CN101945568B - Electronic compound mounting device - Google Patents

Abstract

The present invention provides an electronic component mounting device that prevents adsorption errors and carry-back of electronic components. The electronic component mounting device (100) has: a pressure detection unit (125) which detects the internal pressure of the suction nozzle (105); For electronic components, in the component supply part (102), the suction operation of the suction nozzle is performed by the negative pressure supply unit (122), the pressure detection unit measures and stores the time required for suction until the detected pressure becomes the target suction pressure, and the operation control unit When installing electronic components, according to the required adsorption time obtained by the required adsorption time acquisition control unit, after the suction of each electronic component is continued through the negative pressure supply unit, the suction nozzle is raised, and the required adsorption time acquisition control unit, After measuring the time required for adsorption, the positive pressure supply unit performs adsorption and release of the electronic component, and then raises the adsorption nozzle.

Description

Electronic component mounting device

technical field

The invention relates to an electronic component mounting device which uses a suction nozzle to absorb and mount electronic components.

Background technique

A conventional electronic component mounting device has a mounting head equipped with a suction nozzle and can move freely on the X-Y plane. By making the suction nozzle absorb the electronic component from the electronic component feeder, the mounting head is moved to the component mounting position of the substrate. The mounting position supplies positive pressure into the suction nozzle to release the electronic component, thereby mounting the electronic component.

However, depending on the electronic component, the size, weight, surface material, etc. of the electronic component are different. During adsorption, air leakage (air leakage) may occur between the tip of the suction nozzle and the surface of the electronic component, and sufficient retention cannot be achieved. force.

Therefore, for example, in the electronic component mounting apparatus described in Patent Document 1, an air leakage parameter indicating the degree of leakage is set in advance for each electronic component, and control is performed to reduce the moving speed of the mounting head in accordance with the air leakage parameter. , to prevent electronic components from falling or shifting relative to the position of the suction nozzle.

In addition, there is a problem that the adhesiveness between some electronic components and the tip of the suction nozzle is too high, and the electronic component cannot be separated when released from the tip, and the mounting head is placed in the state where the electronic component is sucked. Move to the next destination, the so-called brought back problem.

Therefore, for example, in the electronic component mounting apparatus described in Patent Document 2, for electronic components that are likely to be carried back, the amount of descent of the suction nozzle is reduced, or the pressing force (adhesion) of the suction nozzle to the electronic component during suction is reduced. Control to prevent bring back.

Patent Document 1: Japanese Patent Laid-Open No. 2007-242818

Patent Document 2: Japanese Patent Laid-Open No. 2007-250795

Contents of the invention

However, in the prior art disclosed in Patent Document 1, the moving speed of the mounting head is reduced according to the air leakage parameter, so it is impossible to prevent mistakes when picking up and picking up the electronic component from the electronic component supply unit.

In addition, in the prior art of the above-mentioned Patent Documents 1 and 2, measures to prevent leakage and carry-back are carried out based on the leakage parameter and the parameter indicating the ease of carry-back, but it is difficult to predict the leakage in advance for each electronic component. The parameter and the parameter indicating the ease of taking it back are actually dealt with after an accident occurs during loading.

In addition, the leakage parameter and the parameter indicating the ease of taking it back must be set by the user himself focusing on each phenomenon and for each electronic component, which is cumbersome.

An object of the present invention is to suppress reduction in suction force with respect to a suction nozzle or occurrence of carry-back before electronic component mounting, and eliminate the need for an operator to perform setting work of electronic component characteristics.

The invention described in claim 1 is an electronic component mounting apparatus including: a substrate holding unit that holds a substrate on which electronic components are mounted; a component supply unit that supplies the plurality of electronic components to be mounted; and a mounting head that It has a suction nozzle that can be raised and lowered, and the suction nozzle is used to suction the electronic components mounted on the substrate; a negative pressure supply unit that applies negative pressure to the suction nozzle; a positive pressure supply unit that applies positive pressure to the suction nozzle. a mounting head moving mechanism, which allows the mounting head to be arbitrarily moved and positioned in a region including from the component supply part to the substrate holding part; and an operation control unit, which executes relative to The mounting operation control of the substrate is characterized by comprising: a pressure detection unit that detects the internal pressure of the suction nozzle; For each electronic component, at the component receiving position of the component supply unit, the suction nozzle is sucked by the negative pressure supply unit, and the pressure detected by the pressure detection unit is measured and stored until the pressure reaches the target suction pressure. The adsorption required time, the operation control unit, when installing the electronic components, according to the adsorption required time obtained by the adsorption required time acquisition control unit, through the negative pressure supply unit for each electronic component After the adsorption, the suction nozzle is raised, and after the adsorption required time acquisition control unit measures the adsorption required time, the electronic component is adsorbed and released by the positive pressure supply unit, and then the suction nozzle is raised. .

The invention described in claim 2 is characterized in that it has the same structure as the invention described in claim 1 , and further includes release required time acquisition control means that, when the mount operation control is not executed, performs For each electronic component to be mounted, at the component receiving position of the component supply unit, the negative pressure supply unit performs the suction operation to make the inside of the suction nozzle become the target suction pressure, and measures and stores the The positive pressure supply unit determines the release required time from the target suction pressure in the suction nozzle to the target release pressure, and the operation control unit determines the required release time according to the release time when the electronic component is mounted. The release required time obtained by the control unit is obtained, and after the suction and release of each electronic component is continuously performed by the positive pressure supply unit, the suction nozzle is raised.

The invention described in claim 3 is characterized in that it has the same structure as the invention described in claim 2, and the release required time acquisition control means acquires the time required for adsorption by the adsorption required time acquisition control means. The measurement starts with the inside of the suction nozzle at a target suction pressure, and the positive pressure supply unit executes operation control to make the inside of the suction nozzle at a target release pressure, thereby measuring the release required time.

The invention described in claim 4 is characterized in that it has the same structure as the invention described in claim 2, and the release required time acquisition control means starts from the state where the inside of the suction nozzle becomes the target suction pressure, and passes the The positive pressure supply unit performs the positive pressure supply with a predicted release required time, and repeats the process of changing the predicted release required time by a predetermined unit time when the target release pressure is not reached in the suction nozzle. With the above operation, the release required time for reaching the target release pressure is obtained.

