may further comprise the steps:
Step 1: preparation ferrite green diaphragm.Choose the ferrite powder of initial permeability between 100～1000, after ball milling evenly mixes, process the ferrite slurry, prepare ferrite green diaphragm through dry method curtain coating mode then, be designated as diaphragm A.The THICKNESS CONTROL of individual layer diaphragm A is between 10um～100um.
Step 2: preparation ceramic size.Choose the ceramic powder of dielectric constant between 10～100, add auxiliary agent, obtain ceramic size after ball milling evenly mixes.Said auxiliary agent comprises adhesive, dispersant, alcohol and toluene.
Step 3: beat array hole.Choose the diaphragm A that respective numbers is used to prepare lamination sheet type electric capacity, beat the equidistance array hole, bore dia is 0.2mm, and pitch of holes is designated as diaphragm B from for 0.6mm with the diaphragm A that accomplishes fluently array hole.
Step 4: fill out ceramic size.The ceramic size of step 2 preparation is inserted in the array hole of diaphragm B, obtained diaphragm D.
Step 5: beat interconnected pores.Choose the diaphragm A that respective numbers is used to prepare lamination sheet type magnetic core inductance, need carry out the position of wire interconnects at the preparation inductance and stamp interconnected pores, the interconnected pores diameter is 0.2mm, and the diaphragm A that accomplishes fluently interconnected pores is designated as diaphragm C.
Step 6: fill out conductor paste.Conductor paste is inserted in the interconnected pores of diaphragm C, obtained diaphragm E.
Step 7: printing.Adopt conductor paste at part diaphragm B surface printing required ground electrode of lamination sheet type capacitor or termination electrode figure, obtain diaphragm F; Likewise, adopt conductor paste, obtain diaphragm G at the required wire pattern of diaphragm C surface printing lamination sheet type magnetic core inductance.
Step 8: lamination, hot water are all pressed, and choose the diaphragm A of some, and diaphragm F and diaphragm G are according to filter construction lamination one by one.The mode of all pressing through hot water behind the lamination forms fine and close crust piece.
Step 9: cutting, binder removal, sintering and end-blocking.The crust piece that step 8 is formed forms cuboid chip of the same size through the mode of cutting, and put into the binder removal stove, sintering furnace carries out binder removal and sintering, forms that size is identical, fine and close to become the porcelain core sheet uniformly.Chip is carried out end-blocking, finally obtain the lamination sheet type wave filter among the present invention.
Claims (3)
1. a lamination sheet type wave filter is composited by lamination sheet type electric capacity and lamination sheet type magnetic core inductance, has the lamination sheet type structure; It is characterized in that: said lamination sheet type magnetic core inductance is formed by the range upon range of sintering of ferrite membrane sheet that multiple-level surface has printed conductor lines; The conductor lines on multilayer ferrite diaphragm surface is interconnected and forms an inductance coil; An exit of this inductance coil links to each other with a termination electrode of whole filter, and another exit links to each other with another termination electrode of whole filter; Said lamination sheet type electric capacity comprises two termination electrode plates and a ground electrode plate; One of them termination electrode plate links to each other with a termination electrode of whole filter; Another termination electrode plate links to each other with another termination electrode of whole filter, and the ground electrode plate links to each other with the ground electrode of whole filter; Be the complex media material between termination electrode and ground electrode, said complex media material comprises Ferrite Material and is distributed in the column Ceramic Array in the Ferrite Material.
2. lamination sheet type wave filter according to claim 1 is characterized in that said lamination sheet type wave filter has periodic structure, and is stacked together spaced reciprocally by a plurality of said lamination sheet type electric capacity and a plurality of said lamination sheet type magnetic core inductance.
3. the preparation method of a lamination sheet type wave filter may further comprise the steps:
Step 1: preparation ferrite green diaphragm; Choose the ferrite powder of initial permeability between 100 to 1000, after ball milling evenly mixes, process the ferrite slurry, prepare ferrite green diaphragm through dry method curtain coating mode then, be designated as diaphragm A; The THICKNESS CONTROL of individual layer diaphragm A at 10um between the 100um;
Step 2: preparation ceramic size; Choose the ceramic powder of dielectric constant between 10 to 100, add auxiliary agent, obtain ceramic size after ball milling evenly mixes; Said auxiliary agent comprises adhesive, dispersant, alcohol and toluene;
Step 3: beat array hole; Choose the diaphragm A that respective numbers is used to prepare lamination sheet type electric capacity, beat the equidistance array hole, bore dia is 0.2mm, and pitch of holes is designated as diaphragm B from for 0.6mm with the diaphragm A that accomplishes fluently array hole;
Step 4: fill out ceramic size; The ceramic size of step 2 preparation is inserted in the array hole of diaphragm B, obtained diaphragm D;
Step 5: beat interconnected pores; Choose the diaphragm A that respective numbers is used to prepare lamination sheet type magnetic core inductance, need carry out the position of wire interconnects at the preparation inductance and stamp interconnected pores, the interconnected pores diameter is 0.2mm, and the diaphragm A that accomplishes fluently interconnected pores is designated as diaphragm C;
Step 6: fill out conductor paste; Conductor paste is inserted in the interconnected pores of diaphragm C, obtained diaphragm E;