The invention described in claim 5 is characterized in that it has the same structure as the invention described in claim 2, and has: a component adsorption detection unit that detects whether an electronic component is adsorbed on the suction nozzle; a time confirmation control unit that makes the inside of the suction nozzle a target suction pressure to suction the electronic component, and performs the operation based on the release required time acquired by the release required time acquisition control unit while the suction nozzle is raised. positive pressure supply, and after a predetermined standby time has elapsed since the positive pressure supply was stopped, it is determined by the component adsorption detection unit whether the electronic component has been released, and the release required time confirmation control unit, by making the The standby time is changed at a predetermined unit time to repeat the above operation until the electronic component is released, thereby obtaining an appropriate standby time, and the operation control unit, when the electronic component is mounted, according to the The positive pressure supply unit performs adsorption and release of each electronic component according to the release required time, and then raises the suction nozzle after a standby time obtained by the release required time confirmation control unit has elapsed.

The effect of the invention

In the invention described in claim 1, since the required time for adsorption is obtained for each electronic component to be mounted until the target adsorption pressure becomes the adsorption pressure, and the adsorption is continued according to the obtained required time for adsorption during mounting operation control, When the target adsorption pressure is reached, the electronic components are lifted and moved, which can suppress the occurrence of errors during adsorption, falling of the moving electronic components, and positional deviation relative to the front end of the suction nozzle, so as to realize the reliability of the operation and Improvement of mounting position accuracy.

In addition, since the adsorption required time until the adsorption target adsorption pressure becomes the adsorption target pressure is obtained before the mounting operation control is performed, it is different from an electronic component that is easily recognized as an electronic component that is prone to air leakage when an error occurs during the mounting operation for the first time. Therefore, in the case of implementing leakage countermeasures, even if the operator does not identify the leakage characteristics of each electronic component, the installation operation can be automatically performed corresponding to the leakage characteristics, thereby further reducing the occurrence of errors.

In addition, it is not necessary for an operator to set and input the leakage characteristic of each electronic component, and the complexity of the setting work can be eliminated.

Furthermore, in claim 1, for example, when the "target suction pressure" is set for each electronic component in the mounting data or the like, the time required for suction until reaching the target suction pressure for each electronic component is measured, and compared with When a common "target adsorption pressure" is set regardless of electronic components, the time required for adsorption until reaching the same target adsorption pressure is measured for each electronic component.

And, the measurement of the required time for adsorption due to the acquisition control of the required time for adsorption is carried out at the component receiving position of the component supply part, and after the measurement, after the suction and release of the electronic component is performed by the positive pressure supply unit, the suction nozzle Therefore, the electronic components are not taken out from the component supply part. As a result, it is possible to avoid wasting the electronic components for the measurement of the time required for adsorption, and to improve the economical efficiency.

In the invention described in claim 2, since the release time required for each electronic component to be mounted is obtained from the suction state until the inside of the suction nozzle reaches the target release pressure by the supply of positive pressure, when the mounting operation is controlled, Since the adsorption and release are carried out according to the obtained time required for the release, it is possible to suppress carry-back of electronic components and improve operational reliability.

In addition, since the release required time until the target release pressure is obtained by the positive pressure supply unit when the mounting operation control is not performed, it is easy to cause carry-back of electronic components different from when an error occurs during the mounting operation and is recognized for the first time. In the case of taking countermeasures, even if the operator does not recognize the characteristics of each electronic component that is prone to carry-back, the installation action to avoid carry-back can be automatically performed to further reduce the occurrence of errors.

In addition, it is not necessary for an operator to perform setting and input work on whether or not each electronic component is likely to be carried back, and the complexity of the setting work can be eliminated.

In addition, since the measurement of the release required time in the release required time acquisition control is performed after the component receiving position of the component supply part is raised, the suction nozzle is raised, so even when the release required time is measured, the electronic Components are not taken out from the component supply unit. As a result, it is possible to avoid wasting electronic components for measuring the time required for release, and to improve economical efficiency.

In addition, the "target release pressure" is a pressure for detaching the adsorbed electronic component from the nozzle, and is preferably a pressure within a range from atmospheric pressure to a positive pressure threshold. In addition, the positive pressure critical value refers to a pressure to such an extent that the position of the electronic component or electronic components mounted around it is not displaced by blowing air when the electronic component is detached.

In addition, in claim 2, for example, when the "target release pressure" is set for each electronic component in the mounting data, etc., the time required for adsorption until reaching the target release pressure for each electronic component is measured, and compared with When a common "target release pressure" is set regardless of electronic components, the release required time until reaching the same target release pressure is measured for each electronic component.

In the invention described in claim 3, since the release required time acquisition control unit is used, the inside of the suction nozzle is set to a target suction pressure state in order to measure the suction required time by the suction required time acquisition control unit. The operation control of the target release pressure is performed by the positive pressure supply of the positive pressure supply unit, and the time required for release is measured, so the measurement of the required time for adsorption and the required time for release are obtained by the release of the control unit. The measurement of the required time is carried out in a series of controls, and the negative pressure supply operation of the suction required time acquisition control unit to make the suction nozzle reach the target suction pressure and the use of the release required time acquisition control unit are performed separately. Compared with the case of supplying negative pressure until the target suction pressure inside the suction nozzle is operated, the time required to acquire the time required for suction and the time required for release can be significantly shortened.

In the invention described in claim 4, the release required time acquisition control unit changes the positive pressure supply of the positive pressure supply unit at a predetermined unit time from the state where the suction nozzle becomes the target suction pressure, and performs a retry to obtain the desired suction pressure. The time required for the release of the target release pressure. The measurement of the time required for release can also monitor the detection pressure of the pressure detection unit, and measure the time from the supply of positive pressure to the target release pressure, but in the case of actual positive pressure supply and stop by motion control In this situation, a time difference is likely to occur, and even if the control is performed according to the measurement time, sometimes the internal pressure of the suction nozzle is not the measured value. Therefore, if the method is implemented by actually setting the time required for the release, and repeating the method of retrying whether the suction nozzle reaches the target suction pressure, the time required for the operation control from the supply of positive pressure to the stop is reflected in the release. In the required time, the influence of the time difference is included from the beginning, so the accurate time required for release can be obtained.

Accordingly, it is possible to more accurately measure the time required for release, to more effectively prevent electronic components from being brought back, and to prevent positional displacement of other electronic components during mounting operations.

In the invention described in claim 5, since the release required time confirmation control unit obtains the standby time after release, and the operation control unit waits for the standby time to elapse from the state where the suction nozzle becomes the target release pressure by releasing the suction, make the suction nozzle

liter, so the carry-back of electronic components can be more reliably prevented.

Description of drawings

FIG. 1 is a plan view showing the whole of the electronic component mounting device according to the present embodiment.

FIG. 2 is a block diagram showing a control system of the electronic component mounting apparatus.

Fig. 3 is a front view of a mounting head of the electronic component mounting device.

Fig. 4 is a flowchart of acquisition control of time required for adsorption.

Fig. 5 is a graph showing the state of pressure change in the suction nozzle after switching of the switching solenoid valve.

FIG. 6 is a flowchart of release required time acquisition control.

Fig. 7 shows the pressure inside the nozzle when the internal pressure of the nozzle is at the three-stage target suction pressure, and the solenoid valve for switching is switched and controlled to supply positive pressure for a predetermined waiting time. Line graph of changing states.

Fig. 8 is a flowchart of release required time confirmation control.

Fig. 9 is a flowchart of electronic component mounting control.

Detailed ways

(embodiment of the invention)

Embodiments of the present invention will be described based on FIGS. 1 to 9 . Hereinafter, as shown in the figure, two directions perpendicular to each other on a horizontal plane are referred to as an X-axis direction and a Y-axis direction, respectively. In addition, let the vertical direction orthogonal to these be a Z-axis direction.

As shown in FIG. 1 , the electronic component mounting apparatus 100 includes: a first component supply unit 102 for arranging and holding a plurality of electronic component feeders 101 for supplying electronic components to be mounted along the X-axis direction; 104, which is configured to be used to place the tray 103 of various electronic components; the substrate conveying unit 108, which conveys the substrate along the X-axis direction; the substrate holding part (not shown), which is arranged on the substrate conveying path of the substrate conveying unit 108 It is used to carry out the electronic component mounting operation relative to the substrate K; the mounting head 106, which can lift and hold a plurality of, for example, 6 suction nozzles 105, and hold the electronic component T; the X-Y gantry as the mounting head moving mechanism 107, which drives and transports the mounting head 106 to any position in the working area including the two component supply parts 102, 104 and the substrate holding part; the base frame 114, which carries and supports the above structures; the air pressure circuit 120, which Make each suction nozzle 105 into an air pressure state (negative pressure) less than atmospheric pressure and an air pressure state (positive pressure) greater than or equal to atmospheric pressure;

The operation control unit 10 of the electronic component mounting apparatus 100 stores mounting data recording various setting contents related to mounting of electronic components, and reads the electronic components to be mounted and the information based on the electronic components from the mounting data. The electronic component feeder 101 installs the component reception position, the data of the mounting position on the substrate, and the like. In addition, the above-mentioned operation control unit 10 controls the X-Y gantry 107, transports the mounting head 106 to the receiving position and the mounting position of the electronic component, controls the mounting head 106 at each position, and performs the lifting operation and suction of the suction nozzle 105. - Release action. In addition, the above-mentioned operation control unit 10 detects the position of the electronic component during suction and the rotation angle of the suction nozzle by using the component recognition device 113 described later during the conveyance of the mounting head 106, and performs operations such as position correction and angle adjustment. control.

(Substrate Transfer Unit and Substrate Holder)

The substrate conveyance unit 108 has a conveyance belt (not shown), and conveys the substrate K in the X-axis direction by the conveyance belt.

In addition, as described above, on the substrate conveying path of the substrate conveying unit 108, at the work position, which is the illustrated position of the substrate K in FIG. The substrate holder for fixed holding. The substrate transport unit 108 transports the substrate K to the substrate holding unit and stops, and holds the substrate K by a holding mechanism not shown. That is, in a state where the substrate K is held by the holding mechanism, a stable electronic component mounting operation is performed.

(1st and 2nd parts supply part)

The first component supply unit 102 is provided at one end of the base frame 114 in the Y-axis direction, and is an area along the X-axis direction where a plurality of electronic component feeders 101 are arranged and mounted. On the upper surface of the flat portion of the first component supply unit 102, a plurality of electronic component feeders 101 are arranged in a row along the X-axis direction, and are placed and mounted. In addition, each electronic component feeder 101 is provided with a latch mechanism, and by operating the latch mechanism, it can be attached to/detached from the first component supply unit.

The above-mentioned electronic component feeder 101 holds a tape reel (not shown) on the rear end side, which is wound with a storage tape for enclosing a large number of electronic components at equal intervals, and has, as described above, near the front end. The transfer unit 101 a transfers electronic components to the mounting head 106 .

During the mounting operation of the electronic component, the mounting head 106 positions the suction nozzle 105 on the conveyance portion 101a of the electronic component feeder 101 to be mounted, and conveys the electronic component.

The second component supply unit 104 is provided on the base frame 114 at an end opposite to the first component supply unit 102 across the substrate transfer unit 108 in the Y-axis direction.

The tray placed on the second component supply unit 104 has a plurality of recesses, and electronic components are arranged in line in each recess.

In addition, during the mounting operation of the electronic component, the mounting head 106 positions the suction nozzle 105 in the concave portion in which the electronic component to be mounted is stored, and transfers the electronic component.

(X-Y gantry)

The X-Y gantry 107 has: an X-axis guide rail 107a, which guides the movement of the mounting head 106 along the X-axis direction; two Y-axis guide rails 107b, which guide the mounting head 106 and the X-axis guide rail 107a along the Y-axis direction; An X-axis motor 109 as a source moves the mounting head 106 in the X-axis direction, and a Y-axis motor 110 as a drive source moves the mounting head 106 in the Y-axis direction via the X-axis guide rail 107a.

In addition, by driving the respective motors 109 and 110, the mounting head 106 can be conveyed substantially over the entire area between the two Y-axis guide rails 107b.

In addition, the respective motors 109 and 110 are positioned by the operation control unit 10 to control the rotation amount to a desired rotation amount by recognizing the respective rotation amounts, thereby positioning the suction nozzle 105 via the mounting head 106 .

In addition, according to the needs of the electronic component mounting operation, the first and second component supply units 102 , 104 and the substrate holding unit are all arranged in the area of the X-Y gantry 107 where the mounting head 106 can be transported.

In addition, a waste box 116 for discarding defective electronic components is provided in the transportable area.