Step 7: printing; Adopt conductor paste at part diaphragm B surface printing required ground electrode of lamination sheet type electric capacity or termination electrode figure, obtain diaphragm F; Likewise, adopt conductor paste, obtain diaphragm G at the required wire pattern of diaphragm C surface printing lamination sheet type magnetic core inductance;
Step 8: lamination, hot water are all pressed, and choose the diaphragm A of some, and diaphragm F and diaphragm G are according to filter construction lamination one by one; The mode of all pressing through hot water behind the lamination forms fine and close crust piece;
Step 9: cutting, binder removal, sintering and end-blocking; The crust piece that step 8 is formed forms cuboid chip of the same size through the mode of cutting, and put into the binder removal stove, sintering furnace carries out binder removal and sintering, forms that size is identical, fine and close to become the porcelain core sheet uniformly; Chip is carried out end-blocking, finally obtain lamination sheet type wave filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102368185A CN101951237B (en) | 2010-07-23 | 2010-07-23 | Laminated sheet type filter and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102368185A CN101951237B (en) | 2010-07-23 | 2010-07-23 | Laminated sheet type filter and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101951237A CN101951237A (en) | 2011-01-19 |
| CN101951237B true CN101951237B (en) | 2012-11-28 |
Family
ID=43454612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102368185A Expired - Fee Related CN101951237B (en) | 2010-07-23 | 2010-07-23 | Laminated sheet type filter and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101951237B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107465395A (en) * | 2014-04-03 | 2017-12-12 | 深圳振华富电子有限公司 | A kind of lamination sheet type ceramic RF low pass filter and preparation method thereof |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105281698A (en) * | 2015-09-17 | 2016-01-27 | 浙江大学 | Mobile communication terminal LTCC nine-order harmonic suppression filter and mobile communication terminal |
| CN107332531A (en) * | 2017-06-29 | 2017-11-07 | 电子科技大学 | A kind of preparation method of lamination tunable filter and adjustable core inductance |
| CN107591256B (en) * | 2017-07-14 | 2019-07-19 | 电子科技大学 | A large-capacity gradient plate array capacitor chip and preparation method thereof |
| CN110492731A (en) * | 2019-09-11 | 2019-11-22 | 成都宏科电子科技有限公司 | A kind of ceramics water type power adapter and manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1289180A (en) * | 1999-09-21 | 2001-03-28 | 株式会社村田制作所 | Inductance-capacitance filter |
| CN1356741A (en) * | 2000-11-29 | 2002-07-03 | 株式会社村田制作所 | Multi-layer LC filter |
-
2010
- 2010-07-23 CN CN2010102368185A patent/CN101951237B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1289180A (en) * | 1999-09-21 | 2001-03-28 | 株式会社村田制作所 | Inductance-capacitance filter |
| CN1356741A (en) * | 2000-11-29 | 2002-07-03 | 株式会社村田制作所 | Multi-layer LC filter |
Non-Patent Citations (1)
| Title |
|---|
| 徐自强等.LTCC带通滤波器的设计.《电子科技大学学报》.2008,第37卷第47-49，136页. * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107465395A (en) * | 2014-04-03 | 2017-12-12 | 深圳振华富电子有限公司 | A kind of lamination sheet type ceramic RF low pass filter and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101951237A (en) | 2011-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6778058B1 (en) | Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate | |
| JP5654102B2 (en) | Multilayer ceramic capacitor and manufacturing method thereof | |
| CN101951237B (en) | Laminated sheet type filter and preparation method thereof | |
| CN101404485B (en) | A kind of multilayer chip filter and its preparation method | |
| JPWO2005034151A1 (en) | Multilayer ceramic electronic component and manufacturing method thereof | |
| WO2006043350A1 (en) | Process for producing stacked ceramic electronic component and composite laminate | |
| CN104582327A (en) | Manufacturing method for high-frequency LTCC (low temperature co-Fired ceramic) multilayer circuit module with built-in passive component | |
| JP2016540467A (en) | Multilayer chip type ceramic radio frequency low pass filter and method of manufacturing the same | |
| CN102163960B (en) | Multilayer chip filter and preparation method thereof | |
| CN107332531A (en) | A kind of preparation method of lamination tunable filter and adjustable core inductance | |
| JPH07263280A (en) | Chip-shaped lc composite component | |
| CN103200507B (en) | Manufacturing method of multi-layer piezoelectric loudspeaker oscillator and multi-layer piezoelectric loudspeaker oscillator | |
| JP2001319822A (en) | Manufacturing method of laminated ceramic electronic part | |
| JPH11317311A (en) | Composite part and method of manufacturing the same | |
| JP2005209816A (en) | Method of manufacturing multilayer ceramic electronic component | |
| JP5245645B2 (en) | Manufacturing method of laminated coil component | |
| JP2909122B2 (en) | Laminated composite parts | |
| JPH1187918A (en) | Multilayered ceramic substrate and manufacture thereof | |
| CN205828624U (en) | Laminated chip power distribution module | |
| JP3239659B2 (en) | Manufacturing method of multilayer inductor component | |
| JPH09199331A (en) | Coil component and method of manufacturing the same | |
| JPH07245242A (en) | Chip lc compound part | |
| JPH07263279A (en) | Lc composite component | |
| JPH11251152A (en) | Composite part and method of manufacturing the same | |
| JPH09167714A (en) | Coil component manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: CHENGDU CHENGDIAN ELECTRONIC + INFORMATION TECHNOL Free format text: FORMER OWNER: ELECTRON SCIENCE + TECHNOLOGY UNIV. Effective date: 20120113 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20120113 Address after: 611731 research building, University of Electronic Science and technology, No. 2006 West Avenue, hi tech West District, Sichuan, Chengdu Applicant after: Chengdu Electronic & Information Technology Engineering Co., Ltd. Address before: 611731 Chengdu province high tech Zone (West) West source Avenue, No. 2006 Applicant before: University of Electronic Science and Technology of China |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20150723 |
|
| EXPY | Termination of patent right or utility model |