(mounted head)

FIG. 3 is a front view of the mounting head 106 seen from a line of sight along the Y-axis direction. Mounting head 106 is provided with: six suction nozzles 105, which use air suction to hold electronic components T at their front ends; six Z-axis motors 111 (only shown in FIG. Lifting in the Z-axis direction; six rotating motors 112, which are used to rotate each suction nozzle 105 respectively, and adjust the angle of the held electronic components around the Z-axis direction; a mark recognition camera 115, which is used to carry out marking on the substrate K photographing, so as to identify the position of the substrate; and the component recognition device 113, which detects the position of the electronic component adsorbed on each suction nozzle 105 relative to the front end of the suction nozzle and the angle of Z-axis rotation. In addition, although each motor 111,112 is shown for only one suction nozzle 105 in FIG.

The above-mentioned suction nozzles 105 are supported on the mounting head 106 in a state along the Z-axis in a liftable and rotatable manner, and can receive or install electronic components by lifting and adjusting the angle of electronic components by rotation.

In addition, the component recognition device 113 irradiates laser light to the electronic component at the tip of the adsorption nozzle 105 along the Y-axis direction from a plurality of light sources arranged in a row along the X-axis direction, and receives the reflected light, depending on which one in the X-axis direction. The reflected light is obtained within the range, and the position and angle of the electronic component at the front end of the suction nozzle can be identified.

In addition, the component recognition device 113 can detect whether or not the electronic component is picked up at the tip of the suction nozzle 105 based on the presence or absence of the reflected light, and can function as a "component suction detection means".

(Pneumatic circuit)

The air pressure circuit 120 has: a positive pressure source 121, which produces positive pressure air pressure; a negative pressure generating device 122, which utilizes the air flow of the positive pressure source to generate negative pressure; The generated positive pressure is decompressed and adjusted to a predetermined pressure by an electro-pneumatic regulator; the switching solenoid valve 124, which switches the negative pressure generated from the negative pressure generating device 122 and the positive pressure output from the decompression device 123, is supplied to each The suction nozzle 105 supplies; and the pressure detection unit 125 detects the internal pressure of each suction nozzle 105 .

The above-mentioned positive pressure source 121 and decompression device 123 function as positive pressure supply means for applying positive pressure to the suction nozzle 105 , and the above-mentioned negative pressure generator 122 functions as negative pressure supply means for applying negative pressure to the suction nozzle 105 .

The switching solenoid valve 124 can be switched to three positions: a negative pressure supply state, a positive pressure supply state, and a closed circuit state, and the switching operation is controlled by the operation control unit 10 . With the above structure, when the suction nozzle 105 is suctioning electronic components, the air pressure circuit 120 switches and controls the switching solenoid valve 124 so that the negative pressure generating device 122 is connected to the suction nozzle 105 to supply negative pressure. state of adsorption.

In addition, when releasing the electronic component from the suction state of the suction nozzle 105 , the switching solenoid valve 124 performs switching control so that the pressure reducing device 123 is connected to the suction nozzle 105 to supply positive pressure to discharge the electronic component.

In addition, although illustration of the pneumatic circuit 120 is abbreviate|omitted, actually, the pneumatic circuit 120 is prepared for each of the several suction nozzles 105 respectively.

(motion control unit)

As shown in Figure 2, the action control unit 10 mainly includes: CPU30, which according to the prescribed control program, carries out the lifting of the X-axis motor 109, the Y-axis motor 110 of the X-Y gantry 107, and the suction nozzle 105 on the mounting head 106. Z-axis motor 111, rotary motor 112 for rotating suction nozzle 105, solenoid valve 124 for switching air pressure circuit 120, pressure detection unit 125, part recognition device 113, and mark recognition camera 115 execute various processes and controls; system ROM 12 , which stores programs for executing various processes and controls; RAM 13, which stores various data and becomes a work area for various processes; I/F (interface) 14, which realizes connection between CPU 30 and various devices; The volatile storage device 17 stores mounting data required for mounting operation control such as a list of electronic components to be mounted on the substrate, mounting positions of each electronic component, receiving positions of the electronic components, and other setting information; the operation panel 15 , which is used for inputting data required for various settings or operations; and a display 18, which is used for prompting various setting contents and necessary information. In addition, each of the above-mentioned motors 109 to 112 is a servo motor having an encoder, and is connected to the I/F 14 via a servo driver not shown.

The above-mentioned CPU 30 reads mounting data from the storage device 17 during the mounting operation of electronic components, and obtains a list of various electronic components to be mounted on the substrate, a receiving position of each electronic component, and a mounting position of each electronic component from the mounting data. location information.

Then, the CPU 30 controls the X-axis and Y-axis motors 109 and 110 to transport the mounting head 106 to the receiving position of the electronic component, and controls the Z-axis motor to lower the suction nozzle 105 to suction the electronic component, and the suction nozzle 105 Ascent, and then the loading head 106 is transported to the installation position.

In addition, the CPU 30 detects the position of the picked electronic component with respect to the nozzle and the rotation angle of the nozzle using the component posture recognition unit during conveyance to the mounting position, and controls the rotary motor 112 to perform angle correction. In addition, when positioning the mounting head 106 to the mounting position, correction is performed in consideration of the position of the electronic component with respect to the suction nozzle.

Then, the suction nozzle 105 is lowered by the Z-axis motor to complete the mounting of the electronic component.

The CPU 30 repeatedly executes the above-described operations for all electronic components mounted on the substrate.

In addition, the CPU 30 performs suction required time acquisition control, release required time acquisition control, and release required time confirmation control in accordance with various programs stored in the system ROM 12 to obtain important information related to the suction operation during electronic component mounting. settings information. Next, these controls will be described in detail.

(The time required for adsorption is controlled)

Acquisition control of the time required for adsorption is the processing performed by the CPU 30 according to the program in the system ROM 12. For example, the following processing is performed: when the mounting action control is not executed immediately after the main power supply of the device is turned on or just after obtaining new mounting data, etc., For each electronic component to be mounted in the mounting data, the suction nozzle 105 is positioned at the transfer portion 101a of the electronic component feeder 101 (or the concave portion of the tray 103), and at this position, the suction nozzle 105 is lowered to the suction height, Negative pressure is supplied by switching the solenoid valve 124, and the CPU 30 monitors the pressure detection unit 125 while the electronic component is being sucked, and measures the time required for suction until the suction target suction pressure is reached.

Moreover, this process is performed for all the electronic components of each component supply part 102,104 used as a mounting object in mounting data, and the time required for adsorption|suction of each electronic component is memorize|stored in the memory|storage device 17.

In addition, the target suction pressure of the above-mentioned suction is a pressure at which the suction nozzle 105 which has suctioned the electronic component can be raised, and can be numerically set on the operation panel 15 .

In this example, the case where the target adsorption pressure is set as a common reference value for electronic components is illustrated, but for each electronic component, for example, the stability at the time of adsorption depending on its weight and shape may be considered. , and respectively set.

Fig. 4 is a flowchart of acquisition control of time required for adsorption. Based on this figure, the control of the time required for adsorption will be described.

First, the CPU 30 controls the X-axis motor 109 and the Y-axis motor 110 so that a certain suction nozzle 105 on the mounting head 106 is positioned on the conveying part 101a (or the tray 103 recess) (step S1).

Then, by driving the Z-axis motor 111, the suction nozzle 105 is lowered to the suction height of the electronic component (step S2), and by switching the switching solenoid valve 124, negative pressure is supplied to the suction nozzle 105 (step S3). Thereby, the electronic components in the conveyance part 101a of the electronic component feeder 101 (or the recessed part of the tray 103) are sucked by the suction nozzle 105. As shown in FIG.

Simultaneously with the negative pressure supply, the CPU 30 monitors the output of the pressure detection unit 125, measures the time until the target adsorption pressure is reached, and obtains the required time for adsorption (step S4).

FIG. 5 is a graph showing the state of the pressure change in the suction nozzle 105 after switching of the switching solenoid valve 124 . Curve A represents a general electronic component with little air leakage, and curve B represents an electronic component with large leakage. In addition, in this graph, the upper part of the vertical axis represents a decrease in air pressure, and the lower part of the vertical axis represents an increase in air pressure.

As shown in the figure, if the supply of negative pressure is started in a state where the tip of the suction nozzle 105 is in contact with the upper surface of each electronic component, in any electronic component, the After a slight delay in the switching timing, the pressure in the suction nozzle drops. In the case of an electronic component with air leakage, as shown in curve B, it can be seen that the slope of the pressure drop becomes gentle, and the time until the target suction pressure is reached (adsorption time required) becomes longer.

Then, after reaching the target suction pressure, the switching solenoid valve 124 is operated to stop the negative pressure supply (step S5 ), and then the switching solenoid valve 124 is operated to switch to positive pressure supply (step S6 ). Then, when the positive pressure supply is performed for a predetermined time, the switching solenoid valve 124 is closed to stop the positive pressure supply (step S7). Thereby, the inside of the suction nozzle 105 returns to atmospheric pressure, and the electronic component is released from the suction state. In the above state, the Z-axis motor 111 is controlled so that the suction nozzle 105 rises to the standby height (step S8), and the acquisition control of the time required for suction of one electronic component is completed.

In addition, the above-described suction required time acquisition control is repeatedly executed until all the electronic components prepared in the electronic component mounting apparatus 100 are completed.

The CPU 30 functions as a "suction required time acquisition control means" by executing the control described above.

(Release takes time to gain control)

The release required time acquisition control is a process executed by the CPU 30 in accordance with the program in the system ROM 12 . For example, the following process is performed: when the mounting operation control is not executed immediately after the main power supply of the device is turned on or immediately after acquiring new mounting data, the suction nozzle 105 is positioned at the position of each electronic component to be mounted in the mounting data. At the transfer part 101a of the electronic component feeder 101 (or the concave part of the tray 103), at this position, the electronic component is sucked by the suction nozzle 105, and the inside of the suction nozzle is set to the target suction pressure, and the supply of positive pressure is started from the above state, and the measurement is performed. The time required for release until the target release pressure is restored.

Moreover, this process is performed for all the electronic components of each component supply part 102,104 used as an installation object among the mounting data, and the time required for release of each electronic component is memorize|stored in the memory|storage device 17.

In FIG. 6, the time required for release acquisition control will be described.

First, the CPU 30 controls the X-axis motor 109 and the Y-axis motor 110 so that a certain suction nozzle 105 on the mounting head 106 is positioned on the conveying portion 101a of the electronic component feeder 101 or the concave portion of the tray 103 of the electronic component to be targeted. place (step S31).

Then, by driving the Z-axis motor 111, the suction nozzle 105 is lowered to the suction height of the electronic component (step S32), and then, by switching the switching solenoid valve 124, negative pressure is supplied to the suction nozzle 105 (step S33). Thereby, the electronic components in the conveyance part 101 a of the electronic component feeder 101 or the recessed part of the tray 103 are sucked by the suction nozzle 105 .

Simultaneously with the negative pressure supply, the CPU 30 monitors the output of the pressure detection unit 125 (step S34), and stops the negative pressure supply by the switching solenoid valve 124 when the suction nozzle 105 reaches the target suction pressure (step S35).

In addition, when the adsorption required time has already been obtained, the pressure detection unit 125 may not be monitored in step S34, and the negative pressure supply may be stopped in step S35 after waiting for the adsorption required time to elapse.

Then, the CPU 30 measures the time until the inside of the suction nozzle 105 reaches the target release pressure by the positive pressure supply (time required for release).

In the above-mentioned measurement, it is also possible to count the elapsed time from the start of the positive pressure supply until the pressure detection unit 125 indicates that the target release pressure has been reached. 124 switching, sometimes delayed due to its responsiveness.

Therefore, in the release required time acquisition control, the solenoid valve 124 for switching is controlled so that at the beginning, after a predetermined time n [ms] elapses from the state where the inside of the suction nozzle 105 reaches the target suction pressure, normal operation is performed. As a result, according to the obtained detection pressure in the suction nozzle 105, it is judged that the initial positive pressure supply time n is too long or too short, and corresponding to the judgment, a predetermined value is added or subtracted from the positive pressure supply time n. Repeatedly retrying, the optimal positive pressure supply time for boosting pressure in the range from atmospheric pressure to positive pressure critical value in the suction nozzle 105 (the range is taken as "target release pressure") is taken as the required release time. obtained by time.

In addition, the initial value of the positive pressure supply time n can be set arbitrarily using the operation panel 15 . In addition, the positive pressure threshold can also be set arbitrarily using the operation panel 15, but it must be set to be greater than or equal to the atmospheric pressure, and the position of the installed electronic components and the electronic components installed around it will not be shifted due to the air flow. In the range.

FIG. 7 shows the suction nozzle 105 when the internal pressure of the suction nozzle 105 is at the three-stage target suction pressure, and the switching solenoid valve 124 performs switching control to perform positive pressure supply for a predetermined waiting time n. A line diagram of the state of internal pressure change.

Curve C shows the pressure change when a positive pressure is applied from the most negative target suction pressure. In this case, even if the positive pressure is supplied for the positive pressure supply time n, the atmospheric pressure will not be reached, and the electronic components will not change from The suction nozzle 105 is released.

In addition, the curve D shows the pressure change when the positive pressure is applied from the target adsorption pressure which is slightly positive pressure compared with C. In this case, if the positive pressure supply is performed for the positive pressure supply time n, the atmospheric pressure can be reached. , and does not exceed the critical value of positive pressure, good adsorption and release can be carried out.

In addition, the curve E shows the pressure change when the positive pressure is applied from the target adsorption pressure which is more positive pressure than D. In this case, if the positive pressure supply is performed for the positive pressure supply time n, the pressure will exceed the atmospheric pressure. , and exceed the critical value of the positive pressure, the electronic components will be released, but due to the possible generation of jets to the surroundings, the electronic components and nearby electronic components may be blown away.

As described above, the optimum positive pressure supply time n is determined corresponding to the target adsorption pressure, and in the release required time acquisition control, the positive pressure supply time n is sequentially varied to search for an optimum value.

Specifically, the positive pressure supply is started (step S36 ), and after the positive pressure supply time n has elapsed (step S37 ), the positive pressure supply is stopped by the control of the switching solenoid valve 124 (step S38 ). Then, determine whether the detection pressure in the suction nozzle 105 of the pressure detection unit 125 at this time is a negative pressure (step S39). The obtained value is used as a new waiting time (step S40), and the process returns to step S33.

Then, after the negative pressure is supplied again until the target suction pressure is reached, positive pressure is supplied for a new positive pressure supply time n [ms], and it is determined whether the internal pressure of the suction nozzle 105 is negative pressure (steps S33 to S39 ). The cycle of steps S33 to S40 is repeated until the internal pressure of the suction nozzle 105 is greater than or equal to the atmospheric pressure.

In addition, in step S39, when it is detected that the pressure inside the suction nozzle 105 is not a negative pressure, it is determined whether the internal pressure is lower than the above-mentioned positive pressure threshold value (step S41).

As a result, when it is greater than or equal to the positive pressure critical value, it is considered that the positive pressure supply time is too long, and the value obtained by subtracting 1 [ms] from n is set as a new positive pressure supply time (step S42 ), the process is returned to step S33.

Then, the negative pressure is supplied again until the target suction pressure is reached, and the positive pressure is supplied for a new positive pressure supply time n [ms] to determine whether the internal pressure of the suction nozzle 105 is a negative pressure, or whether it is not greater than or equal to the positive pressure. Critical value (steps S33 to S41). The cycle of steps S33-S42 is repeated until the positive pressure threshold of the suction nozzle 105 is lower than.

By repeating the above retry, the positive pressure supply time for making the inside of the suction nozzle 105 greater than or equal to the atmospheric pressure and less than the positive pressure critical value by the positive pressure supply can be obtained, which is obtained as the release required time.

Thereby, the inside of the suction nozzle 105 becomes the target release pressure, and the electronic component is released from the suction state. In the above state, the Z-axis motor 111 is controlled so that the suction nozzle 105 rises to the standby height (step S43), and the time acquisition control for the release of one electronic component is completed. In addition, the above-described release required time acquisition control is repeatedly executed until all electronic components prepared in the electronic component mounting apparatus 100 are completed.

The CPU 30 functions as a "release required time acquisition control means" by executing the above control.

(Release required time confirmation control)

The release required time confirmation control is a process executed by the CPU 30 in accordance with the program in the system ROM 12 , and is performed after the above-mentioned release required time acquisition control is executed while the mount operation control is not executed.

In this release required time confirmation control, each electronic component to be mounted in the mounting data is suctioned at the conveying portion 101a of the electronic component feeder 101 (or the concave portion of the tray 103), and the suction nozzle 105 is raised. When the loading head moves and waits above the discard box 116, the positive pressure supply is performed with the required release time obtained in the release time acquisition control, and after the predetermined standby time has elapsed, the component recognition device 113 is used to identify the It is determined whether or not an electronic component is present at the tip of the suction nozzle 105 .

Then, when it is detected that the front end of the suction nozzle 105 is adsorbed to the electronic component, the standby time is added to the predetermined unit time, and the target suction pressure is used for adsorption again, and the adsorption and release are performed at the time required for the release, and For the detection of electronic components, the standby time is extended by unit time, and retrying is repeated until it is confirmed that the electronic components do not exist.

Thereby, the standby time until the electronic component is separated from the suction nozzle 105 after the positive pressure supply for suction and release is stopped can be obtained.

Moreover, this process is performed for all the electronic components of each component supply part 102,104 used as an installation object in the installation data, and the standby time of each electronic component is memorize|stored in the memory|storage device 17.

In addition, in this release required time confirmation control, since each electronic component is consumed one by one, it is not set that the release required time confirmation control is always executed along with the execution of the release required time acquisition control. It is arbitrarily executed in the above case, that is, when the electronic component is carried back even when the electronic component is mounted based on the release required time obtained by the release required time acquisition control.

In FIG. 8, release required time confirmation control is demonstrated.

First, the CPU 30 controls the X-axis motor 109 and the Y-axis motor 110 so that a certain suction nozzle 105 on the mounting head 106 is positioned on the conveying portion 101a of the electronic component feeder 101 (or on the tray 103) of the electronic component to be targeted. recess) (step S61).

Then, by driving the Z-axis motor 111, the suction nozzle 105 is lowered to the suction height of the electronic component (step S62), and by switching the switching solenoid valve 124, negative pressure is supplied to the suction nozzle 105 (step S63). Thereby, the electronic components in the conveyance part 101 a of the electronic component feeder 101 or the recessed part of the tray 103 are sucked by the suction nozzle 105 .

Then, simultaneously with the supply of negative pressure, the CPU 30 monitors the output of the pressure detection unit 125 (step S64), drives the Z-axis motor 11 to raise the suction nozzle 105 (step S65), drive to move the mounting head 106 to the discard box 116 (step S66), and again drive the Z-axis motor 111 to lower the suction nozzle 105 to the discard height (step S67).

Then, during these operation controls, when the inside of the suction nozzle 105 reaches the target suction pressure, the negative pressure supply is stopped (step S68). In addition, when the time required for adsorption has already been obtained, the pressure detection unit 125 may not be monitored in step S64, but the counting of the required time for adsorption may be started, and in step S68, after the required time for adsorption has elapsed, use The supply of negative pressure is stopped.

Then, above the discard box 116, start the supply of positive pressure (step S69), after waiting for the release required time passed by the release required time acquisition control (step S70), stop the supply of positive pressure (step S71) .

Then, after the first standby time m has elapsed from the stop of the positive pressure supply (step S72), the negative pressure supply is performed (step S73), and the suction nozzle 105 is raised to be recognized by the component recognition device 113 mounted on the mounting head 105. height (step S74).

Then, when the result of detection by the component recognition device 113 is that the electronic component is detected to be attracted to the front end portion of the suction nozzle 105 even if the positive pressure supply is performed (step S75), it is considered that the standby time is insufficient, and the The value obtained by adding 1 [ms] to m is used as a new standby time (step S76), and the process returns to step S67. Then, supply the negative pressure again until it reaches the target suction pressure, then stop the negative pressure supply, and supply the positive pressure for the time required for release, after the stop, after waiting for the new standby time m, it is determined whether the electronic component exists (step S67～S75). The loop of steps S67 to S76 is repeated until it is confirmed that the electronic component does not exist.

Then, in step S75, when it is detected that the tip of the suction nozzle 105 has dropped without an electronic component, the finally obtained standby time m is stored in the storage device 17, and the process ends.

In addition, the release required time confirmation control described above is repeatedly executed until all the electronic components prepared in the electronic component mounting apparatus 100 are completed.

The CPU 30 functions as a "release required time confirmation control means" by executing the above control.

(Electronic component mounting motion control)

Next, based on the flowchart of FIG. 9 , the electronic component mounting operation control performed by the CPU 30 in accordance with the program stored in the system ROM 12 will be described.

First, the CPU 30 controls the X-axis motor 109 and the Y-axis motor 110 so that a certain suction nozzle 105 on the mounting head 106 is positioned on the conveying portion 101a of the electronic component feeder 101 (or on the tray 103) of the electronic component to be targeted. recess) (step S101).

Then, by driving the Z-axis motor 111, the suction nozzle 105 is lowered to the suction height of the electronic component (step S102), and by switching the switching solenoid valve 124, negative pressure is supplied to the suction nozzle 105 (step S103). Thereby, the electronic components in the conveyance part 101a of the electronic component feeder 101 (or the recessed part of the tray 103) are sucked by the suction nozzle 105. As shown in FIG.

Then, simultaneously with the negative pressure supply, the CPU 30 counts the required time for adsorption (step S104), and stops the negative pressure supply by switching the electromagnetic valve 124 at the time when the required time for adsorption obtained by the required time for adsorption has passed. (step S105).

Then, by driving the Z-axis motor 111, the suction nozzle 105 is raised to the transport height (step S106), and the X-axis motor 109 and the Y-axis motor 110 are controlled to position the suction nozzle 105 of the mounting head 106 on the substrate K. The installation location (step S107).

Then, the suction nozzle 105 is lowered to the mounting height by driving the Z-axis motor 111 (step S108).

Then, the supply of positive pressure is started (step S109 ), and the supply of positive pressure is stopped (step S111 ) after waiting for the release required time obtained by the release required time acquisition control to elapse (step S110 ).

In addition, after the positive pressure supply is stopped, wait for the elapse of the standby time obtained by the release required time confirmation control (step S112), and then, by driving the Z-axis motor 111, the suction nozzle 105 is raised to the conveying height (step S106), The installation action control for an electronic component ends.

In addition, the processing from S101 to S113 described above is repeatedly executed for all electronic components to be mounted.

(Effect of embodiment)

In the electronic component mounting apparatus 100 described above, since the required time for adsorption is controlled, the required time for adsorption at which the suction pressure in the suction nozzle 105 becomes the target suction pressure is obtained for each electronic component. Time, continuous suction, so in the state of reaching the appropriate target suction pressure, the suction nozzle 105 is raised and moved, which can suppress mistakes during suction, falling of moving electronic components, and positional deviation relative to the front end of the suction nozzle. etc., to realize the improvement of the reliability of the action and the accuracy of the installation position.

In addition, since the acquisition control of the required time for adsorption is performed independently of the mounting operation, for example, by performing the control of the time required for adsorption before performing the mounting operation, it is different from the case where an error occurs during the mounting operation. It is the first time to recognize that this is an electronic component that is likely to cause air leakage of electronic components, and to implement leakage countermeasures. Therefore, even if the operator does not recognize the leakage characteristics of each electronic component, it can automatically respond to the leakage characteristics. Therefore, the installation operation is performed, and the occurrence of errors is further reduced.

In addition, since the required time for adsorption is automatically stored in the storage device 17 for each electronic component through the execution of the acquisition control of the required time for adsorption, it is not necessary for the operator to set and input the leakage characteristics of each electronic component. Eliminates the hassle of setting work.

In addition, because the measurement of the required time for adsorption in the acquisition control of the required time for adsorption is carried out in the conveying part 101a of the electronic component feeder 101 or in the concave part of the tray 103, and after the measurement, a positive pressure is supplied to perform the measurement of the electronic component. After the suction is released, the suction nozzle 105 is raised so that the electronic components are not lifted. Therefore, at least in the control of the time required for suction, there is no waste of electronic components, etc., which can prevent the waste of electronic components and achieve economical efficiency. improve.

In addition, since the execution of the release required time acquisition control is performed, it is possible to obtain a release pressure in which the inside of the suction nozzle 105 is within the range from the atmospheric pressure to the positive pressure threshold (target release pressure) for each electronic component to be mounted. Therefore, when the mounting operation is controlled, the suction release is performed according to the obtained release required time, thereby releasing the electronic component more reliably, suppressing the carry-back of the electronic component, and improving the reliability of the operation.

In addition, since the release required time acquisition control is performed when the mounting operation control is not performed, for example, the release required time acquisition control is performed before the mounting operation, so it is different from the following case, that is, when an error occurs during the mounting operation. It is the first time to recognize that this is an electronic component that is likely to be brought back and take countermeasures. Therefore, even if the operator does not recognize the characteristics of each electronic component that is likely to be taken back, it can be automatically carried out. Avoid the installation action brought back, and reduce the generation of errors even more.

In addition, since the time required for release is also automatically stored in the storage device 17 when the control is obtained, it is not necessary for the operator to perform setting and input work on whether each electronic component is likely to be brought back, and the setting work can be eliminated. of complexity.

In addition, in the above-mentioned release required time acquisition control, the release required time is changed little by little, and repeated trials are repeated to obtain the release required time to make the pressure in the suction nozzle suitable. The same result can be reproduced even when the release required time is obtained under the influence of the time difference and implemented in the motion control of the installation.

Therefore, it is possible to more accurately measure the time required for release, to more effectively prevent electronic components from being brought back, and to prevent positional displacement of other electronic components during mounting operations.

In addition, since the standby time is acquired by the release required time confirmation control, and in the mounting operation, the suction nozzle 105 is not raised during the standby time but is kept on standby in addition to suction and release by the supply of positive pressure. , so the bring-back of electronic parts can be more reliably prevented.

(other)

In addition, in the operation control unit 10 described above, the acquisition control of the required time for adsorption and the acquisition control of the required time for release are performed separately, but it is also possible to obtain both the required time for adsorption and the required time for release through a series of operation controls. .

That is, since the negative pressure supply must be carried out in the suction nozzle 105 when the time required for release is obtained, and after reaching the target suction pressure, the positive pressure supply is started to become an appropriate pressure. When the target suction pressure is reached, the negative pressure supply time is measured to obtain the time required for suction, and then positive pressure is supplied for a predetermined time to determine whether the inside of the suction nozzle is within the range of the target release pressure.

More specifically, the timer is started from the start of the negative pressure supply in step S33 in FIG. Get the time required for adsorption. After subsequent step S36, control is performed as described above, thereby obtaining the release required time. In addition, in the case of retrying due to the determination of "YES" in steps S39 and S41, it is preferable not to count the time for the processing of steps S33 to S35 after the second cycle, but to pass the pressure detection unit 125 monitor and control to stop the negative pressure supply.

As described above, by performing the adsorption time acquisition control and the release time acquisition control in one process, the adsorption time acquisition control of FIG. 4 that is performed separately can be eliminated, and the adsorption time acquisition can be greatly shortened. time and the time required to release the desired time.

Claims (5)

1. an electronic component mounting apparatus, it has:

Board holder, it keeps the substrate of mounting electronic parts;

Parts supply unit, the multiple described electronic unit that its supply will be installed;

Boarded head, it has liftable adsorption mouth, and this adsorption mouth is for adsorbing the electronic unit carried to described substrate;

Negative pressure feeding unit, it applies negative pressure to described adsorption mouth;

Malleation feed unit, it applies malleation to described adsorption mouth;

Boarded head travel mechanism, it makes described boarded head comprising from the region of described parts supply unit to described board holder, at random running fix; And

Action control unit, it is based on installation data, performs and controls relative to the installation action of described substrate,

It is characterized in that having:

Pressure sensing cell, it detects the internal pressure of described adsorption mouth; And

Absorption required time obtains control unit, it is before the described installation action of execution controls, for described electronic unit, respectively at the parts receiving position of described parts supply unit, the absorption action of described adsorption mouth is carried out by described negative pressure feeding unit, further, measure and store pressure that described pressure sensing cell detects and reach absorption required time till target affinity pressure

Described action control unit, when the installation of electronic unit, according to the absorption required time being obtained control unit by described absorption required time and obtain, after continuing absorption, makes described adsorption mouth rise by described negative pressure feeding unit to each electronic unit,

Described absorption required time obtains control unit, after the described absorption required time of measurement, after being carried out the absorption release of electronic unit, makes described adsorption mouth increase by described malleation feed unit.

2. electronic component mounting apparatus according to claim 1, is characterized in that,

There is release required time and obtain control unit, it is not when performing described installation action and controlling, for each electronic unit becoming mounting object in described installation data, at the parts receiving position of described parts supply unit, the absorption action making to become in described adsorption mouth target affinity pressure is carried out by described negative pressure feeding unit, and, measure and store and to be made in described adsorption mouth from described target affinity pressure until becoming the release required time till target release pressure by described malleation feed unit

Described action control unit, when the installation of electronic unit, according to the release required time being obtained control unit by described release required time and obtain, continued to carry out the absorption release of each electronic unit by described malleation feed unit after, described adsorption mouth is made to increase.

3. electronic component mounting apparatus according to claim 2, is characterized in that,

Described release required time obtains control unit, from described absorption required time obtain control unit in order to carry out adsorb required time measurement and making to become in described adsorption mouth the state of target affinity pressure, perform and make by described malleation feed unit the action control becoming target release pressure in described adsorption mouth, thus measure described release required time.

4. electronic component mounting apparatus according to claim 2, is characterized in that,

Described release required time obtains control unit, from becoming the state of target affinity pressure in described adsorption mouth, malleation supply is carried out with the release required time of prediction by described malleation feed unit, when not becoming target release pressure in described adsorption mouth, make the release required time of described prediction repeatedly carry out above-mentioned action with the change of the unit interval of regulation, thus obtain the described release required time for becoming described target release pressure.

5. electronic component mounting apparatus according to claim 2, is characterized in that, has:

Parts absorption detecting unit, it to whether described adsorption mouth being adsorbed with electronic unit detects; And

Release required time confirms control unit, it makes to become target affinity pressure in described adsorption mouth and attract electrons parts, under the state making this adsorption mouth increase, based on the release required time being obtained control unit by described release required time and obtain, carry out malleation supply, and, stopping from the supply of this malleation after the stand-by time of regulation, judge whether described electronic unit is released by described parts absorption detecting unit

Described release required time confirms control unit, by making described stand-by time repeatedly carry out above-mentioned action with the change of the unit interval of regulation, till described electronic unit is released, obtains suitable stand-by time thus, and,

Described action control unit, when the installation of electronic unit, according to described release required time, the absorption release of each electronic unit is carried out by described malleation feed unit, then, after confirming by described release required time the stand-by time that control unit obtains, described adsorption mouth is made to increase.